CN216849923U

CN216849923U - Semiconductor lead frame

Info

Publication number: CN216849923U
Application number: CN202220089201.3U
Authority: CN
Inventors: 王路广; 王孟杰
Original assignee: Ningbo Yinzhou Lumai Electronics Co ltd
Current assignee: Ningbo Yinzhou Lumai Electronics Co ltd
Priority date: 2022-01-13
Filing date: 2022-01-13
Publication date: 2022-06-28
Anticipated expiration: 2032-01-13

Abstract

The utility model relates to the field of semiconductor technology, and a semiconductor lead frame is disclosed, which comprises a base bod, the mounting groove has been seted up to the inside of base member, the internally mounted of mounting groove has the frame body, fixed establishment is all installed to the upper and lower both sides of frame body, the fixed slot has all been seted up to the upper and lower both sides of base member, the fixed slot is linked together with the inside of mounting groove, fixed establishment's one end is connected with the fixed slot. The utility model discloses an install the frame body in the inside of mounting groove, make reset spring self's elastic action, can drive the movable block at the inside rebound of movable groove, can drive the inside that the dead lever alternates the fixed slot, can fix the frame body, make the frame body remain stable in the inside of mounting groove, be connected with the semiconductor through the current conducting plate at the different positions of frame body, make things convenient for the semiconductor of different stitches and the fixed connection of lead frame.

Description

Semiconductor lead frame

Technical Field

The utility model relates to the field of semiconductor technology, especially, relate to a semiconductor lead frame.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a lead-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.

Generally, when a semiconductor is connected, pins of the semiconductor need to be connected with a lead frame, but the pins of the semiconductor are mounted at different positions, so that the semiconductor is inconvenient to mount in the lead frame, the heat dissipation performance of the lead frame is poor, and the semiconductor is influenced to a certain extent.

SUMMERY OF THE UTILITY MODEL

The purpose of the utility model is to solve the shortcoming that exists among the prior art, if: generally, when a semiconductor is connected, pins of the semiconductor are required to be connected with a lead frame, but the pins of the semiconductor are different in installation position, so that the semiconductor is inconvenient to install in the lead frame, the heat dissipation performance of the lead frame is poor, and the semiconductor is influenced to a certain extent.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a semiconductor lead frame, includes the base member, the mounting groove has been seted up to the inside of base member, the internally mounted of mounting groove has the frame body, fixed establishment is all installed to the upper and lower both sides of frame body, the fixed slot has all been seted up to the upper and lower both sides of base member, the fixed slot is linked together with the inside of mounting groove, fixed establishment's one end is connected with the fixed slot, the fixed plate is all installed in the inboard four corners of frame body, the fixed plate is kept away from the one end of frame body and is installed the mount jointly, the screw hole has all been seted up in the four corners of mount, the heat conduction post that the equidistance was arranged is all installed to both sides around the frame body, the current conducting plate is all installed to the inside wall of frame body, spacing hole has all been seted up to one side of current conducting plate.

Preferably, fixed establishment is including seting up the activity groove in both sides about the frame body, reset spring is installed to the inner wall in activity groove, reset spring's one end is installed the movable block, reset spring's one side is kept away from to the movable block is installed the dead lever, reset spring's one end activity interlude is in the inside of fixed slot is kept away from to the dead lever.

Preferably, the upper side and the lower side of the front surface of the frame body are both provided with movable holes, one side of the movable block is provided with an adjusting rod, and one side of the adjusting rod is movably inserted into the movable holes.

Preferably, the heat-conducting plate is installed to the inner wall of fixed slot, the one end of heat-conducting post contacts with the heat-conducting plate, evenly distributed's heating panel is installed to the back of heat-conducting plate, the activity of heating panel alternates in the rear side of base member.

Preferably, four corners of the rear inner wall of the fixing groove are provided with supporting cushion blocks, and one side of each supporting cushion block is in contact with the frame body.

Preferably, the inside of the frame body is provided with uniformly distributed heat dissipation ports.

Compared with the prior art, the beneficial effects of the utility model are that:

(1) the utility model discloses an install the frame body in the inside of mounting groove, make reset spring self's elastic action, can drive the movable block at the inside rebound of movable groove, can drive the inside that the dead lever alternates the fixed slot, can fix the frame body, make the frame body remain stable in the inside of mounting groove, be connected with the semiconductor through the current conducting plate at the different positions of frame body, make things convenient for the semiconductor of different stitches and the fixed connection of lead frame.

(2) The utility model discloses an inside the thermovent transmitted the frame body with the heat on the semiconductor, through the effect of heat conduction post, can be with on the heat-conducting plate of heat transfer on the frame body to through the heating panel with heat wherein effluvium fast, can guarantee semiconductor operating condition's stability, and through the contact of lip block with the frame body, can keep the frame body at the inside stability of base member, be convenient for install fixedly to different semiconductors.

Drawings

FIG. 1 is a schematic view of the overall internal structure of the present invention;

fig. 2 is a schematic structural diagram of a first embodiment of the present invention;

fig. 3 is a schematic structural diagram of a second embodiment of the present invention.

In the figure: 1. a substrate; 2. mounting grooves; 3. a frame body; 4. a heat dissipation port; 5. a heat-conducting column; 6. a fixing mechanism; 61. a movable groove; 62. a return spring; 63. a movable hole; 64. adjusting a rod; 65. fixing the rod; 66. a movable block; 7. a threaded hole; 8. a fixed mount; 9. a fixing plate; 10. a conductive plate; 11. a limiting hole; 12. fixing grooves; 13. a heat dissipation plate; 14. a heat conducting plate; 15. and supporting the cushion block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-3, a semiconductor lead frame comprises a base body 1, a mounting groove 2 is formed in the base body 1, a frame body 3 is installed in the mounting groove 2, fixing mechanisms 6 are installed on the upper side and the lower side of the frame body 3, fixing grooves 12 are formed on the upper side and the lower side of the base body 1, the fixing grooves 12 are communicated with the inside of the mounting groove 2, one end of each fixing mechanism 6 is connected with the corresponding fixing groove 12, fixing plates 9 are installed at the four corners of the inner side of the frame body 3, fixing frames 8 are installed at the ends, away from the frame body 3, of the fixing plates 9, threaded holes 7 are formed in the four corners of each fixing frame 8, a semiconductor can be conveniently installed and fixed through the threaded holes 7, uniformly distributed heat dissipation holes 4 are formed in the frame body 3, heat conduction columns 5 are installed on the front side and the rear side of the frame body 3 at equal intervals, and heat conduction plates 14 are installed on the inner walls of the fixing grooves 12, one end and the heat-conducting plate 14 of heat-conducting post 5 contact, evenly distributed's heating panel 13 is installed to the back of heat-conducting plate 14, the activity of heating panel 13 alternates in the rear side of base member 1, heat transfer to frame body 3 inside through thermovent 4 on with the semiconductor, effect through heat-conducting post 5, can be with heat transfer to heat-conducting plate 14 on the frame body 3, and through heating panel 13 with the heat in it effluvium fast, can guarantee semiconductor operating condition's stability, current conducting plate 10 is all installed to the inside wall of frame body 3, spacing hole 11 has all been seted up to one side of current conducting plate 10.

The first embodiment is as follows:

as shown in fig. 2, the fixing mechanism 6 includes movable grooves 61 disposed on the upper and lower sides of the frame body 3, a return spring 62 is mounted on the inner wall of the movable groove 61, a movable block 66 is mounted at one end of the return spring 62, a fixed rod 65 is mounted at one side of the movable block 66 far from the return spring 62, one end of the fixed rod 65 far from the return spring 62 is movably inserted into the fixed groove 12, movable holes 63 are formed on the upper and lower sides of the front surface of the frame body 3, an adjusting rod 64 is mounted at one side of the movable block 66, one side of the adjusting rod 64 is movably inserted into the movable hole 63, the elastic action of the return spring 62 is enabled by mounting the frame body 3 in the mounting groove 2, the movable block 66 can be driven to move upwards in the movable groove 61, the fixed rod 65 can be driven to be inserted into the fixed groove 12, the frame body 3 can be fixed, and the frame body 3 can be kept stable in the mounting groove 2, and pulling the adjusting rod 64 to one side to drive the movable block 66 to move in the movable groove 61, so that the reset spring 62 can be compressed, the fixed rod 65 is driven to move out of the fixed groove 12, the frame body 3 and the semiconductor can be conveniently replaced integrally, and the maintenance efficiency of the semiconductor is improved.

The second embodiment:

as shown in fig. 3, the four corners of the rear inner wall of the fixing groove 12 are all provided with the supporting cushion blocks 15, one side of each supporting cushion block 15 is in contact with the frame body 3, and the supporting cushion blocks 15 are in contact with the frame body 3, so that the stability of the frame body 3 in the base body 1 can be maintained, and different semiconductors can be conveniently installed and fixed.

In the utility model, when the user uses the device, when the semiconductor is installed and fixed, the semiconductor can be fixed by installing the screw in the threaded hole 7, the frame body 3 is installed in the installation groove 2, the elastic action of the reset spring 62 can drive the movable block 66 to move upwards in the movable groove 61, the fixed rod 65 can be driven to penetrate into the fixed groove 12, the frame body 3 can be fixed, the frame body 3 is kept stable in the installation groove 2, the heat on the semiconductor is transferred into the frame body 3 through the heat dissipation port 4, the heat on the frame body 3 can be transferred onto the heat conduction plate 14 through the action of the heat conduction column 5, and the heat in the heat conduction plate 13 can be quickly dissipated through the heat dissipation plate 13, the stability of the working state of the semiconductor can be ensured, and the cushion block 15 is contacted with the frame body 3, can keep frame body 3 at the inside stability of base member 1, when the semiconductor damage appears, to one side pulling regulation pole 64 drive movable block 66 and remove in the inside of movable groove 61, can compress reset spring 62, drive dead lever 65 and shift out from the inside of fixed slot 12, conveniently carry out holistic change to frame body 3 and semiconductor, promoted the maintenance efficiency to the semiconductor.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Claims

1. The semiconductor lead frame comprises a base body (1) and is characterized in that a mounting groove (2) is formed in the base body (1), a frame body (3) is mounted in the mounting groove (2), fixing mechanisms (6) are mounted on the upper side and the lower side of the frame body (3), fixing grooves (12) are formed in the upper side and the lower side of the base body (1), the fixing grooves (12) are communicated with the inside of the mounting groove (2), one end of each fixing mechanism (6) is connected with the corresponding fixing groove (12), fixing plates (9) are mounted at four corners of the inner side of the frame body (3), a fixing frame (8) is mounted at one end, far away from the frame body (3), of each fixing plate (9), threaded holes (7) are formed in four corners of the fixing frame (8), and heat conducting columns (5) which are arranged at equal intervals are mounted on the front side and the rear side of the frame body (3), the frame is characterized in that the inner side wall of the frame body (3) is provided with a conductive plate (10), and one side of the conductive plate (10) is provided with a limit hole (11).

2. The semiconductor lead frame according to claim 1, wherein the fixing mechanism (6) comprises a movable groove (61) formed on the upper side and the lower side of the frame body (3), a return spring (62) is mounted on the inner wall of the movable groove (61), a movable block (66) is mounted at one end of the return spring (62), a fixing rod (65) is mounted on one side of the movable block (66) far away from the return spring (62), and one end of the fixing rod (65) far away from the return spring (62) is movably inserted into the fixing groove (12).

3. The semiconductor lead frame according to claim 2, wherein the upper side and the lower side of the front surface of the frame body (3) are both provided with movable holes (63), one side of the movable block (66) is provided with an adjusting rod (64), and one side of the adjusting rod (64) is movably inserted into the movable holes (63).

4. The semiconductor lead frame according to claim 1, wherein the inner wall of the fixing groove (12) is provided with a heat conducting plate (14), one end of the heat conducting column (5) is in contact with the heat conducting plate (14), the back surface of the heat conducting plate (14) is provided with uniformly distributed heat dissipating plates (13), and the heat dissipating plates (13) are movably inserted into the back side of the base body (1).

5. The semiconductor lead frame according to claim 1, wherein four corners of the rear inner wall of the fixing groove (12) are provided with supporting pads (15), and one side of each supporting pad (15) is in contact with the frame body (3).

6. The semiconductor lead frame according to claim 1, wherein the frame body (3) has heat dissipation openings (4) formed therein.