CN212753071U - High heat dissipation device of high-power circuit board - Google Patents
High heat dissipation device of high-power circuit board Download PDFInfo
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- CN212753071U CN212753071U CN202022076753.4U CN202022076753U CN212753071U CN 212753071 U CN212753071 U CN 212753071U CN 202022076753 U CN202022076753 U CN 202022076753U CN 212753071 U CN212753071 U CN 212753071U
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- circuit board
- power circuit
- storage tank
- refrigerant storage
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Abstract
The utility model discloses a high heat abstractor of high-power circuit board, it includes base (1), set firmly in refrigerant storage tank (2) at base (1) top, the top of base (1) has set firmly mounting panel (3) that are located refrigerant storage tank (2) left and right sides, be provided with high-power circuit board (4) that are located directly over refrigerant storage tank (2) between two mounting panels (3), the circuit layer of high-power circuit board (4) sets up, slidable mounting has rather than complex lifter (6) in square groove (5), the one end of lifter (6) is from down up running through square groove (5) in order, refrigerant storage tank (2) bottom just stretches into in refrigerant storage tank (2), the top of lifter (6) is provided with finned radiator, finned radiator includes base plate (7) and fin (8). The utility model has the advantages that: the structure is compact, the heat on the circuit layer can be discharged in time, the maintenance of the high-power circuit board is convenient, and the operation is simple.
Description
Technical Field
The utility model relates to a new forms of energy circuit board's installation device, especially a high heat abstractor of high-power circuit board.
Background
The circuit board is a copper-based circuit board and comprises a copper plate and a circuit layer, wherein the circuit layer is arranged on the top surface of the copper plate, and the circuit layer is used for controlling the execution command of the equipment. With the continuous development of electronic devices, circuit boards are also gradually applied to large-scale automated mechanical devices, and the more functions of the automated mechanical devices, the larger the size of the corresponding circuit board is, the larger the power of the corresponding circuit board is, so that a large amount of heat is generated on the circuit layer when the circuit board works.
Before the high-power circuit board is used, an installer firstly installs the high-power circuit board on the top of a control box of equipment through screws, and then welds a finned radiator on a circuit layer of the high-power circuit board, namely welds a substrate of the finned radiator on the circuit layer. When the heat dissipation device works, heat generated on the circuit layer is transferred to the copper plate, the copper plate transfers the heat to the fins of the fin type radiator, and finally the fins transfer the heat to the air, so that the heat dissipation of the circuit board is realized. However, although the circuit board can be cooled through the fin-type radiator, the heat productivity of the circuit layer is large, and the heat on the fins cannot be timely discharged into the air, so that a large amount of heat is accumulated on the fins, the circuit layer can be burned out undoubtedly, the service life of the high-power circuit board is greatly shortened, and the maintenance and repair cost is increased. In addition, because the base plate of the fin radiator is welded on the circuit layer, when the circuit layer is damaged, the circuit layer cannot be maintained, and the maintenance is very difficult. Therefore, a high heat dissipation device capable of timely discharging heat on a circuit layer and facilitating maintenance of a high-power circuit board is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's shortcoming, provide a compact structure, can in time discharge the circuit layer on heat, the high heat abstractor of the high-power circuit board of convenient maintenance high-power circuit board, easy operation.
The purpose of the utility model is realized through the following technical scheme: a high heat dissipation device of a high-power circuit board comprises a base and a refrigerant storage tank fixedly arranged at the top of the base, wherein mounting plates positioned at the left side and the right side of the refrigerant storage tank are fixedly arranged at the top of the base, the high-power circuit board positioned right above the refrigerant storage tank is arranged between the two mounting plates, a circuit layer of the high-power circuit board is arranged upwards, a square groove is formed in the base, a lifting rod matched with the square groove is arranged in the square groove in a sliding manner, one end of the lifting rod sequentially penetrates through the square groove and the bottom of the refrigerant storage tank from bottom to top and extends into the refrigerant storage tank, a fin type heat radiator is arranged at the top of the lifting rod and comprises a base plate and fins, the base plate is welded at the top of the lifting rod, the fins distributed in a rectangular array are welded at the bottom of the base plate, the other end of the lifting rod penetrates through the square groove downwards, the extending end is welded with the fixed plate, the base is fixedly provided with a lifting cylinder, and a piston rod of the lifting cylinder is fixedly arranged on the fixed plate.
The top of two mounting panels all is provided with the screw hole.
The high-power circuit board penetrates through the through hole through a screw and is fixed on the mounting plate in threaded connection with the threaded hole.
And a liquid discharge valve is arranged on the side wall of the refrigerant storage tank.
The lifting cylinder is vertically arranged.
And a dynamic sealing element is arranged between the lifting rod and the refrigerant storage tank.
The bottom welding of base has a plurality of supporting legs that extend in the fixed plate below.
The utility model has the advantages of it is following: the utility model discloses compact structure, can in time discharge the circuit layer and go up heat, convenient maintenance high-power circuit board, easy operation.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of the operation of cooling the fins of a finned heat sink;
fig. 3 is a sectional view a-a of fig. 1.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 1 to 3, a high heat dissipation device for a high power circuit board comprises a base 1 and a refrigerant storage tank 2 fixedly arranged at the top of the base 1, wherein mounting plates 3 positioned at the left and right sides of the refrigerant storage tank 2 are fixedly arranged at the top of the base 1, the high power circuit board 4 positioned right above the refrigerant storage tank 2 is arranged between the two mounting plates 3, a circuit layer of the high power circuit board 4 is arranged upward, a square groove 5 is arranged on the base 1, a lifting rod 6 matched with the square groove 5 is slidably arranged in the square groove 5, one end of the lifting rod 6 sequentially penetrates through the square groove 5 and the bottom of the refrigerant storage tank 2 from bottom to top and extends into the refrigerant storage tank 2, a fin-type heat sink is arranged at the top of the lifting rod 6 and comprises a base plate 7 and fins 8, the base plate 7 is welded at the top of the lifting rod 6, and the, fin 8 sets up directly over refrigerant storage tank 2, and the top surface of base plate 7 contacts with the basal surface of 4 copper boards of high-power circuit board, the other end of lifter 6 runs through square groove 5 downwards and sets up, and extends to serve the welding and have fixed plate 9, still fixed mounting has lift cylinder 10 on the base 1, and lift cylinder 10 vertical sets up, and the piston rod of lift cylinder 10 sets firmly on fixed plate 9.
The top of two mounting panels 3 all is provided with the screw hole. The high-power circuit board 4 is provided with through holes corresponding to the threaded holes on the left edge and the right edge, and the high-power circuit board 4 penetrates through the through holes through screws 11 and is fixed on the mounting plate 3 in threaded connection with the threaded holes. A liquid discharge valve 12 is arranged on the side wall of the refrigerant storage tank 2. And a dynamic sealing element is arranged between the lifting rod 6 and the refrigerant storage tank 2. The bottom welding of base 1 has a plurality of supporting legs 13 that extend below fixed plate 9.
The working process of the utility model is as follows: before using the high-power circuit board 4, an installer firstly welds the support legs 13 of the base 1 to the top of a control box of the equipment; when the high-power circuit board 4 works, heat generated by a circuit layer on the high-power circuit board 4 is transferred to the copper plate, the copper plate transfers the heat to the fins 8 of the fin type radiator, and finally the fins 8 transfer the heat to the air, so that the high-power circuit board is radiated. After working for a period of time, the temperature around the equipment is also high, so the heat dissipation effect of the fins 8 is gradually reduced, a large amount of heat is accumulated on the fins 8, and the high temperature on the circuit layer cannot be reduced.
When the high-power circuit board 4 works for a period of time, a worker only needs to operate the lifting cylinder 10 to extend a piston rod of the lifting cylinder, the piston rod moves downwards, the piston rod drives the fixing plate 9 to move downwards, the fixing plate 9 drives the lifting rod 6 to move downwards, the lifting rod 6 drives the base plate 7 to move downwards, when the base plate 7 moves downwards, the fins 8 on the base plate 7 extend into the refrigerant in the refrigerant storage tank 2, the refrigerant exchanges heat with heat accumulated on the fins 8, so that the temperature of the fins 8 is reduced in a short time, after the high-power circuit board is soaked for a period of time, the worker operates the lifting cylinder 10 to retract the piston rod of the lifting cylinder, the piston rod drives the fixing plate 9 and the lifting rod 6 to move upwards, the lifting rod 6 drives the base plate 7 to move upwards, when the base plate 7 is observed to be in contact with the copper plate of the high-power circuit board, the heat on the circuit layer can be timely discharged, and therefore the service life of the high-power circuit board is prolonged.
In addition, the fin radiator is not welded on the high-power circuit board 4 but can be detached, and the high-power circuit board 4 can be detached from the mounting plate 3, so that the high-power circuit board is convenient for maintenance workers to maintain.
The foregoing is illustrative of the preferred embodiments of the present invention, and it is to be understood that the invention is not limited to the precise forms disclosed herein, and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the invention as defined by the appended claims. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (7)
1. A high heat abstractor of high-power circuit board which characterized in that: the refrigeration system comprises a base (1) and a refrigerant storage tank (2) fixedly arranged at the top of the base (1), wherein mounting plates (3) positioned on the left side and the right side of the refrigerant storage tank (2) are fixedly arranged at the top of the base (1), a high-power circuit board (4) positioned right above the refrigerant storage tank (2) is arranged between the two mounting plates (3), a circuit layer of the high-power circuit board (4) is arranged upwards, a square groove (5) is formed in the base (1), a lifting rod (6) matched with the square groove is slidably mounted in the square groove (5), one end of the lifting rod (6) sequentially penetrates through the bottom of the square groove (5) and the bottom of the refrigerant storage tank (2) from bottom to top and extends into the refrigerant storage tank (2), a fin type radiator is arranged at the top of the lifting rod (6), the fin type radiator comprises a base plate (7) and fins (8), and the, the welding of the bottom of base plate (7) has fin (8) that are the distribution of rectangle array, and fin (8) set up directly over refrigerant storage tank (2), and the top surface of base plate (7) contacts with the basal surface of high-power circuit board (4) copper, the other end of lifter (6) runs through square groove (5) setting downwards, and extends to serve the welding and have fixed plate (9), still fixed mounting has lift cylinder (10) on base (1), and the piston rod of lift cylinder (10) sets firmly on fixed plate (9).
2. The high heat dissipating device of a high power circuit board as claimed in claim 1, wherein: the top of the two mounting plates (3) is provided with a threaded hole.
3. The high heat dissipating device of a high power circuit board as claimed in claim 1, wherein: the high-power circuit board (4) is provided with through holes corresponding to the threaded holes on the left edge and the right edge, and the high-power circuit board (4) penetrates through the through holes through screws (11) and is fixed on the mounting plate (3) in a threaded connection with the threaded holes.
4. The high heat dissipating device of a high power circuit board as claimed in claim 1, wherein: and a liquid discharge valve (12) is arranged on the side wall of the refrigerant storage tank (2).
5. The high heat dissipating device of a high power circuit board as claimed in claim 1, wherein: the lifting cylinder (10) is vertically arranged.
6. The high heat dissipating device of a high power circuit board as claimed in claim 1, wherein: and a dynamic sealing element is arranged between the lifting rod (6) and the refrigerant storage tank (2).
7. The high heat dissipating device of a high power circuit board as claimed in claim 1, wherein: the bottom welding of base (1) has a plurality of supporting legs (13) that extend below fixed plate (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022076753.4U CN212753071U (en) | 2020-09-21 | 2020-09-21 | High heat dissipation device of high-power circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022076753.4U CN212753071U (en) | 2020-09-21 | 2020-09-21 | High heat dissipation device of high-power circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212753071U true CN212753071U (en) | 2021-03-19 |
Family
ID=74990478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022076753.4U Active CN212753071U (en) | 2020-09-21 | 2020-09-21 | High heat dissipation device of high-power circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212753071U (en) |
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2020
- 2020-09-21 CN CN202022076753.4U patent/CN212753071U/en active Active
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