CN211709087U - Thermal resistance measuring clamp of silicon carbide semiconductor element - Google Patents
Thermal resistance measuring clamp of silicon carbide semiconductor element Download PDFInfo
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- CN211709087U CN211709087U CN201821921869.XU CN201821921869U CN211709087U CN 211709087 U CN211709087 U CN 211709087U CN 201821921869 U CN201821921869 U CN 201821921869U CN 211709087 U CN211709087 U CN 211709087U
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- fixed
- pressure head
- thermal resistance
- semiconductor element
- sucker
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Abstract
The utility model discloses a thermal resistance measuring clamp of a silicon carbide semiconductor element, which comprises an insulating pressure head A, a measuring mechanism and a device fixing mechanism, wherein the insulating pressure head A is arranged at one side of the measuring mechanism, the device fixing mechanism is arranged at four corner positions of the lower surface of the measuring mechanism, the inner part of the insulating pressure head A is movably connected with an adjusting plate, one end of the lower surface of the adjusting plate is fixedly connected with an insulating pressure head B, and one end of the upper surface of the adjusting plate is fixedly connected with a fixing rod; through having designed the insulating pressure head B of installing at the inside regulating plate and the regulating plate lower surface one end of insulating pressure head A and insulating pressure head A of adjusting screw one end, the fixed semiconductor component of being convenient for has solved current silicon carbide semiconductor component's thermal resistance and has measured anchor clamps in the use, and its insulating pressure head A structure is fixed, can't have more semiconductor component's size to adjust to can't stabilize fixed problem.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor, concretely relates to carborundum semiconductor element's thermal resistance measurement anchor clamps.
Background
A semiconductor refers to a material having a conductivity between a conductor and an insulator at normal temperature. The semiconductor has wide application in radio, television and temperature measurement. Such as diodes, are devices fabricated using semiconductors. Semiconductor refers to a material whose conductivity can be controlled, ranging from an insulator to a conductor. The importance of semiconductors is enormous, both from a technological and economic point of view. Most of today's electronic products, such as computers, mobile phones or digital audio recorders, have a core unit closely related to semiconductors. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
The existing thermal resistance measuring clamp for the silicon carbide semiconductor element is fixed in shape of an insulating pressure head, so that the thermal resistance measuring clamp cannot be adjusted according to the size of the semiconductor element, the semiconductor element cannot be effectively and stably fixed, and the existing thermal resistance measuring clamp for the silicon carbide semiconductor element cannot be stably fixed on a table top, so that the thermal resistance measuring clamp for the silicon carbide semiconductor element is easy to slip and shake in the using process.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a carborundum semiconductor element's thermal resistance measurement anchor clamps, to solve the thermal resistance measurement anchor clamps that propose current carborundum semiconductor element among the above-mentioned background art because its insulating pressure head shape of itself is fixed, thereby can't adjust according to semiconductor element's size, lead to its unable effective and stable fixed semiconductor element, and current carborundum semiconductor element's thermal resistance measurement anchor clamps can not be stable fix on the desktop, thereby lead to its slippage easily appearing in the use, rock.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a carborundum semiconductor element's thermal resistance measurement anchor clamps, includes insulating pressure head A, measuring mechanism and device fixed establishment, insulating pressure head A installs the one side at measuring mechanism, device fixed establishment installs four turning positions departments of lower surface at measuring mechanism, insulating pressure head A's inside swing joint has the regulating plate, the insulating pressure head B of lower surface one end fixedly connected with of regulating plate, the upper surface one end fixedly connected with dead lever of regulating plate, and the regulating plate passes through dead lever swing joint with insulating pressure head A, the one end fixedly connected with fixation nut of dead lever, the one end fixedly connected with spring of regulating plate, and spring and insulating pressure head A fixed connection.
Preferably, measuring mechanism includes adjusting screw, fixed spring, fixed block, regulation branch and base, and adjusts branch and base fixed connection, the fixed block with adjust branch sliding connection, adjusting screw and fixed block fixed connection, fixed spring and fixed block and the equal fixed connection of regulation branch.
Preferably, device fixed establishment includes sucking disc ejector pin, fixed suction cup, fixed cover and sucking disc spring, and sucking disc ejector pin and base fixed connection, sucking disc ejector pin and fixed suction cup fixed connection, the equal fixed connection of sucking disc spring and fixed cover and base, and fixed cover passes through fixed suction cup spring coupling with the base.
Preferably, the front surface and the rear surface of the insulation pressure head A are both provided with rectangular grooves, and the upper surface of the insulation pressure head A is provided with rectangular holes.
Preferably, the lower surface of the insulation pressure head B and the lower surface of the insulation pressure head A are on the same horizontal line.
