CN220511315U - Integrated circuit board mount pad - Google Patents
Integrated circuit board mount pad Download PDFInfo
- Publication number
- CN220511315U CN220511315U CN202322181034.2U CN202322181034U CN220511315U CN 220511315 U CN220511315 U CN 220511315U CN 202322181034 U CN202322181034 U CN 202322181034U CN 220511315 U CN220511315 U CN 220511315U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- mounting seat
- plates
- integrated circuit
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 claims description 17
- 238000003825 pressing Methods 0.000 claims description 8
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 description 6
- 238000005457 optimization Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated circuit board mounting seat, which comprises a mounting seat, wherein a circuit board is arranged in the mounting seat, support columns are arranged on the left side and the right side of the bottom end in the mounting seat, the upper end faces of the two support columns are fixedly connected with support plates, a plurality of uniformly distributed rubber columns are arranged on the upper end faces of the two support plates, a plurality of uniformly distributed radiating fins are arranged on the outer walls of the two support columns, the contact area between the circuit board and the rubber columns can be reduced, the lower end face of the circuit board is left in a large area, the radiating efficiency of the circuit board can be further improved, heat generated during the working of the circuit board can be further radiated through the radiating fins, the circuit board can be conveniently driven to move up and down through the two mounting plates, the circuit board can be conveniently soldered, the circuit board can be pressed from the upper end faces through the downward movement of the elastic plates, the circuit board can be conveniently and stably mounted in the mounting seat, and the radiating efficiency of the circuit board is improved.
Description
Technical Field
The utility model relates to the technical field of integrated circuit board installation, in particular to an integrated circuit board installation seat.
Background
The integrated circuit board is a carrier for carrying integrated circuits, but often the integrated circuit board is also carried on the integrated circuit board, and the integrated circuit board is mainly composed of silica gel, so the integrated circuit board is green in general, the integrated circuit board is manufactured by adopting a semiconductor manufacturing process, a plurality of components such as transistors, resistors, capacitors and the like are manufactured on a small monocrystalline silicon wafer, and the components are combined into a complete electronic circuit according to a multilayer wiring or tunnel wiring method.
At present, when the existing integrated circuit board is installed, the existing integrated circuit board is generally installed on an installation seat of the integrated circuit board through small screws, so that the installation process is troublesome, the installation efficiency is reduced, the screws cannot collide with the integrated circuit board in the process of rotation, damage to the integrated circuit board is easy to cause, and the contact area between the circuit board and the installation seat is large in the process of installation, so that the heat dissipation effect is poor.
At present, the contact area between the circuit board and the mounting seat is large in the mounting process of the integrated circuit board, so that the heat dissipation effect of the circuit board is poor, the circuit board is mounted more troublesome and is not stable enough, and therefore, the integrated circuit board mounting seat is required to be provided for solving the problem.
Disclosure of Invention
The utility model aims to provide an integrated circuit board mounting seat, which has the characteristics of being portable and stably mounted in the mounting seat and improving the heat dissipation efficiency of the circuit board.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the integrated circuit board mounting seat comprises a mounting seat, wherein a circuit board is arranged in the mounting seat, support columns are arranged on the left side and the right side of the bottom end inside the mounting seat, the upper end faces of the two support columns are fixedly connected with support plates, a plurality of uniformly distributed rubber columns are arranged on the upper end faces of the two support plates, and a plurality of uniformly distributed radiating fins are arranged on the outer walls of the two support columns;
the mounting plate that the inside left and right sides of mount pad all has inner wall bottom and circuit board butt through bolt threaded connection, two the mount is all installed to the opposite one side of mounting plate, two the up end of mount runs through and threaded connection has the screw rod, two the clamp plate is all installed to the lower terminal surface of screw rod, two the elastic plate is all installed to the below of clamp plate.
In order to improve the service life of the circuit board, as an integrated circuit board mounting seat of the present utility model, a fan located below the circuit board is preferably mounted at the bottom end inside the mounting seat.
In order to increase the deformation force of the elastic plate, as an integrated circuit board mounting seat of the present utility model, preferably, two springs are mounted between the inner walls of the two elastic plates and the pressing plate.
In order to fix the cover plate and the mounting seat, the mounting seat for the integrated circuit board is preferably provided with the cover plate on the upper end face, extension plates are fixedly connected to the left side and the right side of the mounting seat and the left side and the right side of the cover plate, and threaded holes are formed in the upper end faces of the four extension plates in a penetrating mode.
In order to solder the circuit board, the integrated circuit board mounting seat is preferably adopted, the left side and the right side of the inner wall of the mounting seat are respectively provided with a sliding groove, and the two sliding grooves are both in sliding connection with the mounting plate through sliding blocks.
