CN212859772U

CN212859772U - Pressing die BT plate cutting channel structure

Info

Publication number: CN212859772U
Application number: CN202020526364.4U
Authority: CN
Inventors: 朱博
Original assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Current assignee: Yanheng Dongshan Precision Manufacturing Co ltd
Priority date: 2020-04-08
Filing date: 2020-04-08
Publication date: 2021-04-02
Anticipated expiration: 2030-04-08

Abstract

The utility model discloses a moulding-die BT board cutting path structure sets up cutting path distance from base plate edge certain distance, shortens the width of cutting path, and the base plate surface electroplates and forms the cutting path, and the thickness of cutting path is greater than base plate thickness, improves the excessive condition of gluing, and improves the identifiability of cutting path, the cutting machine discernment of being convenient for. Through the cutting path structure of the pressing die BT plate, the cutting path can be clearly identified by a machine table on the machine table, the glue overflow is improved, and the cost is saved.

Description

Pressing die BT plate cutting channel structure

Technical Field

The utility model relates to a show the relevant technical field of technique, more accurate saying so relates to a moulding-die BT board cutting way structure.

Background

The BT board is a special high-performance substrate material used for PCBs, and can be widely applied to high-density interconnection multilayer printed boards and packaging substrates which are gradually popular at present due to the high glass transition temperature, excellent dielectric properties, low thermal expansion rate, good mechanical characteristics and the like of the BT board. When the existing BT plate used as the backlight is designed, most of the BT plates are nickel-silver plates, black ink is covered on the edges, and cutting channels are designed around the edges of the plates. Edge covering with black ink sacrifices brightness and therefore white oil is preferred. But because the BT board cutting path structure of prior art adopts the color contrast of white and silver, can't discern the cutting path through adjusting light board in the cutting board, can lead to the cutting operation to go on difficultly. In addition, the BT plate in the prior art is easy to overflow glue into the cutting path in the compression molding process.

Specifically, as shown in fig. 1, a conventional cutting street structure of a die BT board is provided, where a cutting street 2 is located at an edge of a substrate 1, and a width of the cutting street 2 is 0.09 mm. The outer edge of the substrate 1 is plated with silver, and then the scribe line 2 is formed by etching. The substrate 1 is a white substrate, the cutting channel 2 formed after the edge silver plating etching is a white substrate, and silver is arranged around the cutting channel 2. In the prior art, the thickness of the cutting path 2 is smaller than the thickness of the surrounding cutting path, so that the colloid is easy to overflow to the cutting path 2 during pressing.

In summary, the cutting track structure of the BT board for pressing mold in the prior art is prone to cause glue overflow phenomenon during the pressing process, and generally has the problem of being difficult to be identified by the cutting machine, and needs to be improved.

SUMMERY OF THE UTILITY MODEL

In view of this, the main object of the present invention is to provide a pressing die BT board cutting path structure, which sets up a certain distance between the cutting path and the edge of the substrate, shortens the width of the cutting path, and electroplates the surface of the substrate to form the cutting path, the thickness of the cutting path is greater than the thickness of the substrate, the condition of glue overflow is improved, and the identifiability of the cutting path is improved, and the cutting machine identification is convenient.

In order to achieve the above object, the utility model provides a moulding-die BT board cutting path structure, including base plate and cutting path, the cutting path is located on the base plate, the cutting path with the edge of base plate is parallel, the cutting path with an edge portion has between the base plate edge.

Preferably, the width of the edge portion is 0.15 mm.

Preferably, the width of the cutting street is 0.05 mm.

Preferably, the cutting lines are made of silver, and a white substrate is arranged around the cutting lines.

Preferably, the thickness of the cutting path is larger than that of the substrate.

Compared with the prior art, the utility model discloses a moulding-die BT board cutting path structure's advantage lies in: through the cutting path structure of the pressing die BT plate, the cutting path can be clearly identified by a machine table on the machine table, the glue overflow is improved, and the cost is saved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic diagram illustrating a cutting lane structure of a die-pressed BT plate in the prior art.

Fig. 2 is a schematic view of a cutting path structure of a die BT board according to the present invention.

Detailed Description

As shown in fig. 2, the cutting street structure of the die-pressing BT board of the present invention comprises a substrate 10 and a cutting street 20, wherein the cutting street 20 is located on the substrate 10, the cutting street 20 is parallel to the edge of the substrate 10, and the cutting street 20 is not located on the edge of the substrate 10. That is, an edge 101 is formed between the scribe line 20 and the edge of the substrate 10.

Specifically, the linear distance between the scribe line 20 and the edge of the substrate 10 is preferably 0.15mm, that is, the width of the edge 101 is 0.15 mm.

The width of the cutting channel 20 is preferably 0.05mm, so that the die pressing glue is prevented from shielding the cutting channel 20.

The cutting street 20 is formed by etching after the cutting street is directly silvered according to the drawing. The cutting lines 20 are made of silver, white substrates are arranged around the cutting lines 20, and the cutting lines 20 are not covered with ink. The identifiability of the cutting street 20 is higher.

Since the cutting street 20 is plated on the surface of the substrate 10, the thickness of the cutting street 20 is greater than the thickness of the substrate 10. During pressing, the silver layer around the plate is stressed more and compacted more tightly, so that the colloid is prevented from overflowing to the periphery. Meanwhile, the width of the edge part 101 is increased due to the inward movement of the cutting channel 20, the compression is tighter during compression molding, and the colloid is not easy to overflow outwards.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cutting channel structure of a pressing die BT plate is characterized by comprising a substrate and a cutting channel, wherein the cutting channel is positioned on the substrate and is parallel to the edge of the substrate, and an edge part is arranged between the cutting channel and the edge of the substrate.

2. The die BT plate lane structure of claim 1, wherein the width of the edge portion is 0.15 mm.

3. The die BT plate cutting street structure of claim 1, wherein the width of the cutting street is 0.05 mm.

4. The die-pressed BT board cutting street structure according to claim 1 wherein the cutting street is silver and the periphery of the cutting street is white substrate.

5. The die-pressed BT plate cutting street structure of claim 1 wherein the thickness of the cutting street is greater than the thickness of the substrate.