Preferably, the fixing sleeve is in the shape of a hollow cylinder, and the outer diameter of the fixing sleeve is equal to that of the sucker spring.
Preferably, the outer diameter of the fixed sucker is equal to eight times of the zero point of the inner diameter of the fixed sleeve.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) through having designed the insulating pressure head B of installing at the inside regulating plate and the regulating plate lower surface one end of insulating pressure head A and insulating pressure head A of adjusting screw one end, the fixed semiconductor component of being convenient for has solved current silicon carbide semiconductor component's thermal resistance and has measured anchor clamps in the use, and its insulating pressure head A structure is fixed, can't have more semiconductor component's size to adjust to can't stabilize fixed problem.
(2) The whole device is convenient to fix by designing the sucker ejector rod, the fixed sucker, the sucker spring and the fixed sleeve which are arranged on the lower surface of the base, and the problem that the thermal resistance measuring clamp of the existing silicon carbide semiconductor element is easy to slide in the using process so as to influence the measurement is solved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic side sectional view of a part of an insulation pressure head a of the present invention;
fig. 3 is a schematic side sectional view of the fixing sleeve of the present invention;
in the figure: 1. adjusting the screw rod; 2. fixing the spring; 3. a fixed block; 4. adjusting branches; 5. a base; 6. fixing a sleeve; 7. an insulation pressure head A; 8. fixing a nut; 9. an adjusting plate; 10. an insulating pressure head B; 11. a spring; 12. fixing the rod; 13. a sucker ejector rod; 14. fixing the sucker; 15. a sucker spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a carborundum semiconductor element's thermal resistance measurement anchor clamps, including insulating pressure head A7, measuring mechanism and device fixed establishment, one side at measuring mechanism is installed to insulating pressure head A7, device fixed establishment installs four corner position departments of lower surface at measuring mechanism, insulating pressure head A7's inside swing joint has regulating plate 9, the insulating pressure head B10 of lower surface one end fixedly connected with of regulating plate 9, the upper surface one end fixedly connected with dead lever 12 of regulating plate 9, and regulating plate 9 passes through dead lever 12 swing joint with insulating pressure head A7, the one end fixedly connected with fixation nut 8 of dead lever 12, the one end fixedly connected with spring 11 of regulating plate 9, and spring 11 and insulating pressure head A7 fixed connection.
In order to measure the thermal resistance of the semiconductor element, in this embodiment, preferably, the measuring mechanism includes an adjusting screw 1, a fixing spring 2, a fixing block 3, an adjusting branch 4 and a base 5, the adjusting branch 4 is fixedly connected to the base 5, the fixing block 3 is slidably connected to the adjusting branch 4, the adjusting screw 1 is fixedly connected to the fixing block 3, and the fixing spring 2 is fixedly connected to both the fixing block 3 and the adjusting branch 4.
In order to fix the whole device conveniently, in this embodiment, preferably, the device fixing mechanism includes a suction cup ejector rod 13, a fixed suction cup 14, a fixed sleeve 6 and a suction cup spring 15, the suction cup ejector rod 13 is fixedly connected with the base 5, the suction cup ejector rod 13 is fixedly connected with the fixed suction cup 14, the suction cup spring 15 is fixedly connected with the fixed sleeve 6 and the base 5, and the fixed sleeve 6 is connected with the base 5 through the fixed suction cup spring 15.
In order to facilitate the movement of the adjusting plate 9, in the embodiment, it is preferable that the front surface and the rear surface of the insulation pressing head a7 are both provided with rectangular grooves, and the upper surface of the insulation pressing head a7 is provided with a rectangular hole.
In order to facilitate the fixing of the semiconductor element, in the present embodiment, it is preferable that the lower surface of the insulation tap B10 be on the same horizontal line as the lower surface of the insulation tap a 7.
In order to facilitate the fixed connection with the suction cup spring 15, in the present embodiment, it is preferable that the fixing sleeve 6 is shaped as a hollow cylinder, and the outer diameter of the fixing sleeve 6 is equal to the outer diameter of the suction cup spring 15.
In order to facilitate the retraction of the inside of the pouch 6, in this embodiment, the fixed suction cup 14 preferably has an outside diameter equal to eight times the inside diameter of the pouch 6.
