CN112135491B - Hemispherical resonator gyroscope getter heat dissipation device and heat dissipation method - Google Patents
Hemispherical resonator gyroscope getter heat dissipation device and heat dissipation method Download PDFInfo
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- CN112135491B CN112135491B CN202011030688.XA CN202011030688A CN112135491B CN 112135491 B CN112135491 B CN 112135491B CN 202011030688 A CN202011030688 A CN 202011030688A CN 112135491 B CN112135491 B CN 112135491B
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 62
- 238000001816 cooling Methods 0.000 claims abstract description 48
- 239000012212 insulator Substances 0.000 claims abstract description 17
- 238000001994 activation Methods 0.000 claims description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 38
- 239000000741 silica gel Substances 0.000 claims description 34
- 229910002027 silica gel Inorganic materials 0.000 claims description 34
- 230000004913 activation Effects 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000003213 activating effect Effects 0.000 claims description 4
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 12
- 230000005855 radiation Effects 0.000 description 10
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 241000237983 Trochidae Species 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000013016 damping Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000986 non-evaporable getter Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Analytical Chemistry (AREA)
- Gyroscopes (AREA)
Abstract
The invention relates to the field of hemispherical resonator gyroscopes, in particular to a hemispherical resonator gyroscope getter heat dissipation device and a heat dissipation method, wherein the hemispherical resonator gyroscope getter heat dissipation device comprises: the device comprises a getter, a hemispherical resonator gyro sealing shell, a wrapped getter heat collecting/conducting device and a water-cooling heat dissipation system, wherein a vacuum chamber is arranged in the sealing shell; the getter is arranged inside the wrapped getter heat collecting/conducting device and comprises two pins, and the two pins are communicated with the outside of the cavity through an insulator; the water cooling system is arranged on the outer wall of one side of the sealed shell, the inner wall of which is welded with the wrapped getter heat collecting/conducting device, and takes away and radiates heat of the hemispherical resonator gyro sealed shell through water flow circulation.
Description
Technical Field
The invention relates to the field of hemispherical resonator gyroscopes, in particular to a hemispherical resonator gyroscope getter heat dissipation device and a hemispherical resonator gyroscope heat dissipation method.
Background
The hemispherical resonator gyroscope is an all-solid-state vibrating gyroscope, and is manufactured by high-quality fused quartz glass materials through precise machining and complex auxiliary processes. The hemispherical resonator gyroscope has the advantages of high reliability, high precision, long service life, strong radiation resistance and the like, and particularly has the unique service life characteristic of more than 15 years, so that the hemispherical resonator gyroscope is very suitable for space application occasions such as space aircrafts, satellites and the like, and is a preferred gyroscope in the field of aerospace high-reliability application.
The key component of the hemispherical resonator gyroscope is a hemispherical harmonic oscillator, when the harmonic oscillator vibrates in a four-antinode standing wave mode, the standing wave position angle of the harmonic oscillator is related to the rotation of the carrier in space, and the spatial rotation information of the carrier can be obtained by detecting the standing wave position angle. To ensure accurate stability of the standing wave, the resonator must reach a very high quality factor, i.e., Q, which is defined as the ratio of the energy of the oscillation to the energy lost per cycle, therefore, reducing the energy loss is a key to increasing the Q of the hemispherical resonator. The vibration energy loss of the hemispherical harmonic oscillator mainly comes from internal friction force, surface quality defect, film loss, air damping and the like of quartz materials. In order to reduce the energy loss of the air damping to the harmonic oscillator, the hemispherical harmonic oscillator must be placed in a vacuum environment, and the vacuum environment must be maintained for a long time to ensure that the accuracy of the gyroscope is stable and does not drop. This requires the getter to be disposed in the hemispherical resonator gyro vacuum chamber to adsorb residual gases remaining in various materials and gases which are leaked in a minute amount from the materials.
