CN213029053U - Hemispherical resonance gyroscope getter heat dissipation device - Google Patents
Hemispherical resonance gyroscope getter heat dissipation device Download PDFInfo
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- CN213029053U CN213029053U CN202022161748.3U CN202022161748U CN213029053U CN 213029053 U CN213029053 U CN 213029053U CN 202022161748 U CN202022161748 U CN 202022161748U CN 213029053 U CN213029053 U CN 213029053U
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Abstract
The utility model relates to a hemisphere resonance gyroscope field, concretely relates to hemisphere resonance gyroscope getter heat abstractor, include: the getter, a hemispherical resonator gyroscope sealing shell, a packaged getter heat collecting/conducting device and a water-cooling radiating system, wherein a vacuum cavity is formed inside the sealing shell, and the packaged getter heat collecting/conducting device is connected to the inner wall of the sealing shell of the hemispherical resonator gyroscope through brazing; the getter is arranged inside the wrapped getter heat collecting/conducting device and comprises two pins, and the two pins are communicated with the outside of the cavity through the insulator; the water-cooling heat dissipation system is arranged on the outer wall of one side of the sealed shell, the inner wall of the sealed shell is welded with the wrapping type getter heat collecting/conducting device, and the water-cooling heat dissipation system takes away and dissipates heat of the sealed shell of the hemispherical resonator gyroscope through water flow circulation.
Description
Technical Field
The utility model relates to a hemisphere resonance gyroscope field, concretely relates to hemisphere resonance gyroscope getter heat abstractor.
Background
A hemispherical resonator gyroscope is an all-solid-state vibrating gyroscope and is made of high-quality fused quartz glass material through precise mechanical processing and complex auxiliary processes. The hemispherical resonator gyroscope has the advantages of high reliability, high precision, long service life, strong radiation resistance and the like, particularly has the characteristic of unique working life of more than 15 years, is very suitable for space application occasions such as space aircrafts, satellites and the like, and is a preferred gyroscope in the field of aerospace high-reliability application.
The key part of the hemispherical resonance gyroscope is a hemispherical harmonic oscillator, when the harmonic oscillator vibrates in a four-antinode standing wave mode, the standing wave position angle of the harmonic oscillator is related to the rotation of a carrier in space, and the space rotation information of the carrier can be obtained by detecting the standing wave position angle. To ensure accurate and stable standing waves, the harmonic oscillator must achieve a high quality factor, i.e., Q value, which is defined as the ratio of the energy possessed by the oscillation to the energy lost per cycle, and therefore, reducing the energy loss is the key to increasing the Q value of the hemispherical harmonic oscillator. The vibration energy loss of the hemispherical harmonic oscillator mainly comes from the internal friction force of a quartz material, surface quality defects, film layer loss, air damping and the like. In order to reduce the energy loss of the air damping pair harmonic oscillator, the hemispherical harmonic oscillator must be placed in a vacuum environment, and the vacuum environment must be maintained for a long time to ensure that the precision of the gyroscope is stable and does not decrease. This requires a getter to be disposed in the vacuum chamber of the hemispherical resonator gyroscope for adsorbing residual gases remaining in various materials and gases leaked from a trace amount of the materials.
