CN111733403B - Heating device of chemical plating auxiliary tank and plating tank system comprising same - Google Patents

Heating device of chemical plating auxiliary tank and plating tank system comprising same Download PDF

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Publication number
CN111733403B
CN111733403B CN202010794324.2A CN202010794324A CN111733403B CN 111733403 B CN111733403 B CN 111733403B CN 202010794324 A CN202010794324 A CN 202010794324A CN 111733403 B CN111733403 B CN 111733403B
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tank
heating
plating
auxiliary
pipeline
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CN111733403A (en
Inventor
俞波
闻丽君
叶继春
盛江
邹子玉
张修飞
王泽明
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Ningbo Zhongke Weicheng New Material Technology Co ltd
Ningbo Vichnet Technology Co ltd
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Ningbo Zhongke Weicheng New Material Technology Co ltd
Ningbo Vichnet Technology Co ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1628Specific elements or parts of the apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1619Apparatus for electroless plating
    • C23C18/1621Protection of inner surfaces of the apparatus
    • C23C18/1626Protection of inner surfaces of the apparatus through mechanical processes
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1676Heating of the solution
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1675Process conditions
    • C23C18/1683Control of electrolyte composition, e.g. measurement, adjustment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Abstract

A heating device of a chemical plating auxiliary groove comprises a movable support arranged in the auxiliary groove, wherein heating pipes are wound on the movable support, gaps are reserved among the wound heating pipes, the heating pipes are uniformly distributed on the side wall of the movable support, and the movable support is not in contact with the inner peripheral wall of the auxiliary groove; in addition, a novel chemical plating bath system is provided, which comprises a plating bath and a liquid supplementing device, wherein the plating bath comprises a main bath and an auxiliary bath, and a liquid medicine pipeline and an alkali liquor pipeline are arranged in the main bath; a heating device and a pipeline communicated with the circulating system are arranged in the auxiliary groove, and the auxiliary groove is sleeved with a high-temperature-resistant and acid-alkali-resistant PE bag; the output port of the liquid storage container is connected with the input port of the metering pump, the input port of the main tank is connected with the physical output port of the flowmeter, and the output port of the auxiliary tank is connected with the input port of the plating tank through an overflow hopper; and a flowmeter connected with the PLC control electric box is arranged outside the auxiliary tank. Has the characteristics of convenient cleaning and uniform heating.

Description

Heating device of chemical plating auxiliary tank and plating tank system comprising same
Technical Field
The application relates to the technical field of chemical plating wastewater treatment, in particular to a heating device of a chemical plating auxiliary tank and a plating tank system comprising the heating device.
Background
Electroless plating, also known as electroless plating, is a plating method in which metal ions in a plating solution are reduced to metal by means of a suitable reducing agent in the absence of an applied current and deposited on the surface of various materials or parts. The chemical nickel plating is a Ni-P amorphous plating layer generated by the reaction of nickel salt, hypophosphite and the like, has the advantages of no need of an external power supply, uniform plating layer, high hardness, good wear resistance, no limitation of the size and the shape of a plated part and the like, and is widely applied to the technical field of surface treatment of products such as electronics, chemical engineering, machinery and the like. However, in the process of plating chemical nickel plating solution using nickel sulfate hexahydrate as a nickel source and sodium hypophosphite as a reducing agent, phosphite radicals, sulfate radicals and sodium ions are continuously accumulated in the plating solution, so that the aging of the plating solution is caused, the deposition speed of the chemical nickel plating is reduced, the performance of the plating solution is reduced, the quality of the plating layer is reduced, and the service life of the plating solution is seriously influenced.
The deposition rate of the chemical plating solution is mainly influenced by the operation temperature, the concentration of metal ions in the plating solution, the concentration of a reducing agent and the pH value of the plating solution during plating. In order to ensure the deposition rate of the plating solution and prolong the service life of the plating solution, the components of the plating solution need to be reasonably and effectively adjusted to ensure timely replenishment of the consumed components of the plating solution such as metal ions, reducing agents and the like. Along with the increase of the plating time of the chemical nickel plating, the impurities in the plating solution are gradually increased, in the chemical nickel plating process, the reduction center on the wall of the bath, the catalytic particles in the plating solution and the deposited nickel layer all cause nickel reduction, and the local temperature difference of the plating solution is too large to easily cause nickel ion precipitation, so the consumption range of the nickel ions cannot be accurately estimated, in addition, the change of the nickel ion concentration and other complex ion concentrations of the plating solution can influence the utilization rate of hypophosphite ions, and the consumption range of the hypophosphite ions cannot be accurately estimated. Therefore, the technology of chemical plating automatic solution replenishment is also important, and the consumption of various reactants in the plating solution needs to be accurately estimated by a chemical plating tank, so that plating, detection and solution replenishment are automatically and synchronously carried out.
Therefore, as the automation degree and the function of the chemical plating production line are more and more perfect, the corresponding chemical plating bath system becomes more and more large and complex. In order to solve the problem that the system elements are too bulky due to more and more functional requirements of the chemical plating bath system, a novel chemical plating bath system is required to be provided, and the chemical plating bath system adopts a functional integration design and realizes the following functions: the plating is carried out circularly at constant temperature, the liquid is automatically replenished, the deposition is not easy to happen, and the cleaning efficiency of the plating bath is improved.
In the process of automatic dosing, because concentrated liquid medicine is injected intermittently and continuously, certain concentration difference exists between the plating solutions in the main tank and the auxiliary tank, which causes poor uniformity and stability of the plating solution temperature at two ends of the tank body, but the plating solution temperature needs to be kept stable at about 85 ℃ all the time in the chemical plating process, conventionally, a heating device is arranged in the auxiliary tank, as shown in the attached drawings 1-2, the heating device is that a fixing plate 2 ' is arranged on the peripheral side wall of the auxiliary tank 1 ', then a plurality of tightly wound capillary heating pipes 3 ' are arranged on the fixing plate, and the structure is generally maintained at about 90 ℃ because the auxiliary tank is used for keeping the high temperature of the plating solution, under the high-temperature environment, the plating solution is easy to generate nickel ion deposition, and in addition, pollutants such as metal impurities and dust can also cause the increase of nickel deposition; nickel particles attached to the capillary heating pipe firstly fall off at the bottom of the tank body under the intermittent circulation action to form a catalytic center, and the nickel particles are not cleaned in time, so that the consumption of nickel ions is accelerated, and the failure of the plating solution is caused; in addition, the capillary tube is a heat source, so that the local temperature is high, nickel ions in the plating solution are easy to deposit, and the capillary tube is fixed on the four walls and is not easy to disassemble; and when the heating pipe is dismantled, the inside autocatalysis is serious, and especially autocatalysis is serious at narrow space positions with fixed sheets and the like, so that the components of the plating solution are unstable, and the cleaning is difficult. And the auxiliary tank needs to be heated for a long time, impurities in the main tank and the auxiliary tank are finally filtered and left in the auxiliary tank in the heating process, and the impurity particles are remained at the bottom, the inner wall and the heating coil of the auxiliary tank body and often become a reduction center, so that reduction and deposition of nickel ions are caused, the cleaning is difficult and the components of the plating solution are influenced.
The existing dosing and fluid supplementing method is based on a manual dosing mode, and the defects of large workload, inaccurate dosing control, out-of-control liquid medicine and the like exist when the liquid medicine consumption is controlled by adopting manual dosing. The additive in the replenishment solution is a trace substance in the chemical plating solution, but the additive can greatly change the properties of the plating layer such as appearance quality, physical quality and the like, and the additive is frequently added in excess or insufficient manually or the additive is added for too long time intervals. Both of these problems cause quality problems.
The chemical cleaning technology that has now is that the chemical cleaning liquid of feed system in with ton bucket carries the cell body, carry out chemical cleaning to the cell body, the deposit nickel layer of cell wall and cell bottom often is difficult to the sanitization, need the manual work to descend the groove to wash just can thoroughly clean, chemical cleaning liquid itself has certain corrosivity, there is serious potential safety hazard to operation workman's personal safety, and this kind of workman abluent method operational environment is poor, cleaning speed is low, the inefficiency, the security is low, influence enterprise production efficiency, but if not in time wash the coating bath, the deposited nickel layer can make the deposition phenomenon more and more serious, can lead to the consumption of nickel ion can be more and more, cause unnecessary waste.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the heating device of the chemical plating auxiliary tank, which is convenient to clean, uniform in heating and not easy to generate a large amount of nickel deposition.
In order to solve the technical problem, the technical scheme adopted by the application is as follows: a heating device of a chemical plating auxiliary groove comprises a movable support arranged in the auxiliary groove, wherein heating pipes are wound on the movable support, gaps are reserved among the wound heating pipes, the heating pipes are uniformly distributed on the side wall of the movable support, the diameter of an inner pipe of each heating pipe is 0.5-1.5cm, and the movable support is not in contact with the inner peripheral wall of the auxiliary groove; one end of the heating pipe is provided with a heating source inlet, and the other end of the heating pipe is provided with a heating source outlet so as to realize the heating operation of the heating pipe.
The foretell structure of this application, the inside diameter of its heating pipe is 0.5-1.5cm, the winding is on movable support, the volume of auxiliary tank can be reduced to this kind of mode, can also promote rate of heating, distributed winding is on movable support, this kind of mode can increase the area of contact of heating pipe and plating solution, both promote rate of heating, avoid the too high problem of the local temperature of plating solution that inseparable formula winding brought again, traditional inseparable formula winding can lead to the too high plating solution that leads to of plating solution temperature around the heating coil unstable. When the auxiliary tank body needs to be cleaned, the heating pipe and the movable support can be taken out in time for cleaning; and the movable support is not contacted with the inner peripheral wall of the auxiliary groove, is movable and detachable, can be taken out for cleaning in time once deposition is caused, and can prevent the phenomenon that nickel is deposited on the inner wall of the auxiliary groove for a long time and is difficult to clean.
Preferably, the movable support is cylindrical, and the heating pipe is wound on the outer side wall of the cylindrical movable support; by adopting the structure, the pipeline can be attached to the outer side wall of the cylindrical movable support more tightly due to the fact that the pipeline is circular, excessive stretching cannot be caused to the pipeline, and the stability of the pipeline is kept.
Preferably, the upper end face of the movable support is provided with two heating pipe penetrating holes, and a heating source inlet and a heating source outlet of each heating pipe penetrate out of the heating pipe penetrating holes. Adopt this structure can save side space, but also can effectual regular heating pipe.
Preferably, a high-temperature-resistant and acid-alkali-resistant PE bag is laid in the auxiliary groove; the structure is arranged, so that the problem that nickel deposition is extremely easy to cause by the aid of the auxiliary groove body can be effectively solved, the bag is only required to be taken out and treated, the inner wall of the auxiliary groove does not need to be cleaned, the cleaning is convenient and thorough, and plating solution cannot be remained in the auxiliary groove.
The application also provides a novel chemical plating bath system containing the auxiliary bath, which comprises a plating bath and a liquid supplementing device, wherein the plating bath comprises a main bath and the auxiliary bath, and a liquid medicine pipeline and an alkali liquor pipeline are arranged in the main bath; a heating device and a pipeline communicated with the circulating system are arranged in the auxiliary groove, and high-temperature-resistant and acid-alkali-resistant PE bags are sleeved on the inner wall and the bottom of the periphery of the auxiliary groove; the liquid supplementing device comprises a liquid storage container, a metering pump, a flow meter and a PLC control electronic box, wherein an output port of the liquid storage container is connected with an input port of the metering pump, an auxiliary tank is arranged between the main tank and the liquid supplementing device, an output port of the main tank is connected with an input port of the auxiliary tank through an overflow hopper, an output port of the metering pump is communicated with the liquid medicine pipeline and the alkali liquor pipeline through pipelines, and the flow meter is connected to a pipeline between the metering pump and the liquid medicine pipeline and between the metering pump and the alkali liquor pipeline; the auxiliary tank is externally provided with a flowmeter connected with the PLC control electric box, and the flowmeter and the metering pump are both electrically connected with the PLC control electric box.
Preferably, a high-temperature-resistant and acid-resistant and alkali-resistant PE bag is laid in the main groove; the setting of this structure can be effectual in the solution coating bath very easily arouse the nickel sedimentary difficult problem, only need with the sack take out the processing just can, need not clear up the auxiliary tank inner wall, it is convenient, thorough to wash, can not remain the plating bath in the auxiliary tank yet.
Preferably, the circulating system comprises a circulating pump and a filter, the circulating pump and the filter are arranged between the main tank and the auxiliary tank, an output port of the circulating pump is connected with an input port of the filter, and an output port of the filter is connected with an input port of the plating tank; overflow hoppers which are communicated with each other are arranged on the main tank and the auxiliary tank so as to realize that the plating solution in the main tank flows into the auxiliary tank to realize circulation; by adopting the structure, the heated plating solution is always circularly input into the plating tank, the temperature of the plating solution in the main tank body can be effectively maintained, and the uniformity of the temperature of the plating solution in the main tank body is realized by the circulating action of the circulating system and the specific heating device; and the filter is added, so that impurity dirt in the whole plating solution in the plating process can be filtered, and the interference of the impurities in the plating tank on the plating solution is reduced.
Preferably, the alkali liquor pipeline and the liquid medicine pipeline are fixed on the side wall of the main tank and are higher than the upper liquid level of the plating solution in the main tank, a plurality of spray heads are arranged on the alkali liquor pipeline and the liquid medicine pipeline along the length direction, and the angle of each spray head is adjustable so that the supplemented alkali liquor or the plating solution can be uniformly sprayed into the main tank through the spray nozzles. The above-mentioned structure of this application, the creative nozzle that has set up on the pipeline to directly lay alkali lye pipeline and liquid medicine pipeline on the main tank rather than the auxiliary tank, avoid the solution of alkali lye and plating bath to concentrate and add in the narrow and small auxiliary tank in space and lead to the concentration and the temperature anomaly of local plating bath, cause the unstability of plating bath state. In addition, the structure that the nozzles are arranged at intervals by utilizing the large space of the main tank is beneficial to uniformly scattering the fluid replacement into the plating solution in the main tank, so that the transient reduction of the temperature of the whole plating solution caused by excessive fluid replacement at one time is avoided; in addition, the solution supplement (alkali liquor) can cause the local concentration of the plating solution to be too high, and white flocculent precipitate can be generated due to the too high concentration of the supplemented alkali, namely, the nickel hydroxide is generated by the reaction of the hydroxide radical and the nickel ions, and after the nozzle is arranged through the solution supplement pipeline, the spraying is more uniform, the local concentration is reduced, and the phenomenon is avoided.
Drawings
Fig. 1 is a schematic structural view of an auxiliary tank heating apparatus of the prior art.
Fig. 2 is a schematic structural view of an auxiliary tank of the prior art.
As shown in the attached drawings: 1 ', an auxiliary groove, 2 ', a fixing plate, 3 ', a capillary heating pipe,
fig. 3 is a schematic structural view of an auxiliary tank heating apparatus according to the present application.
FIG. 4 is a schematic view of the plating tank system of the present application.
FIG. 5 is a schematic view of the auxiliary tank of the present application with the addition of a bag (the bag is seen as transparent)
FIG. 6 is a schematic diagram of the main slot structure of the present application.
As shown in the attached drawings: 1. the device comprises a movable support, 1.1. a penetration hole, 2. a heating pipe, 3. a PE bag (high temperature and acid and alkali resistant), 2.1. a heating source inlet, 2.2. a heat source outlet, a. a plating tank, a1. main tank, a2. auxiliary tank, b2. liquid supplementing device, b2.1. liquid medicine pipeline, b2.2. alkali liquor pipeline, b2.3. liquid storage container, b2.4. metering pump, b2.5. flowmeter, b2.6.PLC control electric box, d4. circulating system, d1. circulating pump, d2. filter, 4. overflow hopper and 5. spray head.
Detailed Description
The present application will be described in further detail with reference to the following specific embodiments, but the present application is not limited to the following embodiments.
As shown in fig. 3: a heating device of an auxiliary tank for chemical plating comprises a movable support 1 placed in an auxiliary tank a2, wherein the movable support 1 is a plastic support (usually polytetrafluoroethylene), so that the surface of the movable support does not cause reduction deposition of nickel and the movable support is easy to clean, heating pipes 2 are spirally wound on the movable support, gaps are reserved between the wound heating pipes 2, the gaps between two adjacent heating pipes are usually equal to the pipe diameters of the heating pipes 2, the heating pipes 2 are more fully contacted with a plating solution, and the serious noise and plating solution precipitation caused by uniform distribution and overheating when the heating pipes 2 are tightly attached can be avoided, the heating pipes 2 are multiple and uniformly distributed on the outer peripheral wall of the support, the inner diameter of each heating pipe is 0.5-1.5cm (in the embodiment, 1 cm), and the movable support 1 is not contacted with the inner wall (peripheral side wall) of the auxiliary tank a 2; heating pipe 2 one end be provided with heating source import 2.1, the other end is provided with heating source export 2.2, heating source import 2.1 and the exit linkage of steam source, and heating source export 2.2 and the import intercommunication of steam source circulation system.
According to the structure, the inner diameter (namely the inner diameter of the heating pipe) of the heating pipe 1 is 0.5-1.5cm, and the heating pipe is wound on the movable support 1 in a distributed mode, so that the contact area between the heating pipe and the plating solution can be increased, the heating rate is increased, and the problem that the local temperature of the plating solution is too high due to the traditional compact winding mode is solved. The close winding may cause the temperature of the plating solution around the heating coil to be too high, resulting in instability of the plating solution. When the auxiliary tank body needs to be cleaned, the heating pipe and the movable support can be conveniently lifted and taken out for cleaning; and the movable support is not contacted with the inner wall of the auxiliary tank, is movable and detachable, can be taken out for cleaning in time once deposition is caused, and can prevent the phenomenon that the inner deposition causes difficult cleaning on the inner wall of the auxiliary tank.
Specifically, as shown in fig. 3, the movable support 1 is cylindrical, and the heating pipe 2 is wound on the outer circumferential wall of the cylindrical movable support; specifically, baffles are arranged at two ends of the cylindrical movable support 1, so that the plurality of heating pipes 2 can be limited, and the heating pipes 2 are prevented from loosening from the cylindrical support; by adopting the structure, the pipeline can be attached to the outer side wall of the cylindrical movable support more tightly due to the fact that the pipeline is circular, excessive stretching cannot be caused to the pipeline, and the stability of the pipeline is kept.
Specifically, as shown in fig. 3, two heating pipe insertion holes 1.1 are formed in the upper end face of the movable support 1 and used for pipe bundling, the two heating pipe insertion holes 1.1 correspond to a heating source inlet 2.1 and a heating source outlet 2.2 of the restraint heating pipe 2 respectively, so that the heating source inlet 2.1 and the heating source outlet 2.2 of each heating pipe 2 penetrate out of the respective heating pipe insertion hole (a heat source in the heating pipe can be heated by steam or high-temperature water; the heating pipe is a plastic pipe, generally a polytetrafluoroethylene pipe, and is convenient to wind, heat, disassemble and clean and cannot cause reduction deposition of nickel). Adopt this structure can save side space, but also can effectual regular heating pipe.
Specifically, as shown in fig. 5, a high temperature resistant and acid and alkali resistant PE bag 3 is laid in the auxiliary groove a 2; the setting of this structure can be effectual solved auxiliary tank a2 cell body inner wall and very easily arouse the difficult problem of nickel deposit, only need take out PE sack 3 handle change new PE sack 3 just can, need not clear up auxiliary tank a 2's inner wall, it is convenient, thorough to wash, can not remain the plating bath in the auxiliary tank a2 yet.
One embodiment of the invention
As shown in fig. 4-6, the present application further provides a novel chemical plating bath system comprising the above auxiliary bath, comprising a plating bath a and a solution supplementing device b2, wherein the plating bath a comprises a main bath a1 and an auxiliary bath a2, and a solution pipeline b2.1 (concentrated solution of plating solution) and an alkaline solution pipeline b2.2 are arranged in the main bath a1, and are respectively used for supplementing the plating solution and the alkaline solution in the main bath a 1; the system also comprises a heating device and an external circulating system d4, wherein the heating device is used for heating the solution in the main tank a1, and the circulating system d4 enables the solution in the main tank a1 to flow, so that the uniformity of the solution in the main tank a1 is improved, and the production efficiency and the consistency of products are improved; an overflow hopper 4 is arranged in the main tank a1, and the overflow hopper 4 is lower than the plane of the upper end opening of the main tank a 1; the liquid supplementing device b2 further comprises a liquid storage container b2.3, a metering pump b2.4, a flow meter b2.5 and a PLC control electric box b2.6, an output port of the liquid storage container b2.3 is connected with an input port of the metering pump b2.4 (transition connection is carried out through the metering pump in the middle, accurate liquid supplementing feeding and power supplying of liquid supplementing are realized), an input port of a main tank a1 (an input port of a liquid medicine pipeline and an input port of an alkali liquor pipeline) is connected with a physical output port of the flow meter b2.5, the flow meter b2.5 electrically connected with the PLC control electric box b2.6 is arranged outside the plating tank, the flow meter b2.5 and the metering pump b2.4 are both connected with the PLC control electric box b2.6, the flow meter b2.5 transmits a flow signal to the PLC control electric box b2.6, the PLC control electric box b2.6 controls the working state of the metering pump b2.4 according to the flow signal of the flow meter b2.5, and therefore accurate control of the amount of. The program that the control system that PLC control electronic box b2.6 of this application realized adopted is conventional flow control program, is the conventional PLC control technology of trade, only needs to pass through the design of software company according to the above-mentioned function that will realize of this application and can realize to the technique that technical staff in the field just can't know not through creative work, is the conventional technique of trade.
As shown in fig. 4 and 6, the circulation system d4 of the present application includes a circulation pump d4.1 and a filter d4.2, both the circulation pump d4.1 and the filter d4.2 are disposed outside the plating tank a, an output port of the circulation pump d4.1 is connected to an input port of the filter d4.2 through a pipe, an input port of the circulation pump d4.1 is communicated with an auxiliary tank a2, the auxiliary tank a2 is provided with the heating device described in the previous embodiment, and the auxiliary tank a2 is communicated with the overflow hopper 4 through a pipe; the main tank a1 is communicated with the output port of the filter d4.2, namely the output port of the filter d4.2 is communicated with the main tank a1 through a pipeline;
by adopting the structure, the heated plating solution is always circularly input into the main tank a1, the temperature of the plating solution in the main tank a1 can be effectively maintained, and the uniformity of the temperature of the plating solution in the main tank a1 depends on the circulating action of the circulating system; and 4.2, a filter is added, and the filter is a common commercially available particle filter product (a ceramic filter element is used), so that impurity dirt in the whole plating solution in the plating process can be filtered, and the interference of the impurities in the plating tank on the plating solution is reduced.
As shown in fig. 6, the lye pipeline b2.2 and the liquor pipeline b2.1 are arranged on the side wall of the main tank a1, usually to facilitate the recovery and placement of the PE bag 3, the lye pipeline b2.2 and the liquor pipeline b2.1 are connected to the outer side wall of the plating tank 1 through brackets, and after the arrangement, the PE bag 3 can be recovered and placed only by hanging the corresponding heating pipeline and the corresponding circulating pipeline away by a crane; the alkali liquor pipeline b2.2 and the liquid medicine pipeline b2.1 are higher than the upper liquid surface of the plating solution, the alkali liquor pipeline b2.2 and the liquid medicine pipeline b2.1 are respectively provided with a plurality of spray heads 5 along the length direction, and the angle of the spray heads 5 can be adjusted so that the supplemented alkali liquor or the plating solution can be uniformly sprayed into the plating tank through the nozzles of the spray heads 5. The adjustable structure can adopt a ball head structure to arrange the spray head 5 on the pipeline, the water spray angle of the spray head 5 is adjusted according to the specific plating solution depth, and the spray head 5 sprays mist; the above-mentioned structure of this application, creative shower nozzle 5 has been set up on the pipeline to directly lay alkali lye pipeline and liquid medicine pipeline on the coating bath rather than the auxiliary tank, avoid the solution of alkali lye and plating bath to concentrate and add in the narrow and small auxiliary tank in space and lead to the concentration and the temperature anomaly of local plating bath, cause the unstability of plating bath state. In addition, the structure that the spray heads 5 are arranged on the side wall of the plating tank at intervals along the length direction by utilizing the large space of the plating tank per se is beneficial to uniformly scattering the liquid supplement into the plating solution of the plating tank, so that the phenomenon that the temperature of the whole plating solution is temporarily reduced due to excessive liquid supplement amount at one time is avoided; in addition, the liquid supplement (alkali liquor) can cause the local concentration of the plating solution to be too high, and white flocculent precipitate can be generated due to the too high concentration of the supplemented alkali, namely, hydroxyl and nickel ions react to generate nickel hydroxide, and after the spray head 5 is arranged through the liquid supplement pipeline, the spraying is more uniform, the local concentration is reduced, and the phenomenon is avoided.
The working process is as follows:
the auxiliary groove is internally provided with a heating system and a pipeline communicated with the circulating system, and the inner wall and the bottom of the periphery of the auxiliary groove are sleeved with high-temperature-resistant and acid-resistant and alkali-resistant PE (polyethylene) bags. After the plating solution in the auxiliary tank is heated and heated by the heating device (the material of the heating pipe can be polytetrafluoroethylene, the heating pipe is wound to form a heating coil which is uniform and is not arranged on the outer side wall of the movable support), the plating solution is circulated to the main tank by the circulating filter, the plating solution with lower temperature in the main tank flows to the auxiliary tank through the overflow hopper to be heated continuously, and the circulation is repeated until the plating solution temperature of the main tank and the plating solution temperature of the auxiliary tank reach 85 ℃; the auxiliary groove is internally provided with a temperature controller which can control the heating of the heating device, the temperature is lower than a set value to start heating, and the temperature is higher than the set value to stop heating. The chemical plating automatic liquid supplementing system is provided with a PLC control electric box outside the auxiliary tank, and the PLC control electric box comprises a control panel. The working personnel calculate the required fluid infusion amount and the fluid infusion times of each plating bath according to the daily consumption of the plating solution, and set the starting time, the cycle time and the fluid infusion (alkali liquor and concentrated solution) times on the panel in advance. The control electronic box sends a corresponding control signal to the metering pump to command the metering pump to work; when the metering pump is started, the metering pump extracts liquid medicine (alkali liquor and concentrated solution) from the storage container, the liquid medicine enters the liquid supplementing pipeline (the alkali liquor pipeline and the concentrated solution pipeline) through the flow meter and then enters the main tank, so that the supplemented liquid medicine circulates and circulates between the plating tank and the auxiliary tank, and meanwhile, the consumption and the pH value of the plating solution are timely adjusted.
Another embodiment
The main tank a1 is internally paved with the PE (polyethylene) bag 3 which is high temperature resistant and acid and alkali resistant and is used for containing the plating solution in the PE (polyethylene) bag 3 to avoid the contact of the plating solution with the tank wall and the tank bottom, thus effectively preventing the corrosion of the plating tank and prolonging the service life of the plating tank, and the PE (polyethylene) bag 3 is easy to replace and has lower cost; the auxiliary groove a2 and the main groove a1 are two adjacent pools, the overflow hopper 4 is a channel for communicating the auxiliary groove a2 and the main groove a1, and the overflow hopper 4 is generally arranged at a position 2/3 of the height of the main groove a1, so that the liquid level of the main groove a1 is ensured.
The rest of the structure is the same as the previous embodiment.

Claims (8)

1. The utility model provides a heating device of chemical plating auxiliary tank which characterized in that: the device comprises a movable support arranged in an auxiliary groove, wherein heating pipes are wound on the movable support, gaps are reserved among the wound heating pipes, the heating pipes are uniformly distributed on the side wall of the movable support, the diameter of an inner pipe of each heating pipe is 0.5-1.5cm, and the movable support is not in contact with the inner peripheral wall of the auxiliary groove; one end of the heating pipe is provided with a heating source inlet, and the other end of the heating pipe is provided with a heating source outlet so as to realize the heating operation of the heating pipe.
2. The heating apparatus for an electroless plating auxiliary tank according to claim 1, characterized in that: the movable support is cylindrical, and the heating pipe is wound on the outer side wall of the cylindrical movable support.
3. The heating apparatus for an electroless plating auxiliary tank according to claim 1, characterized in that: the heating device is characterized in that two heating pipe penetrating holes are formed in the upper end face of the movable support, and heating source inlets and heating source outlets of the heating pipes penetrate out of the heating pipe penetrating holes.
4. The heating apparatus for an electroless plating auxiliary tank according to claim 1, characterized in that: and a high-temperature-resistant and acid-resistant PE bag is laid in the auxiliary groove.
5. An electroless plating bath system comprising the heating apparatus according to any one of claims 1 to 4, characterized in that: the device comprises a plating tank and a liquid supplementing device, wherein the plating tank comprises a main tank and an auxiliary tank, and a liquid medicine pipeline and an alkali liquor pipeline are arranged in the main tank; a heating device and a pipeline communicated with the circulating system are arranged in the auxiliary groove, and high-temperature-resistant and acid-resistant PE bags are sleeved on the inner wall and the bottom of the periphery of the auxiliary groove; the liquid supplementing device comprises a liquid storage container, a metering pump, a flow meter and a PLC control electronic box, wherein an output port of the liquid storage container is connected with an input port of the metering pump, an auxiliary tank is arranged between the main tank and the liquid supplementing device, an output port of the main tank is connected with an input port of the auxiliary tank through an overflow hopper, an output port of the metering pump is communicated with the liquid medicine pipeline and the alkali liquor pipeline through pipelines, and the flow meter is connected to a pipeline between the metering pump and the liquid medicine pipeline and between the metering pump and the alkali liquor pipeline; the auxiliary tank is externally provided with a flowmeter connected with the PLC control electric box, and the flowmeter and the metering pump are both electrically connected with the PLC control electric box.
6. An electroless plating bath system according to claim 5, wherein: and a high-temperature-resistant and acid-resistant PE bag is laid in the main groove.
7. An electroless plating bath system according to claim 5, wherein: the circulating system comprises a circulating pump and a filter, the circulating pump and the filter are arranged between the main tank and the auxiliary tank, an output port of the circulating pump is connected with an input port of the filter, and an output port of the filter is connected with an input port of the plating tank; the main tank and the auxiliary tank are provided with overflow hoppers which are communicated with each other so as to realize that the plating solution in the main tank flows into the auxiliary tank to realize circulation.
8. An electroless plating bath system according to claim 5, wherein: the alkali liquor pipeline and the liquid medicine pipeline are fixed on the side wall of the main tank and are higher than the upper liquid surface of the plating solution in the main tank, a plurality of spray heads are arranged on the alkali liquor pipeline and the liquid medicine pipeline along the length direction, and the angle of each spray head is adjustable so that the supplemented alkali liquor or the plating solution can be uniformly sprayed into the main tank through the spray nozzles.
CN202010794324.2A 2020-08-10 2020-08-10 Heating device of chemical plating auxiliary tank and plating tank system comprising same Active CN111733403B (en)

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CN114164420A (en) * 2021-12-07 2022-03-11 上达电子(深圳)股份有限公司 Tin melting tank structure and use method thereof
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JPS61235567A (en) * 1985-04-10 1986-10-20 Chuo Seisakusho:Kk Method and apparatus for filtering plating liquid
CN107151794A (en) * 2016-10-27 2017-09-12 江门崇达电路技术有限公司 A kind of heavy copper groove of PCB production technologies
CN206545042U (en) * 2017-01-19 2017-10-10 永煜机械设备股份有限公司 Volume to volume chemical nickel equipment
CN210341063U (en) * 2019-06-19 2020-04-17 宁波中科纬诚新材料科技有限公司 Automatic liquid supplementing system for chemical plating

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Publication number Priority date Publication date Assignee Title
JPS61235567A (en) * 1985-04-10 1986-10-20 Chuo Seisakusho:Kk Method and apparatus for filtering plating liquid
CN107151794A (en) * 2016-10-27 2017-09-12 江门崇达电路技术有限公司 A kind of heavy copper groove of PCB production technologies
CN206545042U (en) * 2017-01-19 2017-10-10 永煜机械设备股份有限公司 Volume to volume chemical nickel equipment
CN210341063U (en) * 2019-06-19 2020-04-17 宁波中科纬诚新材料科技有限公司 Automatic liquid supplementing system for chemical plating

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