The hemispherical resonator gyro is usually made of non-evaporable getter, which is mainly made of zirconium or titanium as matrix and is made into alloy by smelting with other metals according to a certain proportion or sintered with mixed powder. Before the getter is gettered, the getter must be heated in a vacuum atmosphere to remove the passivation film on the surface, so that the fresh metal layer is exposed to perform the function of the getter, and the process is activation. Because the getter alloy material has conductivity, the getter can be heated by applying voltage to the getter, and the getter can be activated after reaching a given temperature and being maintained for a certain time. The getter is activated with a central temperature of up to several hundred degrees celsius, and in vacuum, a very small portion of the heat is conducted from the leads to the housing, and a large amount of the remaining heat is radiated to spread all around, and a substantial portion is absorbed by the gyro internal components, resulting in an increase in the internal component temperature. The technical practice proves that the getter activation process is easy to cause the excessive internal temperature of the hemispherical resonator gyroscope due to the fact that the applied electric power is larger, the duration time is longer and the heat conduction path is lacked in the hemispherical resonator gyroscope vacuum chamber, and if the measures are improper, the internal solder can be melted, and serious problems of assembly precision loss, gyroscope function failure and the like occur. In addition, the getter activation process releases gas, and the high-power activation at one time not only results in high activation temperature, but also causes damage to the vacuum pump beyond the evacuation capability of the vacuum evacuation system.
Disclosure of Invention
In order to solve the problem that the internal temperature of the hemispherical resonator gyroscope is too high due to the lack of a heat conduction path in the hemispherical resonator gyroscope vacuum chamber, the invention provides a hemispherical resonator gyroscope getter heat dissipation device and a hemispherical resonator gyroscope heat dissipation method.
A hemispherical resonator gyro getter heat sink comprising: the device comprises a getter 3, a hemispherical resonator gyro sealed shell 4, a wrapped getter heat collecting/conducting device 8 and a water cooling system, wherein a vacuum chamber 2 is arranged in the sealed shell 4, and the wrapped getter heat collecting/conducting device 8 is soldered on the inner wall of the hemispherical resonator gyro sealed shell 4; the getter 3 is wrapped inside the wrapped getter heat collecting/conducting device 8, and the getter 3 is in non-contact with the inner wall of the wrapped getter heat collecting/conducting device 8; the getter 3 comprises two pins 5, the two pins 5 being open to the outside of the vacuum chamber 2 through insulators 6 on the hermetic shell 4; the water cooling system is arranged on the outer side of the sealed shell 4 of which the inner wall is welded with the wrapped getter heat collecting/conducting device 8, and takes away and radiates heat in the hemispherical resonator gyro sealed shell 4 through water flow circulation.
Further, the wrapped getter heat collecting/conducting device 8 is a cylinder, a plane with the largest surface area of the cylinder is welded on the inner wall of the sealed shell 4 of the hemispherical resonator gyro, and a plane 9 is arranged above the cylinder.
Further, the inside of the wrapped getter heat collecting/conducting device 8 is provided with a circular through hole, and the radius of the circular through hole is larger than the outer diameter of the getter 3, so that the getter 3 is wrapped inside the circular through hole but is not in contact with the inner wall of the circular through hole.
Further, the wrapped getter heat collection/conduction device 8 is made of an oxygen-free copper material with high thermal conductivity.
Further, a protruding heat conducting fin/needle is arranged at a position corresponding to the wrapped getter heat collecting/conducting device 8 at the outer side of the bottom of the sealed housing 4, the heat conducting fin/needle is made of insulating high heat conductivity material, the heat conducting fin/needle is wrapped by a water cooling head 11 of the water cooling system, and the heat on the heat conducting fin/needle is dissipated through water flow in the water cooling head 11.
Further, the water cooling system comprises a water cooling head 11, a circulating pump 12, a liquid storage device 13, a radiator 14 and a silica gel pipeline 15, wherein the water cooling head 11 is attached to the outer wall of one side of a sealed shell 4 of the wrapped getter heat collecting/conducting device 8 through heat conduction silicone grease, and two pipeline interfaces are arranged on the water cooling head 11; the circulating pump 12 is arranged at one side of the liquid storage device 13 and communicated with the liquid storage device, and two pipeline interfaces are arranged on the circulating pump 12; the heat sink 14 includes metal fins 16, a fan 17, and two tube interfaces.
Further, the water-cooling head 11 is made of a red copper material with high thermal conductivity.
Further, the silica gel pipeline 15 includes a first silica gel pipeline, a second silica gel pipeline and a third silica gel pipeline, and is connected with pipeline interfaces on the water cooling head 11 and the circulating pump 12 through silica gel pipelines to form a first silica gel pipeline; the second silica gel pipeline is formed by connecting pipeline interfaces on the water cooling head 11 and the radiator 14 through a silica gel pipe; the third silica gel pipeline is formed by connecting the pipeline interfaces on the radiator 14 and the circulating pump 12 through the silica gel pipeline.