The utility model discloses a theory of operation and use flow: after the device is installed, the device is placed at a designated position through the base 5, then the base 5 is pressed downwards, at the moment, the sucker spring 15 receives downward pressure and contracts, so that the fixed sucker 14 extends out of the inside of the fixed sleeve 6 and is adsorbed at the designated position, the whole device is fixed, then the fixed nut 8 is rotated, the adjusting plate 9 can slide in the insulating pressure head A7, due to the existence of the spring 11, after the fixed nut 8 rotates and loosens, the adjusting plate 9 can automatically pop out, then the distance between the two insulating pressure heads B10 is adjusted according to the length and the size of a semiconductor to be fixed, after the adjustment is completed, the adjusting plate 9 is fixed through the fixed nut 8, finally the insulating pressure head A7 and the two insulating pressure heads B10 can be adjusted through the adjusting screw rod 1 to fix the semiconductor element and measure the thermal resistance of the semiconductor element, when the device is not needed to be used, the adjusting plate 9 is pressed, so that the adjusting plate 9 is accommodated in the insulating pressure head A7 and is fixed by rotating the fixing nut 8, and due to the existence of the sucker spring 15, when the device is not used, the fixing sucker 14 cannot suck and fix the device, so that the carrying of the device cannot be influenced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a carborundum semiconductor element's thermal resistance measurement anchor clamps, includes insulating pressure head A (7), measuring mechanism and device fixed establishment, its characterized in that: insulating pressure head A (7) are installed in one side of measuring mechanism, device fixed establishment installs four corner positions of lower surface at measuring mechanism department, the inside swing joint of insulating pressure head A (7) has regulating plate (9), the insulating pressure head B (10) of lower surface one end fixedly connected with of regulating plate (9), the upper surface one end fixedly connected with dead lever (12) of regulating plate (9), and regulating plate (9) and insulating pressure head A (7) pass through dead lever (12) swing joint, the one end fixedly connected with fixation nut (8) of dead lever (12), the one end fixedly connected with spring (11) of regulating plate (9), and spring (11) and insulating pressure head A (7) fixed connection.
2. The thermal resistance measuring jig for a silicon carbide semiconductor element according to claim 1, characterized in that: measuring mechanism includes adjusting screw (1), fixed spring (2), fixed block (3), adjusts branch (4) and base (5), and adjusts branch (4) and base (5) fixed connection, fixed block (3) and regulation branch (4) sliding connection, adjusting screw (1) and fixed block (3) fixed connection, fixed spring (2) and fixed block (3) and the equal fixed connection of regulation branch (4).
3. The thermal resistance measuring jig for a silicon carbide semiconductor element according to claim 2, characterized in that: the device fixing mechanism comprises a sucker ejector rod (13), a fixed sucker (14), a fixed sleeve (6) and a sucker spring (15), the sucker ejector rod (13) is fixedly connected with the base (5), the sucker ejector rod (13) is fixedly connected with the fixed sucker (14), the sucker spring (15) is fixedly connected with the fixed sleeve (6) and the base (5), and the fixed sleeve (6) is connected with the base (5) through the fixed sucker spring (15).
4. The thermal resistance measuring jig for a silicon carbide semiconductor element according to claim 1, characterized in that: the front surface and the rear surface of the insulation pressure head A (7) are provided with rectangular grooves, and the upper surface of the insulation pressure head A (7) is provided with rectangular holes.
5. The thermal resistance measuring jig for a silicon carbide semiconductor element according to claim 1, characterized in that: the lower surface of the insulation pressure head B (10) and the lower surface of the insulation pressure head A (7) are on the same horizontal line.
6. The thermal resistance measuring jig for a silicon carbide semiconductor element according to claim 3, characterized in that: the shape of the fixed sleeve (6) is a hollow cylinder, and the outer diameter of the fixed sleeve (6) is equal to that of the sucker spring (15).
7. The thermal resistance measuring jig for a silicon carbide semiconductor element according to claim 3, characterized in that: the outer diameter of the fixed sucker (14) is equal to eight times of the zero point of the inner diameter of the fixed sleeve (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821921869.XU CN211709087U (en) | 2018-11-21 | 2018-11-21 | Thermal resistance measuring clamp of silicon carbide semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821921869.XU CN211709087U (en) | 2018-11-21 | 2018-11-21 | Thermal resistance measuring clamp of silicon carbide semiconductor element |
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| Publication Number | Publication Date |
|---|---|
| CN211709087U true CN211709087U (en) | 2020-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821921869.XU Active CN211709087U (en) | 2018-11-21 | 2018-11-21 | Thermal resistance measuring clamp of silicon carbide semiconductor element |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112782216A (en) * | 2020-12-29 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Thermal resistance test fixture for flip chip packaging |
| CN112782215A (en) * | 2020-12-28 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Novel thermal resistance test fixture for electronic element |
-
2018
- 2018-11-21 CN CN201821921869.XU patent/CN211709087U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112782215A (en) * | 2020-12-28 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Novel thermal resistance test fixture for electronic element |
| CN112782216A (en) * | 2020-12-29 | 2021-05-11 | 中国电子科技集团公司第五十八研究所 | Thermal resistance test fixture for flip chip packaging |
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