The hemispherical resonator gyroscope is usually prepared by using a non-evaporable getter, mainly using zirconium or titanium as a substrate, and smelting the zirconium or titanium and other metals according to a certain proportion to prepare alloy or mixed powder and sintering the alloy or mixed powder. Before the getter absorbs air, the getter needs to be heated in a vacuum atmosphere to remove a passivation film on the surface and expose a fresh metal layer to play the function of the getter, and the process is activation. The getter alloy material has conductivity, so that the getter can generate heat by applying voltage to the getter, and the getter can be activated after reaching a given temperature and being kept for a certain time. When the getter is activated, the central temperature is as high as several hundred degrees centigrade, and in vacuum, except for a small part of the heat reaches the shell in a conduction mode from the lead, the rest large amount of heat is diffused to the periphery in a radiation mode, and a large part of the heat is absorbed by the internal components of the gyroscope, so that the temperature of the internal components is increased. The process practice proves that the getter is easy to cause overhigh internal temperature of the hemispherical resonator gyroscope due to the fact that the applied electric power is large and the duration is long in the activation process, and a heat conduction path is lacked in a vacuum chamber of the hemispherical resonator gyroscope, so that if measures are not proper, internal welding fluxes are melted, the serious problems of assembly precision loss, gyroscope function failure and the like occur. In addition, the getter releases gas during the activation process, and the high-power activation at one time not only causes high activation temperature, but also exceeds the exhaust capability of a vacuum exhaust system to cause damage to a vacuum pump.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem of the inside high temperature of hemisphere resonance top that leads to owing to lack the heat conduction way in the above-mentioned hemisphere resonance top vacuum chamber, the utility model provides a hemisphere resonance top getter heat abstractor, the device can guarantee not transfinite at hemisphere resonance top getter activation in-process top inside temperature.
A hemispherical resonator gyroscope getter heat dissipation device, comprising: the getter comprises a getter 3, a hemispherical resonator gyroscope sealing shell 4, a packaged getter heat collecting/conducting device 8 and a water-cooling heat dissipation system, wherein a vacuum chamber 2 is arranged in the sealing shell 4, and the packaged getter heat collecting/conducting device 8 is connected to the inner wall of the sealing shell 4 of the hemispherical resonator gyroscope through brazing; the getter 3 is wrapped inside the wrapped getter heat collecting/conducting device 8, and the getter 3 is not in contact with the inner wall of the wrapped getter heat collecting/conducting device 8; the getter 3 comprises two pins 5, the two pins 5 are led to the outside of the vacuum chamber 2 through an insulator 6 on the sealed shell 4; the water-cooling heat dissipation system is arranged on the outer side of the sealed shell 4, the inner wall of the sealed shell is welded with the wrapped getter heat collecting/conducting device 8, and the water-cooling heat dissipation system 8 takes away and dissipates heat inside the sealed shell 4 of the hemispherical resonator gyroscope through water flow circulation.
Furthermore, the wrapped getter heat collecting/conducting device 8 is a cylinder, a plane with the largest surface area in the cylinder is welded on the inner wall of the sealed shell 4 of the hemispherical resonator gyroscope, and a plane 9 is arranged above the cylinder.
Further, a circular through hole is arranged inside the wrapped getter heat collecting/conducting device 8, and the radius of the circular through hole is larger than the outer diameter of the getter 3, so that the getter 3 is wrapped inside the circular through hole and is not in contact with the inner wall of the circular through hole.
Further, the wrapped getter heat collecting/conducting device 8 is made of oxygen-free copper material with high thermal conductivity.
Furthermore, a protruding heat conducting strip/heat conducting needle is arranged on the outer side of the bottom of the sealed shell 4 at a position corresponding to the wrapped getter heat collecting/conducting device 8, the heat conducting strip/heat conducting needle is made of an insulating high-heat-conductivity material, the heat conducting strip/heat conducting needle is wrapped by a water cooling head 11 of a water cooling system, and heat on the heat conducting strip/heat conducting needle is dissipated through water flow in the water cooling head 11.
Further, the water-cooling heat dissipation system comprises a water-cooling head 11, a circulating pump 12, a liquid storage device 13, a radiator 14 and a silica gel pipeline 15, wherein the water-cooling head 11 is jointed with the outer wall of one side of the sealed shell 4, of which the inner wall is welded with the wrapped getter heat collecting/conducting device 8, through heat-conducting silicone grease, and two pipeline interfaces are arranged on the water-cooling head 11; the circulating pump 12 is arranged on one side of the liquid storage device 13 and is communicated with the inside of the liquid storage device, and two pipeline interfaces are arranged on the circulating pump 12; the heat sink 14 includes metal fins 16, a fan 17, and two pipe connections.
Further, the water cooling head 11 is made of red copper material with high thermal conductivity.