A heat dissipation method of a hemispherical resonator gyroscope getter comprises the following steps: s1, activating a getter: the getter is successively applied with an initial current of 2A and then successively increased by 0.5A up to the limit current, comprising in particular: applying a first current to the insulator 6 of the sealed shell 4 for first activation, wherein the first applied current is 2A, starting timing by taking a mark when an air pressure turning point appears in the vacuum chamber 2, waiting for 30 seconds for power-off, and ending the first activation process; when the air pressure in the vacuum chamber 2 is lower than 1×10 －5 Pa, starting to apply a second current to the insulator 6 of the sealed shell 4, wherein the second applied current is 2.5A, starting to count time by taking the air pressure turning point in the vacuum chamber 2 as a mark, waiting for 30 seconds, powering off, and ending the second activation process; … … and so on, when the last activation is performed, the power is cut off when the air pressure is basically close to the air pressure before the first activation, so that the getter is ensured to be thoroughly activated; s2, in the getter activation process, the temperature of the sealed shell 4 is measured, and when the temperature of the sealed shell 4 reaches a threshold value, the circulating pump 12 and the radiator 14 of the water cooling system are turned on, and heat on the sealed shell 4 is emitted to the environment due to the circulation of water flow.
The invention has the beneficial effects that:
1. The invention designs a wrapping structure, which wraps the getter body mostly to block the heat radiation channel, and the heat absorbed by the structure is guided to the shell through the contact of the structure body and the shell in a large area, so that the heat collection and conduction are realized, and the heat diffused into the gyroscope is greatly reduced. Along with heat conduction to the top shell, the temperature of the top shell is gradually increased, the water cooling heat dissipation system takes away and dissipates the heat of the top shell through water circulation with high efficiency, the temperature of the top shell is reduced, and the internal temperature of the top is indirectly reduced and controlled to a safe value lower than the melting point and the melting temperature.
2. The method has the advantages of simple operation, less measured value, time and labor saving, and certain advantages, and the step-by-step activation method effectively avoids the problem of vacuum pump damage caused by the fact that the released gas exceeds the exhaust capacity of a vacuum exhaust system in the process of activating the getter.
Drawings
The invention will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a schematic diagram of the internal structure of a hemispherical resonator gyroscope;
FIG. 2 is a schematic view of a getter heat collection/conduction device installation;
FIG. 3 is a block diagram of a getter heat sink;
FIG. 4 is a schematic diagram of a water cooling system;
FIG. 5 is a schematic diagram of a step-wise activation gas pressure variation of a getter;
The marks in the figure: the device comprises a harmonic oscillator 1, a vacuum chamber 2, a getter 3, a sealed shell 4, a getter pin 5, an insulator 6, a welding point 7, a wrapped getter heat collecting/conducting device 8, a plane 9, a wrapped getter heat collecting/conducting device bottom surface 10, a water cooling head 11, a circulating pump 12, a liquid reservoir 13, a radiator 14, a silica gel pipeline 15, a metal fin 16 and a fan 17.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The activation process of the getter 3 must be performed under vacuum, a certain current is applied to the getter 3, the internal temperature of the getter 3 is gradually increased, and the passivation film existing on the surface is removed through the reaction, so that the fresh metal layer is exposed. This activation process getters release gas and the exhaust system needs to remove the released gas. The temperature of the getter can be up to hundreds of degrees celsius due to the relatively long overall activation process. The heat released by the getter is conducted to the outside of the vacuum chamber 2 through the two pins 5 and the insulator 6, and the rest of the heat mainly reaches the inner wall of the vacuum chamber 2, quartz components such as the harmonic oscillator 1 and the like through a space radiation path. The quartz component has poor thermal conductivity, and the absorbed heat is accumulated to cause the temperature to rise gradually, so that the temperature of the welding point 7 exceeds the temperature of the solder, and the solder is melted. The harmonic oscillator 1 shifts under the action of gravity, and even slips when serious, so that the product is in fault. The structure of the hemispherical resonator gyro is shown in fig. 1, and the structure of the hemispherical resonator gyro comprises: the resonator comprises a resonator 1, a vacuum chamber 2, a getter 3 and a sealed shell 4, wherein the vacuum chamber 2 is arranged in the sealed shell 4, the sealed vacuum chamber 2 is used for reducing energy loss of the resonator 1 caused by air damping, and the resonator 1 is arranged in the vacuum chamber 2; the getter 3 is generally arranged on the inner wall of the sealed shell 4, a space exists between the getter 3 and the harmonic oscillator 1, two pins 5 are arranged at two ends of the getter 3, and the two pins 5 are communicated with the outside of the vacuum chamber 2 through insulators 6 on the vacuum chamber 2, so that the getter 3 is conveniently electrified.
