CN220692006U - Integrated circuit board packaging structure - Google Patents
Integrated circuit board packaging structure Download PDFInfo
- Publication number
- CN220692006U CN220692006U CN202321969560.9U CN202321969560U CN220692006U CN 220692006 U CN220692006 U CN 220692006U CN 202321969560 U CN202321969560 U CN 202321969560U CN 220692006 U CN220692006 U CN 220692006U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- fixedly connected
- integrated circuit
- shell
- louvre
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 230000017525 heat dissipation Effects 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 9
- 239000012535 impurity Substances 0.000 abstract description 6
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000001771 impaired effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an integrated circuit board packaging structure which comprises a packaging shell, wherein one side of the top end of the packaging shell is movably hinged with a cover plate, two sides of the bottom end inside the packaging shell are fixedly connected with supporting blocks, and the top end of each supporting block is fixedly connected with a connecting block. This integrated circuit board packaging structure is through being provided with louvre, the filter screen, backup pad and heat conduction copper sheet, the heat conduction copper sheet of backup pad bottom is conducted heat to the heat that the circuit board produced, thereby can prevent to dispel the heat to the circuit board that the circuit board during operation is too high leads to the spare part impaired, be provided with the louvre in the inside of apron, the louvre can be further to the inside heat dissipation of encapsulation shell, improve the inside cooling efficiency of encapsulation shell, the inside filter screen of louvre can prevent that dust and impurity from getting into the inside of encapsulation shell through the louvre, it is the inside that dust and impurity get into the casing through the louvre easily and the relatively poor problem of cooling efficiency.
Description
Technical Field
The utility model relates to the technical field of integrated circuit boards, in particular to an integrated circuit board packaging structure.
Background
The integrated circuit board is made by adding a plurality of transistors, resistors, capacitors and other components on a small monocrystalline silicon wafer by adopting a semiconductor manufacturing process, then combining the components into a complete electronic circuit according to a proper method, and after the circuit board is packaged, a great amount of heat is generated at the position of the electronic component during high-load operation.
According to the packaging structure of integrated circuit board that application number CN201821580350.X provided, which comprises a substrate, the both sides inside of base plate is provided with the slot, the inner wall of slot is provided with insulating cover, the inner wall grafting of insulating cover has the spliced pole, the upper end of spliced pole is provided with the heating panel, the surface coating of heating panel has heat conduction silicone grease, the middle part of base plate is provided with the recess, the inside lower surface contact of recess is connected with first backing plate, the centre of first backing plate is provided with the hole of stepping down, the upper end contact of first backing plate is connected with electronic component, and the packaging structure of this integrated circuit board, the heat dissipation that heat conduction strip that sets up can transmit electronic component production is spread, prevents that local heat from being too high, leads to the circuit board to burn out, and the heating panel of setting up can dispel the heat in the electronic component fast through great radiating area to reduce the inside temperature of electronic component.
According to the technical scheme, the heat generated by the electronic element can be dispersed through the heat conducting strip, so that local heat is prevented from being too high, but dust and impurities easily enter the inside of the shell through the heat radiating holes and the heat radiating efficiency is poor when the integrated circuit board packaging structure is used, and therefore, a novel integrated circuit board packaging structure is provided for improving the problems.
Disclosure of Invention
The utility model aims to provide an integrated circuit board packaging structure, which solves the problems that dust and impurities easily enter the inside of a shell through a heat dissipation hole and the heat dissipation efficiency is poor in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an integrated circuit board packaging structure, includes the encapsulation shell, one side activity articulated on encapsulation shell top has the apron, the both sides fixedly connected with supporting shoe of the inside bottom of encapsulation shell, the top fixedly connected with connecting block of supporting shoe, fixedly connected with backup pad between the supporting shoe, be provided with heat conduction copper sheet between the bottom of backup pad and encapsulation shell, the inside of apron is provided with the louvre, the inside of louvre is provided with the filter screen.
Preferably, the heat dissipation holes are provided with a plurality of groups, and the heat dissipation holes are arranged at equal intervals in the cover plate.
Preferably, the inside activity of connecting block articulates there is the movable block, the top of movable block is provided with the movable frame, the bottom fixedly connected with insulation buffer pad of movable frame one side.
Preferably, the movable frame is movably hinged to the top end of the connecting block through the movable block, and the movable frame is provided with two groups.
Preferably, the top fixedly connected with mounting bracket of encapsulation shell opposite side, the opposite side fixedly connected with connecting plate of apron bottom, the spacing groove has been seted up to the inside of connecting plate and mounting bracket, the opposite side of mounting bracket is provided with the arm-tie, fixedly connected with spacing spring between mounting bracket and the arm-tie, one side fixedly connected with gag lever post of arm-tie.
Preferably, the limit rod is embedded in the limit groove, and the limit spring is arranged on the other side of the outside of the limit rod.
Compared with the prior art, the utility model has the beneficial effects that: the integrated circuit board packaging structure not only improves the heat dissipation efficiency and prevents dust from entering the inside of the shell, but also facilitates the limit fixation of the circuit board and the fixation of the cover plate;
(1) The circuit board is supported by the supporting plate through the heat dissipation holes, the filter screen, the supporting plate and the heat conduction copper sheet, and the heat conduction copper sheet at the bottom end of the supporting plate conducts heat to heat generated by the circuit board, so that the circuit board can be dissipated to prevent damage to parts caused by overhigh temperature when the circuit board works, the heat dissipation holes are formed in the cover plate, the heat dissipation holes can further dissipate heat in the packaging shell, the cooling efficiency in the packaging shell is improved, and the filter screen in the heat dissipation holes can prevent dust and impurities from entering the packaging shell through the heat dissipation holes;
(2) The circuit board is placed on the top end of the supporting plate pair through the connecting block, the movable frame and the insulating buffer cushion, and then the movable block is rotated;
(3) Through being provided with connecting plate, spacing groove, mounting bracket, gag lever post, spacing spring and arm-tie, the pulling arm-tie drives the inside that the gag lever post breaks away from the spacing groove and makes the apron lose fixedly, and the apron is opened after losing fixedly, need inlay the connecting plate of apron bottom at the inside of mounting bracket when fixed to the apron, then loosen the arm-tie, and spacing spring can make the inside of gag lever post embedding spacing groove fix the apron through self elasticity.
Drawings
FIG. 1 is a schematic cross-sectional elevation view of the present utility model;
FIG. 2 is an enlarged cross-sectional schematic view of the connecting block of the present utility model;
FIG. 3 is a schematic top view of a cover plate according to the present utility model;
fig. 4 is an enlarged sectional view of fig. 1 a according to the present utility model.
In the figure: 1. a package housing; 2. a support block; 3. a connecting block; 4. a cover plate; 5. a heat radiation hole; 6. a filter screen; 7. a movable block; 8. a support plate; 9. a thermally conductive copper sheet; 10. a movable frame; 11. an insulating buffer pad; 12. a connecting plate; 13. a limit groove; 14. a mounting frame; 15. a limit rod; 16. a limit spring; 17. pulling the plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1: referring to fig. 1-4, an integrated circuit board packaging structure comprises a packaging shell 1, wherein one side of the top end of the packaging shell 1 is movably hinged with a cover plate 4, two sides of the bottom end inside the packaging shell 1 are fixedly connected with supporting blocks 2, a supporting plate 8 is fixedly connected between the supporting blocks 2, a heat conducting copper sheet 9 is arranged between the supporting plate 8 and the bottom end of the packaging shell 1, a heat dissipation hole 5 is formed inside the cover plate 4, and a filter screen 6 is arranged inside the heat dissipation hole 5;
the heat dissipation holes 5 are provided with a plurality of groups, and the heat dissipation holes 5 are arranged at equal intervals in the cover plate 4;
specifically, as shown in fig. 1 and 3, the supporting plate 8 supports the circuit board, and the heat conduction copper sheet 9 at the bottom end of the supporting plate 8 conducts heat to heat generated by the circuit board, so that the circuit board can be radiated to prevent damage to parts caused by overhigh temperature during operation of the circuit board, the radiating holes 5 are formed in the cover plate 4, the radiating holes 5 can further radiate the inside of the packaging shell 1, the cooling efficiency of the inside of the packaging shell 1 is improved, and the filter screen 6 in the radiating holes 5 can prevent dust and impurities from entering the inside of the packaging shell 1 through the radiating holes 5.
Example 2: the top end of the supporting block 2 is fixedly connected with a connecting block 3, a movable block 7 is movably hinged in the connecting block 3, a movable frame 10 is arranged at the top end of the movable block 7, an insulating buffer cushion 11 is fixedly connected with the bottom end of one side of the movable frame 10, the movable frame 10 is movably hinged at the top end of the connecting block 3 through the movable block 7, and two groups of movable frames 10 are arranged;
specifically, as shown in fig. 1 and 2, after the circuit board is placed, the movable block 7 is rotated, and since the movable block 7 is movably hinged in the connecting block 3 and the movable frame 10 is fixedly connected to the top end of the movable block 7, the bottom end of the other side of the movable frame 10 can be rotated to the top end of the circuit board to limit and fix the circuit board by rotating the movable block 7, so that the phenomenon of dislocation is avoided.
Example 3: the top end of the other side of the packaging shell 1 is fixedly connected with a mounting frame 14, the other side of the bottom end of the cover plate 4 is fixedly connected with a connecting plate 12, limiting grooves 13 are formed in the connecting plate 12 and the mounting frame 14, a pull plate 17 is arranged on the other side of the mounting frame 14, a limiting spring 16 is fixedly connected between the mounting frame 14 and the pull plate 17, one side of the pull plate 17 is fixedly connected with a limiting rod 15, the limiting rod 15 is embedded in the limiting grooves 13, and the limiting spring 16 is arranged on the other side of the outer part of the limiting rod 15;
specifically, as shown in fig. 1 and fig. 4, when the pull plate 17 is pulled, the pull plate 17 drives the limit rod 15 to separate from the inside of the limit groove 13, so that the cover plate 4 is not fixed, after the cover plate 4 is not fixed, the cover plate 4 is opened, the connecting plate 12 at the bottom end of the cover plate 4 is embedded in the inside of the mounting frame 14 when the cover plate 4 is required to be fixed, then the pull plate 17 is loosened, and the limit spring 16 enables the limit rod 15 to be embedded in the inside of the limit groove 13 through elasticity of the limit spring 16 to fix the cover plate 4.
Working principle: when the circuit board packaging structure is used, the pull plate 17 is pulled, the pull plate 17 drives the limiting rod 15 to be separated from the inside of the limiting groove 13, so that the cover plate 4 is lost, the cover plate 4 is opened after the cover plate 4 is lost to be fixed, the circuit board is placed on the top end of the supporting plate 8 after the cover plate 4 is opened, then the movable block 7 is rotated, the movable block 7 is movably hinged in the connecting block 3, the movable frame 10 is fixedly connected to the top end of the movable block 7, the bottom end of the other side of the movable frame 10 can be rotated to the top end of the circuit board to limit and fix the circuit board, the phenomenon of dislocation is avoided, the connecting plate 12 at the bottom end of the cover plate 4 is required to be embedded in the inside of the mounting frame 14 when the cover plate 4 is fixed, then the pull plate 17 is loosened, the limiting spring 16 enables the limiting rod 15 to be embedded in the inside of the limiting groove 13 through self elasticity to fix the cover plate 4, the heat conducting copper sheet 9 at the bottom end of the supporting plate 8 conducts heat to the circuit board, therefore the circuit board is prevented from being damaged due to overhigh temperature when the circuit board works, the heat conducting holes 5 are formed in the inside the cover plate 4, the inside the packaging shell 1 can be further cooled, the packaging shell 1 is prevented from being damaged, the heat conducting efficiency is improved, the inside the packaging shell 1 is improved, the packaging shell is prevented from the dust and the dust can be prevented from entering the inside the packaging shell 5 through the filter screen 5 through the heat through the holes 5.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. An integrated circuit board packaging structure, including encapsulation shell (1), its characterized in that: one side activity on encapsulation shell (1) top articulates there is apron (4), the both sides fixedly connected with supporting shoe (2) of the inside bottom of encapsulation shell (1), the top fixedly connected with connecting block (3) of supporting shoe (2), fixedly connected with backup pad (8) between supporting shoe (2), be provided with heat conduction copper sheet (9) between the bottom of backup pad (8) and encapsulation shell (1), the inside of apron (4) is provided with louvre (5), the inside of louvre (5) is provided with filter screen (6).
2. The integrated circuit board package structure of claim 1, wherein: the heat dissipation holes (5) are arranged in a plurality of groups, and the heat dissipation holes (5) are arranged in the cover plate (4) at equal intervals.
3. The integrated circuit board package structure of claim 1, wherein: the inside activity of connecting block (3) articulates there is movable block (7), the top of movable block (7) is provided with movable frame (10), the bottom fixedly connected with insulating blotter (11) of movable frame (10) one side.
4. An integrated circuit board package structure according to claim 3, wherein: the movable frame (10) is movably hinged to the top end of the connecting block (3) through the movable block (7), and the movable frame (10) is provided with two groups.
5. The integrated circuit board package structure of claim 1, wherein: the packaging structure comprises a packaging shell (1), wherein a mounting frame (14) is fixedly connected to the top end of the other side of the packaging shell (1), a connecting plate (12) is fixedly connected to the other side of the bottom end of a cover plate (4), a limiting groove (13) is formed in the connecting plate (12) and the mounting frame (14), a pull plate (17) is arranged on the other side of the mounting frame (14), a limiting spring (16) is fixedly connected between the mounting frame (14) and the pull plate (17), and a limiting rod (15) is fixedly connected to one side of the pull plate (17).
6. The integrated circuit board package structure of claim 5, wherein: the limiting rod (15) is embedded in the limiting groove (13), and the limiting spring (16) is arranged on the other side of the outer portion of the limiting rod (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321969560.9U CN220692006U (en) | 2023-07-25 | 2023-07-25 | Integrated circuit board packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321969560.9U CN220692006U (en) | 2023-07-25 | 2023-07-25 | Integrated circuit board packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220692006U true CN220692006U (en) | 2024-03-29 |
Family
ID=90403522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321969560.9U Active CN220692006U (en) | 2023-07-25 | 2023-07-25 | Integrated circuit board packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220692006U (en) |
-
2023
- 2023-07-25 CN CN202321969560.9U patent/CN220692006U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |