CN212722972U

CN212722972U - Test fixture for optical communication device

Info

Publication number: CN212722972U
Application number: CN202021130895.8U
Authority: CN
Inventors: 徐鹏嵩; 郭孝明; 朱晶; 张文刚
Original assignee: Stelight Instrument Inc
Current assignee: Suzhou Lianxun Instrument Co ltd
Priority date: 2020-06-17
Filing date: 2020-06-17
Publication date: 2021-03-16
Anticipated expiration: 2030-06-17

Abstract

The utility model discloses a test fixture of optical communication device, including base plate, a plurality of test socket, heat-conducting plate, PCB board and apron, the PCB board is located the base plate below, heat-conducting plate and apron set gradually above the base plate, a plurality of the test socket is installed respectively on the base plate and is connected with PCB board electricity, install the device to be tested between heat-conducting plate and the apron, and the lower extreme of this device to be tested passes the heat-conducting plate and is connected with the test socket electricity; the heat-conducting plate lower surface is provided with a plurality of lug at the interval, open first through-hole, the second through-hole that has a plurality of and lug to correspond on base plate, the PCB board respectively, the lug lower extreme passes first through-hole, second through-hole in proper order and stretches out from the second through-hole. The utility model discloses structural design is ingenious, can place many await measuring devices, has improved efficiency of software testing, reduce cost to the device greatly.

Description

Test fixture for optical communication device

Technical Field

The utility model relates to a test fixture of optical communication device belongs to optical communication test technical field.

Background

At present, TO tests in the industry only have normal temperature test clamps, TO high-temperature and low-temperature batch test clamps do not exist, the speed of a TO packaged laser reaches 25G and 50G along with the development of optical communication, high-speed commercial TO needs high-temperature and low-temperature tests, no adaptive batch clamp is available in the industry at present, the existing scheme is single chip testing, the temperature control precision is high, but the batch production efficiency is low, and the TO high-temperature and low-temperature batch test clamps cannot be compatible with aging equipment.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a test fixture of optical communication device, its structural design is ingenious, can place many await measuring devices, has improved efficiency of software testing, reduce cost to the device greatly.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a test fixture for optical communication devices comprises a base plate, a plurality of test sockets, a heat conducting plate, a PCB and a cover plate, wherein the PCB is positioned below the base plate, the heat conducting plate and the cover plate are sequentially arranged above the base plate, the test sockets are respectively arranged on the base plate and are electrically connected with the PCB, a device to be tested is arranged between the heat conducting plate and the cover plate, and the lower end of the device to be tested penetrates through the heat conducting plate to be electrically connected with the test sockets;

the heat-conducting plate lower surface is provided with a plurality of lug at the interval, open first through-hole, the second through-hole that has a plurality of and lug to correspond on base plate, the PCB board respectively, the lug lower extreme passes first through-hole, second through-hole in proper order and stretches out from the second through-hole.

The further improved scheme in the technical scheme is as follows:

1. in the scheme, the cover plate is a plastic heat-insulating cover plate.

2. In the scheme, the heat conducting plate is an aluminum alloy plate.

3. In the above scheme, the substrate is a plastic heat-insulating plate.

4. In the above scheme, the cover plate is respectively provided with light-emitting holes corresponding to the devices to be tested.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses optical communication device's test fixture, it is through adopting the multilayer design, and structural design is ingenious, when possessing good compatibility, but most normal atmospheric temperature of adaptation, aging testing system, can place many examination devices that await measuring, can also be applicable to multiple test mode such as high temperature ageing, low temperature test, normal atmospheric temperature test, high temperature test, has improved efficiency of software testing, reduce cost to the device greatly.

Drawings

FIG. 1 is a schematic structural view of a test fixture for optical communication devices according to the present invention;

fig. 2 is a schematic diagram of the structure of the heat conducting plate of the present invention.