Further, the silica gel pipeline 15 comprises a first silica gel pipeline, a second silica gel pipeline and a third silica gel pipeline, and is connected with pipeline interfaces on the water cooling head 11 and the circulating pump 12 through silica gel pipes to form a first silica gel pipeline; the pipeline interfaces on the water cooling head 11 and the radiator 14 are connected through a silica gel tube to form a second silica gel pipeline; and the third silica gel pipeline is formed by connecting the radiator 14 and the pipeline interface on the circulating pump 12 through a silica gel pipe.
The utility model has the advantages that:
1. the utility model relates to a parcel formula structure wraps up getter body most, blocks heat radiation channel, and the absorptive heat of this structure passes through the structure and the contact direction shell of shell large tracts of land, has realized thermal collection and conduction to the heat of top inside diffusion has significantly reduced. Along with heat conduction to the top shell, the temperature of the top shell is gradually increased, the water-cooling heat dissipation system takes away and dissipates the heat of the top shell efficiently through water flow circulation, the temperature of the top shell is reduced, and the internal temperature of the top is indirectly reduced and controlled to a safety value lower than the melting point melting temperature.
2. The utility model discloses substep activation getter avoids getter activation in-process too much gas of once release to the atmospheric pressure in time and the vacuum chamber is as the criterion of substep activation, and atmospheric pressure in the vacuum chamber is surveyed easily, consequently the utility model discloses an activation method easy operation, the measured value is few, and labour saving and time saving has certain advantage, and this substep activation method effectively avoids the release gas in the getter activation process to exceed vacuum exhaust system's exhaust ability and causes the vacuum pump damage problem, in addition, the utility model has the advantages of the criterion is clear, and the process is controllable, and vacuum system operates steadily.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic diagram of the internal structure of a hemispherical resonator gyroscope;
FIG. 2 is a schematic view of the getter heat collection/transfer device installation;
FIG. 3 is a view of a getter heat sink;
FIG. 4 is a schematic diagram of a water-cooling heat dissipation system;
FIG. 5 is a schematic view of the getter step-by-step activation pressure change;
the labels in the figure are: the device comprises a harmonic oscillator 1, a vacuum chamber 2, a getter 3, a sealed shell 4, a getter pin 5, an insulator 6, a welding point 7, a packaged getter heat collecting/conducting device 8, a plane 9, a packaged getter heat collecting/conducting device bottom surface 10, a water cooling head 11, a circulating pump 12, a liquid storage device 13, a radiator 14, a silica gel pipeline 15, a metal fin 16 and a fan 17.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The activation process of the getter 3 must be carried out under vacuum, a certain current is applied to the getter 3, the internal temperature of the getter 3 is gradually raised, and the passivation film existing on the surface is removed through reaction, so that a fresh metal layer is exposed. The getter releases gas during this activation process and the exhaust system needs to remove the released gas. The getter temperature can reach hundreds of degrees centigrade at most due to the long time of the whole activation process. Except a small part of the heat released by the getter is conducted to the outside of the vacuum chamber 2 through the two pins 5 and the insulator 6, the rest of the heat mainly reaches the inner wall of the vacuum chamber 2 and quartz components such as the harmonic oscillator 1 through a spatial radiation way. The quartz component is relatively poor in thermal conductivity and the heat absorbed by it builds up causing a gradual temperature rise and eventually the temperature at the solder joint 7 exceeds the solder temperature and the solder melts. The harmonic oscillator 1 shifts under the action of gravity, even slips when the harmonic oscillator is serious, and product faults are caused. The structure of a hemispherical resonator gyro is shown in fig. 1, and the structure of the hemispherical resonator gyro includes: the resonator comprises a harmonic oscillator 1, a vacuum chamber 2, a getter 3 and a sealed shell 4, wherein the vacuum chamber 2 is arranged in the sealed shell 4, the sealed vacuum chamber 2 is used for reducing energy loss of the harmonic oscillator 1 caused by air damping, and the harmonic oscillator 1 is arranged in the vacuum chamber 2; the getter 3 is usually arranged on the inner wall of the sealed shell 4, and there is a space between the getter 3 and the resonator 1, two pins 5 are arranged at two ends of the getter 3, and the two pins 5 are led to the outside of the vacuum chamber 2 through an insulator 6 on the vacuum chamber 2, so as to conveniently electrify the getter 3.
