CN211720846U - Solder mask capable of avoiding solder mask film printing - Google Patents
Solder mask capable of avoiding solder mask film printing Download PDFInfo
- Publication number
- CN211720846U CN211720846U CN201921427915.5U CN201921427915U CN211720846U CN 211720846 U CN211720846 U CN 211720846U CN 201921427915 U CN201921427915 U CN 201921427915U CN 211720846 U CN211720846 U CN 211720846U
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- solder mask
- backing plate
- plate
- solder resist
- exposure machine
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a can avoid solder mask film seal hinder weld plate, including backing plate and protective layer, it is platelike structure to hinder weld plate, it establishes to the backing plate to hinder weld plate bottom, the backing plate coats and is stamped the protective layer, the backing plate is placed on the exposure machine mesa is on the surface, the exposure machine is including but not limited to CCD exposure machine, the utility model discloses simple structure, low in production cost, the problem of PCB board product solder mask film seal can effectively be solved in favourable extensive industrial production, the utility model discloses extensively be applicable to processing and relevant trade.
Description
Technical Field
The utility model relates to a PCB board hinders and welds technical field, specifically is a can avoid hindering of solder mask film seal hinders welding plate.
Background
With the development of the PCB technology, the requirements of PCB products on the appearance quality of a solder mask layer are more and more demanding, and the PCB products are particularly used for the problem of solder mask layer film printing.
Most factories have film print defects. The solder mask film printing is mainly embodied on the position of the substrate, and the position of the substrate is lower than that of the circuit and the copper surface, so that the silk-screen printing ink is thick; the printing ink can not be completely cured after low-temperature prebaking, the dryness is insufficient, the silk-screen printing ink is photosensitive, and the surface printing ink can be cured only after the silk-screen printing ink reacts with ultraviolet light of an exposure machine; at present, a solder mask exposure machine is semi-automatic or full-automatic, and in the production process of a PCB (printed Circuit Board) in the exposure machine, after the exposure machine absorbs vacuum and extrudes, a soft silica gel pad on the table surface of the exposure machine is in contact with ink at the position of a base material of the PCB to extrude, so that an indentation, namely a film print, is generated.
The existing and traditional improvement methods are to prolong the pre-baking time, increase the pre-baking temperature, reduce the quantity of inserting plates of a pig cage, paste films on the table surface of an exposure machine and the like, and cannot solve the problem of a large-area PCB (printed circuit board) which is a base material.
Disclosure of Invention
The utility model provides a can avoid resistance welding plate of solder mask film seal to hinder the not good problem of effect in order to solve prior art.
In order to solve the technical problem, the utility model discloses a following technical scheme:
the utility model provides a can avoid hindering of solder mask film seal hinders solder mask, includes backing plate and protective layer, hinder the solder mask and be platelike structure, hinder the solder mask bottom and establish to the backing plate, the backing plate coats and is stamped the protective layer.
The pad is placed on the surface of the table of an exposure machine, including but not limited to a CCD exposure machine.
The backing plate includes but is not limited to a PCB board, and the backing plate is a rigid structure.
The protective layer includes, but is not limited to, a film protective film.
Further, the thickness of the backing plate is within the range of 1.2-1.6 mm.
The backing plate is hard material, does not contact substrate solder mask printing ink in the exposure process, and the exposure owner vacuum degree is general 320mmhg simultaneously, through reducing owner vacuum degree, reduces backing plate and PCB board extrusion, and the dryness after the printing ink prebakes can be improved through placing for a long time.
Because of the backing plate is hard material, the backing plate structure can not change, and substrate printing ink has the difference in height with printing ink on circuit, the copper face, therefore the backing plate only contacts the printing ink on circuit and the copper face, can not contact substrate printing ink, increases the film protection film of posting the plain noodles simultaneously on the backing plate, can effectively protect PCB board face printing ink smoothness.
Removing the original silica gel pad on the exposure machine, and correspondingly installing the base plate according to the CCD hanging hole groove on the exposure table; and (5) the corresponding surface of the base plate, which is stuck with the film protective film, faces upwards, and then the installation can be finished.
It is visible by above technical scheme, the utility model discloses following beneficial effect has:
1. the utility model discloses simple structure, low in production cost is favorable to large-scale industrial production.
2. The utility model discloses can effectively solve the problem of PCB board product solder mask film seal.
3. The utility model discloses extensively be applicable to processing and relevant trade.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings used in the following description will be briefly described, and it is obvious for those skilled in the art that other drawings can be obtained without creative efforts.
Fig. 1 is a schematic structural diagram provided by the present invention.
Wherein: 1. a base plate; 2. and a protective layer.
Detailed Description
In order to make the technical solutions in the present invention better understood, the following description of the present invention with reference to the accompanying drawings will be made clear and fully descriptive of the technical solutions in the present invention, and it is obvious that the description is only a part of the present invention, not all of it. Based on the utility model provides a, all other that ordinary skilled in the art obtained under the prerequisite of not making the creative work all should belong to the scope protected by the utility model.
Referring to fig. 1, the solder mask capable of avoiding the film printing of the solder mask includes a pad 1 and a protective layer 2, the solder mask is in a plate-shaped structure, the bottom of the solder mask is provided with the pad 1, and the pad 1 is covered with the protective layer 2.
The pad 1 is placed on the surface of the table of an exposure machine, including but not limited to a CCD exposure machine.
The backing plate 1 includes but is not limited to a PCB board, and the backing plate 1 is a rigid structure.
The protective layer 2 comprises but is not limited to a film protective film, the thickness of the base plate 1 is within the range of 1.2-1.6mm, an original silica gel pad on an exposure machine is removed, and the base plate 1 is correspondingly installed according to an exposure table CCD hanging hole groove; the corresponding surface of the base plate 1 with the film protective film faces upwards, and then installation can be completed.
To sum up, compared with the prior art, the utility model, the PCB product solder mask film seal problem of any structure can effectively be solved.
Claims (5)
1. The utility model provides a can avoid solder mask film seal's resistance welding board, includes backing plate (1) and protective layer (2), its characterized in that: the welding resistance plate is of a plate-shaped structure, a base plate (1) is arranged at the bottom end of the welding resistance plate, and a protective layer (2) covers the base plate (1); the protective layer (2) is a smooth film protective film.
2. The solder resist capable of avoiding solder resist film printing according to claim 1, characterized in that: the pad (1) is placed on the surface of the table top of an exposure machine, including but not limited to a CCD exposure machine.
3. The solder resist capable of avoiding solder resist film printing according to claim 1, characterized in that: the pad (1) includes but is not limited to a PCB board.
4. The solder resist capable of avoiding solder resist film printing according to claim 1, characterized in that: the backing plate (1) is of a rigid structure.
5. The solder resist capable of avoiding solder resist film printing according to claim 1, characterized in that: the thickness of the backing plate (1) is within the range of 1.2-1.6 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921427915.5U CN211720846U (en) | 2019-08-29 | 2019-08-29 | Solder mask capable of avoiding solder mask film printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921427915.5U CN211720846U (en) | 2019-08-29 | 2019-08-29 | Solder mask capable of avoiding solder mask film printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211720846U true CN211720846U (en) | 2020-10-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921427915.5U Active CN211720846U (en) | 2019-08-29 | 2019-08-29 | Solder mask capable of avoiding solder mask film printing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211720846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347804A (en) * | 2021-06-11 | 2021-09-03 | 金禄电子科技股份有限公司 | Circuit board and solder mask method thereof |
-
2019
- 2019-08-29 CN CN201921427915.5U patent/CN211720846U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113347804A (en) * | 2021-06-11 | 2021-09-03 | 金禄电子科技股份有限公司 | Circuit board and solder mask method thereof |
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