CN103203976A - Three-dimensional mask plate for printing - Google Patents
Three-dimensional mask plate for printing Download PDFInfo
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- CN103203976A CN103203976A CN2012100107796A CN201210010779A CN103203976A CN 103203976 A CN103203976 A CN 103203976A CN 2012100107796 A CN2012100107796 A CN 2012100107796A CN 201210010779 A CN201210010779 A CN 201210010779A CN 103203976 A CN103203976 A CN 103203976A
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Abstract
The invention discloses a mask plate for printing, which comprises a substrate, a printing surface and a PCB (Printed Circuit Board) surface, wherein the printing surface and the PCB surface are positioned on both sides of the substrate. The mask plate is provided with a plurality of pattern openings and a three-dimensional structure; and the three-dimensional structure comprises a convex region on the printing surface and a concave region on the PCB surface. The mask plate is provided with three-dimensional convex and concave parts, and a convex height is 0.1 to 10 mm while a concave depth is 0.1 to 10 mm; the outer included angles between the convex and the concave parts and the plate surface are 80 degrees to 90 degrees; the mask plate comprises the following components: 40 percent to 55 percent of iron and 45 percent to 60 percent of nickel; and the mask plate has high accuracy, high uniformity and high plate surface quality, is bright and has no coarse points, scratches or pinholes; the openings have high quality, smooth opening walls, and no burrs; and the mask plate is low in production cost and has simple process and low energy consumption.
Description
Technical field
The present invention relates to a kind of 3 D stereo mask plate, relate in particular to printing 3 D stereo mask plate.
Background technology
Along with China's electron trade develops rapidly, mould printing technology also is applied at electronics manufacturing, and the SMT printing is exactly the typical case.In the electronic product manufacture process, to weld electronic component and PCB need be placed on tin on the PCB earlier, and have hundreds of pad need go up tin on the PCB, the position of each pad corresponding electronic component, print the disposable first-class tin the best way accurately of the pad of tin on the needs exactly.Usually the method for usefulness is to make the stainless steel substrates that countless apertures are arranged in electronics manufacturing, each hole corresponding need to go up the pad of tin, then stainless steel substrates is attached on the grenadine that stretches tight, grenadine is attached on the bottom surface of print stencil net frame.
Printing stencil is the mould of print solder paste, at present the general steel mesh that adopts.And the punching block opening precision that traditional handicraft is made by laser cutting technique can not reach requirement, and plate face quality is also not high enough.The electroformed nickel mask plate then easily forms pin hole, rough point because of the plate face, and the solution instability, cost height, defective such as energy consumption is big.
Whether the tin cream on the pad is smooth, even, whether consumption suitably will directly influence the effect of electronic component SMT, when precision electronic element pad and hot pressing finger is particularly arranged, requires higher to printing stencil.
The development of PCB industry not only is confined to plane template, and existing PCB industry development is rapid, and some have the position of particular requirement to need the spill position, as B2it printed board.Prepared 3-dimensional metal mask plate has and the identical 3-D in male structure of substrate; with corresponding concavo-convex position, protective substrate surface; and when using prepared 3-dimensional metal mask plate to shift in substrate surface relief region edge, thereby mask open can closely contact accurately contraposition with substrate.Make simultaneously have the metal mask plate corresponding with concaveconvex shape on the pcb board be after development in future trend.
How to develop a kind of printing stencil or even metallic nickel printing stencil of making than common steel mesh, the new product that performance is more excellent, and have accurate depth-to-width ratio and the measured concavo-convex position of opening matter is most important.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention provides a kind of the printing with its printing stencil of making than common steel mesh of 3 D stereo mask plate, excellent performance and have accurate depth-to-width ratio and the measured concavo-convex position of opening matter.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of mask used for printing plate, comprise substrate and be positioned at printing surface and the PCB face of substrate both sides, described mask plate has a plurality of figure openings and 3-D solid structure, and described 3-D solid structure comprises the elevated regions that is positioned at described printing surface and the sunk area of described PCB face.
Wherein, described elevated regions and sunk area center are on the same line, and this line is vertical with the plate face of described mask plate.
Wherein, the angle of the sunk area of described mask plate and plate face is at 80 ° ~ 90 °.
Wherein, described sunk area is less than the area of elevated regions, and described 3-D solid structure is hollow-core construction.