Based on the above problems of the hemispherical resonator gyroscope vacuum chamber, such as the internal temperature of the hemispherical resonator gyroscope is too high due to lack of heat conduction path, and the product is failed, the present embodiment provides a hemispherical resonator gyroscope getter heat dissipation device, which includes: the wrapped getter heat collecting/conducting device 8 and the water-cooling heat dissipation system are shown in fig. 2, the wrapped getter heat collecting/conducting device 8 is connected to the inner wall of the sealed shell 4 of the hemispherical resonator gyroscope through brazing, and since the melting temperature of the brazing solder is higher than the maximum activation temperature of the getter 3, when the temperature inside the hemispherical resonator gyroscope is increased when the getter 3 is activated, the wrapped getter heat collecting/conducting device 8 is not melted.
The wrapped getter heat collecting/conducting device 8 is far away from the internal device of the hemispherical resonator gyroscope, namely, a certain distance is reserved between the wrapped getter heat collecting/conducting device 8 and the internal device of the hemispherical resonator gyroscope, and the design enables heat absorbed by the wrapped getter heat collecting/conducting device 8 not to be quickly dissipated into the vacuum chamber, so that the internal device of the hemispherical resonator gyroscope is damaged.
In a preferred embodiment, the wrapped getter heat collecting/conducting device 8 is a cylinder, the left end and the right end of the cylinder are planes with the same size and shape, the bottom of the cylinder is a rectangular base, and a plane 9 is arranged above the cylinder (the plane 9 is used for adhering a platinum resistor for temperature measurement to test thermal resistance).
In a preferred embodiment, the encapsulated getter heat collecting/conducting means 8 is internally provided with circular through holes.
The getter 3 is wrapped inside the circular through hole of the wrapping type getter heat collecting/conducting device 8, and the getter 3 is not in contact with the inner wall of the wrapping type getter heat collecting/conducting device 8; the getter 3 comprises two pins 5, and the two pins 5 of the getter 3 respectively extend from two ends of the through hole of the wrapped getter heat collecting/conducting device 8 and are communicated to the outside of the vacuum chamber 2 through the insulator 6 on the sealed shell 4 so as to electrify the getter 3. Insulator 6 on the sealed shell 4 is a tubular metal resonator, and the pin 5 just can be lived in the parcel of the dimension of tubular metal resonator, and during the circular telegram, insulator 6 is as the passageway of inside and outside signal of telecommunication. There is a layer of glass between insulator 6 and the closed shell in order to realize with the closed shell is insulating, guarantee the gas tightness of vacuum chamber 2 simultaneously, when applying current signal for pin 5, because the effect of glass, the sealed shell is in the safe state of no electric current all the time, can not cause the influence to sealed shell 4.
In a preferred embodiment, the radius of the circular through hole of the encapsulated getter heat collecting/conducting device 8 is larger than the outer diameter of the getter 3, so that the getter 3 can be encapsulated inside the through hole and the getter 3 is not in contact with the inner wall of the hole, and gas release is facilitated when the getter 3 is activated.
In an alternative embodiment, the wrapped getter heat collecting/conducting device 8 is a semicircular cavity, the circular bottom surface is welded on the inner wall of the sealed shell 4 of the hemispherical resonator gyroscope, the semicircular cavity is internally provided with a semicircular cavity, and the size of the cavity is larger than the volume of the getter 3 so as to contain the getter 3 and block the heat of the getter 3; two small holes are arranged on the circular cavity, and two pins 5 of the getter 3 are led to the outside of the vacuum chamber 2 through the small holes and the insulator 6 on the sealed shell 4; a plane 9 is arranged above the cavity, and the plane 9 is used for adhering a platinum resistor for temperature measurement to test thermal resistance.
The function of the encapsulated getter heat collecting/conducting means 8 comprises: 1) the radiation heat of the absorbent is captured and collected in a wrapping manner, so that the heat is prevented from radiating outwards, and the heat is particularly prevented from radiating towards an internal device; 2) the collected heat is conducted to the closed housing 4.