Based on the problems of overhigh internal temperature, product faults and the like of the hemispherical resonator gyroscope caused by lack of heat conduction paths in the hemispherical resonator gyroscope vacuum chamber, the embodiment provides a hemispherical resonator gyroscope getter heat dissipation device, which comprises: the wrapped getter heat collecting/conducting device 8 and the water cooling system are shown in fig. 2, the wrapped getter heat collecting/conducting device 8 is welded on the inner wall of the sealed shell 4 of the hemispherical resonator gyro through brazing, and the melting temperature of brazing solder is higher than the highest activation temperature of the getter 3, so that when the getter 3 is activated, the temperature inside the hemispherical resonator gyro is increased, and the wrapped getter heat collecting/conducting device 8 is not melted.
The wrapping type getter heat collecting/conducting device 8 is far away from the internal components of the hemispherical resonator gyro, namely, is separated from the internal components of the hemispherical resonator gyro by a certain distance, and the design ensures that the heat absorbed by the wrapping type getter heat collecting/conducting device 8 cannot be quickly dissipated into the vacuum chamber, so that the internal components of the hemispherical resonator gyro are damaged.
In a preferred embodiment, the wrapped getter heat collecting/conducting device 8 is a column, the left and right ends of the column are equal in size and shape, the bottom of the column is a rectangular base, and a plane 9 is included above the column (the plane 9 serves as a means for sticking a platinum resistor for measuring temperature and measuring thermal resistance).
In a preferred embodiment, the wrapped getter heat collection/conduction device 8 is internally provided with circular through holes.
The getter 3 is wrapped in the circular through hole of the wrapped getter heat collecting/conducting device 8, and the getter 3 is in non-contact with the inner wall of the wrapped getter heat collecting/conducting device 8; the getter 3 comprises two pins 5, the two pins 5 of the getter 3 respectively protruding from the two ends of the through hole of the wrapped getter heat collecting/conducting means 8 and being led outside the vacuum chamber 2 through insulators 6 on the sealed housing 4, so as to energize the getter 3. The insulator 6 on the sealed shell 4 is a metal tube, the dimension of the metal tube just can wrap the pin 5, and when the power is on, the insulator 6 is used as a channel for internal and external electric signals. There is one deck glass between insulator 6 and the sealed shell in order to realize with sealed shell insulation, guarantees vacuum chamber 2's gas tightness simultaneously, when adding the current signal for pin 5, because glass's effect, sealed shell is in the safe state of no electric current all the time, can not cause the influence to sealed shell 4.
In a preferred embodiment, the circular through-hole radius of the wrapped getter heat collection/conduction device 8 is larger than the outer diameter of the getter 3, so that the getter 3 can be wrapped inside the through-hole without contact of the getter 3 with the inner wall of the hole, facilitating gas release when the getter 3 is activated.
In an alternative embodiment, the heat collecting/conducting device 8 of the wrapped getter is a semicircular cavity, the circular bottom surface is welded on the inner wall of the sealed shell 4 of the hemispherical resonator gyro, the semicircular cavity is a semicircular cavity, and the size of the cavity is larger than the volume of the getter 3 so as to accommodate the getter 3 and block the heat of the getter 3; two small holes are formed in the circular cavity, and two pins 5 of the getter 3 are led to the outside of the vacuum chamber 2 through the small holes and an insulator 6 on the sealed shell 4; a plane 9 is arranged above the cavity, and the plane 9 is used for pasting a temperature measuring platinum resistor for testing thermal resistance.
