CN213275861U

CN213275861U - Efficient test fixture for laser chip

Info

Publication number: CN213275861U
Application number: CN202021849975.9U
Authority: CN
Inventors: 徐鹏嵩; 郭孝明; 朱晶; 王凯旋; 王贤杰; 顾涛; 胡海洋; 黄建军
Original assignee: Stelight Instrument Inc
Current assignee: Suzhou Lianxun Instrument Co ltd
Priority date: 2020-08-28
Filing date: 2020-08-28
Publication date: 2021-05-25
Anticipated expiration: 2030-08-28

Abstract

The utility model discloses a high-efficient test fixture for laser chip, including PCB board, a plurality of test socket, backup pad, mounting panel and the apron that weld on the PCB board, backup pad, mounting panel and apron superpose in proper order above the PCB board, be provided with the through-hole that supplies test socket upper end to pass in the backup pad, install the device under test between mounting panel and the apron, the lower extreme of this device under test passes the mounting panel and is connected with the test socket electricity, be provided with a heating plate between backup pad and the mounting panel; and the heating plate is distributed with conductive wires which are connected with a fuse in series, and when the temperature of the heating plate exceeds a set threshold value, the fuse is disconnected. The utility model discloses both guaranteed the security that anchor clamps used, made the heating plate keep balanced stable to the heating of a plurality of testers that await measuring on the anchor clamps again, guaranteed test data's uniformity and stability.

Description

Efficient test fixture for laser chip

Technical Field

The utility model relates to a high-efficient test fixture for laser instrument chip belongs to optical communication test technical field.

Background

At present, the TO test in the industry only has a normal temperature test fixture, but no TO high-temperature batch test fixture exists, along with the development of optical communication, the speed of a TO packaged laser reaches 25G, the commercial TO of 25G needs TO be subjected TO high-temperature test, and no adaptive batch fixture is available in the industry at present.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a high-efficient test fixture for laser instrument chip, it had both guaranteed the security that anchor clamps used, made the heating plate keep balanced stable to the heating of a plurality of await measuring devices on the anchor clamps again, had guaranteed test data's uniformity and stability.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a high-efficiency test fixture for a laser chip comprises a PCB, a plurality of test sockets welded on the PCB, a support plate, a mounting plate and a cover plate, wherein the support plate, the mounting plate and the cover plate are sequentially stacked above the PCB, the support plate is provided with a through hole for the upper end of the test socket to pass through, a device to be tested is mounted between the mounting plate and the cover plate, the lower end of the device to be tested passes through the mounting plate to be electrically connected with the test socket, and a heating plate is arranged between the support plate and the mounting plate;

and the heating plate is distributed with conductive wires which are connected with a fuse in series, and when the temperature of the heating plate exceeds a set threshold value, the fuse is disconnected.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, a through hole is formed in the center of the heating plate, and the through hole is circular or rectangular.

2. In the scheme, the cover plate is a plastic heat-insulating cover plate.

3. In the above scheme, the mounting plate is an aluminum alloy plate.

4. In the scheme, the supporting plate is a plastic heat-insulating plate.

5. In the above scheme, the cover plate is respectively provided with light-emitting holes corresponding to the devices to be tested.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses a high-efficient test fixture for laser instrument chip, its structural design is ingenious, when possessing good compatibility, can adapt most normal atmospheric temperature, high temperature test system, can place many testers, has improved the efficiency of software testing to the device greatly, reduce cost; in addition, the heating plate is distributed with conductive wires which are connected in series with a fuse, when the temperature of the heating plate exceeds a set threshold value, the fuse is disconnected, and the arrangement of the fuse on the heating plate not only ensures the use safety of the clamp, but also can avoid burning out other parts or products such as a controller and the like due to overhigh temperature; in addition, the through holes are formed in the heating sheet, so that the heating sheet can uniformly and stably heat a plurality of devices to be tested on the fixture, the situation that the central temperature is high and the peripheral temperature is low to cause large deviation of test data of the central device and test data of peripheral devices is avoided, and the consistency and stability of the test data are ensured.

Drawings

FIG. 1 is a schematic structural view of a high-efficiency test fixture for a laser chip according to the present invention;

fig. 2 is a schematic structural view of the heating plate of the present invention.

In the above drawings: 1. a PCB board; 2. a test socket; 3. a support plate; 4. mounting a plate; 5. a cover plate; 10. A heating plate; 101. a conductive filament; 14. a fuse; 15. a through hole; 16. a device under test.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

Example 1: a high-efficiency test fixture for a laser chip comprises a PCB (printed Circuit Board) 1, a plurality of test sockets 2 welded on the PCB 1, a support plate 3, a mounting plate 4 and a cover plate 5, wherein the support plate 3, the mounting plate 4 and the cover plate 5 are sequentially stacked above the PCB 1, a through hole for the upper end of the test socket 2 to pass through is formed in the support plate 3, a device to be tested 16 is arranged between the mounting plate 4 and the cover plate 5, the lower end of the device to be tested 16 passes through the mounting plate 4 to be electrically connected with the test sockets 2, and a heating plate 10 is arranged between the support plate 3 and the mounting plate 4; the heating plate 10 is distributed with a conductive wire 101, the conductive wire 101 is connected in series with a fuse 14, and when the temperature of the heating plate 10 exceeds a set threshold value, the fuse 14 is disconnected.

A through hole 15 is formed in the center of the heating plate 10, and the shape of the through hole 15 is circular or rectangular; the cover plate 5 is a plastic heat-insulating cover plate.

Example 2: a high-efficiency test fixture for a laser chip comprises a PCB (printed Circuit Board) 1, a plurality of test sockets 2 welded on the PCB 1, a support plate 3, a mounting plate 4 and a cover plate 5, wherein the support plate 3, the mounting plate 4 and the cover plate 5 are sequentially stacked above the PCB 1, a through hole for the upper end of the test socket 2 to pass through is formed in the support plate 3, a device to be tested 16 is arranged between the mounting plate 4 and the cover plate 5, the lower end of the device to be tested 16 passes through the mounting plate 4 to be electrically connected with the test sockets 2, and a heating plate 10 is arranged between the support plate 3 and the mounting plate 4; the heating plate 10 is distributed with a conductive wire 101, the conductive wire 101 is connected in series with a fuse 14, and when the temperature of the heating plate 10 exceeds a set threshold value, the fuse 14 is disconnected.

The mounting plate 4 is an aluminum alloy plate; the supporting plate 3 is a plastic heat-insulating plate; the cover plate 5 is provided with light-emitting holes corresponding to the devices to be tested 16.

When the efficient test fixture for the laser chip is adopted, the structure design is ingenious, the fixture has good compatibility and can be adapted to most normal-temperature and high-temperature test systems, and meanwhile, a plurality of devices to be tested can be placed, so that the test efficiency of the devices is greatly improved, and the cost is reduced;

in addition, the arrangement of the fuse on the heating plate not only ensures the use safety of the clamp, but also can avoid burning out other parts or products such as the controller and the like due to overhigh temperature;

in addition, the through holes are formed in the heating sheet, so that the heating sheet can uniformly and stably heat a plurality of devices to be tested on the fixture, the situation that the central temperature is high and the peripheral temperature is low to cause large deviation of test data of the central device and test data of peripheral devices is avoided, and the consistency and stability of the test data are ensured.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims

1. A high-efficient test fixture for laser chip which characterized in that: the device comprises a PCB (1), a plurality of test sockets (2) welded on the PCB (1), a support plate (3), a mounting plate (4) and a cover plate (5), wherein the support plate (3), the mounting plate (4) and the cover plate (5) are sequentially stacked above the PCB (1), a through hole for the upper end of the test socket (2) to pass through is formed in the support plate (3), a device to be tested (16) is arranged between the mounting plate (4) and the cover plate (5), the lower end of the device to be tested (16) passes through the mounting plate (4) and is electrically connected with the test sockets (2), and a heating plate (10) is arranged between the support plate (3) and the mounting plate (4);

and conductive wires (101) are distributed on the heating plate (10), a fuse (14) is connected in series on the conductive wires (101), and when the temperature of the heating plate (10) exceeds a set threshold value, the fuse (14) is disconnected.

2. A high efficiency test fixture for laser chips as recited in claim 1, wherein: the center of the heating plate (10) is provided with a through hole (15), and the shape of the through hole (15) is round or rectangular.

3. A high efficiency test fixture for laser chips as recited in claim 1, wherein: the cover plate (5) is a plastic heat-insulating cover plate.

4. A high efficiency test fixture for laser chips as recited in claim 1, wherein: the mounting plate (4) is an aluminum alloy plate.

5. A high efficiency test fixture for laser chips as recited in claim 1, wherein: the supporting plate (3) is a plastic heat-insulating plate.

6. A high efficiency test fixture for laser chips as recited in claim 1, wherein: and light-emitting holes corresponding to the devices to be tested (16) are respectively formed in the cover plate (5).