TWM613564U - Heat source simulation structure - Google Patents

Abstract

A heat source simulation structure, including a heating element and a heating element thermally coupled to each other to form a simulated heat source body, the simulated heat source body is covered with an insulating shell and a heating substrate to prevent heat dissipation, and one end of the heating element is electrically connected to an external power supply In order to heat the heating element, the side of the heating element corresponding to the heating element is provided with a thermocouple element, and a temperature monitoring interface is used to connect a data acquisition instrument to record the temperature of the upper surface of the heating element. The thermal insulation design around the main structure of the simulated heat source can reduce the contact thermal resistance between the heating element and the heating element, so as to reduce the heat loss of the simulated structure of the heat source, thereby improving the measurement accuracy and reliability.

Description

Heat source simulation structure

This creation is related to a heat source technology field, especially a heat source simulation structure.

In recent years, the rapid development of science and technology, the high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits, the power of the equipment increases with the improvement of performance, and the heat generated per unit volume is also getting higher and higher. Therefore, the problem of heat dissipation becomes more and more important. Since the performance of high heat sources is an important factor affecting the results of heat exchange experiments, in order to ensure that electronic devices work normally and are not affected by thermal energy, it is extremely important to conduct simulated heat source tests for the performance of high heat source products in advance.

The current heat source simulation devices used to simulate the heating of electronic devices use ceramic heaters, heating wires and heating blocks to form a heat source device to simulate whether the heat of the electronic devices is all taken away by the heat transfer device, but due to the aforementioned structure and material Inconsistent, the entire heating structure is not a co-capacitance design with average heating, but is generated by each heating module. It is difficult for the heat transfer between the heating structure and the heat sink to reach a steady state, resulting in large heat transfer losses, etc. Disadvantages affect everything, causing the measurement result to be inconsistent with the actual heat dissipation of the electronic device, and the error is large, which affects the accuracy and reliability of the measurement.

Furthermore, since the heating device itself in the above test method also has a certain heat dissipation effect, part of the heating is radiated by the heating device, so the accuracy of the measurement result is also affected.

Therefore, how to solve the above-mentioned problems and deficiencies of the heating device is equivalent to solving the heat generation of electronic devices such as chips, which is the direction that the creators of this case and related manufacturers in this industry want to study and improve.

In order to improve the above-mentioned problems, one purpose of this creation is to simulate the main body of the heat source by thermally coupling the heating element and the heating element with each other, surrounded by a shell with insulating properties and a heating substrate to wrap heat insulation to prevent the main body of the heat source from dissipating heat (heat radiation) And environmental radiation) to reduce the heat loss of the heat source simulation structure, or the heating element can be properly heated by the heating element to control the heating amount of the heating element for temperature compensation to control the influence of the measurement result, thereby improving the accuracy and reliability of the measurement Sex.

Another purpose of this creation is to connect the heating element and the heating element by welding to prevent the two from generating large contact thermal resistance, and the structure is simple and easy to operate.

Another purpose of this creation is that the heat source simulation structure can be used independently or simultaneously with the test platform.

In order to achieve the above-mentioned purpose, this creation provides a heat source simulation structure, which includes: a bearing body on which a temperature monitoring interface is arranged; a shell correspondingly covered on the bearing body, between the shell and the bearing body Jointly define an accommodating space; and a heat source main body, including: a heating element accommodated in the accommodating space, at least one perforation is provided on one side of the heating element; at least one heating element, one end of the heating element is provided in the heating element In the perforation of the body, the other end of the heating element exposes the shell and is electrically connected to an external power supply to heat the heating element; at least one thermocouple element is provided on the side of the heating element corresponding to the heating element.

The aforementioned carrier includes a base and a heating substrate arranged on one side of the base, the temperature monitoring interface is arranged on the base, and the accommodating space is located between the housing and the heating substrate.

After one end of the aforementioned heating element is provided in the perforation of the heating element, the connection part is connected by welding.

A heating wire is provided in the heating body.

The aforementioned heating element and heating element are made of high temperature resistant materials.

The aforementioned heating element and heating element are made of copper or stainless steel.

The aforementioned heating element is an electric heating tube or a heating rod.

The aforementioned temperature monitoring interface is electrically connected to a data acquisition instrument to record the temperature of the upper surface of the heating element.

The aforementioned housing and heating substrate are made of high-temperature resistant insulating materials.

The aforementioned shell and heating substrate are made of glass fiber, which has the function of heat insulation and insulation.

The aforementioned shell is arranged on the side of the heating element away from the base for insulation and heat conduction.

The size and area of the aforementioned heating element and the number of heating elements are specifically designed according to the size of the heating power and the specific requirements of the size and shape of the wafer.

The direction of the perforation on the heating element is along the length direction of the base, or the direction of the perforation is along the width direction of the base.

The aforementioned heat source simulation structure can be used alone or in synchronization with a test platform.

100: Heat source simulation device

1: Carrier

11: Base

11a: Top surface

111: Temperature monitoring unit interface

112: Assembly part (such as assembly groove or assembly hole)

12: Heating the substrate

121: The first plate

122: second plate

R1: drop section

13: shell

131: Shell bottom frame

132: Shell cover

133: accommodation space

134: The first gap

135: The second gap

R2: Limiting part

136: display hole

2: The main body of the heat source

21: heating element

211: fever block

212: Fever core

213: Piercing

214: mounting hole

22: heating element

221: first end

222: second end

23: Heating wire (heating resistance wire)

24: Thermocouple element

Figure 1 is a three-dimensional combination diagram of the simulation structure of the creative heat source; Figures 2A and 2B are the three-dimensional exploded views of two embodiments of the simulation structure of the creative heat source; Figures 3 and 4 are the combination of the simulation structure of the heat source shown in Figure 1. Partial cross-sectional view;

The above-mentioned purpose of this creation and its structural and functional characteristics will be described based on the preferred and specific embodiments of the accompanying drawings.

Please refer to Figure 1 for the three-dimensional assembly diagram of the creative heat source simulation structure; Figures 2A and 2B are the three-dimensional exploded views of two embodiments of the creative heat source simulation structure; Figures 3 and 4 are the heat source simulation structure shown in Figure 1. Sectional view of the combined part. As shown in the figure, the creative heat source simulation device 100 includes a carrier 1, a housing 13 and a heat source main body 2. Wherein, the carrier 1 includes a base 11 and a heating substrate 12, that is, as shown in FIG. 2A, the base 11 and the heating substrate 12 may be integrally formed into the carrier 1, or may be formed separately as shown in FIG. 2B The base 11 and the heating substrate 12, and then the base 11 and the heating substrate 12 are sequentially stacked from below to top to form the carrier 1. The foregoing structure is described in detail as follows.

The base 11 has a top surface 11a on which a temperature monitoring interface 111 and an assembling portion 112 are provided. In this embodiment, the assembling portion 112 is, for example, an assembling groove, an assembling hole, or the like.

The heating substrate 12 is arranged on one side of the top surface 11a of the base 11. The heating substrate 12 has a first plate 121 and a second plate 122 located on one side of the first plate 121, and the second plate The longitudinal cross-sectional area of 122 is smaller than the longitudinal cross-sectional area of the first plate 121, so that the second plate 122 and the first plate 121 form at least one drop section at the junction of the two (two drop sections in this creation) ) R1, and the drop sections R1 are respectively adjacent to the left and right sides of the second plate 122.

The shell 13 includes a hollow shell bottom frame 131 and a hollow shell cover 132 connected to the top of the shell bottom frame 131. The interior between the shell bottom frame 131 and the shell cover 132 jointly defines an accommodating space 133, And on the same side of the shell bottom frame 131 and the shell cover 132, a first notch 134 (located in the shell bottom frame 31) and a second notch 135 (located in the shell cover 132) are respectively opened. However, it includes but does not limit whether the first gap 134 and the second gap 135 are connected.

In this embodiment, the shell bottom frame 131 corresponds to the two sides of the first notch 134 to form two opposite limit parts R2, as shown in FIGS. 2A and 2B, the first notch 134 can accommodate the heating The second plate 122 of the substrate 12, the two limiting portions R2 are used for correspondingly limiting the two drop sections R1 between the first plate 121 and the second plate 122. A display hole 136 is defined on the top surface of the cover 132 of the housing 13, and the display hole 136 is connected to the receiving space 133, so that the housing 13 can be covered outside the heating substrate 12.

The aforementioned heating substrate 12 and the housing 13 may be made of high-temperature resistant insulating materials. Further, the materials of the heating substrate 12 and the shell 13 include but are not limited to glass fiber with low thermal conductivity; preferably, the glass fiber has insulation, high temperature resistance, and corrosion resistance characteristics, so that the heating substrate 12 and the shell 13 It has the function of heat insulation and insulation.

The aforementioned temperature monitoring interface 111 can be electrically connected to a data acquisition instrument to record the temperature of the upper surface of the heating element 21 of the heat source main body 2.

The heat source main body 2 is used to be arranged in the containing space 133 of the housing 13. The heat source main body 2 includes a heating element 21, at least one heating element 22 and at least one thermocouple element 24.

In this embodiment, the heating element 21 includes a heating block 211 and a heating core 212 stacked from bottom to top. As shown in Figures 2A and 2B, a side surface of the heating block 211 is recessed with a through hole 213 corresponding to the heating element 22 for inserting and positioning one end of the heating element 22; the heating core 212 is arranged on the top of the heating block 211 The cross-sectional area of the heating core 212 is at least equal to the diameter of the display hole 136 of the housing 13, and a mounting hole 214 is recessed at a specific position on a side surface of the heating core 212. Specifically, the perforation 213 of the heating block 211 and the mounting hole 214 of the heating core 212 are located on the same side, and both can correspond to the second notch 135 of the cover 132 of the housing 13.

Further, in order to increase the heating speed of the heating block 211 and maintain its own heat, as shown in Figures 3 and 4, the heating block 211 is embedded with heating wires (or heating resistance wires) 23, or the heating block 211 is provided with a hole into which the heating wire 23 can be inserted. In this embodiment, the heating wire 23 is not limited to its number and the position inside the heating block 211; and it includes, but is not limited to, high temperature resistant Fe-Cr-Al alloy heating wire and Ni-Cr alloy heating wire or others.

The heating element 22 includes, but is not limited to, an electric heating tube or a heating rod. It has a first end 221 and a second end 222 opposite to the first end 221. The heating element 22 is accommodated behind the perforation 213 of the heating block 211 with the first end 221, and the connection between the first end 221 and the perforation 213 can be welded together to prevent the heating element 22 from being combined with the perforation 213. The heating element 21 generates a large contact thermal resistance. The second end 222 of the heating element 22 corresponds to the housing 13 and can be appropriately exposed outside the second notch 135 of the housing cover 132, and the lead wires can be appropriately extended with positive and negative electrodes for Electrically connected to an external power supply (not shown in the figure), through the external power supply, most of the heat in the heating element 22 is transferred to the heating element 21 to heat the heating element 21, and the external power supply is controlled The voltage mode can control the heating element 22 (electric heating tube or heating rod) heating and power can be corrected in time, so as to obtain a heating mode equivalent to electronic devices such as IGBT, diode and high-power amplifier MOSFET.

One end of the thermocouple element 24 is installed in the mounting hole 214 on a side surface of the heating core 212 and located on the side of the heating element 21 away from the heating element 22. The thermocouple element 24 is used to measure the temperature of the heating element 21 and can be accurately monitored. The thermocouple element 24 includes, but is not limited to, different depth designs arranged in the heating element 21.

In more detail, in order to accurately monitor the temperature of the heating block 211, the mounting hole 214 on one side of the heating core 212 is set to correspond to the thermocouple element 24 and has a similar outer diameter design, which can be used for one end of the thermocouple element 24. And the mounting hole 214 is located at the edge of the heating core 212 and extended to the center. The mounting hole 214 in the center provides insertion of the thermocouple element 24 and is used to measure the heating core 212 close to the central surface. Temperature, the mounting hole 214 at the edge is usually used as an auxiliary.

The aforementioned heating element 21 and heating element 22 can be made of high-temperature resistant materials. Further, the materials of the heating element 21 and the heating element 22 include but are not limited to copper or stainless steel.

The extension direction of the perforation 213 on the heating element 21 is set to be along the length direction of the base 11, or the extension direction of the perforation 213 is set to be along the width direction of the base 11.

The size and area of the heating element 21 and the number of heating elements 22 are specifically designed according to the specific requirements of the size of the heating power and the size and shape of the wafer or other electronic devices. For example, put about 0.5mm~3mm or others on the basis of the wafer size.

The aforementioned thermocouple elements 24 include but are not limited to a plurality of thermocouple elements 24. One end of each thermocouple element 24 of the plurality of thermocouple elements 24 is inserted into the mounting hole 214 on one side of the heating core 212. The plurality of thermocouple elements 24 are arranged in the heating element 21 with different depth designs.

Accordingly, through the combination of the above-mentioned components, as shown in FIGS. 1 to 4, the heating substrate 12 is provided on the top surface of the base 11, and then the heating element 21 is stacked on the heating substrate 12 with its bottom surface. , Continue to house the first end 221 of the heating element 22 in the perforation 213 of the heating block 211 and then connect the two by welding (coupling), so that the heating element 22 is connected to the heating block 211, and the One end of the thermocouple element 24 is installed in the mounting hole 214 on one side of the heating core 212 of the heating element 21, and the assembly is constituted as the main body of the heat source. The housing 13 is accommodated in an accommodating space 133 and covered on the outside of the heating element 21 and the heating substrate 12, and the housing 13 is fixed to the top surface 11a of the base 11 with a housing bottom frame 131 through a screw lock. The second end 222 of the heating element 22 and the other end of the thermocouple element 24 are exposed outside the second notch 135 of the cover 132 of the housing 13. In addition, the second end 222 of the heating element is exposed outside the housing 13 and is electrically connected to the external power supply to heat the heating element 21. The thermocouple element 24 is used to measure the temperature of the heating element 21 and the other end is exposed. It is beneficial to accurately monitor the temperature value. Furthermore, the temperature monitoring interface 111 is used to connect a data acquisition instrument to record the temperature of the upper surface of the heating element. Thereby, the heat source body 2 is configured to have thermal conductivity and insulation properties, which can reduce the contact thermal resistance between the heating element and the heating element, and the exterior is covered by the housing 13 and the heating substrate 12 so as to have insulation, heat preservation and heat insulation properties, thereby It can prevent the main body of the heat source from dissipating heat, thereby improving the accuracy and reliability of the measurement.

The creative heat source simulation structure 100 can be used alone or in synchronization with a test platform.

The following is a more specific explanation with reference to Figures 1 to 4: using the above-mentioned component and structural design and related experimental tests and analysis, the heat loss (Q loss/heat loss) of the created heat source simulation structure 100 is less than (<) 4%, This is of great significance for improving the credibility and accuracy of experimental data. The specific connection relationship and requirements between them are shown in Table 1 and Table 2:

In this creation, the heating element 22 and the heating element 21 with heat conduction function are coupled and connected to form the simulated heat source main body 2 to prevent large contact thermal resistance, and the heat source main body 2 is surrounded by glass fiber with low thermal conductivity characteristics to make the shell 13 and heat it. The substrate 12 is wrapped and insulated to prevent heat dissipation (heat radiation, and environmental radiation) from the heating element 22 and the heating element 21, and the heat loss of the heat source simulation structure 100 is obtained through measurement and analysis Disability is controlled within 4%. The measurement analysis is to use the thermocouple element 24 to measure the temperature of the heating element 21 and to accurately monitor the temperature value, and the temperature monitoring interface 111 is electrically connected to a data acquisition instrument to record the upper surface of the heating element (heating surface). ) Temperature obtained, thereby improving the accuracy and reliability of the measurement. And the structure is simple and easy to operate.

During the measurement, the temperature of the heating body 21 is measured by thermocouple elements 24 arranged at different depths and different radial positions, and a data collector can be electrically connected to the temperature monitoring interface 111 to record the heating of the heating body 21 For example, when detecting the temperature value of the heating element 21, if the value has a sudden rise point, adjust the heating power of the heating element 22 and the heating wire 23 so that the heat transfer of the heating element 21 to the wafer is equal to that of the wafer. The heat dissipation of the environment finally realizes the mechanism of compensating the heat dissipation loss of the chip, avoiding the influence of the heat loss of the heating element 21 on the measurement result, thereby improving the accuracy and reliability of the measurement.

This creation has been described in detail above, but what is described above is only a preferred embodiment of this creation, and should not limit the scope of implementation of this creation. That is to say, all equal changes and modifications made in accordance with the scope of the application for this creation shall still fall within the scope of the patent for this creation.

100: Heat source simulation device

11: Base

11a: Top surface

111: Temperature monitoring unit interface

122: second plate

131: Shell bottom frame

132: Shell cover

136: display hole

212: Fever core

214: mounting hole

Claims (12)

A heat source simulation structure, comprising: a bearing body on which a temperature monitoring interface is arranged; a shell correspondingly covered on the bearing body, the shell and the bearing body jointly define an accommodating space; and a heat source The main body includes: a heating element arranged in the accommodating space, one side of the heating element is provided with at least one perforation; at least one heating element, one end of the heating element is arranged in the perforation of the heating element, and the heating element is another One end exposes the shell and is electrically connected to an external power supply to heat the heating element; at least one thermocouple element is arranged on the side of the heating element corresponding to the heating element. According to the heat source simulation structure described in claim 1, wherein the carrier includes a base and a heating substrate arranged on one side of the base, the temperature monitoring interface is arranged on the base, and the containing space is located in the housing And the heating substrate. As for the heat source simulation structure described in item 1 of the scope of patent application, after one end of the heating element is provided in the perforation of the heating body, the connection is joined by welding. In the heat source simulation structure described in item 1 of the scope of patent application, a heating wire or a heating resistance wire is provided in the heating body. The heat source simulation structure as described in item 1 of the scope of patent application, wherein the heating element and the heating body are made of high temperature resistant materials. For the heat source simulation structure described in item 1 of the scope of patent application, the heating element and the heating element are made of copper or stainless steel. According to the heat source simulation structure described in item 1 of the scope of patent application, the heating element is an electric heating tube or a heating rod. In the heat source simulation structure described in item 1 of the scope of patent application, the temperature monitoring interface is electrically connected to a data acquisition instrument to record the temperature of the upper surface of the heating element. According to the heat source simulation structure described in item 1 of the scope of patent application, the housing and the heating substrate are made of high-temperature resistant insulating materials. As for the heat source simulation structure described in item 1 of the scope of patent application, the shell and the heating substrate are made of glass fiber, which has heat insulation and insulation functions. According to the heat source simulation structure described in item 1 of the scope of patent application, the shell is arranged on the side of the heating element away from the base for insulation and conduction of heat. Such as the heat source simulation structure described in item 1 of the scope of patent application, the heat source simulation structure can be used alone or simultaneously with a test platform.

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