The roles of the wrapped getter heat collection/conduction device 8 include: 1) The radiation heat of the getter is captured and collected in a wrapping mode, so that the heat is prevented from radiating outwards, and particularly the radiation of the heat to the direction of an internal device is prevented; 2) The collected heat is conducted to the enclosure 4.
In a preferred embodiment, the wrapped getter heat collection/conduction device 8 is fabricated from an oxygen free copper material having a high thermal conductivity.
In a preferred embodiment, the shape of the wrapped getter heat collecting/conducting device 8 is a D-shaped column, as shown in fig. 2, and a circular through hole is arranged in the middle of the D-shaped column, the radius of the circular through hole is larger than the outer diameter of the getter 3, so that the getter 3 can be wrapped inside the through hole, and the getter 3 is not contacted with the inner wall of the circular through hole, and a plane with the largest surface area on the D-shaped column is welded on the inner wall of the sealed shell 4 of the hemispherical resonator gyro. Preferably, the D-shaped column is dimensioned: length L, width W, height H, and circular via diameter D, as shown in fig. 3.
Alternatively, the shape of the wrapped getter heat collection/conduction device 8 may be chosen other than the shape described in the above embodiments, but must have the following two characteristics: characteristic one: the getter 3 is wrapped/shielded as much as possible, so that the radiation heat of the getter is captured and collected, the heat is prevented from radiating outwards, and the radiation of the heat to the direction of an internal device is particularly prevented; and the second characteristic is: there is a large contact area with the sealed housing 4 to facilitate rapid transfer of heat to the sealed housing 4.
In a preferred embodiment, the outer side of the bottom of the sealed housing 4 is provided with a protruding heat conducting fin/needle at a position corresponding to the wrapped getter heat collecting/conducting device 8, the heat conducting fin/needle is made of insulating high heat conductivity material, the heat conducting fin/needle is wrapped by the water cooling head 11 of the water cooling system, and the heat conducting fin/needle mainly acts to increase the contact area between the wrapped getter heat collecting/conducting device 8 and the circulating water flow, so that heat dissipation is quicker, and the heat on the heat conducting fin/needle is dissipated through the circulating water flow in the water cooling head 11.
The wrapped getter heat collection/conduction device 8 wraps the getter mostly, and the heat radiated during the activation of the getter is mostly absorbed by the device, avoiding the direct radiation of heat to other components. The temperature of the device will also rise after absorbing heat and become a new radiation source, and in order to control the temperature inside the hemispherical resonator gyro vacuum chamber to be at a low value, the temperature of the wrapped getter heat collection/conduction device 8 must be controlled below a low value, which depends on the thermal resistance formula:
where the thermal resistance R is defined as the ratio of the internal and external temperature difference to the power, T 1 is the temperature of the external surface of the sealed enclosure 4, T 2 is the temperature of the surface of the wrapped getter heat collection/conduction device 8, and P is the collected getter power. The thermal resistance R is dependent only on the physical structure and material properties of the heat conduction path and does not vary with power and temperature, so once determined by design, the internal temperature can be measured and controlled by the external temperature.
As shown in fig. 3, a platinum resistor was attached to the top surface 9 of the device and the outer surface of the sealed housing 4, and a heat source was provided by a power resistor instead of a getter, and the thermal resistance R from the heat collecting/conducting device to the outer surface of the sealed housing was measured to be 3.2 ℃/W.
When the getter is activated, the temperature T 1 of the outer surface of the sealed enclosure can be measured on-line, the getter heating power P can be calculated from the applied voltage and current, and the device surface temperature can be calculated from the heat collection/conduction device surface temperature formula assuming that all of this power is absorbed by the heat collection/conduction device:
T2＝T1+3.2P
After the wrapped getter heat collecting/conducting device 8 is adopted, the getter power is about 10W in the full power activation state, the surface temperature of the wrapped getter heat collecting/conducting device 8 is higher than the outer surface temperature of the sealed shell 4 by 32 ℃ according to the calculation, and the surface temperature of the wrapped getter heat collecting/conducting device 8 is highest, namely 62 ℃ and is far lower than the melting temperature of the solder at the welding point 7 under the condition that the outer surface temperature of the sealed shell 4 is controlled within 30 ℃, so that the activation process can be ensured not to lead to melting of the welding point. The heat collecting/conducting device 8 is of a wrapped structure, the body of the getter 3 is mostly wrapped, a heat radiation channel is blocked, and heat absorbed by the wrapped getter heat collecting/conducting device 8 is guided to the sealed shell 4 through the contact of the structural body and the shell in a large area, so that heat collection and conduction are realized, and heat diffused into the gyroscope is greatly reduced.
With the heat conduction to the top shell, the temperature of the top shell is gradually increased, and if the heat cannot be emitted, the internal temperature of the top is gradually raised, and the natural air conduction and convection heat dissipation are insufficient to ensure that the internal temperature of the top is not overrun due to the fact that the contact area of the top shell and the air is not large. The test of the activation process shows that if the shell is only exposed to room temperature air during the activation process, natural heat dissipation is realized by utilizing air conduction and convection, and the temperature of the shell exceeds 130 ℃ during the activation of the full power 10W. According to a thermal resistance formula, the internal temperature of the gyroscope exceeds 162 ℃, and the vibrator welding point still can be possibly caused to melt, so that the shell temperature is further reduced by adopting the water cooling system, the water cooling system takes away and radiates the shell heat of the gyroscope through water circulation with high efficiency, the shell temperature of the gyroscope is reduced, and the internal temperature of the gyroscope is indirectly reduced and controlled to a safe value lower than the melting point and melting temperature.
As shown in fig. 4, the water cooling system comprises a water cooling head 11, a circulating pump 12, a liquid storage device 13, a radiator 14 and a silica gel pipeline 15, wherein the water cooling head 11 is attached to the outer wall of one side of a sealed housing 4 of the wrapped getter heat collecting/conducting device 8 by heat conduction silicone grease, and two pipeline interfaces are arranged on the water cooling head 11; the circulating pump 12 is arranged at one side of the liquid storage device 13 and communicated with the liquid storage device, and two pipeline interfaces are arranged on the circulating pump 12; the heat sink 14 includes metal fins 16, a fan 17, and two tube interfaces.
In a preferred embodiment, the water-cooling head 11 is made of a high thermal conductivity red copper material.
The silica gel pipeline 15 comprises a first silica gel pipeline, a second silica gel pipeline and a third silica gel pipeline, and is connected with one of pipeline interfaces of the water cooling head 11 and one of pipeline interfaces of the circulating pump 12 through a silica gel pipe to form the first silica gel pipeline; the other pipeline interface of the water cooling head 11 is connected with one of the pipeline interfaces on the radiator 14 through a silica gel pipe to form a second silica gel pipeline; the other pipeline interface of the radiator 14 and the other pipeline interface of the circulating pump 12 are connected through a silica gel pipe to form a third silica gel pipeline.
The heat on the sealed housing 4 and the wrapped getter heat collection/conduction device 8 is conducted by the water cooling head 11 into the water flow inside the water cooling head 11, and the circulation pump 12 pumps the heated water in the water cooling head out and into the radiator. The heat dissipation gas transfers the heat in the water to the metal fins 16 with a large surface area inside, the fan 17 blows air to discharge the heat of the metal fins into the air, the temperature of the water is reduced back to the liquid reservoir after the heat dissipation, and then the water is sent to the water cooling head again to complete a cycle.
The water cooling heat dissipation system takes liquid as a medium, takes away heat of the hemispherical resonator gyro sealed shell 4 and efficiently dissipates the heat into the air, and the heat dissipation efficiency is high. Through practical tests, the shell temperature can be stably kept within 5 ℃ above room temperature when the getter is activated at full power. As can be seen from the surface temperature formula of the heat collecting/conducting device, when the full power is activated in the environment of room temperature and 25 ℃, the temperature of the wrapped getter heat collecting/conducting device 8 in the hemispherical resonator gyroscope is about 62 ℃, and the temperature of any part in the gyroscope is not higher than the temperature, so that the safety of the internal structure is ensured.
A hemispherical resonator gyroscope getter heat dissipation method, including but not limited to the following:
1. getter activation is first performed: the conventional step-activation method is generally determined based on the temperature of the getter, and thus requires much data to be measured and has poor controllability because the getter is inside the closed casing, and there is a great difficulty in determining the temperature of the getter or the inside of the closed casing. Based on the above, the invention adopts a hemispherical resonator gyro getter activation method, as shown in fig. 5, comprising the following steps: the getter is successively applied with an initial current of 2A and then successively increased by 0.5A up to the limit current, comprising in particular: applying a first current to the insulator 6 of the sealed shell 4 for first activation, wherein the first applied current is 2A, observing air pressure change after power-up, releasing air more and more quickly and exceeding the exhaust speed of the vacuum pump along with the rise of the heating temperature of the getter by electric power, gradually increasing the air pressure during the process, when the release of the getter is completed quickly, the exhaust speed is faster than the release speed, the air pressure is changed from increasing to reducing, starting timing by taking an air pressure turning point in the vacuum chamber 2 as a sign, waiting for 30 seconds to be powered off, and ending the first activation process; when the air pressure in the vacuum chamber 2 is lower than 1×10 －5 Pa, starting to apply a second current to the insulator 6 of the sealed shell 4, wherein the second applied current is 2.5A, starting to count time by taking the air pressure turning point in the vacuum chamber 2 as a mark, waiting for 30 seconds, powering off, and ending the second activation process; … … and so on, when the last activation is performed, the power is turned off when the gas pressure is substantially close to the gas pressure before the first activation, ensuring thorough activation of the getter. The step-by-step activation method of the invention keeps the maximum air pressure in the activation process above 1X 10 －3 Pa, and the vacuum system operates steadily.
The step-by-step activation method only takes the air pressure and the time as the step-by-step activation criteria, and the air pressure in the vacuum chamber is easy to measure, so that the activation method is simpler in operation, less in measured value, time-saving and labor-saving, and has certain advantages. The step-by-step activation method is taken as a measure for controlling the internal temperature of the vacuum chamber in the whole activation process, can reduce the temperature of the sealed shell to control the temperature of the vacuum chamber, limit the temperature of the vacuum chamber within a safe value, and protect the device of the hemispherical resonator gyroscope.
2. In the process of activating the getter, the temperature of the sealed shell 4 is measured, when the temperature of the outer surface of the sealed shell 4 reaches a threshold value, the circulating pump 12 and the radiator 14 of the water cooling system are turned on, the heat on the sealed shell 4 is dissipated to the environment due to the effect of water circulation, and the temperature inside the sealed shell 4 is controlled to be always kept within a safe temperature range for enabling the hemispherical resonator gyro to work normally.
Further, in a preferred embodiment, one way of determining the threshold value includes: threshold = solder melting temperature of solder joint 7-30-k, k is a safe temperature difference, and 5< k <15.
The above technical solution only represents the preferred technical solution of the present application, and some changes that may be made by those skilled in the art to some parts of the technical solution represent the principles of the present application, and the technical solution falls within the scope of the present application.
In the description of the present application, it should be understood that the terms "coaxial," "bottom," "one end," "two ends," "top," "middle," "other end," "upper," "one side," "inner," "front," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and are not to be construed as limiting the present application.
Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," and "third" may explicitly or implicitly include at least one such feature.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A hemispherical resonator gyro getter heat sink comprising: the device is characterized in that the wrapped getter heat collecting/conducting device (8) is soldered on the inner wall of the sealed shell (4) of the hemispherical resonator gyroscope; the wrapped getter heat collection/conduction device (8) is far away from the internal components of the hemispherical resonator gyroscope; the getter (3) is wrapped in the wrapped getter heat collecting/conducting device (8), and the getter (3) is in non-contact with the inner wall of the wrapped getter heat collecting/conducting device (8); the getter (3) comprises two pins (5), and the two pins (5) of the getter (3) respectively extend out of two ends of a through hole of the wrapping type getter heat collecting/conducting device (8); the two pins (5) are communicated with the outside of the vacuum chamber (2) through insulators (6) on the sealed shell (4); the water cooling system is arranged at the outer side of the sealed shell (4) of which the inner wall is welded with the wrapped getter heat collecting/conducting device (8), and takes away and radiates heat in the hemispherical resonator gyro sealed shell (4) through water flow circulation;
The outside of the bottom of the sealed shell (4) is provided with a convex heat conducting fin/needle at a position corresponding to the wrapped getter heat collecting/conducting device (8), the heat conducting fin/needle is made of insulating high-heat-conductivity materials, the heat conducting fin/needle is wrapped by a water cooling head (11) of a water cooling system, and the heat on the heat conducting fin/needle is dissipated through water flow in the water cooling head (11).
2. A getter heat sink device for hemispherical resonator gyroscopes according to claim 1, in which the heat collecting/conducting means (8) of the wrapped getter is a cylinder, a plane with the largest surface area of the cylinder being welded to the inner wall of the sealed housing (4) of the hemispherical resonator gyroscope, and a plane (9) being included above the cylinder.
3. A hemispherical resonator gyro getter heat sink according to claim 1, characterized in that the inside of the wrapped getter heat collecting/conducting means (8) is provided with a circular through hole, and the radius of the circular through hole is larger than the outer diameter of the getter (3) so as to wrap the getter (3) inside the circular through hole but not in contact with the inner wall of the circular through hole.
4. A hemispherical resonator gyro getter heat sink according to claim 1, characterized in that the wrapped getter heat collecting/conducting means (8) is made of oxygen free copper material with high thermal conductivity.
5. The hemispherical resonator gyro getter heat dissipation device according to claim 1, wherein the water cooling system comprises a water cooling head (11), a circulating pump (12), a liquid reservoir (13), a radiator (14) and a silica gel pipeline (15), the water cooling head (11) is attached to the outer wall of one side of a sealed shell (4) of the inner wall of which the wrapped getter heat collection/conduction device (8) is welded through heat conduction silicone grease, and two pipeline interfaces are arranged on the water cooling head (11); the circulating pump (12) is arranged at one side of the liquid storage device (13) and communicated with the liquid storage device, and two pipeline interfaces are arranged on the circulating pump (12); the radiator (14) comprises a metal fin (16), a fan (17) and two pipeline interfaces.
6. The hemispherical resonator gyro getter heat sink device according to claim 5, wherein the water-cooled head (11) is made of a high thermal conductivity red copper material.
7. The hemispherical resonator gyro getter heat dissipation device according to claim 5, wherein the silica gel pipeline (15) comprises a first silica gel pipeline, a second silica gel pipeline and a third silica gel pipeline, and the first silica gel pipeline is formed by connecting pipeline interfaces on the water cooling head (11) and the circulating pump (12) through the silica gel pipeline; the second silica gel pipeline is formed by connecting pipeline interfaces on the water cooling head (11) and the radiator (14) through a silica gel pipe; and a third silica gel pipeline is formed by connecting a pipeline interface on the radiator (14) and the circulating pump (12) through a silica gel pipe.
8. A hemispherical resonator gyro getter heat dissipation method, characterized in that the hemispherical resonator gyro getter heat dissipation device is the hemispherical resonator gyro getter heat dissipation device according to any one of claims 1-7; the method comprises the following steps:
S1, activating a getter: the getter is successively applied with an initial current of 2A and then successively increased by 0.5A up to the limit current, comprising in particular: applying a first current to an insulator (6) of the sealed shell (4) for first activation, wherein the first applied current is 2A, starting timing by taking a mark when an air pressure turning point appears in the vacuum chamber (2) as a mark, waiting for 30 seconds for power-off, and ending the first activation process; when the air pressure in the vacuum chamber (2) is lower than 1 multiplied by 10 －5 Pa, starting to apply a second current on an insulator (6) of the sealed shell (4), wherein the second applied current is 2.5A, starting to count time by taking an air pressure turning point in the vacuum chamber (2) as a mark, waiting for 30 seconds to cut off power, and ending the second activation process; … … and so on, when the last activation is performed, the power is cut off when the air pressure is basically close to the air pressure before the first activation, so that the getter is ensured to be thoroughly activated;
S2, in the getter activation process, the temperature of the sealed shell (4) is measured, and when the temperature of the sealed shell (4) reaches a threshold value, a circulating pump (12) and a radiator (14) of the water cooling system are turned on, and heat on the sealed shell (4) is emitted to the environment due to the circulation of water flow.
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| CN115727828A (en) * | 2022-11-21 | 2023-03-03 | 中国船舶集团有限公司第七〇七研究所 | Device for detecting internal vacuum degree of resonant gyroscope and vacuum exhaust and packaging method |
| CN118533160B (en) * | 2024-07-24 | 2024-09-24 | 四川图林科技有限责任公司 | Hemispherical resonant gyro system for temperature calibration and compensation |
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