CN212783420U - Encapsulated IC and integrated circuit package - Google Patents
Encapsulated IC and integrated circuit package Download PDFInfo
- Publication number
- CN212783420U CN212783420U CN202021972961.6U CN202021972961U CN212783420U CN 212783420 U CN212783420 U CN 212783420U CN 202021972961 U CN202021972961 U CN 202021972961U CN 212783420 U CN212783420 U CN 212783420U
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- fixedly connected
- plate
- sliding
- encapsulation
- integrated circuit
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Abstract
The utility model discloses an encapsulation formula IC and integrated circuit encapsulation, glue including underframe and encapsulation, fixedly connected with circuit board in the underframe, fixedly connected with semiconductor chip on the circuit board, the spout has been seted up on the underframe, fixedly connected with is sealed to fill up in the spout, the encapsulation is glued and is set up the below at last frame, lead to inslot fixedly connected with annular slab, the top fixedly connected with hinge of annular slab, the below fixedly connected with of hinge turns over the board, the top fixedly connected with handle that turns over the board, one side of handle is provided with the buckle. This encapsulation formula IC and integrated circuit encapsulation setting is accomplished underframe and last frame installation back, and the pulling handle turns over the outside upset of the effect that the board passes through the hinge when the pulling handle, squeezes into the space that forms between underframe and the last frame with the encapsulation glue, encapsulates the semiconductor chip, can promote production efficiency by a wide margin through this kind of encapsulation formula encapsulation, reduction in production cost.
Description
Technical Field
The utility model relates to a circuit packaging technology field specifically is an encapsulation formula IC and integrated circuit encapsulation.
Background
The location of the integrated circuit package in the pyramid of electronics is both the apex of the pyramid and the base of the pyramid, and it is well established that it is in both these locations at the same time, and in this regard, the IC represents the tip of the electronics in terms of the density of electronic components (e.g., transistors). However, IC is a starting point and a basic structural unit, which is the basis for most electronic systems in our lives. Similarly, ICs are not just monolithic chips or basic electronic structures, but are widely varied in variety (analog, digital, radio frequency, sensors, etc.) and thus vary in packaging requirements and requirements.
In the traditional integrated circuit package, a metal frame is used as a carrier, production process operation is carried out on the metal carrier, and die-casting molding is carried out on the rear end of the metal carrier by using a die-casting mold machine, so that the production equipment investment is large, the production efficiency is low, and the product cost is high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an encapsulation formula IC and integrated circuit encapsulation to solve the traditional integrated circuit encapsulation on the existing market that above-mentioned background art provided and use metal frame as the carrier, carry out the production technology operation on metal carrier, die-casting machine carries out the die-casting shaping for the rear end, and production facility drops into greatly, and production efficiency is low, the problem that product cost is high.
In order to achieve the above object, the utility model provides a following technical scheme: a kind of encapsulation type IC and integrated circuit package, including underframe and packaging glue, the said underframe is internal to connect with the breadboard fixedly, the said breadboard connects with the semiconductor chip fixedly, the said underframe has concrete chutes, the said concrete chute internal to connect with the sealing gasket fixedly, the said sealing gasket internal to engage and connect with the slide plate, the upper side of the said slide plate connects with the upper frame fixedly;
one side of upper ledge is provided with the shrouding, set up threaded hole on the shrouding, threaded hole female connection has connecting bolt, the encapsulation is glued and is set up in the below of upper ledge, it has logical groove to open in the upper ledge, it has the annular slab to lead to inslot fixedly connected with, the top fixedly connected with hinge of annular slab, the below fixedly connected with of hinge turns over the board, the top fixedly connected with handle that turns over the board, one side of handle is provided with the buckle.
Preferably, the sliding grooves, the sealing gaskets and the sliding plates are symmetrically arranged in two groups between the lower frame and the upper frame, and the two groups of sliding grooves, the sealing gaskets and the sliding plates form a sliding structure.
Preferably, the cross sections of the sliding chute, the sealing gasket and the sliding plate are all T-shaped, the internal cross section area of the sealing gasket is smaller than that of the sliding plate, and the sealing gasket is made of rubber.
Preferably, the two ends of the sliding groove of the sealing plate are respectively provided with a group, the cross section of the sealing plate is rectangular, and the cross section of the sealing plate is larger than that of the sliding groove.
Preferably, the four corners of the sealing plate are respectively provided with a group of threaded holes and connecting bolts, the length of each connecting bolt is larger than the depth of each threaded hole, and the four groups of threaded holes, the connecting bolts and the sealing plate form a limiting structure.
Preferably, annular plate, hinge, turn over board, handle and buckle constitute activity flip structure, and the annular plate internal dimension equals with the size of turning over the board.
Compared with the prior art, the beneficial effects of the utility model are that: the encapsulation type IC and the integrated circuit package are as follows:
1. the lower frame, the sliding groove, the sealing gasket, the sliding plate and the upper frame are arranged, the cross sections of the sliding groove, the sealing gasket and the sliding plate are all in a T shape, the sliding plate is aligned with the sliding groove at first, then the sliding plate is pushed into the sealing gasket, and therefore butt joint and assembly between the lower frame and the upper frame are facilitated;
2. the sliding plate is provided with a sealing plate, threaded holes and connecting bolts, wherein the two ends of the sliding groove of the sealing plate are respectively provided with one group, after the lower frame and the upper frame are assembled, the sealing plate is aligned with the sliding groove, then the connecting bolts at the four corners are screwed into the threaded holes, and the sealing plate is connected with the lower frame, so that the two ends of the sliding groove are sealed, and the sliding plate is fixed in the sliding groove, so that the lower frame and the upper frame can be more firmly installed and prevented from falling off;
3. be provided with the encapsulation and glue, lead to the groove, the annular plate, the hinge, turn over the board, handle and buckle, accomplish the back with underframe and last frame mounting, open the buckle, the pulling handle, turn over the outside upset of effect that the board passes through the hinge in the pulling handle, squeeze into the space that forms between underframe and the last frame with the encapsulation glue this moment, encapsulate the semiconductor chip, can promote production efficiency by a wide margin through this kind of encapsulation formula encapsulation, and the reduction in production cost, after the encapsulation is accomplished, with the buckle card on turning over the board, will turn over the board to fix in the annular plate can.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the chute of the present invention;
fig. 3 is an enlarged view of the part a structure of the present invention.
In the figure: 1. a lower frame; 2. a circuit board; 3. a semiconductor chip; 4. a chute; 5. a gasket; 6. a slide plate; 7. an upper frame; 8. closing the plate; 9. a threaded hole; 10. a connecting bolt; 11. packaging glue; 12. a through groove; 13. an annular plate; 14. a hinge; 15. turning over a plate; 16. a handle; 17. and (5) buckling.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the present invention provides a technical solution: a kind of encapsulation type IC and integrated circuit package, including underframe 1, breadboard 2, semiconductor chip 3, concrete chute 4, sealing gasket 5, slide plate 6, upper frame 7, shrouding 8, threaded hole 9, connecting bolt 10, packaging glue 11, through groove 12, annular plate 13, hinge 14, turning over the board 15, handle 16 and buckle 17, fixedly connect with breadboard 2 in the underframe 1, fixedly connect with semiconductor chip 3 on the breadboard 2, the underframe 1 has concrete chute 4, fixedly connect with sealing gasket 5 in the concrete chute 4, the inside block of the sealing gasket 5 connects with the slide plate 6, the cross section of the concrete chute 4, sealing gasket 5 and slide plate 6 is T-shaped, and the inside cross-sectional area of the sealing gasket 5 is smaller than the cross-sectional area of the slide plate 6, and the material of the sealing gasket 5 is rubber, make the slide plate 6 push into the course of the sealing gasket 5, the sealing gasket 5 can be squeezed and, the friction force is increased, the sliding plate is not easy to shake, the upper frame 7 is fixedly connected above the sliding plate 6, two groups of sliding grooves 4, sealing gaskets 5 and sliding plates 6 are symmetrically arranged between the lower frame 1 and the upper frame 7, the two groups of sliding grooves 4, sealing gaskets 5 and sliding plates 6 form a sliding structure, and the lower frame 1 and the upper frame 7 are convenient to butt under the action of the two groups of sliding grooves 4, sealing gaskets 5 and sliding plates 6;
a sealing plate 8 is arranged on one side of the upper frame 7, two ends of the sliding groove 4 of the sealing plate 8 are respectively provided with a group, the cross section of the sealing plate 8 is rectangular, the cross section of the sealing plate 8 is larger than that of the sliding groove 4, the two ends of the sliding groove 4 can be sealed by the sealing plate 8, the sliding plate 6 is prevented from sliding out of the sliding groove 4, a threaded hole 9 is formed in the sealing plate 8, a connecting bolt 10 is connected with the threaded hole 9 in a threaded manner, the threaded hole 9 and the connecting bolt 10 are respectively provided with a group at four corners of the sealing plate 8, the length of the connecting bolt 10 is larger than the depth of the threaded hole 9, a limiting structure is formed by the four groups of threaded holes 9, the connecting bolts 10 and the sealing plate 8, the sealing plate 8 can be firmly installed at two ends of the sliding groove 4, the packaging adhesive 11 is arranged below the upper frame, the utility model discloses a novel structure of turning over the board, including annular plate 13, hinge 14, hinge 15, turning over board 15's top fixedly connected with handle 16, annular plate 13, hinge 14, turning over board 15, handle 16 and buckle 17 constitute activity flip structure, and annular plate 13 internal dimension equals with turning over board 15's size, makes to turn over board 15 and can block in annular plate 13, and the less gap of the feasible improves the leakproofness, one side of handle 16 is provided with buckle 17.
The working principle is as follows: when the encapsulation type IC and the integrated circuit package are used, the device is simply known, firstly, the sliding plate 6 is aligned with the sliding groove 4, then the sliding plate 6 is pushed into the sealing gasket 5, so that the butt joint assembly between the lower frame 1 and the upper frame 7 is convenient, because the internal cross-sectional area of the sealing gasket 5 is smaller than that of the sliding plate 6, and the material of the sealing gasket 5 is rubber, when the sliding plate 6 is pushed into the sealing gasket 5, the sealing gasket 5 is deformed to increase the friction force, so that the butt joint of the lower frame 1 and the upper frame 7 is stable, secondly, after the assembly of the lower frame 1 and the upper frame 7 is completed, the sealing plate 8 is aligned with the sliding groove 4, then the connecting bolts 10 at four corners are screwed into the threaded holes 9, the sealing plate 8 is connected with the lower frame 1, so that the two ends of the sliding groove 4 are sealed, the sliding plate 6 is fixed in the sliding groove 4, the falling-off is prevented, then, after the lower frame 1 and the upper frame 7 are installed, the buckle 17 is opened, the handle 16 is pulled, the turning plate 15 is turned outwards under the action of the hinge 14 while the handle 16 is pulled, at the moment, the packaging glue 11 is injected into a gap formed between the lower frame 1 and the upper frame 7, the semiconductor chip 3 is packaged, the production efficiency can be greatly improved through the encapsulation type packaging, the production cost is reduced, after the packaging is completed, the buckle 17 is clamped on the turning plate 15, and the turning plate 15 is fixed in the annular plate 13.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (6)
1. An encapsulated IC and integrated circuit package, comprising a lower frame (1) and an encapsulating adhesive (11), characterized in that: a circuit board (2) is fixedly connected in the lower frame (1), a conductor chip (3) is fixedly connected on the circuit board (2), a sliding groove (4) is formed in the lower frame (1), a sealing gasket (5) is fixedly connected in the sliding groove (4), a sliding plate (6) is connected in the sealing gasket (5) in a clamping manner, and an upper frame (7) is fixedly connected above the sliding plate (6);
one side of going up frame (7) is provided with shrouding (8), set up threaded hole (9) on shrouding (8), threaded hole (9) female connection has connecting bolt (10), encapsulation glue (11) set up the below at last frame (7), it has logical groove (12) to go up to seted up in frame (7), lead to fixedly connected with annular slab (13) in groove (12), the top fixedly connected with hinge (14) of annular slab (13), the below fixedly connected with of hinge (14) turns over board (15), the top fixedly connected with handle (16) of turning over board (15), one side of handle (16) is provided with buckle (17).
2. The encapsulated IC and integrated circuit package of claim 1, wherein: the sliding grooves (4), the sealing gaskets (5) and the sliding plates (6) are symmetrically arranged in two groups between the lower frame (1) and the upper frame (7), and the two groups of sliding grooves (4), the sealing gaskets (5) and the sliding plates (6) form a sliding structure.
3. The encapsulated IC and integrated circuit package of claim 1, wherein: the cross sections of the sliding groove (4), the sealing gasket (5) and the sliding plate (6) are all T-shaped, the inner cross section area of the sealing gasket (5) is smaller than that of the sliding plate (6), and the sealing gasket (5) is made of rubber.
4. The encapsulated IC and integrated circuit package of claim 1, wherein: the two ends of the sliding groove (4) of the sealing plate (8) are respectively provided with a group, the cross section of the sealing plate (8) is rectangular, and the cross section of the sealing plate (8) is larger than that of the sliding groove (4).
5. The encapsulated IC and integrated circuit package of claim 1, wherein: the four corners of the sealing plate (8) are respectively provided with a group of threaded holes (9) and connecting bolts (10), the length of each connecting bolt (10) is larger than the depth of each threaded hole (9), and the four groups of threaded holes (9), the connecting bolts (10) and the sealing plate (8) form a limiting structure.
6. The encapsulated IC and integrated circuit package of claim 1, wherein: the annular plate (13), the hinge (14), the turning plate (15), the handle (16) and the buckle (17) form a movable turning structure, and the inner size of the annular plate (13) is equal to that of the turning plate (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021972961.6U CN212783420U (en) | 2020-09-10 | 2020-09-10 | Encapsulated IC and integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021972961.6U CN212783420U (en) | 2020-09-10 | 2020-09-10 | Encapsulated IC and integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212783420U true CN212783420U (en) | 2021-03-23 |
Family
ID=75065195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021972961.6U Expired - Fee Related CN212783420U (en) | 2020-09-10 | 2020-09-10 | Encapsulated IC and integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212783420U (en) |
-
2020
- 2020-09-10 CN CN202021972961.6U patent/CN212783420U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220225 Address after: 443500 group 4, Jing'an village, yayakou Township, Changyang Tujia Autonomous County, Yichang City, Hubei Province Patentee after: Xiang Pengfei Address before: 528400 3rd floor, building 1, No.2 Lefeng 8th Road, Maohui Industrial Zone, Henglan Town, Zhongshan City, Guangdong Province Patentee before: Zhongshan Xinyu Semiconductor Technology Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220610 Address after: 441000 floor 3, plant 6, building 3, Nongxin science and Technology Industrial Park, Yicheng Economic Development Zone, Xiangyang City, Hubei Province Patentee after: Xiangyang Xinyu Semiconductor Technology Co.,Ltd. Address before: 443500 group 4, Jing'an village, yayakou Township, Changyang Tujia Autonomous County, Yichang City, Hubei Province Patentee before: Xiang Pengfei |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210323 |