CN217052471U - Electroplating device of dielectric filter - Google Patents
Electroplating device of dielectric filter Download PDFInfo
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- CN217052471U CN217052471U CN202220564017.XU CN202220564017U CN217052471U CN 217052471 U CN217052471 U CN 217052471U CN 202220564017 U CN202220564017 U CN 202220564017U CN 217052471 U CN217052471 U CN 217052471U
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Abstract
The utility model discloses a dielectric filter's electroplating device, include: the electroplating bath is used for accommodating the dielectric filter and is filled with electroplating solution; a liquid spraying mechanism provided in the plating tank and configured to spray the plating solution toward the plating tank; the liquid supply flow regulating mechanism is communicated with the liquid spraying mechanism and is used for regulating the flow of the input electroplating liquid; the gas supplementing mechanism is communicated with the electroplating tank and is used for conveying gas into the electroplating tank; and the heating mechanism is partially arranged in the electroplating bath and is used for heating the electroplating solution in the electroplating bath by conveying a heating medium. The problems that in the prior art, a silver burning mode is adopted in the manufacturing process of the dielectric filter, the process needs to be maintained at high temperature, so that the energy consumption cost is overhigh, and silver-containing slurry flows and accumulates at the bottom of a hole to cause silver waste are solved.
Description
Technical Field
The utility model relates to a dielectric filter produces technical field, what especially relate to is a dielectric filter's electroplating device.
Background
The dielectric filter is a common part in a communication base station, and with the technical development of 5G and 6G, the dielectric filter forms different structures according to different requirements, the body structure of the dielectric filter generally adopts an insulating material with a ceramic or plastic structure, and is provided with grooves, shallow grooves, blind holes and other arrangement modes on the outer side, and a metal layer is formed on the outer layer, so that the purely required frequency is formed after the filtering is selected from signals with various frequencies of input signals.
The prior art dielectric filter is generally manufactured by silver firing, that is, silver-containing slurry is fired and condensed on the outer layer of the dielectric filter to form the signal processing function. However, the method of burning silver is too costly because the process needs high temperature to maintain.
Accordingly, there is a need for improvements and developments in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned prior art not enough, the utility model aims to provide an electroplating device of dielectric filter solves among the prior art and burns silver mode because of its technology needs high temperature to maintain, leads to the too high problem of energy consumption cost.
The technical scheme of the utility model as follows:
an electroplating apparatus for a dielectric filter, comprising: the electroplating bath is used for accommodating the dielectric filter and containing electroplating solution;
the liquid spraying mechanism is arranged in the electroplating bath and is used for spraying electroplating liquid towards the electroplating bath;
the liquid supply flow regulating mechanism is communicated with the liquid spraying mechanism and is used for regulating the flow of the input electroplating liquid;
the gas supplementing mechanism is communicated with the electroplating bath and is used for conveying gas into the electroplating bath;
and the heating mechanism is partially arranged in the electroplating bath and is used for heating the electroplating solution in the electroplating bath by conveying a heating medium.
Further, tonifying qi mechanism includes: the gas conveying pipe is connected to the bottom of the electroplating tank;
the air pump is communicated with the air delivery pipe and is positioned on the outer side of the electroplating bath;
the air supply pipe is connected with an external air supply device;
the air supply valve is arranged on the air supply pipe.
Further, the heating mechanism includes: the heat exchange tube is provided with an inflow end and an outflow end and is laid at the bottom of the plating bath;
and the temperature control assembly is communicated with the inflow end and is used for controlling the flow rate of the heating medium in the heat exchange pipe.
Further, the temperature control assembly comprises: the output end of the first flow meter is connected with the inflow end;
the output end of the heat flow control valve is connected with the input end of the first flow meter, and the input end of the heat flow control valve is connected with external heat supply medium equipment.
Further, the heat exchange tube is a coil tube and covers the bottom surface of the plating bath.
Further, the plating bath includes: an outer groove is arranged on the outer side of the inner groove,
the inner groove is positioned in the outer groove and is provided with an inner cavity, a liquid spraying mechanism is arranged in the inner cavity, and a liquid storage cavity is formed between the outer groove and the inner groove;
the liquid supply flow regulating mechanism is communicated with the liquid storage cavity and the liquid spraying mechanism and is used for conveying liquid in the liquid storage cavity to the liquid spraying mechanism.
Further, the liquid supply flow rate adjusting mechanism includes: the liquid inlet pipeline is communicated with the liquid storage cavity;
the pump body is connected with a liquid inlet pipeline;
one end of the liquid outlet pipeline is communicated with the pump body, and the other end of the liquid outlet pipeline is communicated with the liquid spraying mechanism;
the liquid outlet pipeline is connected with a second flow meter and a flow regulating valve.
Further, the liquid supply flow regulating mechanism also comprises a filter, and the filter is arranged on the liquid inlet pipeline.
Further, the liquid ejection mechanism includes: the inner-layer liquid spraying assembly is provided with an inner spraying hole;
the outer layer liquid spraying assembly is provided with an outer spraying hole, is arranged on the outer side of the inner layer liquid spraying assembly and forms an electroplating space with the inner layer liquid spraying assembly;
the inner jet hole and the outer jet hole are both arranged towards an electroplating space, and the electroplating space is used for accommodating the dielectric filter;
the outer layer liquid spraying assembly and the inner layer liquid spraying assembly are both connected with a liquid supply flow regulating mechanism.
Further, the inner spray assembly comprises: an inner communicating pipe;
the inner injection pipes are arranged in the circumferential direction of the inner communicating pipe at intervals and are communicated with the inner communicating pipe, and the inner injection holes are formed in the inner injection pipes;
the outer liquid spray assembly includes: an outer communicating pipe;
many outer injection pipes, many outer injection pipe intervals set up in the week of outer communicating pipe, and all communicate outer communicating pipe, and outer jet orifice sets up on outer injection pipe.
Has the advantages that: compared with the prior art, the utility model provides an electroplating device of dielectric filter, wherein through placing dielectric filter in the plating bath to supply liquid to the hydrojet mechanism through supplying liquid flow control mechanism, make the hydrojet mechanism can spout the plating solution towards dielectric filter, adjust the plating solution through supplying liquid flow control mechanism, can control the liquid jet volume according to the demand, improve the suitability; the air supply mechanism is used for supplying air into the electroplating bath to prevent disproportionation reaction in the electroplating process in the electroplating bath and prevent bivalent copper from being changed into monovalent copper, thereby improving the quality of products; the electroplating solution in the electroplating bath is heated through the heating mechanism, and the temperature of the electroplating solution is controlled, so that the optimal electroplating effect is achieved at the stable preset temperature, and the electroplating efficiency is improved. Through the electroplating device, the metal layer can be added to the outer layer of the dielectric filter, so that the existing silver burning mode is replaced, the electroplating process does not need high-temperature maintenance, the energy consumption is low, the efficiency is high, and the production cost is saved.
Drawings
FIG. 1 is a cross-sectional view of an embodiment of an electroplating apparatus for a dielectric filter according to the present invention;
FIG. 2 is a plan view of a plating tank according to an embodiment of a plating apparatus for a dielectric filter according to the present invention;
FIG. 3 is a schematic view of a liquid spraying mechanism disposed in a plating tank according to an embodiment of an electroplating apparatus for a dielectric filter of the present invention;
fig. 4 is a sectional view of a liquid ejecting mechanism of an embodiment of an electroplating apparatus for a dielectric filter according to the present invention.
The reference numbers in the figures: 100. an electroplating bath; 110. an outer tank; 120. an inner tank; 130. a liquid storage cavity; 200. a liquid spraying mechanism; 210. an inner spray assembly; 211. an inner jet hole; 212. an inner communicating pipe; 213. an inner injection pipe; 220. an outer layer spray assembly; 221. an outer jet hole; 222. an outer communicating pipe; 223. an outer injection pipe; 230. electroplating a space; 300. a liquid supply flow rate adjusting mechanism; 310. a liquid inlet pipeline; 311. a filter; 320. a pump body; 330. a liquid outlet pipeline; 331. a second flow meter; 332. a flow regulating valve; 400. an air supply mechanism; 410. a gas delivery pipe; 420. an air pump; 430. an air feed pipe; 440. an air supply valve; 500. a heating mechanism; 510. a heat exchange tube; 511. an inflow end; 512. an outflow end; 520. a temperature control assembly; 521. a first flow meter; 522. a heat flow control valve; 523. and a temperature detector.
Detailed Description
The utility model provides an electroplating device of a dielectric filter, which is more clear and definite in the purposes, technical proposal and effects, and is described in detail in the following with reference to the attached drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The specific structure of this embodiment is as follows:
as shown in fig. 1, the present embodiment provides a plating apparatus for plating a dielectric filter, the plating apparatus including: the electroplating bath 100, the liquid spraying mechanism 200, the liquid supply flow regulating mechanism 300, the air replenishing mechanism 400 and the heating mechanism 500. Plating cell 100 is configured to receive a dielectric filter and contain a plating solution, and plating cell 100 may take various forms, such as a cylindrical, square, or the like. Liquid spray mechanism 200 is provided in plating tank 100, and is configured to spray plating liquid toward plating tank 100; specifically, the plating solution is transported and ejected to impact the dielectric filter in the plating tank 100. The liquid supply flow regulating mechanism 300 is communicated with the liquid spraying mechanism 200 and is used for regulating the flow of the input electroplating liquid; gas supply mechanism 400 is in communication with plating cell 100 and is configured to supply gas into plating cell 100; heating mechanism 500 is partially disposed within plating cell 100 and heats the plating solution within plating cell 100 by delivering a heating medium. By placing the dielectric filter in the electroplating bath 100 and supplying liquid to the liquid spraying mechanism 200 through the liquid supply flow adjusting mechanism 300, the liquid spraying mechanism 200 can spray electroplating liquid towards the dielectric filter, and the electroplating liquid is adjusted through the liquid supply flow adjusting mechanism 300, so that the liquid spraying amount can be controlled according to the requirement, and the applicability is improved; the gas supply mechanism 400 is used for supplying gas into the electroplating tank 100 so as to prevent disproportionation reaction in the electroplating process in the electroplating tank 100 and prevent bivalent copper from being changed into monovalent copper, thereby improving the electroplating quality of products; the electroplating solution in the electroplating bath 100 is heated by the heating mechanism 500, and the temperature of the electroplating solution is controlled, so that the optimal electroplating effect is achieved at a stable preset temperature, and the electroplating efficiency is improved. Through the electroplating device, the metal layer can be added on the outer layer of the dielectric filter, so that the existing silver burning mode is replaced, the electroplating process does not need high-temperature maintenance, the energy consumption is low, the efficiency is high, and the production cost is saved.
In a preferred embodiment, as shown in fig. 1, the gas supply mechanism 400 specifically includes: a gas delivery pipe 410, a gas pump 420, a gas delivery pipe 430, and a gas delivery valve 440. The gas pipe 410, the gas supply pipe 430 and the gas pump 420 are connected in sequence; gas pipe 410 is connected to the bottom of plating tank 100, gas pump 420 is communicated with gas pipe 410 and is positioned outside plating tank 100, and gas pipe 430 is connected to an external gas supply device; gas is pumped from the bottom of plating cell 100 into plating cell 100 by gas pump 420 and gas is delivered through gas delivery tube 410, which diffuses the gas from the bottom upward to allow the gas to be thoroughly mixed into the plating solution. The air supply valve 440 is disposed on the air supply pipe 430, and the air supply valve 440 can close or open the air supply pipe 430 to control air supply. In addition, the air supply valve 440 can be set to automatically supply air, for example, the air supply valve 440 is set to be an electromagnetic valve, the air pump 420 can control the speed and flow rate of air supply, so as to form a control system, and the control system composed of the electromagnetic valve, the air pump 420 and the controller is used for controlling the automatic air supply of the electroplating solution, so as to control the reaction state of the electroplating solution.
In a preferred embodiment, as shown in fig. 1, the heating mechanism 500 specifically includes: heat exchange tube 510, temperature control assembly 520. Heat exchange tube 510 has an inlet end 511 and an outlet end 512, heat exchange tube 510 is laid on the bottom of plating cell 100 and placed above the gas tubes, and temperature control assembly 520 is in communication with inlet end 511 and is used to control the flow rate of the heating medium in heat exchange tube 510. The flow rate and flow rate of the heating medium flowing into the heat exchange tube 510 are controlled by the temperature control assembly 520, so that the flow rate of the heating medium flowing through the heat exchange tube 510 is changed, the intensity of heat exchange is controlled, and the temperature of the plating solution in the plating bath 100 is changed. The heating medium can be hot water, hot oil, etc.
In addition, a temperature detector 523 may be disposed in the plating tank 100 to measure a real-time temperature of the plating solution, and the temperature control assembly 520 may be operated according to the measured temperature to adjust the temperature of the plating solution according to the requirement.
In a preferred embodiment, as shown in fig. 1, the temperature control assembly 520 specifically includes: a first flow meter 521, and a heat flow control valve 522. The output end of the first flow meter 521 is connected to the inflow end 511, the output end of the heat flow control valve 522 is connected to the input end of the first flow meter 521, and the input end of the heat flow control valve 522 is connected to the external heat supply medium device. The flow rate in the heat exchange tube 510 is monitored by the first flow meter 521, and the flow rate is adjusted by the heat flow control valve 522, so that the flow rate of the heat medium can be controlled, and the heating temperature of the plating solution can be controlled.
In a preferred embodiment, heat exchange tubes 510 are coiled tubes and cover the bottom surface of plating cell 100. The coil structure can be spiral or in a reciprocating bending shape, so that the heat dissipation area can be increased, and the plating solution can be fully heated in the flowing process of the heat medium in the heat exchange tube 510.
In a preferred embodiment, as shown in fig. 1 and 2, plating cell 100 includes: an outer tank 110, and an inner tank 120. The inner tank 120 is disposed in the outer tank 110, the inner tank 120 has an inner cavity, the liquid spraying mechanism 200 is disposed in the inner cavity, and a liquid storage chamber 130 is formed between the outer tank 110 and the inner tank 120. The liquid supply flow rate adjusting mechanism 300 communicates the liquid storage chamber 130 and the liquid ejecting mechanism 200, and serves to convey the liquid in the liquid storage chamber 130 to the liquid ejecting mechanism 200. The inner tank 120 and the outer tank 110 in this embodiment are both provided as circular tanks. When electroplating is carried out, the dielectric filter is arranged in the inner cavity through the hanging rack, and electroplating liquid is sprayed to the dielectric filter on the hanging rack through the liquid spraying mechanism 200. When the solution in the inner tank 120 is excessive and can flow out into the reservoir 130 through the opening of the inner tank 120, the reservoir 130 stores the overflowing plating solution. Thereby ensuring that the amount of the plating solution in the inner tank 120 is fixed, and being beneficial to ensuring the quality consistency in the electrolytic process of the dielectric filter. The liquid supply flow rate adjusting mechanism 300 is communicated with the liquid storage cavity and the liquid spraying mechanism 200 and is used for filtering the liquid in the liquid storage cavity and then conveying the filtered liquid to the liquid spraying mechanism 200. The liquid supply flow regulating mechanism 300 extracts the electroplating liquid in the liquid storage cavity in the outer tank 110, and inputs the electroplating liquid into the liquid spraying mechanism 200 after filtering and liquid supplementing, so that the cyclic utilization of the electrolyte is realized. Wherein the electrolytic bath is provided in the form of the inner tank 120 and the outer tank 110, by providing the liquid ejection mechanism 200 in the plating liquid in the inner tank 120, the dielectric filter is located in the inner tank 120, and the plating liquid is ejected to the dielectric filter in the inner tank 120 by the liquid ejection mechanism 200, and the plating is completed. The electroplating solution in the inner tank 120 overflows to the outer tank 110, and the electroplating solution in the outer tank 110 is replenished or filtered by the solution supply flow regulating mechanism 300, and then is ejected into the perforation tube in the inner tank 120 to be sprayed onto the dielectric filter for electroplating. The circulation is convenient to operate, and the electroplating solution can be supplemented in time; the inner tank 120 has a fixed volume, so that more electroplating solution overflows, thereby controlling the electroplating solution more accurately; the inner tank 120 is disposed inside the outer tank 110, reducing the influence of the plating environment.
In a preferred embodiment, as shown in FIGS. 1 and 3, the liquid supply flow rate adjustment mechanism 300 comprises: an inlet pipe 310, a pump body 320 and an outlet pipe 330. The liquid inlet pipe 310 is communicated with the liquid storage cavity, the pump body 320 is connected with the liquid inlet pipe 310, one end of the liquid outlet pipe 330 is communicated with the pump body 320, the other end of the liquid outlet pipe 330 is communicated with the liquid spraying mechanism 200, and the liquid outlet pipe 330 is connected with a second flow meter 331 and a flow regulating valve 332. The plating solution in the plating tank 110 is pumped out through the pump body 320 and pumped out to the liquid spraying mechanism 200 through the liquid outlet pipe 330, so that the plating solution can be recycled. In addition, the liquid outlet pipe 330 is connected with a second flow meter 331 and a flow regulating valve 332, which can regulate the flow of the plating solution output from the liquid outlet pipe 330, so that the amount of the plating solution sprayed by the liquid spraying mechanism 200 can be controlled, and the plating process can be more reasonably controlled.
In a preferred embodiment, as shown in fig. 1 and 3, the liquid supply flow rate adjusting mechanism 300 further comprises a filter 311, and the filter 311 is disposed on the liquid supply pipeline 310. Install filter 311 on inlet liquid pipeline 310, can carry out effective filtration to endless plating solution, the plating solution after the filtration carries out cyclic utilization, more does benefit to the quality of guaranteeing to electroplate back work piece.
In a preferred embodiment, as shown in fig. 3 and 4, the liquid spraying mechanism 200 specifically includes: inner spray assembly 210 and outer spray assembly 220. Inner spray holes 211 are formed in inner spray assembly 210, outer spray holes 221 are formed in outer spray assembly 220, outer spray assembly 220 is disposed outside inner spray assembly 210, and plating space 230 is formed between inner spray assembly 210 and outer spray assembly 220; the inner ejection hole 211 and the outer ejection hole 221 are both disposed toward the plating space 230, and the plating space 230 is for accommodating a dielectric filter; the outer spray assembly 220 and the inner spray assembly 210 are both connected to a liquid supply flow regulating mechanism 300. By arranging the inner spray assembly 210 and the outer spray assembly 220, and spraying electroplating solution to the dielectric filter on the rack in the electroplating space 230 through the inner spray hole 211 and the outer spray hole 221 respectively, electroplating of the dielectric filter is realized, the electroplating solution is sprayed towards opposite directions through the inner spray hole 211 and the outer spray hole 221, the surface in a hole groove (a through hole or a blind hole) on the dielectric filter can be uniformly electroplated, and the spray pipes of the inner spray assembly 210 and the outer spray assembly 220 are arranged oppositely and work coordinately, so that the dielectric filter can swing in the jet flow of the inner spray hole 221 and the jet flow of the outer spray hole 221 to exhaust, and the pressure of the jet flow of the inner spray hole 221 and the jet flow of the outer spray hole 221 can enable the electroplating solution on the outline (particularly the through hole or the blind hole) of the workpiece to be fully exchanged. Therefore, the electroplating of the scheme replaces the silver burning mode, the energy consumption of the electroplating process is low, the efficiency is high, the plating layer is uniform, and the silver is saved.
In a preferred embodiment, as shown in FIGS. 3 and 4, inner spray assembly 210 comprises: an inner communicating pipe 212, a plurality of inner injection pipes 213. A plurality of inner injection pipes 213 are arranged at intervals in the circumferential direction of the inner communication pipe 212 and are communicated with the inner communication pipe 212, and the inner injection holes 211 are arranged on the inner injection pipes 213. The inner connection pipe 212 is connected to an outer liquid supply pipe, and the plating solution is supplied to the inner connection pipe 212 through the outer liquid supply pipe, flows into each inner injection pipe 213 through the inner connection pipe 212, and is emitted to the dielectric filter in the plating space 230 through the inner injection holes 211 of each inner injection pipe 213. Through the structure of the inner connecting pipe and the inner spraying pipe 213, spraying can be realized in the space surrounding the electroplating space 230 for one circle, and more dielectric filters can be accommodated in the electroplating space 230. And the rack hung with the dielectric filter can be rotated, so that the dielectric filter moves around the electroplating space 230, and the electroplating is more sufficient.
As shown in fig. 3 and 4, outer spray assembly 220 includes: an outer communication pipe 222, and a plurality of outer injection pipes 223. The plurality of outer injection pipes 223 are disposed at intervals in the circumferential direction of the outer communication pipe 222, and are all communicated with the outer communication pipe 222, and the outer injection holes 221 are provided on the outer injection pipes 223. The outer communication pipe 222 communicates with an external liquid supply pipe, and the plating solution is supplied to the outer communication pipe 222 through the external liquid supply pipe, flows into each outer spray pipe 223 through the outer communication pipe 222, and is emitted to the dielectric filter in the plating space 230 through the outer spray holes 221 of each outer spray pipe 223.
In summary, compared with the prior art, the electroplating apparatus for a dielectric filter provided by the present invention has the advantages that the dielectric filter is placed in the electroplating bath 100, and the liquid supply flow adjusting mechanism 300 supplies liquid to the liquid spraying mechanism 200, so that the liquid spraying mechanism 200 can spray electroplating liquid towards the dielectric filter, and the liquid supply flow adjusting mechanism 300 adjusts the electroplating liquid, so that the amount of the spraying liquid can be controlled as required, and the applicability is improved; the gas supply mechanism 400 is used for supplying gas into the electroplating bath 100 so as to prevent disproportionation reaction in the electroplating process in the electroplating bath 100 and prevent bivalent copper from being changed into monovalent copper, thereby improving the quality of products; the electroplating solution in the electroplating bath 100 is heated by the heating mechanism 500, and the temperature of the electroplating solution is controlled, so that the optimal electroplating effect is achieved at a stable preset temperature, and the electroplating efficiency is improved. Through the electroplating device, the metal layer can be added on the outer layer of the dielectric filter, so that the existing silver burning mode is replaced, the electroplating process does not need high-temperature maintenance, the energy consumption is low, the efficiency is high, and the production cost is saved.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. An electroplating apparatus for a dielectric filter, comprising: the electroplating bath is used for accommodating the dielectric filter and is filled with electroplating solution;
a liquid spraying mechanism provided in the plating tank and configured to spray plating liquid toward the plating tank;
the liquid supply flow regulating mechanism is communicated with the liquid spraying mechanism and is used for regulating the flow of the input electroplating liquid;
the gas supplementing mechanism is communicated with the electroplating tank and is used for conveying gas into the electroplating tank;
and the heating mechanism is partially arranged in the electroplating bath and is used for heating the electroplating solution in the electroplating bath by conveying a heating medium.
2. The plating apparatus for a dielectric filter as recited in claim 1, wherein the air supply mechanism comprises: the gas transmission pipe is connected to the bottom of the electroplating bath;
the air pump is communicated with the air delivery pipe and is positioned on the outer side of the electroplating bath;
the air supply pipe is connected with an external air supply device;
and the air supply valve is arranged on the air supply pipe.
3. The plating apparatus for a dielectric filter according to claim 2, wherein the heating mechanism comprises: the heat exchange pipe is provided with an inflow end and an outflow end and is paved at the bottom of the plating bath;
and the temperature control assembly is communicated with the inflow end and is used for controlling the flow velocity of the heating medium in the heat exchange pipe.
4. The electroplating apparatus for a dielectric filter according to claim 3, wherein the temperature control assembly comprises: the output end of the first flow meter is connected to the inflow end;
the output end of the heat flow control valve is connected with the input end of the first flow meter, and the input end of the heat flow control valve is connected with external heat supply medium equipment.
5. The plating apparatus for dielectric filters as recited in claim 3, wherein the heat exchanging tube is a coil tube and covers a bottom surface of the plating tank.
6. The plating apparatus for a dielectric filter according to claim 1, wherein the plating tank comprises: an outer groove is arranged on the outer side of the inner groove,
the inner groove is positioned in the outer groove and is provided with an inner cavity, the liquid spraying mechanism is arranged in the inner cavity, and a liquid storage cavity is formed between the outer groove and the inner groove;
and the liquid supply flow regulating mechanism is communicated with the liquid storage cavity and the liquid spraying mechanism and is used for conveying the liquid in the liquid storage cavity to the liquid spraying mechanism.
7. The electroplating device for a dielectric filter according to claim 6, wherein the liquid supply flow rate adjusting mechanism comprises: the liquid inlet pipeline is communicated with the liquid storage cavity;
the pump body is connected with the liquid inlet pipeline;
one end of the liquid outlet pipeline is communicated with the pump body, and the other end of the liquid outlet pipeline is communicated with the liquid spraying mechanism;
and the liquid outlet pipeline is connected with a second flow meter and a flow regulating valve.
8. The electroplating device for a dielectric filter according to claim 7, wherein the liquid supply flow rate adjusting mechanism further comprises a filter, and the filter is arranged on the liquid inlet pipeline.
9. The dielectric filter plating apparatus according to claim 1, wherein the liquid ejecting mechanism comprises: the inner layer liquid spraying assembly is provided with an inner spraying hole;
the outer layer liquid spraying assembly is provided with an outer spraying hole, is arranged on the outer side of the inner layer liquid spraying assembly and forms an electroplating space with the inner layer liquid spraying assembly;
the inner jet hole and the outer jet hole are both arranged towards the electroplating space, and the electroplating space is used for accommodating the dielectric filter;
the outer layer liquid spraying assembly and the inner layer liquid spraying assembly are both connected with the liquid supply flow regulating mechanism.
10. The dielectric filter electroplating apparatus of claim 9, wherein the inner spray assembly comprises: an inner communicating pipe;
the inner injection pipes are arranged on the circumferential direction of the inner through pipe at intervals and are communicated with the inner through pipe, and the inner injection holes are formed in the inner injection pipes;
the outer spray assembly comprises: an outer communicating pipe;
many outer injection pipes, many outer injection pipe interval sets up in the circumference of outer communicating pipe, and all communicate outer communicating pipe, outer jet orifice sets up outer injection pipe is last.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220564017.XU CN217052471U (en) | 2022-03-15 | 2022-03-15 | Electroplating device of dielectric filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220564017.XU CN217052471U (en) | 2022-03-15 | 2022-03-15 | Electroplating device of dielectric filter |
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| Publication Number | Publication Date |
|---|---|
| CN217052471U true CN217052471U (en) | 2022-07-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220564017.XU Active CN217052471U (en) | 2022-03-15 | 2022-03-15 | Electroplating device of dielectric filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217052471U (en) |
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- 2022-03-15 CN CN202220564017.XU patent/CN217052471U/en active Active
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