In the above drawings: 1. a substrate; 101. a first through hole; 2. a test socket; 3. a heat conducting plate; 301. a bump; 4. a PCB board; 401. a second through hole; 5. a cover plate; 10. a device under test.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: a test fixture for optical communication devices comprises a base plate 1, a plurality of test sockets 2, a heat conducting plate 3, a PCB 4 and a cover plate 5, wherein the PCB 4 is positioned below the base plate 1, the heat conducting plate 3 and the cover plate 5 are sequentially arranged above the base plate 1, the test sockets 2 are respectively arranged on the base plate 1 and are electrically connected with the PCB 4, a device to be tested 10 is arranged between the heat conducting plate 3 and the cover plate 5, and the lower end of the device to be tested 10 penetrates through the heat conducting plate 3 and is electrically connected with the test sockets 2;

the interval is provided with a plurality of lug 301 on 3 lower surfaces of heat-conducting plate, open first through-hole 101, the second through-hole 401 that have a plurality of and lug 301 to correspond on base plate 1, the PCB board 4 respectively, lug 301 lower extreme passes first through-hole 101, second through-hole 401 in proper order and stretches out from second through-hole 401, contacts with the temperature control platform on the test bench.

The cover plate 5 is a plastic heat-insulating cover plate; the heat conductive plate 3 is an aluminum alloy plate.

Example 2: a test fixture for optical communication devices comprises a base plate 1, a plurality of test sockets 2, a heat conducting plate 3, a PCB 4 and a cover plate 5, wherein the PCB 4 is positioned below the base plate 1, the heat conducting plate 3 and the cover plate 5 are sequentially arranged above the base plate 1, the test sockets 2 are respectively arranged on the base plate 1 and are electrically connected with the PCB 4, a device to be tested 10 is arranged between the heat conducting plate 3 and the cover plate 5, and the lower end of the device to be tested 10 penetrates through the heat conducting plate 3 and is electrically connected with the test sockets 2;

The substrate 1 is a plastic heat-insulation plate; the cover plate 5 is provided with light-emitting holes corresponding to the devices to be tested 10.

When the test fixture for the optical communication device is adopted, the test fixture is ingenious in structural design by adopting multilayer design, has good compatibility, can be adapted to most of normal-temperature and aging test systems, can be used for placing a plurality of devices to be tested, can be suitable for various test modes such as high-temperature aging, low-temperature test, normal-temperature test and high-temperature test, and greatly improves the test efficiency of the devices and reduces the cost.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A test fixture for optical communication devices is characterized in that: the testing device comprises a base plate (1), a plurality of testing sockets (2), a heat-conducting plate (3), a PCB (4) and a cover plate (5), wherein the PCB (4) is positioned below the base plate (1), the heat-conducting plate (3) and the cover plate (5) are sequentially arranged above the base plate (1), the plurality of testing sockets (2) are respectively arranged on the base plate (1) and are electrically connected with the PCB (4), a device to be tested (10) is arranged between the heat-conducting plate (3) and the cover plate (5), and the lower end of the device to be tested (10) penetrates through the heat-conducting plate (3) and is electrically connected with the testing sockets (2);

the heat-conducting plate is characterized in that a plurality of bumps (301) are arranged on the lower surface of the heat-conducting plate (3) at intervals, a plurality of first through holes (101) and second through holes (401) corresponding to the bumps (301) are formed in the substrate (1) and the PCB (4) respectively, and the lower ends of the bumps (301) sequentially penetrate through the first through holes (101) and the second through holes (401) and extend out of the second through holes (401).

2. The test fixture for optical communication devices of claim 1, wherein: the cover plate (5) is a plastic heat-insulating cover plate.

3. The test fixture for optical communication devices of claim 1, wherein: the heat conducting plate (3) is an aluminum alloy plate.

4. The test fixture for optical communication devices of claim 1, wherein: the substrate (1) is a plastic heat-insulation board.

5. The test fixture for optical communication devices of claim 1, wherein: and light-emitting holes corresponding to the devices to be tested (10) are respectively formed in the cover plate (5).