CN112782215A - Novel thermal resistance test fixture for electronic element - Google Patents
Novel thermal resistance test fixture for electronic element Download PDFInfo
- Publication number
- CN112782215A CN112782215A CN202011583135.7A CN202011583135A CN112782215A CN 112782215 A CN112782215 A CN 112782215A CN 202011583135 A CN202011583135 A CN 202011583135A CN 112782215 A CN112782215 A CN 112782215A
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- China
- Prior art keywords
- guide rail
- sliding block
- thermal resistance
- resistance test
- conductive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/20—Investigating or analyzing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a novel electronic element thermal resistance test fixture, and belongs to the technical field of electronic element thermal resistance tests. The novel electronic element thermal resistance test fixture comprises a base, a sliding block guide rail and a cover plate; the base is of a square structure, and the slide block guide rail is placed in the center of the base; the cover plate is placed above the sliding block guide rail, and two sides of the cover plate are fixed through a front guide rail positioning block and a rear guide rail positioning block respectively; a plurality of conductive sliding blocks are connected in the inner guide rails on the two sides of the sliding block guide rail in a sliding manner; each conductive sliding block is vertically and fixedly connected with a conductive sliding block rod; and a component fixing sliding block is arranged in the sliding block guide rail, and a screw rod is vertically and fixedly connected to the fixing sliding block. The novel electronic element thermal resistance test fixture does not need to weld pins through contact connection, improves the thermal resistance test efficiency of the electronic element, and avoids the occurrence of contact short circuit between adjacent pins of the electronic element.
Description
Technical Field
The invention relates to the technical field of electronic element thermal resistance testing, in particular to a novel electronic element thermal resistance testing clamp.
Background
Thermal resistance, which is one of the important parameters for measuring the heat dissipation performance of an electronic component, has a very important significance for the reliability of the whole electronic component. The thermal resistance is defined as the ratio of the temperature difference of the junction and the shell to the power of the electronic element, and when the thermal resistance of the electronic element is tested and calculated, the electronic element shell is contacted with an object with high thermal conductivity, so that the temperature of the electronic element shell is kept as constant as possible. When the thermal resistance test of the electronic element is carried out, because the distance between adjacent pins of the electronic element is very small, leads are required to be welded on the pins under normal conditions, and the welding easily causes the welding contact of the adjacent pins, so that the short circuit of the electronic element is caused, and the test cannot be carried out.
Disclosure of Invention
In order to solve the problem of the welding contact short circuit, the invention aims to provide a novel electronic element thermal resistance test fixture, which improves the thermal resistance test efficiency of an electronic element and avoids the contact short circuit between adjacent pins of the electronic element.
In order to solve the technical problem, the invention provides a novel electronic element thermal resistance test fixture, which comprises a base, a slider guide rail and a cover plate, wherein the base is provided with a plurality of through holes;
the base is of a square structure, and the slide block guide rail is placed in the center of the base;
the cover plate is placed above the sliding block guide rail, and two sides of the cover plate are fixed through a front guide rail positioning block and a rear guide rail positioning block respectively;
a plurality of conductive sliding blocks are connected in the inner guide rails on the two sides of the sliding block guide rail in a sliding manner;
each conductive sliding block is vertically and fixedly connected with a conductive sliding block rod;
and a component fixing sliding block is arranged in the sliding block guide rail, and a screw rod is vertically and fixedly connected to the fixing sliding block.
Optionally, the slider guide rail is provided with a cavity at the top and bottom, the side edge is provided with a joint guide rail hole, and the external joint on the conductive slider moves back and forth along the joint guide rail hole.
Optionally, a copper sheet is arranged inside the external connector, so that the external connector is convenient to contact with the electronic element.
Optionally, the copper sheet is a conductive copper sheet, and the exterior of the conductive copper sheet is wrapped with an insulating heat-resistant material.
Optionally, the conductive slider rod penetrates through the slider guide rail, and is fixedly connected with a pull rod handle at the tail end, and the position of the conductive slider in the inner guide rail is adjusted by pulling the pull rod handle.
Optionally, the component fixing sliding blocks are provided with two groups, one group is fixedly connected with the sliding block guide rail, and the other group is fixedly connected with the screw rod.
Optionally, the screw rod is connected with a positioning nut in a threaded manner, and the positioning nut is screwed to drive the component fixing sliding block to slide in the sliding block guide rail.
Optionally, strip-shaped protrusions are designed on both sides of the lower surface of the cover plate, and the length of the strip-shaped protrusions is consistent with that of the movement path of the conductive sliding block in the sliding block guide rail.
The novel clamp for testing the thermal resistance of the electronic element comprises a base, a sliding block guide rail and a cover plate, wherein the base is provided with a first guide rail and a second guide rail; the base is of a square structure, and the slide block guide rail is placed in the center of the base; the cover plate is placed above the sliding block guide rail, and two sides of the cover plate are fixed through a front guide rail positioning block and a rear guide rail positioning block respectively; a plurality of conductive sliding blocks are connected in the inner guide rails on the two sides of the sliding block guide rail in a sliding manner; each conductive sliding block is vertically and fixedly connected with a conductive sliding block rod; and a component fixing sliding block is arranged in the sliding block guide rail, and a screw rod is vertically and fixedly connected to the fixing sliding block. The novel electronic element thermal resistance test fixture does not need to weld pins through contact connection, improves the thermal resistance test efficiency of the electronic element, and avoids the occurrence of contact short circuit between adjacent pins of the electronic element.
Drawings
FIG. 1 is a schematic diagram of an overall structure of a novel thermal resistance test fixture for electronic components according to the present invention;
fig. 2 is a schematic diagram of an internal structure of the novel electronic component thermal resistance test fixture provided by the invention.
Detailed Description
The following describes a novel thermal resistance test fixture for electronic components in detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The invention provides a novel electronic element thermal resistance test fixture, the structure of which is shown in figures 1 and 2, and the fixture comprises a base 1, a slide block guide rail 2 and a cover plate 3; the base 1 is of a square structure, and the slide block guide rail 2 is placed in the center of the base 1; the cover plate 3 is placed above the slider guide rail 2, and two sides of the cover plate are fixed through a front guide rail positioning block 6 and a rear guide rail positioning block 8 respectively; a plurality of conductive sliding blocks 4 are connected in the inner guide rails on the two sides of the sliding block guide rail 2 in a sliding manner; each conductive sliding block 4 is vertically and fixedly connected with a conductive sliding block rod 9; a component fixing slide block 10 is arranged in the slide block guide rail 2, and a screw rod 7 is vertically and fixedly connected to the fixing slide block 10.
Specifically, the slide block guide rail 2 is provided with a cavity up and down, the side edge is provided with a joint guide rail hole, and the external joint on the conductive slide block 4 moves back and forth along the joint guide rail hole; a copper sheet is arranged inside the external joint, so that the external joint is convenient to contact with an electronic element; the copper sheet is a conductive copper sheet, and an insulating heat-resistant material is wrapped outside the copper sheet; the conductive sliding block rod 9 penetrates through the sliding block guide rail 2, the tail end of the conductive sliding block rod is fixedly connected with a pull rod handle, and the position of the conductive sliding block 4 in the inner guide rail is adjusted by pulling the pull rod handle; two groups of component fixing sliding blocks 10 are arranged, one group is fixedly connected with the sliding block guide rail 2, and the other group of component fixing sliding blocks 10 fixedly connected with the screw 7 are in sliding connection with the sliding block guide rail 2; a positioning nut 5 is connected to the screw 7 in a threaded manner, and the component fixing slide block 10 can be driven to slide in the slide block guide rail 2 by screwing the positioning nut 5, so that the electronic component is fixed and positioned; strip-shaped bulges are designed on two sides of the lower surface of the cover plate 3, the length of the motion path of each strip-shaped bulge is consistent with that of the conductive sliding block 4 in the sliding block guide rail 2, and the electronic element is ensured to be in close contact with the conductive sliding block 4.
When the electronic component fixing device is used specifically, the cover plate 3 is opened, an electronic component is placed in the electronic component fixing device, the conductive sliding block rod 9 is adjusted to enable the conductive sliding block 4 to correspond to a contact pin of the electronic component, the conductive sliding block abuts against the component fixing sliding block 10 on the inner side of the sliding block guide rail 2, and the positioning screw 7 is rotated to push the component fixing sliding block 10 to fixedly clamp the electronic component in the axial direction; the cuboid protrusion on the lower surface of the cover plate 3 can realize the close contact between the conductive sliding block 4 and the electronic element pin.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (8)
1. A novel electronic component thermal resistance test fixture is characterized by comprising a base (1), a slide block guide rail (2) and a cover plate (3);
the base (1) is of a square structure, and the sliding block guide rail (2) is placed in the center of the base (1);
the cover plate (3) is placed above the sliding block guide rail (2), and two sides of the cover plate are fixed through a front guide rail positioning block (6) and a rear guide rail positioning block (8) respectively;
a plurality of conductive sliding blocks (4) are connected in the inner guide rails on the two sides of the sliding block guide rail (2) in a sliding manner;
each conductive sliding block (4) is vertically and fixedly connected with a conductive sliding block rod (9);
a component fixing slide block (10) is placed in the slide block guide rail (2), and a screw rod (7) is vertically and fixedly connected to the fixing slide block (10).
2. The novel clamp for testing the thermal resistance of the electronic component as claimed in claim 1, wherein the slider guide rail (2) is provided with a cavity up and down, the side edge of the slider guide rail is provided with a joint guide rail hole, and the external joint on the conductive slider (4) moves back and forth along the joint guide rail hole.
3. The novel thermal resistance test fixture for electronic components as claimed in claim 2, wherein the external connectors are internally provided with copper sheets for facilitating contact with the electronic components.
4. The novel thermal resistance test fixture for electronic components as claimed in claim 3, wherein the copper sheet is a conductive copper sheet, and is externally wrapped with an insulating heat-resistant material.
5. The novel thermal resistance test fixture for electronic components as claimed in claim 1, wherein the conductive slider rod (9) passes through the slider guide rail (2) and is fixedly connected with a pull rod handle at the tail end, and the position of the conductive slider (4) in the inner guide rail is adjusted by pulling the pull rod handle.
6. The novel thermal resistance test fixture for electronic components as claimed in claim 1, wherein two sets of the component fixing sliding blocks (10) are provided, one set is fixedly connected with the sliding block guide rail (2), and the other component fixing sliding block (10) fixedly connected with the screw (7) is slidably connected with the sliding block guide rail (2).
7. The novel thermal resistance test fixture for electronic components as claimed in claim 6, wherein a positioning nut (5) is connected to the screw (7) in a threaded manner, and the component fixing slider (10) can be driven to slide in the slider guide rail (2) by screwing the positioning nut (5).
8. The novel thermal resistance test fixture for electronic components as claimed in claim 1, wherein both sides of the lower surface of the cover plate (3) are designed with long-strip-shaped protrusions, and the long-strip-shaped protrusions are consistent with the length of the moving path of the conductive slider (4) in the slider guide rail (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011583135.7A CN112782215A (en) | 2020-12-28 | 2020-12-28 | Novel thermal resistance test fixture for electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011583135.7A CN112782215A (en) | 2020-12-28 | 2020-12-28 | Novel thermal resistance test fixture for electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112782215A true CN112782215A (en) | 2021-05-11 |
Family
ID=75753001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011583135.7A Pending CN112782215A (en) | 2020-12-28 | 2020-12-28 | Novel thermal resistance test fixture for electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112782215A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397325A (en) * | 2022-01-20 | 2022-04-26 | 淮安永捷电子科技有限公司 | Device and method for detecting heat dissipation performance of electronic capacitor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103884876A (en) * | 2014-03-31 | 2014-06-25 | 工业和信息化部电子第五研究所 | Electronic element thermal resistance measurement clamp |
| CN110231498A (en) * | 2019-07-17 | 2019-09-13 | 安徽三优光电科技有限公司 | A kind of SMD encapsulation semiconductor devices thermo-resistance measurement fixture |
| CN111103521A (en) * | 2019-12-27 | 2020-05-05 | 中国电子科技集团公司第十三研究所 | Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device |
| CN211206580U (en) * | 2019-11-30 | 2020-08-07 | 穆棱市北一半导体科技有限公司 | Thermal resistance test fixture for electronic element |
| CN211709087U (en) * | 2018-11-21 | 2020-10-20 | 天津百腾信科技有限公司 | Thermal resistance measuring clamp of silicon carbide semiconductor element |
| CN212060009U (en) * | 2020-04-15 | 2020-12-01 | 中科瑞测（天津）科技有限公司 | Clamping device for transient thermal resistance test |
-
2020
- 2020-12-28 CN CN202011583135.7A patent/CN112782215A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103884876A (en) * | 2014-03-31 | 2014-06-25 | 工业和信息化部电子第五研究所 | Electronic element thermal resistance measurement clamp |
| CN211709087U (en) * | 2018-11-21 | 2020-10-20 | 天津百腾信科技有限公司 | Thermal resistance measuring clamp of silicon carbide semiconductor element |
| CN110231498A (en) * | 2019-07-17 | 2019-09-13 | 安徽三优光电科技有限公司 | A kind of SMD encapsulation semiconductor devices thermo-resistance measurement fixture |
| CN211206580U (en) * | 2019-11-30 | 2020-08-07 | 穆棱市北一半导体科技有限公司 | Thermal resistance test fixture for electronic element |
| CN111103521A (en) * | 2019-12-27 | 2020-05-05 | 中国电子科技集团公司第十三研究所 | Clamp for testing junction-to-shell thermal resistance of SMD packaged semiconductor device |
| CN212060009U (en) * | 2020-04-15 | 2020-12-01 | 中科瑞测（天津）科技有限公司 | Clamping device for transient thermal resistance test |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114397325A (en) * | 2022-01-20 | 2022-04-26 | 淮安永捷电子科技有限公司 | Device and method for detecting heat dissipation performance of electronic capacitor |
| CN114397325B (en) * | 2022-01-20 | 2023-03-24 | 淮安永捷电子科技有限公司 | Device and method for detecting heat dissipation performance of electronic capacitor |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210511 |
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| RJ01 | Rejection of invention patent application after publication |