CN110839335B - Novel heat pipe and energy storage material-based power amplifier heat dissipation device - Google Patents
Novel heat pipe and energy storage material-based power amplifier heat dissipation device Download PDFInfo
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- CN110839335B CN110839335B CN201911164864.6A CN201911164864A CN110839335B CN 110839335 B CN110839335 B CN 110839335B CN 201911164864 A CN201911164864 A CN 201911164864A CN 110839335 B CN110839335 B CN 110839335B
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- heat pipe
- storage material
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- 238000004146 energy storage Methods 0.000 title claims abstract description 44
- 239000011232 storage material Substances 0.000 title claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 32
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 230000008859 change Effects 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 239000006260 foam Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 19
- 239000007790 solid phase Substances 0.000 claims abstract description 15
- 238000005338 heat storage Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 9
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 claims abstract description 6
- 239000012188 paraffin wax Substances 0.000 claims abstract description 6
- 239000011148 porous material Substances 0.000 claims description 21
- 230000005494 condensation Effects 0.000 claims description 20
- 238000009833 condensation Methods 0.000 claims description 20
- 238000001704 evaporation Methods 0.000 claims description 17
- 230000008020 evaporation Effects 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 9
- 238000005057 refrigeration Methods 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000005470 impregnation Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000012782 phase change material Substances 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 239000002131 composite material Substances 0.000 abstract 1
- 239000012071 phase Substances 0.000 description 10
- 239000007791 liquid phase Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a power amplifier heat dissipation device based on a novel heat pipe and an energy storage material, which comprises a high-efficiency heat conduction and heat storage device, a heat management control device and an auxiliary heat dissipation device, wherein the high-efficiency heat conduction and heat storage device comprises a power amplifier, a T-shaped heat pipe, an aluminum cold plate and the energy storage material; the energy storage material comprises a foam metal framework and a solid phase change material, wherein the solid phase change material is a composite phase change material such as paraffin, aliphatic hydrocarbon and the like. The thermal management control device comprises a temperature sensor and a thermal management controller; the auxiliary heat dissipation device comprises a fan base and a fan; the invention can lead out the heat generated by the power amplifier in a short time and further store the heat into the energy storage material of the aluminum cold plate, thereby ensuring that the power amplifier can be kept to operate in a safe temperature range within a certain time; meanwhile, the heat is stored in the phase change material, so that the influence of the working environment on the heat dissipation process of the power amplifier can be reduced, and the power amplifier can be recycled.
Description
Technical Field
The invention belongs to the field of engineering application power amplifier heat management, and particularly relates to a power amplifier heat dissipation device based on a novel heat pipe and an energy storage material.
Background
In the prior art, in general, a power amplifier module bonds several layers of circuits by a fusion bonding process, and the other side of the circuit is combined with a bottom metal plate to dissipate heat. Under the current application scenarios, it is required to ensure that the power amplifier keeps the normal working temperature within a short time of starting, i.e. a proper way needs to be found to conduct the heat generated by the power amplifier away from the surface as soon as possible. Among them, in recent years, heat pipes have been widely paid attention to and studied for their heat conduction characteristics even better than those of pure metals; the phase-change energy storage method utilizes the latent heat of the material during phase change to store energy, and has the characteristic of high heat storage efficiency. Accordingly, phase change energy storage materials are attracting more and more attention from researchers.
The phase change energy storage materials can be mainly classified into solid-liquid phase change and solid-solid phase change according to phase change forms. The solid-liquid phase change material is the most widely applied phase change material due to the larger phase change latent heat and the wider phase change temperature range, but has fluidity and is easy to leak after absorbing heat and changing phase into liquid phase, and the solid-liquid phase change material needs to be packaged in practical application. In addition, another problem commonly existing in solid-liquid phase change materials is that the heat conductivity coefficient is small, the heat exchange performance is poor, and the application of the phase change materials in the heat storage field is restricted.
Disclosure of Invention
The invention aims to: the invention aims to effectively carry out heat management on a power amplifier, and as in certain special working environments, the power amplifier needs to be ensured to keep the temperature in a proper range in short-time high-load working, and the heat generated by the power amplifier cannot be quickly conducted away by the heat dissipation of a fusion bonding process in the prior art; aiming at the defects of the prior art, the invention provides the power amplifier radiating device based on the novel heat pipe and the energy storage material, and the system has the advantages of simple and stable structure, high radiating and cooling efficiency and high safety, and can monitor the radiating condition of the system.
The technical scheme is as follows: in order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows: the power amplifier heat dissipation device based on the novel heat pipe and the energy storage material comprises a heat conduction and heat storage device, a heat management control device and an auxiliary heat dissipation device, wherein the heat conduction and heat storage device comprises a T-shaped heat pipe (101), a power amplifier (102), an aluminum cold plate (103) and the energy storage material (104); the thermal management control device comprises a temperature collector (201) and a thermal management controller (202); the auxiliary heat dissipation device comprises a fan (301) and a fan base (302);
the T-shaped heat pipe (101) comprises an evaporation end (105) and a condensation end (108), the power amplifier (102) is nested on the evaporation end (105) of the T-shaped heat pipe (101), and the condensation end (108) of the T-shaped heat pipe (101) is arranged in a caulking groove (110) at the upper part of the aluminum refrigeration plate (103); the aluminum cold plate (103) is internally and uniformly provided with pipelines (112), and the pipelines (112) are communicated with the bottom surface of the aluminum cold plate (103); a third pore canal (113) is uniformly distributed in the energy storage material (104), the third pore canal (113) penetrates through the energy storage material (104), the energy storage material (104) is positioned in the cavity of the aluminum refrigeration plate (103), and the third pore canal (113) is nested on the pipeline (112); the first pore channels (107) which are uniformly arranged on the condensation end (108) are correspondingly communicated with the third pore channel (113), and the lower frame of the aluminum cold plate (103) is fixedly connected with the fan base (302);
the temperature collector (201) is respectively connected with the thermal management controller (202) and the power amplifier (102), the other end of the thermal management controller (202) is connected with the fan (301), and the fan (301) is arranged inside the fan base (302).
Further, a second pore canal (109) is arranged at the joint of the evaporation end (105) and the condensation end (108) of the T-shaped heat pipe (101).
Further, the T-shaped heat pipe (101) is an integrally formed heat pipe. The size of the pore canal and the pipeline can be set according to the actual implementation.
Furthermore, the wick (106) inside the T-shaped heat pipe (101) is a copper net, the inside of the T-shaped heat pipe (101) is filled with acetone with the evaporation temperature of 50-60 ℃, and meanwhile, the contact area between the condensation end 108 and the aluminum refrigeration plate 103 can be increased due to the design.
Further, the energy storage material (104) is composed of a solid phase change material (114) and a foam metal framework (115), the foam metal framework (115) is composed of foam metal Cu with the porosity of 85% -95%, and the solid phase change material (114) is filled in the foam metal framework (115).
Further, the solid phase change material (114) is composed of a mixed working medium of paraffin and aliphatic hydrocarbon.
Further, the energy storage material (104) is manufactured by a vacuum impregnation method.
Further, the condensation end (108) of the T-shaped heat pipe (101) is sealed with the caulking groove (110) at the upper part of the aluminum cold plate (103) through heat conduction silica gel, and the heat conduction coefficient of the heat conduction silica gel is 3-5 W.m -1 ·K -1 。
Further, the thermal management controller (202) is configured with a chip, and processes signals transmitted by the temperature sensor by programming to determine whether to enable the fan (301) to assist in heat dissipation.
The beneficial effects are that: compared with the prior art, the technical scheme of the invention has the following beneficial technical effects:
the heat generated by the power amplifier can be exported in a short time by adopting the heat conduction-heat storage device and further transferred to the energy storage material in the cold plate, so that the power amplifier can be ensured to operate within a safe temperature range within a certain time; meanwhile, the heat management control device and the auxiliary heat dissipation device can further monitor the working temperature of the power amplifier in real time, so that the stability of the working temperature of the power amplifier is ensured, and the influence of the working environment on the heat dissipation process of the power amplifier can be reduced and the power amplifier can be recycled by storing heat in the phase-change material.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a cross-sectional layout view of a high efficiency thermal conduction-heat storage device;
FIG. 3 is a schematic cross-sectional view of a T-shaped heat pipe;
FIG. 4 is a schematic cross-sectional view of an aluminum cold plate;
FIG. 5 is a schematic cross-sectional view of an energy storage material;
FIG. 6 is a schematic diagram of an auxiliary heat sink;
reference numeral component description: the heat pipe comprises a 101-T-shaped heat pipe, a 102-power amplifier, a 103-aluminum cold plate, a 104-energy storage material, a 105-evaporation end, a 106-liquid suction core, a 107-first pore canal, a 108-T-shaped heat pipe condensation end, a 109-second pore canal, a 110-caulking groove, a 111-cavity at the lower part of the aluminum cold plate, a 112-pipeline, a 113-third pore canal, a 114-solid phase change material, a 115-foam metal framework, a 201-temperature collector, a 202-heat management controller, a 301-fan, a 302-fan base and a 303-mounting point on the fan base.
Detailed Description
The invention is further described in detail below with reference to the accompanying drawings.
As shown in fig. 1, the heat dissipation device of the power amplifier based on the novel heat pipe and the energy storage material comprises a heat conduction-heat storage device, a heat management control device and an auxiliary heat dissipation device, wherein the heat conduction-heat storage device comprises a T-shaped heat pipe (101), a power amplifier (102), an aluminum cold plate (103) and the energy storage material (104); the thermal management control device comprises a temperature collector (201) and a thermal management controller (202); the auxiliary heat dissipation device comprises a fan (301) and a fan base (302);
the T-shaped heat pipe (101) comprises an evaporation end (105) and a condensation end (108), the power amplifier (102) is nested on the evaporation end (105) of the T-shaped heat pipe (101), and the condensation end (108) of the T-shaped heat pipe (101) is arranged in a caulking groove (110) at the upper part of the aluminum refrigeration plate (103); the aluminum cold plate (103) is internally and uniformly provided with pipelines (112), and the pipelines (112) are communicated with the bottom surface of the aluminum cold plate (103); a third pore canal (113) is uniformly distributed in the energy storage material (104), the third pore canal (113) penetrates through the energy storage material (104), the energy storage material (104) is positioned in the cavity of the aluminum refrigeration plate (103), and the third pore canal (113) is nested on the pipeline (112); the first pore channels (107) which are uniformly arranged on the condensation end (108) are correspondingly communicated with the third pore channel (113), and the lower frame of the aluminum cold plate (103) is fixedly connected with the fan base (302);
the temperature collector (201) is respectively connected with the thermal management controller (202) and the power amplifier (102), the other end of the thermal management controller (202) is connected with the fan (301), and the fan (301) is arranged inside the fan base (302).
The T-shaped heat pipe 101 serves to rapidly conduct heat generated by the power amplifier 102 away from the evaporating end 105 to the condensing end 108.
The aluminum cooling plate 103 is used for placing a plurality of T-shaped heat pipes 101 in the upper caulking groove 110, and sealing and storing energy material 104 in the lower cavity, wherein the number of T-shaped heat pipes 101 can be set according to the aluminum cooling plate 103.
The energy storage material 104 is comprised of a solid phase change material 114 and a foam metal skeleton 115. The solid phase change material 114 is composed of a mixed working fluid of paraffin and aliphatic hydrocarbon, and the solid phase change material 114 can improve the phase change latent heat, so that the working fluid in unit phase change volume stores more heat.
The foam metal skeleton 115 is filled with the solid phase change material 114, and the foam metal skeleton 115 is composed of foam metal Cu with the porosity of 85% -95%, so that the heat conductivity can be improved and the contact area of the phase change material can be increased.
The duct 107 on the T-shaped heat pipe 101 and the pipe 112 on the aluminum cold plate 103 function as a control line, and at the same time, the air convection heat dissipation effect can be increased when the auxiliary heat dissipation device is started.
As shown in fig. 1, the power amplifier 102 is nested in the evaporation end 105 of the T-shaped heat pipe 101, so that generated heat is rapidly conducted away, and the condensation end 108 of the T-shaped heat pipe 101 is positioned in the caulking groove 110 on the upper surface of the aluminum refrigeration plate 103 and is connected with the caulking groove through heat conduction silicone grease in a sealing manner; the power amplifier 102 generates a large amount of heat at the moment of starting, the evaporation end 105 of the T-shaped heat pipe 101 absorbs the heat, the working medium in the evaporation end changes phase from liquid state to gas state and moves to the condensation end 108, then the heat is taken away by the solid phase-change material 114 in the foam metal and stored in the energy storage material 104, the temperature of acetone vapor in the condensation end is reduced, phase-change condensation occurs again, and the acetone vapor flows back to the evaporation end through the copper mesh of the liquid suction core 106, so that the heat exchange process is completed. Meanwhile, the heat management control device and the auxiliary heat dissipation device can further monitor and regulate the working temperature of the power amplifier 102 in real time, so that the stability of the working temperature of the power amplifier 102 is ensured.
As shown in fig. 2-4, the T-shaped heat pipe 101 is provided with a hole 107 and a pipeline 112 on the aluminum cold plate 103 for the control circuit to pass through, wherein the hole 107 and the pipeline 112 are in one-to-one correspondence, and the hole 107 penetrates through the condensation end 108; the pipe 112 communicates with the bottom surface of the aluminum cold plate 103, i.e., uniform holes are formed in the bottom surface of the aluminum cold plate 103.
As shown in fig. 5, the foam metal skeleton 115 is composed of foam metal Cu with a porosity of 85% -95%, and is internally filled with a solid phase change material 114 composed of a mixed working substance of paraffin and aliphatic hydrocarbon.
As shown in fig. 3, the lower frame of the aluminum refrigeration plate 103 is fixed to the fan base 302 by screw connection, the fan 301 is connected to the thermal management control device, the management controller 202 is configured with a chip, and the signal transmitted from the temperature sensor is processed by programming to determine whether to enable the fan 301 to assist in heat dissipation. The mixed solid phase-change material filled with paraffin and aliphatic hydrocarbon has the advantage of large energy storage capacity because of large phase-change latent heat. Wherein, foam metal skeleton 115 adopts foam metal Cu, and foam metal Cu heat conductivity is good, promotes heat transfer efficiency by a wide margin. Therefore, the novel heat pipe and energy storage material-based power amplifier heat dissipation device has the advantages of simple system structure, high thermal stability and high heat exchange efficiency.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, and various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention are included in the protection scope of the present invention.
Claims (8)
1. The power amplifier heat dissipation device based on the novel heat pipe and the energy storage material is characterized by comprising a heat conduction and heat storage device, a heat management control device and an auxiliary heat dissipation device, wherein the heat conduction and heat storage device comprises a T-shaped heat pipe (101), a power amplifier (102), an aluminum cold plate (103) and the energy storage material (104); the thermal management control device comprises a temperature collector (201) and a thermal management controller (202); the auxiliary heat dissipation device comprises a fan (301) and a fan base (302);
the T-shaped heat pipe (101) comprises an evaporation end (105) and a condensation end (108), the power amplifier (102) is nested on the evaporation end (105) of the T-shaped heat pipe (101), and the condensation end (108) of the T-shaped heat pipe (101) is arranged in a caulking groove (110) at the upper part of the aluminum refrigeration plate (103); the aluminum cold plate (103) is internally and uniformly provided with pipelines (112), and the pipelines (112) are communicated with the bottom surface of the aluminum cold plate (103); a third pore canal (113) is uniformly distributed in the energy storage material (104), the third pore canal (113) penetrates through the energy storage material (104), the energy storage material (104) is positioned in the cavity of the aluminum refrigeration plate (103), and the third pore canal (113) is nested on the corresponding pipeline (112); the first pore channels (107) which are uniformly arranged on the condensation end (108) are correspondingly communicated with the third pore channel (113), and the lower frame of the aluminum cold plate (103) is fixedly connected with the fan base (302);
the temperature collector (201) is respectively connected with the thermal management controller (202) and the power amplifier (102), the other end of the thermal management controller (202) is connected with the fan (301), and the fan (301) is arranged in the fan base (302);
the thermal management controller (202) is provided with a chip, and a signal transmitted by the temperature sensor is processed by programming to determine whether the fan (301) is started to assist in heat dissipation.
2. The power amplifier heat dissipation device based on the novel heat pipe and the energy storage material as claimed in claim 1, wherein: the connection part of the evaporation end (105) and the condensation end (108) of the T-shaped heat pipe (101) is provided with a second pore canal (109) penetrating through the evaporation end (105).
3. A power amplifier heat sink based on a novel heat pipe and energy storage material according to claim 1 or 2, characterized in that the T-shaped heat pipe (101) is an integrally formed heat pipe.
4. The power amplifier heat dissipation device based on the novel heat pipe and the energy storage material as claimed in claim 1, wherein: the liquid suction core (106) inside the T-shaped heat pipe (101) is a copper net, and the inside of the T-shaped heat pipe (101) is filled with acetone with the evaporation temperature of 50-60 ℃.
5. The power amplifier heat dissipation device based on the novel heat pipe and the energy storage material as claimed in claim 1, wherein: the energy storage material (104) is composed of a solid phase change material (114) and a foam metal framework (115), wherein the foam metal framework (115) is composed of foam metal Cu with the porosity of 85% -95%, and the solid phase change material (114) is filled in the foam metal framework (115).
6. The power amplifier heat dissipation device based on the novel heat pipe and the energy storage material according to claim 5, wherein: the solid phase change material (114) is composed of a mixed working medium of paraffin and aliphatic hydrocarbon.
7. The power amplifier heat dissipation device based on the novel heat pipe and the energy storage material according to claim 5, wherein: the energy storage material (104) is manufactured by a vacuum impregnation method.
8. The power amplifier heat dissipation device based on the novel heat pipe and the energy storage material as claimed in claim 1, wherein: the condensation end (108) of the T-shaped heat pipe (101) and the caulking groove (110) at the upper part of the aluminum cold plate (103) are sealed by heat conduction silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164864.6A CN110839335B (en) | 2019-11-25 | 2019-11-25 | Novel heat pipe and energy storage material-based power amplifier heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911164864.6A CN110839335B (en) | 2019-11-25 | 2019-11-25 | Novel heat pipe and energy storage material-based power amplifier heat dissipation device |
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| CN110839335A CN110839335A (en) | 2020-02-25 |
| CN110839335B true CN110839335B (en) | 2024-03-19 |
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| CN110071348A (en) * | 2019-05-10 | 2019-07-30 | 佛山科学技术学院 | Based on the cooling power battery thermal management system of composite phase-change material and its application |
| CN211352892U (en) * | 2019-11-25 | 2020-08-25 | 东南大学 | Power amplifier heat dissipation device based on novel heat pipe and energy storage material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7002800B2 (en) * | 2002-01-25 | 2006-02-21 | Lockheed Martin Corporation | Integrated power and cooling architecture |
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2019
- 2019-11-25 CN CN201911164864.6A patent/CN110839335B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106033827A (en) * | 2015-03-18 | 2016-10-19 | 广东万锦科技股份有限公司 | Power battery thermal management system with functions of efficient heat dissipation and efficient heating |
| CN204760747U (en) * | 2015-07-20 | 2015-11-11 | 武汉博激世纪科技有限公司 | L type heat pipe laser instrument heat abstractor |
| CN108184320A (en) * | 2017-12-30 | 2018-06-19 | 广州程星通信科技有限公司 | A kind of radiator for power amplifier |
| CN109560306A (en) * | 2018-11-30 | 2019-04-02 | 东南大学 | A kind of Proton Exchange Membrane Fuel Cells phase-change accumulation energy system based on foam metal |
| CN110071348A (en) * | 2019-05-10 | 2019-07-30 | 佛山科学技术学院 | Based on the cooling power battery thermal management system of composite phase-change material and its application |
| CN211352892U (en) * | 2019-11-25 | 2020-08-25 | 东南大学 | Power amplifier heat dissipation device based on novel heat pipe and energy storage material |
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| CN110839335A (en) | 2020-02-25 |
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