In a preferred embodiment, the encapsulated getter heat collection/conduction device 8 is fabricated from an oxygen-free copper material having a high thermal conductivity.
In a preferred embodiment, the wrapped getter heat collecting/conducting device 8 is in the shape of a D-shaped column, as shown in fig. 2, and a circular through hole is formed in the middle of the D-shaped column, the radius of the circular through hole is larger than the outer diameter of the getter 3, so that the getter 3 can be wrapped inside the through hole and the getter 3 is not in contact with the inner wall of the circular through hole, and a plane with the largest upper surface area of the D-shaped column is welded on the inner wall of the sealed shell 4 of the hemispherical resonator gyroscope. Preferably, the structural dimensions of the D-shaped column are designed as follows: length L, width W, height H and circular via diameter D, as shown in fig. 3.
Alternatively, the shape of the encapsulated getter heat collecting/conducting means 8 can be chosen other than the one described in the above embodiments, but must have the following two characteristics: the method is characterized in that: the getter 3 is wrapped/shielded as much as possible so as to capture and collect the radiation heat of the getter, and the heat is prevented from radiating outwards, and especially the heat is prevented from radiating towards the direction of an internal device; the second characteristic: there is a large contact area with the sealed housing 4 to facilitate rapid heat transfer to the sealed housing 4.
In a preferred embodiment, the outside of the bottom of the sealed shell 4 is provided with a protruded heat conducting plate/pin at a position corresponding to the wrapped getter heat collecting/conducting device 8, the heat conducting plate/pin is made of an insulating high heat conductivity material, the heat conducting plate/pin is wrapped by the water cooling head 11 of the water cooling system, and the heat conducting plate/pin mainly serves to increase the contact area between the wrapped getter heat collecting/conducting device 8 and the circulating water flow, so that the heat dissipation is quicker, and the heat on the heat conducting plate/pin is dissipated through the circulating water flow in the water cooling head 11.
The packed getter heat collecting/conducting device 8 is used for packing most of the getters, and the most of heat radiated in the getter activating process is absorbed by the packed getter heat collecting/conducting device, so that the heat is prevented from being directly radiated to other components. The temperature of the device will also rise after absorbing heat and become a new radiation source, in order to control the temperature inside the vacuum chamber of the hemispherical resonator gyroscope to be a low value, therefore, the temperature of the encapsulated getter heat collecting/conducting device 8 must be controlled below a low value, and the temperature of the encapsulated getter heat collecting/conducting device depends on the formula of thermal resistance:
in the formula, the thermal resistance R is defined as the ratio of the internal and external temperature difference to the power, T1For sealing the outer surface temperature, T, of the housing 42For the surface temperature of the encapsulated getter heat collecting/conducting device 8, P is the collected getter power. The thermal resistance R depends only on the physical structure and material properties of the heat conduction path and does not vary with power and temperature, so once the thermal resistance is determined by design, the internal temperature can be measured and controlled by the external temperature.
As shown in FIG. 3, a platinum resistor for temperature measurement is adhered on the top plane 9 of the device and the outer surface of the sealed shell 4, a power resistor is used for replacing a getter to provide a heat source, and the thermal resistance R of the heat collecting/conducting device to the outer surface of the sealed shell is measured to be 3.2 ℃/W in an experiment.
The temperature T of the outer surface of the sealed housing when the getter is activated1The getter heating power P can be calculated from the applied voltage and current, which can be measured on-line, while the device surface temperature can be calculated from the heat collecting/conducting device surface temperature equation, assuming that all of these powers are absorbed by the heat collecting/conducting device:
T2＝T1+3.2P
after the wrapped getter heat collecting/conducting device 8 is adopted, the power of the getter is about 10W in a full power activation state, the surface temperature of the wrapped getter heat collecting/conducting device 8 is higher than the outer surface temperature of the sealing shell 4 by 32 ℃ according to the formula, and if the outer surface temperature of the sealing shell 4 is controlled within 30 ℃, the surface temperature of the wrapped getter heat collecting/conducting device 8 is 62 ℃ at the highest and is far lower than the melting temperature of solder at the welding point 7, so that the welding point can not be melted in the activation process. The utility model discloses a heat collection conduction device 8 is a parcel formula structure, wraps up getter 3 body most, blocks the heat radiation passageway, and the absorptive heat of parcel formula getter heat collection conduction device 8 has realized thermal collection and conduction through the structure and the sealed shell 4 of the contact direction of shell large tracts of land to the heat of top internal diffusion has significantly reduced.
Along with heat conduction to the top shell, the temperature of the top shell is gradually increased, the temperature in the top shell can be still gradually raised if the heat cannot be dissipated, and because the contact area between the top shell and air is not large, natural air conduction and convection heat dissipation are not enough to ensure that the temperature in the top shell does not exceed the limit. The activation process tests show that if the shell is only exposed to room temperature air during activation, the shell temperature can exceed 130 ℃ during full power 10W activation by utilizing air conduction and convection to naturally dissipate heat. Knowing the top internal temperature by the thermal resistance formula and exceeding 162 ℃, still probably leading to the oscillator welding point to melt, for this reason, the utility model discloses a water-cooling heat dissipation system further reduces the shell temperature, and water-cooling heat dissipation system takes away and gives off top shell heat through rivers circulation high efficiency, reduces top shell temperature, and indirect reduction and control top internal temperature are to a safe value that is less than melting point melting temperature.
As shown in fig. 4, the water-cooling heat dissipation system comprises a water-cooling head 11, a circulating pump 12, a liquid reservoir 13, a radiator 14 and a silica gel pipeline 15, wherein the water-cooling head 11 is jointed with the outer wall of one side of a sealed shell 4, the inner wall of which is welded with a wrapped getter heat collecting/conducting device 8, through heat-conducting silicone grease, and the water-cooling head 11 is provided with two pipeline interfaces; the circulating pump 12 is arranged on one side of the liquid storage device 13 and is communicated with the inside of the liquid storage device, and two pipeline interfaces are arranged on the circulating pump 12; the heat sink 14 includes metal fins 16, a fan 17, and two pipe connections.
In a preferred embodiment, the water cooling head 11 is made of red copper material with high thermal conductivity.
The silica gel pipeline 15 comprises a first silica gel pipeline, a second silica gel pipeline and a third silica gel pipeline, and is connected with one pipeline interface of the water cooling head 11 and one pipeline interface of the circulating pump 12 through a silica gel tube to form a first silica gel pipeline; the other pipeline interface of the water-cooling head 11 and one pipeline interface on the radiator 14 are connected through a silica gel tube to form a second silica gel pipeline; and the other pipeline interface of the radiator 14 and the other pipeline interface on the circulating pump 12 are connected through a silicone tube to form a third silicone tube.
The heat on the sealed shell 4 and the wrapped getter heat collecting/conducting device 8 is conducted to the water flow inside the water cooling head 11 through the water cooling head 11, and the circulating pump 12 pumps the heated water in the water cooling head away to a radiator. The heat dissipation air transfers the heat in the water to the metal fins 16 with large surface area inside, the fan 17 blows air to discharge the heat of the metal fins to the air, the temperature of the water is reduced to return to the liquid storage device after the heat is dissipated, and then the water is sent to the water cooling head again to complete a cycle.
The water-cooling heat dissipation system takes liquid as a medium, takes away heat of the hemispherical resonant gyroscope sealing shell 4 and efficiently dissipates the heat into the air, and the heat dissipation efficiency is high. Actual tests show that when the getter is activated at full power, the temperature of the shell can be stably kept within 5 ℃ above room temperature. According to the surface temperature formula of the heat collecting/conducting device, when the full power is activated in the environment of 25 ℃ of room temperature, the temperature of the wrapped getter heat collecting/conducting device 8 in the hemispherical resonator gyroscope is about 62 ℃, and the temperature of any part in the gyroscope is not higher than the temperature, so that the safety of the internal structure is ensured.
A method for radiating getter of hemispherical resonator gyroscope includes but is not limited to the following processes:
1. getter activation is first performed: the traditional step activation method is usually determined based on the temperature of the getter, and because the getter is in the closed shell, the temperature of the getter or the closed shell is difficult to measure, so the traditional step activation method needs more measured data and has poor controllability. Based on this, the utility model discloses a hemisphere resonance top getter activation method, as shown in fig. 5, includes the following steps: the method comprises the following steps of sequentially applying current for the getter, wherein the initial current is 2A, and then sequentially increasing 0.5A to the limit current, and specifically comprises the following steps: first activation by applying a first current to the insulator 6 of the sealed housing 4The current is 2A, the air pressure change is observed after power-up, the released gas is faster and exceeds the exhaust speed of the vacuum pump along with the rise of the temperature of the getter heated by electric power, the air pressure in the process is gradually increased, when the getter is quickly released and finishes, the exhaust speed is higher than the release speed, the air pressure is changed from increasing to beginning to reducing, the timing is started to wait for 30 seconds for power-off by taking the air pressure turning point in the vacuum chamber 2 as a mark, and the first activation process is finished; when the air pressure in the vacuum chamber 2 is lower than 1 x 10－5When Pa, starting to apply a second current on the insulator 6 of the sealed shell 4, wherein the second applied current is 2.5A, starting to time and wait for 30 seconds of power off by taking the time when the air pressure turning point appears in the vacuum chamber 2 as a mark, and finishing the second activation process; … … and so on, when the last activation is carried out, the power is cut off when the air pressure is basically close to the air pressure before the first activation, thus ensuring the getter to be activated completely. The step activation method of the invention keeps the maximum air pressure at 1 x 10 in the activation process－3And Pa above, the vacuum system operates stably.
The step-by-step activation method only takes air pressure and time as criteria for step-by-step activation, and air pressure in the vacuum chamber is easy to measure, so that the activation method is simpler to operate, less in measured value, time-saving and labor-saving, and has certain advantages. The step-by-step activation method is used as a measure for controlling the temperature in the vacuum chamber in the whole activation process, and can reduce the temperature of the sealed shell to control the temperature of the vacuum chamber, so that the temperature of the vacuum chamber is limited within a safe value, and devices of the hemispherical resonator gyro are protected.
2. In the getter activation process, the temperature of the sealed shell 4 is measured, when the temperature of the outer surface of the sealed shell 4 reaches a threshold value, a circulating pump 12 and a radiator 14 of a water-cooling radiating system are opened, heat on the sealed shell 4 is radiated to the environment under the action of water flow circulation, and the temperature inside the sealed shell 4 is controlled to be always kept in a safe temperature range enabling the hemispherical resonance gyroscope to normally work.
Further, in a preferred embodiment, a manner of determining the threshold value includes: the threshold is the solder melting temperature of the solder joint 7-30-k, k is the safe temperature difference, and 5< k < 15.
The technical solutions described above only represent the preferred technical solutions of the present application, and some possible modifications to some parts of the technical solutions will all represent the principles of the present application and fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "coaxial", "bottom", "one end", "two ends", "top", "middle", "other end", "upper", "one side", "inner", "front", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore, should not be taken as limiting the present application.
Furthermore, the terms "first", "second", "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third" may explicitly or implicitly include at least one such feature.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communicated with each other inside the two elements or the interaction relationship between the two elements, unless otherwise specifically defined, and the specific meaning of the terms in the present application may be understood by those skilled in the art according to specific situations.
Although embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A hemispherical resonator gyroscope getter heat dissipation device, comprising: the getter heat collecting and conducting device is characterized in that the wrapped getter heat collecting and conducting device (8) is connected to the inner wall of the sealed shell (4) of the hemispherical resonant gyroscope through brazing; the getter (3) is wrapped inside the wrapped getter heat collecting/conducting device (8), and the getter (3) is not in contact with the inner wall of the wrapped getter heat collecting/conducting device (8); the getter (3) comprises two pins (5), and the two pins (5) are communicated to the outside of the vacuum chamber (2) through an insulator (6) on the sealed shell (4); the water-cooling heat dissipation system is arranged on the outer side of the sealed shell (4) with the inner wall welded with the wrapped getter heat collecting/conducting device (8), and takes away and dissipates heat inside the hemispherical resonance gyroscope sealed shell (4) through water flow circulation.
2. A getter radiator for hemispherical resonator gyros according to claim 1, wherein the encapsulated getter heat collecting/conducting device (8) is a cylinder, a plane with the largest surface area in the cylinder is welded to the inner wall of the sealed shell (4) of the hemispherical resonator gyro, and a plane (9) is arranged above the cylinder.
3. A hemispherical resonator gyroscope getter radiator according to claim 1, wherein the round through hole is arranged inside the wrapped getter heat collecting/conducting device (8), and the radius of the round through hole is larger than the outer diameter of the getter (3), so as to wrap the getter (3) inside the round through hole but not contact the inner wall of the round through hole.
4. A hemispherical resonator gyroscope getter heat sink according to any of claims 1-3, wherein the encapsulated getter heat collecting/conducting means (8) is made of oxygen-free copper material with high thermal conductivity.
5. The getter radiator of hemispherical resonator gyroscope according to claim 1, wherein the outside of the bottom of the sealed housing (4) is provided with a protruded heat conducting plate/pin at a position corresponding to the wrapped getter heat collecting/conducting device (8), the heat conducting plate/pin is made of insulating high heat conductivity material, the heat conducting plate/pin is wrapped by the water cooling head (11) of the water cooling radiating system, and heat on the heat conducting plate/pin is radiated through water flow in the water cooling head (11).
6. The hemispherical resonator gyroscope getter heat dissipation device according to claim 1, wherein the water cooling heat dissipation system comprises a water cooling head (11), a circulating pump (12), a liquid reservoir (13), a heat sink (14) and a silica gel pipeline (15), the water cooling head (11) is attached to the outer wall of one side of a sealed shell (4) with a wrapped getter heat collecting/conducting device (8) welded on the inner wall through heat-conducting silicone grease, and two pipeline interfaces are arranged on the water cooling head (11); the circulating pump (12) is arranged on one side of the liquid storage device (13) and is communicated with the inside of the liquid storage device, and two pipeline interfaces are arranged on the circulating pump (12); the heat sink (14) comprises metal fins (16), a fan (17) and two pipe interfaces.
7. A getter radiator of a hemispherical resonator gyroscope according to claim 6, wherein the water cooling head (11) is made of red copper material with high thermal conductivity.
8. The hemispherical resonator gyroscope getter heat dissipation device according to claim 6, wherein the silica gel pipeline (15) comprises a first silica gel pipeline, a second silica gel pipeline and a third silica gel pipeline, and a pipeline interface on the water cooling head (11) and the circulating pump (12) is connected through a silica gel pipe to form the first silica gel pipeline; a pipeline interface on the water cooling head (11) and the radiator (14) is connected through a silica gel tube to form a second silica gel pipeline; and the third silica gel pipeline is formed by connecting the radiator (14) and a pipeline interface on the circulating pump (12) through a silica gel pipe.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112135491A (en) * | 2020-09-27 | 2020-12-25 | 中国电子科技集团公司第二十六研究所 | Hemispherical resonance gyroscope getter heat dissipation device and heat dissipation method |
| CN114754755A (en) * | 2022-06-15 | 2022-07-15 | 中国船舶重工集团公司第七0七研究所 | Vacuum exhaust packaging device and method for quartz hemispherical resonator gyroscope |
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2020
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112135491A (en) * | 2020-09-27 | 2020-12-25 | 中国电子科技集团公司第二十六研究所 | Hemispherical resonance gyroscope getter heat dissipation device and heat dissipation method |
| CN112135491B (en) * | 2020-09-27 | 2024-05-10 | 中国电子科技集团公司第二十六研究所 | Hemispherical resonator gyroscope getter heat dissipation device and heat dissipation method |
| CN114754755A (en) * | 2022-06-15 | 2022-07-15 | 中国船舶重工集团公司第七0七研究所 | Vacuum exhaust packaging device and method for quartz hemispherical resonator gyroscope |
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