CN215647563U

CN215647563U - Improve PCB and hinder welding consent protruding structure of printing ink

Info

Publication number: CN215647563U
Application number: CN202122000369.0U
Authority: CN
Inventors: 黄志刚; 柯勇; 赵宏静; 缪翀
Original assignee: Guangdong Tongyuan Precision Circuit Co ltd
Current assignee: Guangdong Tongyuan Precision Circuit Co ltd
Priority date: 2021-08-24
Filing date: 2021-08-24
Publication date: 2022-01-25
Anticipated expiration: 2031-08-24

Abstract

The utility model provides a structure for improving PCB solder mask plug hole ink bulges, which relates to the technical field of printed circuit boards and comprises an upper hot plate of an FPC fast press, a lower hot plate of the FPC fast press and a PCB, wherein the top surface and the bottom surface of the PCB are coated with a silicon-free release film, one side of the silicon-free release film, which is far away from the PCB, is provided with a mirror steel plate, the bottom surface of the mirror steel plate at the bottom of the PCB is provided with a silicon buffer layer, the bottom surface of the silicon buffer layer is abutted against the top surface of the lower hot plate of the FPC fast press, the top surface of the mirror steel plate at the top surface of the PCB is connected with the bottom surface of the upper hot plate of the FPC fast press, after the solder mask ink on the surface of the PCB is plugged by adopting the upper hot plate of the FPC fast press and the lower hot plate of the FPC fast press, the plug hole ink bulges are accumulated, the positions of the ink bulges are extruded by the mirror steel plate to flow to a low position under certain temperature and pressure conditions, so as to play a leveling role, and the ink bulges at the hole can be leveled, and then the surface oil is printed by silk, so that the problems of hole plugging ink protrusion, ink accumulation and color difference existing in the existing solder mask hole plugging process can be effectively solved.

Description

Improve PCB and hinder welding consent protruding structure of printing ink

Technical Field

The utility model relates to the technical field of printed circuit boards, in particular to a structure for improving ink protrusions of a PCB solder mask plug hole.

Background

With the rapid development of the PCB technology, the requirement of a customer on PCB solder mask is higher and higher, quality defects such as ink accumulation, ink protrusion, ink depression, copper exposure of an orifice and the like after solder mask hole plugging are not allowed, when the thickness of a PCB board is larger than 1.0mm, the solder mask hole plugging treatment is usually carried out on a via hole by adopting an aluminum sheet screen, the problems of false copper exposure of the orifice and the like are avoided, along with the development of electronic products towards the directions of lightness, thinness and smallness, the PCB also develops towards high density, microporosity and high difficulty, therefore, a large number of PCBs with SMT and BGA appear, the hole plugging is required for preventing various welding problems of the customer from appearing when the customer pastes components on the surface, the solder mask layer is manufactured by coating a layer of solder mask ink on the PCB with an outer circuit after manufacture, except for positions of a welding pad, a hole and the like, and carrying out curing treatment on the solder mask ink, so that the PCB is protected and has the function of solder mask. When a solder mask layer is manufactured, some holes on a PCB need to be filled and cured with solder resist ink, that is, a hole is filled with solder resist ink, such a hole is called a hole filled with solder resist ink, and a general flow of filling the hole with solder resist ink is as follows: solder resist pretreatment → solder resist ink hole plugging → standing → silk screen solder resist ink → pre-baking → exposure → development → one-segment post-baking.

According to the chinese patent No. CN209676608U, a solder resist ink hole plugging device for large holes of a PCB board comprises: the screen printing table, the taphole bearing plate and the screen printing screen plate; the screen printing table is used for bearing a PCB to be plugged, the PCB, the plug hole bearing plate and the screen printing screen are sequentially stacked from bottom to top, and the PCB, the plug hole bearing plate and the screen printing screen vertically correspond to each other; wherein, run through on the consent loading board be equipped with the PCB board treat that the consent corresponds at least one through-hole, this device silk screen printing carries out the operation of counterpointing through the pilot pin, realizes the preparation in batches, and the consent is efficient, and the consent loading board is the common material of PCB product, and no copper epoxy board has improved PCB product comprehensive properties greatly and has reduced the operating cost, and the consent loading board does not have pincher trees.

Above-mentioned patent document is when welding PCB board china ink, the printing ink surface after the welding does not flatten, make the through-hole of instillation printing ink department appear piling easily, produce the arch, the surface smoothness is poor, be unfavorable for the installation of PCB board to use, conducting hole surface printing ink can have obvious printing ink to pile up during current consent, defects such as printing ink arch, even behind silk screen printing face oil, all can have the printing ink of different degrees to pile up, defects such as arch, influence the roughness and the colour difference on PCB surface, it is inconvenient to make the PCB board produce when the installation is used, be unfavorable for in-service use.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art, and provides a structure for improving PCB solder mask plug hole ink bumps.

In order to achieve the purpose, the utility model adopts the following technical scheme: the utility model provides an improve PCB hinders and welds bellied structure of consent printing ink, includes that FPC presses fast and goes up the hot plate, hot plate and PCB board under the quick press of FPC, PCB board top surface and bottom surface department all coat and are equipped with no silicon from the type membrane, one side that PCB board was kept away from the type membrane to no silicon all is equipped with mirror surface steel sheet, the mirror surface steel sheet bottom surface of PCB board bottom is equipped with the silica gel buffer layer, hot plate top surface offsets under silica gel buffer layer bottom surface and the quick press of FPC, the mirror surface steel sheet top surface of PCB board top surface presses fast with FPC and goes up the hot plate bottom surface and be connected.

Preferably, the overlooking cross-sectional area of the mirror steel plate is the same as the overlooking cross-sectional area of the PCB, and the thickness of the mirror steel plate is 1.5 mm.

Preferably, silica gel buffer layer top surface offsets with mirror surface steel sheet bottom surface, and the thickness of silica gel buffer layer is 3mm, and silica gel buffer layer top surface and bottom surface are the plane.

Preferably, the bottom surface of the silicon-free release film is the same as the surface cross section of the PCB, and the thickness of the silicon-free release film is 30 μm.

Preferably, the silica gel buffer layer adopts silica gel injection moulding, and silica gel buffer layer edge all adopts the smooth level and smooth processing of cutting.

Preferably, the cross section of the bottom surface of the upper hot plate of the FPC fast press is the same as that of the top surface of the lower hot plate of the FPC fast press, and the overlooking cross section of the mirror steel plate is the same as that of the bottom surface of the upper hot plate of the FPC fast press.

Preferably, the surface of the PCB is molded by adopting an aluminum sheet plughole screen plate, and the edge of the surface of the PCB is subjected to burr polishing by adopting sand paper.

Advantageous effects

According to the utility model, after the solder resist ink on the surface of the PCB is subjected to hole plugging by adopting the upper hot plate of the FPC fast press and the lower hot plate of the FPC fast press, the hole plugging ink is accumulated, the position of the ink bulge is extruded by the mirror steel plate to flow to the lower position under the condition of certain temperature and pressure, the leveling effect is achieved, the ink on the hole plugging ink bulge and the accumulated part is leveled, and then the surface oil is silkscreened, so that the problems of hole plugging ink bulge, ink accumulation and color difference existing in the existing solder resist hole plugging process can be effectively solved.

Drawings

FIG. 1 is a schematic perspective view of a structure for improving ink protrusions of a solder resist via hole of a PCB;

fig. 2 is a front cross-sectional view of a structure for improving solder resist via ink bumps of a PCB.

Illustration of the drawings:

1. a hot plate is arranged on the FPC fast press; 2. a mirror surface steel plate; 3. a silicon-free release film; 4. a PCB board; 5. a silica gel buffer layer; 6. and (4) a lower hot plate of an FPC fast press.

Detailed Description

In order to make the technical means, the original characteristics, the achieved purposes and the effects of the utility model easily understood, the utility model is further described below with reference to the specific embodiments and the attached drawings, but the following embodiments are only the preferred embodiments of the utility model, and not all embodiments. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative efforts belong to the protection scope of the present invention.

Specific embodiments of the present invention are described below with reference to the accompanying drawings.

The specific embodiment is as follows:

referring to fig. 1-2, a structure for improving the ink bulge of a PCB solder mask plug hole comprises an upper hot plate 1 of a FPC fast press, a lower hot plate 6 of the FPC fast press and a PCB 4, wherein the top surface and the bottom surface of the PCB 4 are both coated with a silicon-free release film 3, one side of the silicon-free release film 3 away from the PCB 4 is both provided with a mirror steel plate 2, the bottom surface of the mirror steel plate 2 at the bottom of the PCB 4 is provided with a silica gel buffer layer 5, the bottom surface of the silica gel buffer layer 5 is abutted against the top surface of the lower hot plate 6 of the FPC fast press, the top surface of the mirror steel plate 2 at the top surface of the PCB 4 is connected with the bottom surface of the upper hot plate 1 of the FPC fast press, the surface of the PCB 4 is formed by adopting an aluminum sheet plug hole screen plate, the edge of the surface of the PCB 4 is both treated by sanding burr, the burr treatment of the PCB 4 is smoothened, the phenomenon that the PCB 4 is scratched by uneven edge when being installed and used is prevented, the palm scratch of an operator is increased in uniformity and the operation safety of the PCB 4, performing solder mask and plughole operation on a PCB 4 after completing a circuit by using an aluminum sheet plughole screen, pre-baking after plughole, wherein the baking parameter is 50 ℃ multiplied by 15min, the ink is in a semi-flowing state after baking, leveling by using an upper hot plate 1 of an FPC (flexible printed circuit) fast press and a lower hot plate 6 of the FPC fast press after the plughole ink is pre-baked, the overlooking cross-sectional area of a mirror steel plate 2 is the same as the overlooking cross-sectional area of the PCB 4, the thickness of the mirror steel plate 2 is 1.5mm, after the solder mask ink plughole on the surface of the PCB 4 is subjected to solder mask by using the upper hot plate 1 of the FPC fast press and the lower hot plate 6 of the FPC fast press, plughole ink is accumulated, the position of the ink bulge is extruded by the mirror steel plate 2 to flow to a low position under certain temperature and pressure conditions, so as to play a leveling effect, leveling the ink bulge at the position of the plughole ink, and the ink at the accumulated position, and then screen printing the ink is printed, so that the problem of the existing plughole ink bulge existing plughole ink can be effectively solved, The problems of ink accumulation and color difference are solved, the top surface of a silica gel buffer layer 5 is abutted against the bottom surface of a mirror steel plate 2, the thickness of the silica gel buffer layer 5 is 3mm, and the top surface and the bottom surface of the silica gel buffer layer 5 are both planes, wherein 1 mirror steel plate 2 with the thickness specification of 1.5mm is used at the upper part and the lower part of a PCB 4, a silica gel pad with the thickness specification of 3mm is used as a buffer material between the mirror steel plate 2 at the bottom of the PCB 4 and a FPC fast press lower hot plate 6, a silicon-free release film 3 with the thickness specification of 30um is covered on the two surfaces of the PCB 4 during fast pressing and leveling, the bottom surface of the silicon-free release film 3 is the same as the surface section of the PCB 4, the thickness of the silicon-free release film 3 is 30 mu m, the silica gel buffer layer 5 is formed by injection molding, the edges of the silica gel buffer layer 5 are cut smoothly and leveled, the sizes of the bottom surface of the FPC fast press upper hot plate 1 and the top surface of the FPC fast press lower hot plate 6 are the same, the overlook cross section of the mirror steel plate 2 is the same as the cross section of the FPC fast press upper hot plate 1, the quick pressing temperature is 60 ℃, the prepressing is 20kg multiplied by 5s + the compacting is 60kg multiplied by 10s, and after the prepressing and the leveling, the printing face oil production is normally carried out, so that the processing flatness of the PCB 4 is guaranteed.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the utility model. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides an improve PCB hinders and welds bellied structure of consent printing ink, hot dish (1) on the quick press of FPC, hot dish (6) and PCB board (4) under the quick press of FPC, its characterized in that: PCB board (4) top surface and bottom surface department all coat and are equipped with no silicon from type membrane (3), no silicon all is equipped with mirror surface steel sheet (2) from one side that PCB board (4) were kept away from type membrane (3), mirror surface steel sheet (2) bottom surface of PCB board (4) bottom is equipped with silica gel buffer layer (5), hot plate (6) top surface offsets under silica gel buffer layer (5) bottom surface and the fast press of FPC, hot plate (1) bottom surface is connected on mirror surface steel sheet (2) top surface and the fast press of FPC of PCB board (4) top surface.

2. The structure for improving the ink bump of the PCB solder mask hole as claimed in claim 1, wherein: the overlook cross sectional area of the mirror steel plate (2) is the same as the overlook cross sectional area of the PCB (4), and the thickness of the mirror steel plate (2) is 1.5 mm.

3. The structure for improving the ink bump of the PCB solder mask hole as claimed in claim 1, wherein: silica gel buffer layer (5) top surface offsets with mirror surface steel sheet (2) bottom surface, and the thickness of silica gel buffer layer (5) is 3mm, and silica gel buffer layer (5) top surface and bottom surface are the plane.

4. The structure for improving the ink bump of the PCB solder mask hole as claimed in claim 1, wherein: the bottom surface of the silicon-free release film (3) is the same as the surface section of the PCB (4), and the thickness of the silicon-free release film (3) is 30 mu m.

5. The structure for improving the ink bump of the solder mask hole of the PCB as claimed in claim 3, wherein: silica gel buffer layer (5) adopt silica gel injection moulding, and silica gel buffer layer (5) edge all adopts the smooth level and smooth processing of cutting.

6. The structure for improving the ink bump of the PCB solder mask hole as claimed in claim 1, wherein: the cross section of the bottom surface of the upper hot plate (1) of the FPC fast press is the same as that of the top surface of the lower hot plate (6) of the FPC fast press, and the overlooking cross section of the mirror steel plate (2) is the same as that of the bottom surface of the upper hot plate (1) of the FPC fast press.

7. The structure for improving the ink bump of the PCB solder mask hole as claimed in claim 1, wherein: the surface of the PCB (4) is formed by adopting an aluminum sheet hole plugging screen plate, and the edge of the surface of the PCB (4) is subjected to burr polishing by adopting sand paper.