In order to dissipate heat of a circuit board in the mounting seat, as an integrated circuit board mounting seat of the present utility model, preferably, the lower end surface inside the mounting seat is provided with two heat dissipation holes.
Compared with the prior art, the utility model has the following beneficial effects:
according to the utility model, the contact area with the circuit board can be reduced through the plurality of rubber columns, the lower end face of the circuit board is left in a large area, so that the heat dissipation efficiency of the circuit board can be improved, the smooth heat dissipation of the circuit board is ensured, the heat generated during the work of the circuit board can be further dissipated through the heat dissipation fins, the circuit board is driven to move up and down through the two mounting plates so as to be convenient for soldering tin on the circuit board, the screw rod pushes the pressing plate and the elastic plate to move down until the elastic plate moves down to be in contact with the circuit board, the circuit board is pressed from the upper end face, and the circuit board can be stably mounted in the mounting seat, so that the circuit board is mounted in the mounting seat in a portable and stable manner, and meanwhile, the heat dissipation efficiency of the circuit board is improved.
Drawings
FIG. 1 is an overall block diagram of the present utility model;
FIG. 2 is an enlarged block diagram of the present utility model at A of FIG. 1;
fig. 3 is an enlarged structural view of the present utility model at B of fig. 1.
In the figure: 1. a mounting base; 101. a chute; 102. a heat radiation hole; 2. a support column; 201. a heat radiation fin; 202. a support plate; 203. a rubber column; 3. a mounting plate; 301. a fixing frame; 302. a screw; 303. a pressing plate; 304. an elastic plate; 305. a spring; 4. a fan; 5. a cover plate; 501. an extension plate; 6. a circuit board.
Detailed Description
Referring to fig. 1 to 3, an integrated circuit board mounting seat includes a mounting seat 1, a circuit board 6 is disposed in the mounting seat 1, support columns 2 are mounted on both left and right sides of the bottom end in the mounting seat 1, support plates 202 are fixedly connected to upper end surfaces of the two support columns 2, a plurality of uniformly distributed rubber columns 203 are mounted on upper end surfaces of the two support plates 202, and a plurality of uniformly distributed heat dissipation fins 201 are mounted on outer walls of the two support columns 2;
the inside left and right sides of mount pad 1 all has mounting panel 3 of inner wall bottom and circuit board 6 butt through bolt threaded connection, and mount 301 is all installed to the opposite one side of two mounting panels 3, and the up end of two mounts 301 runs through and threaded connection has screw 302, and clamp plate 303 is all installed to the lower terminal surface of two screw 302, and elastic plate 304 is all installed to the below of two clamp plates 303.
In this embodiment: the circuit board 6 is placed on the upper end face of the rubber column 203, the contact area with the circuit board 6 can be reduced through the rubber columns 203, and then the heat dissipation efficiency of the circuit board 6 can be improved, meanwhile, the left side and the right side of the lower end face of the circuit board 6 are supported through the two support columns 2, so that the lower end face of the circuit board 6 is left to be large in area, the smooth heat dissipation of the circuit board 6 can be guaranteed, the heat dissipation fins 201 through the outer walls of the support columns 2 can further dissipate heat generated during the working of the circuit board 6, the left side and the right side of the lower end face of the circuit board 6 are supported through the two mounting plates 3, so that the circuit board 6 can be driven to move up and down, soldering tin is convenient to be conducted on the circuit board 6, the screw 302 pushes the pressing plate 303 and the elastic plate 304 to move down until the elastic plate 304 moves down to be in contact with the circuit board 6, the circuit board 6 is pressed from the upper end face, and then the circuit board 6 can be stably mounted in the mounting seat 1, and the heat dissipation efficiency of the circuit board 6 is improved.
As a technical optimization scheme of the utility model, the bottom end inside the mounting seat 1 is provided with the fan 4 positioned below the circuit board 6.
In this embodiment: the fan 4 can blow and radiate the lower end face of the circuit board 6, thereby prolonging the service life of the circuit board 6.
As a technical optimization scheme of the present utility model, two springs 305 are installed between the inner walls of two elastic plates 304 and the pressing plate 303.
In this embodiment: by the elastic force of the spring 305, the deformation force of the elastic plate 304 can be increased, so that when the circuit board 6 is swayed by external force, the force can be effectively buffered by the spring 305.
As a technical optimization scheme of the utility model, the upper end face of the mounting seat 1 is provided with the cover plate 5, the left side and the right side of the mounting seat 1 and the left side and the right side of the cover plate 5 are fixedly connected with the extension plates 501, and the upper end faces of the four extension plates 501 are provided with threaded holes in a penetrating way.
In this embodiment: can protect circuit board 6 through apron 5, avoid outside dust to get into in mount pad 1 and fall in the up end of circuit board 6, through fixing bolt with two extension boards 501 of left and right sides respectively threaded connection, and then can fix apron 5 and mount pad 1.
As a technical optimization scheme of the utility model, sliding grooves 101 are formed in the left side and the right side of the inner wall of the mounting seat 1, and the two sliding grooves 101 are in sliding connection with the mounting plate 3 through sliding blocks.
In this embodiment: by pulling the mounting plate 3 upwards, the mounting plate 3 drives the circuit board 6 to slide up and down in the chute 101 until the circuit board 6 moves to the upper part inside the mounting seat 1, so that soldering tin is conveniently carried out on the circuit board 6.
As a technical optimization scheme of the utility model, two heat dissipation holes 102 are formed in the lower end face of the inside of the mounting seat 1.
In this embodiment: the heat dissipation holes 102 can dissipate heat from the circuit board 6 in the mount 1.
Working principle: firstly, place circuit board 6 at rubber post 203 up end, simultaneously circuit board 6 is located the up end of mounting panel 3 inner wall, can reduce the area of contact with circuit board 6 through a plurality of rubber posts 203, and then can improve circuit board 6's radiating efficiency, and simultaneously support the left and right sides of circuit board 6 lower extreme face through two support columns 2, make the lower terminal surface of circuit board 6 large tracts of land keep empty, and then can guarantee that circuit board 6 dispel the heat that circuit board 6 produced smoothly, and can further distribute the heat that the during operation of circuit board 6 through the fin 201 of support column 2 outer wall, can blow the heat dissipation to circuit board 6's lower extreme face through fan 4, thereby improve circuit board 6's life, secondly, support circuit board 6's left and right sides through two mounting panels 3, so as to drive circuit board 6 and reciprocate, thereby be convenient for soldering tin to circuit board 6, and through rotating screw 302, make screw 302 promote clamp plate 303 and elastic plate 304 move down with circuit board 6 from the up end face suppression, and then can make circuit board 6 stably install at mounting seat 1, and finally install at mounting seat 1, can be fixed at the both sides of mounting seat 1 and screw bolt 5 are fixed respectively, and the mounting seat 1 is fixed at both sides.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (6)
1. An integrated circuit board mount pad, includes mount pad (1), the inside of mount pad (1) is provided with circuit board (6), its characterized in that: support columns (2) are arranged on the left side and the right side of the inner bottom end of the mounting seat (1), support plates (202) are fixedly connected to the upper end faces of the two support columns (2), a plurality of uniformly distributed rubber columns (203) are arranged on the upper end faces of the two support plates (202), and a plurality of uniformly distributed radiating fins (201) are arranged on the outer walls of the two support columns (2);
the mounting seat is characterized in that the left side and the right side of the inside of the mounting seat (1) are respectively connected with mounting plates (3) with the bottom ends of the inner walls and the circuit boards (6) in a butt mode through bolts, fixing frames (301) are respectively mounted on one opposite sides of the mounting plates (3), the upper end faces of the fixing frames (301) penetrate through the screw rods (302) in a threaded mode, pressing plates (303) are respectively mounted on the lower end faces of the screw rods (302), and elastic plates (304) are respectively mounted below the pressing plates (303).
2. The integrated circuit board mount of claim 1, wherein: the bottom end inside the mounting seat (1) is provided with a fan (4) positioned below the circuit board (6).
3. The integrated circuit board mount of claim 1, wherein: two springs (305) are arranged between the inner walls of the two elastic plates (304) and the pressing plate (303).
4. The integrated circuit board mount of claim 1, wherein: the mounting seat is characterized in that a cover plate (5) is arranged on the upper end face of the mounting seat (1), extension plates (501) are fixedly connected to the left side and the right side of the mounting seat (1) and the left side and the right side of the cover plate (5), and threaded holes are formed in the upper end faces of the four extension plates (501) in a penetrating mode.
5. The integrated circuit board mount of claim 1, wherein: the left side and the right side of the inner wall of the mounting seat (1) are provided with sliding grooves (101), and the two sliding grooves (101) are in sliding connection with the mounting plate (3) through sliding blocks.
6. The integrated circuit board mount of claim 1, wherein: two heat dissipation holes (102) are formed in the lower end face of the inside of the mounting seat (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322181034.2U CN220511315U (en) | 2023-08-15 | 2023-08-15 | Integrated circuit board mount pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322181034.2U CN220511315U (en) | 2023-08-15 | 2023-08-15 | Integrated circuit board mount pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220511315U true CN220511315U (en) | 2024-02-20 |
Family
ID=89867535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322181034.2U Active CN220511315U (en) | 2023-08-15 | 2023-08-15 | Integrated circuit board mount pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220511315U (en) |
-
2023
- 2023-08-15 CN CN202322181034.2U patent/CN220511315U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |