CN212722971U - High-low temperature test fixture for optical communication device - Google Patents
High-low temperature test fixture for optical communication device Download PDFInfo
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- CN212722971U CN212722971U CN202021130894.3U CN202021130894U CN212722971U CN 212722971 U CN212722971 U CN 212722971U CN 202021130894 U CN202021130894 U CN 202021130894U CN 212722971 U CN212722971 U CN 212722971U
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Abstract
The utility model discloses a high low temperature test fixture of optical communication device, including base plate, test socket, heat-conducting plate, PCB board and apron, the PCB board is located the base plate below, heat-conducting plate and apron set gradually above the base plate, the test socket is installed on the base plate and is connected with PCB board electricity, installs the device to be tested between heat-conducting plate and the apron, this device to be tested passes the heat-conducting plate and is connected with the test socket electricity; the heat conducting plate is provided with a convex block, the substrate and the PCB are provided with a first through hole and a second through hole, and the convex block sequentially passes through the first through hole and the second through hole and extends out of the second through hole; the heat conducting plate is provided with a mounting through hole, the inner wall of the mounting through hole is provided with a flange part, and a device to be tested is mounted in the mounting through hole; the heat conducting plate is also provided with a limit groove, and the upper end of the test socket is embedded into the limit groove. The utility model discloses both improved efficiency of software testing to the device, reduce cost greatly, improved the precision and the stability to the device test that awaits measuring again.
Description
Technical Field
The utility model relates to a high low temperature test fixture of optical communication device belongs to optical communication test technical field.
Background
At present, TO tests in the industry only have normal temperature test clamps, TO high-temperature and low-temperature batch test clamps do not exist, the speed of a TO packaged laser reaches 25G and 50G along with the development of optical communication, high-speed commercial TO needs high-temperature and low-temperature tests, no adaptive batch clamp is available in the industry at present, the existing scheme is single chip testing, the temperature control precision is high, but the batch production efficiency is low, and the TO high-temperature and low-temperature batch test clamps cannot be compatible with aging equipment.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high low temperature test fixture of optical communication device, it has both improved efficiency of software testing, reduce cost to the device greatly, has improved precision and stability to the device test that awaits measuring again.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a high-low temperature test fixture for optical communication devices comprises a base plate, a plurality of test sockets, a heat conducting plate, a PCB and a cover plate, wherein the PCB is positioned below the base plate, the heat conducting plate and the cover plate are sequentially arranged above the base plate, the test sockets are respectively arranged on the base plate and are electrically connected with the PCB, a device to be tested is arranged between the heat conducting plate and the cover plate, and the lower end of the device to be tested penetrates through the heat conducting plate to be electrically connected with the test sockets;
the lower surface of the heat conducting plate is provided with a plurality of convex blocks at intervals, the substrate and the PCB are respectively provided with a plurality of first through holes and second through holes corresponding to the convex blocks, and the lower ends of the convex blocks sequentially penetrate through the first through holes and the second through holes and extend out of the second through holes; the upper surface of the heat conducting plate is provided with a plurality of mounting through holes corresponding to the test socket, the inner wall of the upper part of the mounting through hole is provided with a flange part which extends inwards in the radial direction, and the device to be tested is mounted in the mounting through hole and is in contact connection with the upper surface of the flange part; the lower surface of the heat conducting plate is also provided with a plurality of limiting grooves corresponding to the test socket, and the upper end of the test socket is embedded into the limiting grooves.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the two sides of the mounting through hole are respectively provided with a strip-shaped groove communicated with the mounting through hole.
2. In the scheme, the cover plate is a plastic heat-insulating cover plate.
3. In the above scheme, the substrate is a plastic heat-insulating plate.
4. In the above scheme, the cover plate is respectively provided with light-emitting holes corresponding to the devices to be tested.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
1. the utility model discloses optical communication device's high low temperature test fixture, it is through adopting the multilayer design, and structural design is ingenious, when possessing good compatibility, but most normal atmospheric temperature of adaptation, aging testing system, can place many examination devices that await measuring, can also be applicable to multiple test mode such as high temperature ageing, low temperature test, normal atmospheric temperature test, high temperature test, has improved efficiency of software testing, reduce cost to the device greatly.
2. The utility model discloses high low temperature test fixture of optical communication device, it is not only convenient for the placing of device, but also can cooperate with the apron to realize the fixed to the device to guarantee to the stability and the precision of device test; due to the arrangement of the strip-shaped grooves, devices in the mounting through holes can be taken and placed conveniently, and the testing efficiency is improved; through the setting of spacing groove, strengthened the stability to the test socket installation, the device that is convenient for await measuring is more firm to be connected with test socket to the precision and the stability to the device that awaits measuring test have been improved.
Drawings
FIG. 1 is a schematic structural view of a high and low temperature test fixture for optical communication devices of the present invention;
FIG. 2 is a first schematic diagram of the heat conducting plate of the present invention;
FIG. 3 is a schematic diagram of a second heat-conducting plate structure of the present invention;
figure 4 is the utility model discloses installation through-hole structure sketch map.
In the above drawings: 1. a substrate; 101. a first through hole; 2. a test socket; 3. a heat conducting plate; 301. a bump; 4. a PCB board; 401. a second through hole; 5. a cover plate; 6. mounting a through hole; 601. a flange portion; 7. a strip-shaped groove; 10. a device to be tested; 13. a limiting groove.
Detailed Description
In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.
Example 1: a high-low temperature test fixture for optical communication devices comprises a base plate 1, a plurality of test sockets 2, a heat conducting plate 3, a PCB 4 and a cover plate 5, wherein the PCB 4 is positioned below the base plate 1, the heat conducting plate 3 and the cover plate 5 are sequentially arranged above the base plate 1, the test sockets 2 are respectively arranged on the base plate 1 and are electrically connected with the PCB 4, a device to be tested 10 is arranged between the heat conducting plate 3 and the cover plate 5, and the lower end of the device to be tested 10 penetrates through the heat conducting plate 3 and is electrically connected with the test sockets 2;
a plurality of bumps 301 are arranged on the lower surface of the heat conducting plate 3 at intervals, a plurality of first through holes 101 and second through holes 401 corresponding to the bumps 301 are respectively formed on the substrate 1 and the PCB 4, and the lower ends of the bumps 301 sequentially penetrate through the first through holes 101 and the second through holes 401, extend out of the second through holes 401 and are in contact with a temperature control platform on a testing machine; the upper surface of the heat conducting plate 3 is provided with a plurality of mounting through holes 6 corresponding to the test socket 2, the inner wall of the upper part of the mounting through hole 6 is provided with a flange part 601 which extends inwards in the radial direction, and the device to be tested 10 is mounted in the mounting through hole 6 and is in contact connection with the upper surface of the flange part 601; the lower surface of the heat conducting plate 3 is also provided with a plurality of limiting grooves 13 corresponding to the test socket 2, and the upper end of the test socket 2 is embedded into the limiting grooves 13.
Two sides of the mounting through hole 6 are respectively provided with a strip-shaped groove 7 communicated with the mounting through hole 6; the cover plate 5 is a plastic heat-insulating cover plate.
Example 2: a high-low temperature test fixture for optical communication devices comprises a base plate 1, a plurality of test sockets 2, a heat conducting plate 3, a PCB 4 and a cover plate 5, wherein the PCB 4 is positioned below the base plate 1, the heat conducting plate 3 and the cover plate 5 are sequentially arranged above the base plate 1, the test sockets 2 are respectively arranged on the base plate 1 and are electrically connected with the PCB 4, a device to be tested 10 is arranged between the heat conducting plate 3 and the cover plate 5, and the lower end of the device to be tested 10 penetrates through the heat conducting plate 3 and is electrically connected with the test sockets 2;
a plurality of bumps 301 are arranged on the lower surface of the heat conducting plate 3 at intervals, a plurality of first through holes 101 and second through holes 401 corresponding to the bumps 301 are respectively formed on the substrate 1 and the PCB 4, and the lower ends of the bumps 301 sequentially penetrate through the first through holes 101 and the second through holes 401, extend out of the second through holes 401 and are in contact with a temperature control platform on a testing machine; the upper surface of the heat conducting plate 3 is provided with a plurality of mounting through holes 6 corresponding to the test socket 2, the inner wall of the upper part of the mounting through hole 6 is provided with a flange part 601 which extends inwards in the radial direction, and the device to be tested 10 is mounted in the mounting through hole 6 and is in contact connection with the upper surface of the flange part 601; the lower surface of the heat conducting plate 3 is also provided with a plurality of limiting grooves 13 corresponding to the test socket 2, and the upper end of the test socket 2 is embedded into the limiting grooves 13.
The substrate 1 is a plastic heat-insulation plate; the cover plate 5 is provided with light-emitting holes corresponding to the devices to be tested 10.
When the high-low temperature test fixture of the optical communication device is adopted, the multi-layer design is adopted, the structural design is ingenious, the high-low temperature test fixture has good compatibility, can be adapted to most normal temperature and aging test systems, can be used for placing a plurality of devices to be tested, and can be suitable for various test modes such as high temperature aging, low temperature test, normal temperature test, high temperature test and the like, so that the test efficiency of the devices is greatly improved, and the cost is reduced; in addition, the device can be conveniently placed, and can be fixed by matching with the cover plate, so that the stability and the precision of the device test are ensured; due to the arrangement of the strip-shaped grooves, devices in the mounting through holes can be taken and placed conveniently, and the testing efficiency is improved; through the setting of spacing groove, strengthened the stability to the test socket installation, the device that is convenient for await measuring is more firm to be connected with test socket to the precision and the stability to the device that awaits measuring test have been improved.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. The utility model provides a high low temperature test fixture of optical communication device which characterized in that: the testing device comprises a base plate (1), a plurality of testing sockets (2), a heat-conducting plate (3), a PCB (4) and a cover plate (5), wherein the PCB (4) is positioned below the base plate (1), the heat-conducting plate (3) and the cover plate (5) are sequentially arranged above the base plate (1), the plurality of testing sockets (2) are respectively arranged on the base plate (1) and are electrically connected with the PCB (4), a device to be tested (10) is arranged between the heat-conducting plate (3) and the cover plate (5), and the lower end of the device to be tested (10) penetrates through the heat-conducting plate (3) and is electrically connected with the testing sockets (2);
a plurality of bumps (301) are arranged on the lower surface of the heat conducting plate (3) at intervals, a plurality of first through holes (101) and second through holes (401) corresponding to the bumps (301) are respectively formed in the substrate (1) and the PCB (4), and the lower ends of the bumps (301) sequentially penetrate through the first through holes (101) and the second through holes (401) and extend out of the second through holes (401);
the upper surface of the heat conducting plate (3) is provided with a plurality of mounting through holes (6) corresponding to the test socket (2), the inner wall of the upper part of the mounting through hole (6) is provided with a flange part (601) extending inwards in the radial direction, and the device to be tested (10) is mounted in the mounting through hole (6) and is in contact connection with the upper surface of the flange part (601); the lower surface of the heat conducting plate (3) is also provided with a plurality of limiting grooves (13) corresponding to the test socket (2), and the upper end of the test socket (2) is embedded into the limiting grooves (13).
2. The high and low temperature test fixture for optical communication devices of claim 1, wherein: and strip-shaped grooves (7) communicated with the mounting through holes (6) are respectively formed in two sides of the mounting through holes (6).
3. The high and low temperature test fixture for optical communication devices of claim 1, wherein: the cover plate (5) is a plastic heat-insulating cover plate.
4. The high and low temperature test fixture for optical communication devices of claim 1, wherein: the substrate (1) is a plastic heat-insulation board.
5. The high and low temperature test fixture for optical communication devices of claim 1, wherein: and light-emitting holes corresponding to the devices to be tested (10) are respectively formed in the cover plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021130894.3U CN212722971U (en) | 2020-06-17 | 2020-06-17 | High-low temperature test fixture for optical communication device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021130894.3U CN212722971U (en) | 2020-06-17 | 2020-06-17 | High-low temperature test fixture for optical communication device |
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| Publication Number | Publication Date |
|---|---|
| CN212722971U true CN212722971U (en) | 2021-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021130894.3U Active CN212722971U (en) | 2020-06-17 | 2020-06-17 | High-low temperature test fixture for optical communication device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114384404A (en) * | 2022-03-23 | 2022-04-22 | 上海菲莱测试技术有限公司 | Cooling test assembly unit and aging cooling device |
-
2020
- 2020-06-17 CN CN202021130894.3U patent/CN212722971U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114384404A (en) * | 2022-03-23 | 2022-04-22 | 上海菲莱测试技术有限公司 | Cooling test assembly unit and aging cooling device |
| CN114384404B (en) * | 2022-03-23 | 2022-08-23 | 上海菲莱测试技术有限公司 | Cooling test assembly unit and aging cooling device |
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Address after: Building 5, No. 1508, Xiangjiang Road, Suzhou High-tech Zone, Suzhou City, Jiangsu Province 215129 Patentee after: Suzhou Lianxun Instrument Co.,Ltd. Address before: 215011 Building 5, no.1508 Xiangjiang Road, high tech Zone, Suzhou City, Jiangsu Province Patentee before: STELIGHT INSTRUMENT Inc. |