CN212800534U

CN212800534U - High-efficiency solution circulation chemical nickel bath for printed circuit board

Info

Publication number: CN212800534U
Application number: CN202021168434.XU
Authority: CN
Inventors: 王兴平; 田东培; 王爱臣; 王芳
Original assignee: Cookson Enthone Chemistry Shanghai Co Ltd
Current assignee: Alent Enthone Chemistry Shanghai Co Ltd
Priority date: 2020-06-22
Filing date: 2020-06-22
Publication date: 2021-03-26
Anticipated expiration: 2030-06-22

Abstract

The utility model discloses a printed circuit board is with high-efficient solution circulation chemical nickel groove, including solution circulation chemical nickel groove main part, hang basket and circulating device, this solution circulation chemical nickel groove main part divide into the A district, B district and C district, wherein the B district is located between A district and the C district, the porous partition board that utilizes special design separates between B district and the A district and between B district and the C district, solution can flow between different districts through porous partition board, circulating device's both ends are connected with A district and C district respectively, it is used for its inside to place to wait to plate printed circuit board and place in the B district to hang the basket. The utility model discloses through the flow direction of control solution in the coating bath, make its flow more even, the solution exchange is even between every PCB in the string basket, has avoided the upper and lower, left and right sides and front and back position of nickel bath to have concentration difference and temperature difference phenomenon.

Description

High-efficiency solution circulation chemical nickel bath for printed circuit board

Technical Field

The utility model relates to a chemistry nickel gold technical field, more specifically say and relate to a Printed Circuit Board (PCB) is with high-efficient solution circulation chemistry nickel groove.

Background

Electroless nickel gold (electroless nickel gold) or electroless nickel gold (electroless nickel gold) is prepared by depositing a uniform palladium catalyst layer on the surface of clean copper in advance through a displacement reaction, then putting the workpiece into a chemical nickel plating bath, depositing a nickel-phosphorus layer (phosphorus content is usually 7-11%) on the nickel ions in the chemical nickel bath solution through an autocatalytic reaction under the action of palladium catalysis, then putting the workpiece into a gold plating bath, depositing a gold layer on the surface of nickel through the displacement reaction of nickel and gold ions, and providing good conduction and welding protection by utilizing the characteristics of low contact resistance and difficult oxidation of gold.

Chemical nickel is the key point of the control of the chemical nickel-gold process, wherein a chemical nickel groove is used as a carrier for chemical reaction in production, and plays an important role in achieving uniformity, stability, continuity and reliability of the whole reaction process. For the deposition of metallic nickel, the catalytic action of palladium is mainly in progress in the early stage of the reaction because its catalytic ability is weaker than that of palladium, and then nickel ions can continuously deposit nickel metal to a desired thickness by their own catalytic ability. This requires that the electroless nickel bath (electroless nickel solution) be sufficiently reactive to ensure that nickel deposition can continue, and if the electroless nickel bath is not sufficiently reactive, the molding of the article will be stopped, thus creating a problem of lost plating. Wherein maintaining the proper circulation of electroless nickel plating solution is critical to maintaining the activity of the electroless nickel plating solution and is also critical to forming a uniform nickel layer.

Under the normal condition, the circulation volume of the solution in the nickel tank is generally designed to be 5-10 tank solution turnover volume (Turn Over)/hour, the solution circularly flows back to complete the exchange of the solution in the tank through a T-shaped or H-shaped circulating pipe arranged at the bottom and matched with a proper air injection pipe, the mode easily causes uneven up-and-down exchange and uneven left-and-right exchange in the tank, and when a hanging basket is loaded with a plurality of PCBs, uneven front-and-back solution exchange is also easily caused. Especially for micro blind hole plates and carrier plates and similar carrier plates requiring higher coating uniformity, designing a high-efficiency solution circulation chemical nickel bath is very important.

Disclosure of Invention

The utility model aims at providing a Printed Circuit Board (PCB) is with high-efficient solution circulation chemical nickel groove, it includes solution circulation chemical nickel groove main part, hangs basket and circulating device, solution circulation chemical nickel groove main part divide into A district, B district and C district, the B position in the A district with between the C district, the B district with between the A district and the B district with utilize porous partition plate to separate between the C district, solution can flow between different districts through porous partition plate, circulating device's both ends respectively with the A district with the C district is connected, it is used for placing inside it and treats to plate printed circuit board and place in to hang the basket in the B district.

Preferably, the circulating device comprises a circulating pump, a liquid outlet pipe and a liquid inlet pipe, the area A is connected with the liquid inlet pipe, and the area C is connected with the liquid outlet pipe, so that the flowing direction of the solution flows from the area A to the area B and then from the area B to the area C.

Preferably, the chemical nickel bath main part of solution circulation is the cuboid shape, and the A district the B district with the C district also is the cuboid shape, the left surface top in A district is provided with and is used for the installation the port of feed liquor pipe, the right flank below in C district is provided with and is used for the installation the port of drain pipe.

Preferably, the liquid outlet pipe and the liquid inlet pipe are respectively provided with a flowmeter for respectively adjusting the liquid outlet amount and the liquid inlet amount.

Preferably, the top of the zone a and the top of the zone C are sealed with a sealing cover plate.

Preferably, a heating device is arranged in the zone C for heating the solution.

Preferably, the hanging basket is fixed on the palladium flying base, and the palladium flying base is fixed on the swinging frame of the production line.

Preferably, the hanging basket is connected with the flying palladium through at least two connecting rods, so that the hanging basket can swing back and forth and up and down under the driving of the flying palladium.

Preferably, the hanging basket is a rectangular parallelepiped frame, nylon wires (or similar acid-resistant and heat-resistant materials) are woven on the frame of the hanging basket, the hanging basket is divided into different areas for placing PCBs, and the quality problem caused by mutual superposition of the PCBs is avoided.

Preferably, the Printed Circuit Board (PCB) to be plated is vertically inserted into the cradle.

Preferably, the aperture of the holes on the porous partition plate is 1-5 mm, the interval between the holes is 5-10 mm, and the holes in two adjacent rows are staggered.

The utility model provides a Printed Circuit Board (PCB) is with high-efficient solution circulation chemical nickel groove can make solution flow into B district from A district via a plurality of holes on the baffle between A district and the B district of solution circulation chemical nickel groove main part in the circulation process, then flow into C district from B district via a plurality of holes on the baffle between B district and the C district again, the flow direction of solution in the B district has been controlled, the flow homogeneity of solution between every piece of PCB has also been increased simultaneously, and the homogeneity of the concentration of solution and temperature around it. In addition, the solution is integrally controlled to flow in from the upper left of the area A and flow out from the lower right of the area C by using the efficient solution circulating device, so that the circulating flow uniformity of the solution is further increased, and the potential risk of uneven concentration and temperature distribution caused by insufficient circulation of the solution is effectively avoided. Therefore, the utility model discloses following beneficial effect has been reached:

the utility model discloses a high-efficient circulation stirring of nickel bath solution can be guaranteed with high-efficient solution circulation chemical nickel bath to Printed Circuit Board (PCB), and more reasonable solution (solution) flow direction has realized solution even exchange, more even solution flow mode and nickel inslot about, around and concentration difference and the temperature difference between about in every PCB in the string basket. Finally, the stability of the nickel bath is benefited, the production quality of the electroless nickel and the gold is improved, the rejection rate is reduced, the cost is saved, and the production efficiency is improved.

Drawings

In order to illustrate the embodiments of the invention more clearly, reference will now be made briefly to the attached drawings of embodiments, it being understood that the drawings described below are only examples of some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without the inventive step in the forerunner.

Fig. 1 is a front perspective view of a high efficiency solution circulation chemical nickel bath for Printed Circuit Boards (PCBs) according to an embodiment of the present invention.

Fig. 2 is a structural schematic diagram of the hanging basket.

Detailed Description

In the description of the utility model, the material for preparing the chemical nickel bath main body can be PP, PVC or 316 stainless steel.

In the description of the present invention, the heating device in zone C may be a common heating device used for heating solutions commonly used in the art.

In the description of the utility model, the material of the partition board between the A area and the B area and the partition board between the B area and the C area can be the same as or different from that of the chemical nickel bath main body.

In the description of the present invention, the "solution" is also referred to as a nickel plating solution.

In order to make the technical means, creation features, achievement purposes and effects of the present invention easy to understand and understand, the present invention is further explained below with reference to the accompanying drawings.

As shown in fig. 1, the high-efficiency solution circulation chemical nickel bath for Printed Circuit Board (PCB) of the present invention includes a solution circulation chemical nickel bath main body 1, a hanging basket 10 and a circulation device. The solution circulation chemical nickel bath main body 1 is divided into an area A, an area B and an area C, wherein the area A is positioned on the left, the area B is positioned between the area A and the area C, and the area C is positioned on the right. The regions A and B are separated by a porous partition 31, and the regions B and C are separated by a porous partition 32. A hanging basket 10 is placed in the area B. In the example shown in the figure, the chemical nickel bath body 1 has a rectangular parallelepiped shape, and the a, B and C regions are also each rectangular parallelepiped shape. The circulating device of the high-efficiency solution circulating chemical nickel bath for the PCB comprises a circulating pump 20, a liquid outlet pipe 21, a liquid inlet pipe 22, a flow regulating valve 23 arranged on the liquid outlet pipe 21 and a flow regulating valve 24 arranged on the liquid inlet pipe 22.

The porous partition plate 31 and the porous partition plate 32 are provided with a plurality of holes. The aperture of the holes is 1-5 mm, the interval between the holes is 5-10 mm, and two adjacent rows are arranged in a staggered mode. The holes can ensure that the solution flows more uniformly when entering the zone B from the zone A and entering the zone C from the zone B, and avoid the phenomena of concentration difference and temperature difference up and down, left and right, front and back in the tank.

The area A is connected with the liquid inlet pipe 22, and the area C is connected with the liquid outlet pipe 21. A port (not shown) for installing the liquid inlet pipe 22 is arranged above the left side surface of the area a, and a port (not shown) for installing the liquid outlet pipe 21 is arranged below the right side surface of the area C. That is, the connection point of the area A and the liquid inlet pipe 22 is located above the left side surface of the area A, and the connection point of the area C and the liquid outlet pipe 21 is located below the right side surface of the area C, so that the solution enters the area A from the upper left of the area A, enters the area B through the plurality of holes in the partition plate 31, enters the area C from the area B through the plurality of holes in the partition plate 32, and finally enters the liquid outlet pipe 21 from the lower right of the area C. The arrows in FIG. 1 indicate the direction of solution flow.

A heating device (not shown) may be provided in the C zone for heating the solution.

The top of the areas A and C can be sealed by a sealing cover plate, and the area B is opened.

In the example shown in fig. 1, the hanging basket 10 is a frame structure in the shape of a rectangular parallelepiped. The cradle 10 is fixed to a palladium fly 12 by two connecting rods 11, the palladium fly 12 being able to rest on a palladium fly base 13 mounted on a swinging frame (not shown) of the production line. During actual work, the production line sways the frame back and forth and up and down to drive the palladium flying to sway back and forth and up and down, so as to drive the hanging basket 10 to sway back and forth and up and down, finally, the PCB to be plated in the hanging basket 10 sways up and down in the chemical nickel plating solution, and the even exchange of the plating solution between the PCBs is increased.

Fig. 2 shows a specific embodiment of the pannier 10 for placing PCBs, in which nylon threads 101 are woven on the frame of the pannier 10 to form a mesh, so as to divide the pannier 10 into a plurality of regions 102, and PCBs can be inserted into the regions 102, so that the PCBs are limited to different regions, thereby preventing the PCBs from being overlapped with each other to cause quality problems.

The working mode of the chemical nickel tank of the utility model is as follows:

when the hanging basket is used, the PCBs are inserted into the area 102 of the hanging basket 10 one by one, the PCBs are separated by the frame and the nylon wire, the circulating pump 20 starts to work under the driving of a power supply, a solution pumped out from the circulating pump 20 enters the area A from the left upper part of the area A through the liquid inlet pipe 22, enters the area B from the area A through the holes in the porous partition plate 31, flows through the hanging basket 10, then enters the area C from the area B through the holes in the porous partition plate 32, and enters the liquid outlet pipe 21 from the right lower part of the area C after being heated to a preset temperature by the heating device in the area C and returns to the circulating pump 20. Meanwhile, the cradle 10 swings back and forth and up and down under the driving of the power supply, thereby driving the PCB to swing back and forth and up and down. This use neotype high-efficient solution circulation chemical nickel groove during operation for printed circuit board, because solution gets into the B district from the A district, gets into the in-process in C district from the B district again, and a plurality of holes on porous baffle 31 and the porous baffle 32 flow, flow more evenly, have concentration difference and temperature difference phenomenon about, around and about having avoided the inslot. And hang basket 10 and sway from beginning to end up-and-down under the drive of power to drive PCB and sway from beginning to end up-and-down, make the solution of its annex form regional vortex, solution exchange is more even between every PCB, has better effect to aperture and little pad.

Through the above description, it can be seen that the utility model discloses a high-efficient solution circulation chemical nickel groove for printed circuit board can realize that more even solution (solution) flows, does not have the concentration difference and the temperature difference phenomenon of the upper and lower, left and right sides and front and back position of nickel groove for the solution exchange between every PCB in the hanging basket is more even. The chemical nickel bath has high stability, good quality of the chemical nickel gold production, low rejection rate and high production efficiency.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A high-efficiency solution circulation chemical nickel bath for a printed circuit board is characterized by comprising a solution circulation chemical nickel bath main body, a hanging basket and a circulating device,

the main body of the solution circulation chemical nickel bath is divided into an area A, an area B and an area C, the area B is positioned between the area A and the area C, the area B and the area A and the area B and the area C are separated by a porous clapboard, solution can flow between different areas through the porous clapboard,

two ends of the circulating device are respectively connected with the A area and the C area,

the hanging basket is used for placing a printed circuit board to be plated inside the hanging basket and is placed in the area B.

2. The high efficiency solution circulation chemical nickel bath for printed circuit boards according to claim 1, wherein the circulation means comprises a circulation pump, a liquid outlet pipe and a liquid inlet pipe, the zone A is connected to the liquid inlet pipe, and the zone C is connected to the liquid outlet pipe, so that the flow direction of the solution is from the zone A to the zone B and then from the zone B to the zone C.

3. The high-efficiency solution circulation chemical nickel bath for the printed circuit board as claimed in claim 2, wherein the solution circulation chemical nickel bath body is in a rectangular parallelepiped shape, the zone a, the zone B and the zone C are also in a rectangular parallelepiped shape, a port for installing the liquid inlet pipe is arranged above the left side surface of the zone a, and a port for installing the liquid outlet pipe is arranged below the right side surface of the zone C.

4. The high efficiency solution circulation chemical nickel bath for printed circuit boards according to claim 2, wherein flow meters are respectively installed on the liquid outlet pipe and the liquid inlet pipe for adjusting the liquid outlet amount and the liquid inlet amount.

5. The high efficiency solution circulation chemical nickel bath for printed circuit boards according to claim 1, wherein the top of the zone a and the top of the zone C are sealed with a sealing cover plate.

6. The high efficiency solution circulation chemical nickel bath for printed circuit boards according to claim 1, wherein a heating means is provided in the zone C for heating the solution.

7. The high efficiency solution circulation electroless nickel bath for printed circuit boards according to claim 1, wherein the hanging basket is fixed on a flying palladium base on a swing frame of the production line.

8. The high efficiency solution circulation chemical nickel bath for printed circuit boards according to claim 7, wherein the hanging basket is connected with the flying palladium by at least two connecting rods, so that the hanging basket can swing back and forth and up and down under the driving of the flying palladium.

9. The high efficiency chemical nickel bath with solution circulation for the printed circuit board as claimed in claim 1, wherein the hanging basket is a rectangular parallelepiped frame, and nylon wires are woven on the frame of the hanging basket to divide the hanging basket into different areas for placing PCBs, thereby preventing PCBs from being overlapped with each other to cause quality problems.

10. The high-efficiency solution circulation chemical nickel bath for the printed circuit board as claimed in claim 1, wherein the diameter of the holes on the porous partition plate is 1-5 mm, the distance between the holes is 5-10 mm, and the holes in two adjacent rows are staggered.