Wherein, the aligning accuracy height of described elevated regions and described substrate, and the hole wall of 3-D solid structure is smooth, no burr.
Wherein, the height of described elevated regions is 0.1 ~ 10mm.
Wherein, the degree of depth of described sunk area is 0.1 ~ 10mm.
Wherein, the substrate thickness of described metal mask plate is 20 ~ 100um.
Wherein, the material of described mask plate is dilval, and two kinds of component sums are 100%, and described iron content is 40% ~ 55%, and nickel content is 45% ~ 60%.
Wherein, the uniformity COV of described ferro-nickel alloy plating is less than 5%; Described ferro-nickel alloy plating surface brightness is the one-level light, does not have rough point, pin hole.
(3) beneficial effect
A kind of mask used for printing plate that technique scheme provides, comprise substrate and be positioned at printing surface and the PCB face of substrate both sides, described mask plate has a plurality of figure openings and 3-D solid structure, and described 3-D solid structure comprises the elevated regions that is positioned at described printing surface and the sunk area of described PCB face.This kind mask plate has projection and the depression position of three-dimensional, and its height of projection is 0.1 ~ 10mm, and the degree of depth of depression is 0.1 ~ 10mm, and the outer angle of projection and depression position and plate face is at 80 ° ~ 90 °; This mask plate component is that 40% ~ 55% iron and 45% ~ 60% this kind of nickel mask plate precision are very high; This kind mask plate uniformity height, plate face quality is good, light, does not have rough point, cut, a pin hole; The opening quality is good, smooth, the no burr of hole wall; This kind mask plate production cost is low, and technology is simple, and energy consumption is low.
Description of drawings
Figure 1A is embodiment of the invention metal mask plate 3 D stereo area schematic;
Figure 1B is A ~ A schematic cross-section of Fig. 1;
Fig. 2 is the figure opening schematic diagram on the embodiment of the invention laser cutting 3-D solid structure;
Fig. 3 is embodiment of the invention printing schematic diagram;
Wherein: 1: elevated regions; 2: sunk area; 3: printing surface; The 4:PCB face; 11: mask plate; 22: the figure opening; The 111:PCB plate; 222:PCB plate elevated regions; 444: scraper; 555: material for transfer.
The specific embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples are used for explanation the present invention, but are not used for limiting the scope of the invention.
Shown in Figure 1A, 1B, Fig. 2 and 3, the embodiment of the invention provides a kind of mask used for printing plate 11, comprise substrate and be positioned at printing surface 3 and the PCB face 4 of substrate both sides, mask plate 11 has a plurality of figure openings 22 and 3-D solid structure, and 3-D solid structure comprises the elevated regions 1 that is positioned at printing surface 3 and the sunk area 2 of PCB face 4.Can access high accuracy printing 3 D stereo dilval mask plate 11, plate face brightness is good, and coating surface quality is good, no pit, pin hole etc.; Can access up and the down district of differing heights or the degree of depth, the outer angle of up and down district and plate face is beneficial near 90 ° and prints the required precision of tin cream at present very much; Than the opening precision height of laser steel mesh, the opening quality is good, and hole wall is smooth; This kind mask plate 11 uniformity height; Cost than metallic nickel mask plate 11 is low, and energy consumption is low, and technology is simple.
This template is the first step print solder paste that is applied in the SMT surface mounting technology flow process, and in printing process, the quality of the uniformity of plate face and opening quality directly influences the quality of tin quality down.Good uniformity just the following tin bad phenomenon of the thin partially position of plate face can not occur.Generally improve coating uniformity by in electrotyping bath, adding an anode baffle; The opening quality is good, the tin that just can not occur collapsing, connects tin, draws bad phenomenon such as point.Electroforming just is that than the great advantage of laser steel mesh electroforming is the deposition of atomic level, as long as the development point control gets bad phenomenon such as fine, the hole wall of the mask plate 11 that electroforming is come out is smooth, no burr.Concrete pcb board 111 cooperates with the PCB face 4 of mask plate 11 with reference to shown in Figure 3, and pcb board elevated regions 222 cooperates with the 3-D solid structure of mask plate 11, and scraper 444 mobilization materials 555 are mobile at the printing surface 3 of mask plate 11 in printing process.
Elevated regions 1 and sunk area 2 centers are on the same line, and this line is vertical with the plate face of mask plate 11.The sunk area 2 of mask plate 11 and the angle of plate face are at 80 ° ~ 90 °.Sunk area 2 is less than the area of elevated regions 1, and 3-D solid structure is hollow-core construction.The aligning accuracy height of elevated regions 1 and substrate, and the hole wall of 3-D solid structure is smooth, no burr.
For 3 D stereo mask plate 11, whether the problem that need overcome has the making of projection and sunk area 2 good, especially positional precision.In order to cooperate the required precision of specific position, and strict to the depth-to-width ratio in up or down district, also comprise the angle of raised or sunken district and vertical panel face direction.Therefore, particularly important for selection and the making of core, the adhesion between down district and the plane coating also is the emphasis of considering besides.The making of elevated regions 1 and sunk area 2 is produced a pit mainly by first etching core at core, carries out electroforming at this core again, peels off the 3-D solid structure that can obtain differing heights and the degree of depth after the electroforming.
Printing 3 D stereo dilval mask plate 11 opening precision height, product component can satisfy print request simultaneously, and product thickness also can be controlled in claimed range; Adopt 304 stainless steel cores as cathode base, coating is easy to peel off, and can obtain depression and the elevated regions 1 of angle composite demand, this is because 304 stainless steel surfaces have formed the oxidized surface film that one deck has the densification of amorphous structure, with sedimentary deposit very big crystalline phase difference is arranged, thereby " not bonding " characteristic of the electroformed layer that forms is beneficial to peeling off of sunk area 2.
The height of elevated regions 1 is 0.1 ~ 10mm, and the height of preferred elevated regions 1 is 0.5 ~ 1mm.The degree of depth of sunk area 2 is 0.1 ~ 10mm.The degree of depth of preferred sunk area 2 is for being 0.5 ~ 1mm.The substrate thickness of metal mask plate 11 is 20 ~ 100um.
The material of mask plate 11 is dilval, and two kinds of component sums are 100%, and iron content is 40% ~ 55%, and nickel content is 45% ~ 60%.The uniformity COV of ferro-nickel alloy plating is less than 5%; The ferro-nickel alloy plating surface brightness is the one-level light, does not have rough point, pin hole.
As can be seen from the above embodiments, the embodiment of the invention provides a kind of mask used for printing plate 11, comprise substrate and be positioned at printing surface 3 and the PCB face 4 of substrate both sides, mask plate 11 has a plurality of figure openings 22 and 3-D solid structure, and 3-D solid structure comprises the elevated regions 1 that is positioned at printing surface 3 and the sunk area 2 of PCB face 4.This kind mask plate 11 has projection and the depression position of three-dimensional, and its height of projection is 0.1 ~ 10mm, and the degree of depth of depression is 0.1 ~ 10mm, and the outer angle of projection and depression position and plate face is at 80 ° ~ 90 °; These mask plate 11 components are that 40% ~ 55% iron and 45% ~ 60% this kind of nickel mask plate, 11 precision are very high; This kind mask plate 11 uniformity height, plate face quality is good, light, does not have rough point, cut, a pin hole; The opening quality is good, smooth, the no burr of hole wall; This kind mask plate 11 production costs are low, and technology is simple, and energy consumption is low.
It below only is preferred embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the technology of the present invention principle; can also make some improvement and replacement, these improvement and replacement also should be considered as protection scope of the present invention.
Claims (10)
1. mask used for printing plate, it is characterized in that, comprise substrate and be positioned at printing surface and the PCB face of substrate both sides, described mask plate has a plurality of figure openings and 3-D solid structure, and described 3-D solid structure comprises the elevated regions that is positioned at described printing surface and the sunk area of described PCB face.
2. mask used for printing plate according to claim 1 is characterized in that, described elevated regions and sunk area center are on the same line, and this line is vertical with the plate face of described mask plate.
3. mask used for printing plate according to claim 2 is characterized in that, the angle of the sunk area of described mask plate and plate face is at 80 ° ~ 90 °.
4. mask used for printing plate according to claim 3 is characterized in that, described sunk area is less than the area of elevated regions, and described 3-D solid structure is hollow-core construction.
5. mask used for printing plate according to claim 4 is characterized in that, the aligning accuracy height of described elevated regions and described substrate, and the hole wall of 3-D solid structure is smooth, no burr.
6. mask used for printing plate according to claim 5 is characterized in that, the height of described elevated regions is 0.1 ~ 10mm.
7. mask used for printing plate according to claim 6 is characterized in that, the degree of depth of described sunk area is 0.1 ~ 10mm.
8. mask used for printing plate according to claim 3 is characterized in that, the substrate thickness of described metal mask plate is 20 ~ 100um.
9. mask used for printing plate according to claim 1 is characterized in that, the material of described mask plate is dilval, and two kinds of component sums are 100%, and described iron content is 40% ~ 55%, and nickel content is 45% ~ 60%.
10. mask used for printing plate according to claim 1 is characterized in that, the uniformity COV of described ferro-nickel alloy plating is less than 5%; Described ferro-nickel alloy plating surface brightness is the one-level light, does not have rough point, pin hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010779.6A CN103203976B (en) | 2012-01-16 | 2012-01-16 | A kind of printing Three-dimensional mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010779.6A CN103203976B (en) | 2012-01-16 | 2012-01-16 | A kind of printing Three-dimensional mask plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103203976A true CN103203976A (en) | 2013-07-17 |
| CN103203976B CN103203976B (en) | 2016-04-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210010779.6A Expired - Fee Related CN103203976B (en) | 2012-01-16 | 2012-01-16 | A kind of printing Three-dimensional mask plate |
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| CN (1) | CN103203976B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103203984A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
| CN103203982A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
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| JPH0692053A (en) * | 1992-02-24 | 1994-04-05 | Kyushu Hitachi Maxell Ltd | Production of metal mask plate for printing |
| JP2001244616A (en) * | 2000-02-29 | 2001-09-07 | Optrex Corp | Metal mask for printing cream solder |
| JP2003080859A (en) * | 2001-09-13 | 2003-03-19 | Rohm Co Ltd | Method for screen-printing paste on lead frame, and its apparatus |
| JP2004155004A (en) * | 2002-11-06 | 2004-06-03 | Matsushita Electric Ind Co Ltd | Squeegee for printing cream solder and method for printing cream solder |
| JP2006213000A (en) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | Screen printing plate and its manufacturing method |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
| CN102092180A (en) * | 2009-12-10 | 2011-06-15 | 中国人民银行印制科学技术研究所 | Metal porous plate and preparation method thereof |
| CN202685579U (en) * | 2012-01-16 | 2013-01-23 | 昆山允升吉光电科技有限公司 | Three-dimensional stereoscopic mask plate for printing |
| CN103203982A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
| CN103203984A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
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2012
- 2012-01-16 CN CN201210010779.6A patent/CN103203976B/en not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0692053A (en) * | 1992-02-24 | 1994-04-05 | Kyushu Hitachi Maxell Ltd | Production of metal mask plate for printing |
| JPH0664359A (en) * | 1992-08-24 | 1994-03-08 | Matsushita Electric Ind Co Ltd | Screen printing plate |
| JP2001244616A (en) * | 2000-02-29 | 2001-09-07 | Optrex Corp | Metal mask for printing cream solder |
| JP2003080859A (en) * | 2001-09-13 | 2003-03-19 | Rohm Co Ltd | Method for screen-printing paste on lead frame, and its apparatus |
| JP2004155004A (en) * | 2002-11-06 | 2004-06-03 | Matsushita Electric Ind Co Ltd | Squeegee for printing cream solder and method for printing cream solder |
| JP2006213000A (en) * | 2005-02-07 | 2006-08-17 | Bonmaaku:Kk | Screen printing plate and its manufacturing method |
| CN101540288A (en) * | 2008-03-18 | 2009-09-23 | 恩益禧电子股份有限公司 | Method for printing a metal paste, metal mask, and bump forming method |
| CN102092180A (en) * | 2009-12-10 | 2011-06-15 | 中国人民银行印制科学技术研究所 | Metal porous plate and preparation method thereof |
| CN202685579U (en) * | 2012-01-16 | 2013-01-23 | 昆山允升吉光电科技有限公司 | Three-dimensional stereoscopic mask plate for printing |
| CN103203982A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
| CN103203984A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103203984A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
| CN103203982A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | Three-dimensional mask plate for printing |
| CN103203982B (en) * | 2012-01-16 | 2016-01-27 | 昆山允升吉光电科技有限公司 | A kind of printing Three-dimensional mask plate |
| CN103203984B (en) * | 2012-01-16 | 2016-06-15 | 昆山允升吉光电科技有限公司 | A kind of printing Three-dimensional mask plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103203976B (en) | 2016-04-27 |
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