CN204304040U - Ceramic socket and TO packaging aging clamp - Google Patents
Ceramic socket and TO packaging aging clamp Download PDFInfo
- Publication number
- CN204304040U CN204304040U CN201420745718.9U CN201420745718U CN204304040U CN 204304040 U CN204304040 U CN 204304040U CN 201420745718 U CN201420745718 U CN 201420745718U CN 204304040 U CN204304040 U CN 204304040U
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- Prior art keywords
- ceramic
- circuit board
- aging
- contact
- ceramic socket
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- 239000000919 ceramic Substances 0.000 title claims abstract description 90
- 230000032683 aging Effects 0.000 title claims abstract description 54
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000012360 testing method Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 2
- 230000007774 longterm Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000002431 foraging effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model discloses a kind of ceramic socket and TO packaging aging clamp, wherein TO packaging aging clamp comprises: ceramic base circuit board, and its back side is provided with burn in test circuit, this ceramic base circuit board is also provided with and organizes jack more; Multiple ceramic socket, it is arranged on described ceramic base circuit board front, and each ceramic socket is provided with multiple jack, is inserted with contact in jack, and the pin of burn-in test chip is connected with burn in test circuit by this contact; High-temperature cable, its one end is communicated with burn in test circuit, and the other end connects aging testing system.The plug of ceramic socket of the present utility model and ceramic socket and the more convenient aging chip of TO packaging aging clamp, can carry out high temperature test simultaneously for a long time in high temperature environments.
Description
Technical field
The utility model relates to aging clamp, particularly relates to a kind of ceramic socket and TO packaging aging clamp.
Background technology
At present, more independently burn-in sockets on market, its structure is primarily of engineering plastics and contact composition, and its Main Function is for placing TO packaged chip device.And this independently burn-in sockets plug chip is also inconvenient, be not easy to aim at, or easily the pin of chip fractureed.
Along with the develop rapidly of electronic technology, the quantity required of chip device is in continuous increase, the quality requirement of chip is also improving constantly simultaneously, is therefore fixed on circuit boards by multiple burn-in sockets, carries out aging grip device arise at the historic moment by high-temperature cable and circuit communication.But be limited to the sheet material problem of circuit board, the most high energy of the FR4 sheet material of common circuit plate is normally operated in about 150 DEG C for a long time, some special sheet material as: also just the short time can be operated in about 200 DEG C to the sheet material such as aluminium base, copper base, Rogers; And at high temperature, engineering plastics and contact, contact reliability between contact and aging chip device can decrease, and have a strong impact on the burn-in test quality of chip in burn-in sockets long-term work.
Utility model content
The technical problems to be solved in the utility model is can not long term high temperature work for aging clamp of the prior art, and the defect that the plug of the pin of aging chip is inconvenient, provide a kind of and continue high temperature resistant and plug ceramic socket and TO packaging aging clamp easily.
The utility model solves the technical scheme that its technical problem adopts:
There is provided a kind of ceramic socket, for the aging chip of grafting, this ceramic socket is provided with multiple jack, is inserted with contact in jack, and the top of this contact is uncovered shape, and a pin is synthesized in below, and this pin stretches out described jack.
In ceramic socket described in the utility model, described contact is that copper material is made, surface gold-plating.
In ceramic socket described in the utility model, described contact is Y type or X-type contact.
In ceramic socket described in the utility model, described ceramic socket is column structure.
In ceramic socket described in the utility model, described jack is evenly distributed on around described ceramic socket center.
The utility model additionally provides a kind of TO packaging aging clamp, comprising:
Ceramic base circuit board, its back side is provided with burn in test circuit, this ceramic base circuit board is also provided with and organizes jack more;
Multiple ceramic socket, described ceramic socket is the ceramic socket in technique scheme, and it is arranged on described ceramic base circuit board front, and each ceramic socket is provided with multiple jack, be inserted with contact in jack, the pin of burn-in test chip is connected with burn in test circuit by this contact;
High-temperature cable, its one end is communicated with burn in test circuit, and the other end connects aging testing system.
In TO packaging aging clamp described in the utility model, this aging clamp also comprises shell, and described ceramic base circuit board is fixed on this shell.
In TO packaging aging clamp described in the utility model, described shell is provided with interior slot, and described ceramic base circuit board is fixed on this shell by this interior slot.
In TO packaging aging clamp described in the utility model, described outer casing bottom is provided with support column, and described ceramic base circuit board is supported by this support column.
In TO packaging aging clamp described in the utility model, a lateral edges of described shell is provided with pipe clamp fixed head, and it is provided with pipe clamp, and described high-temperature cable is locked by described pipe clamp.
The beneficial effect that the utility model produces is: ceramic socket of the present utility model is provided with multiple jack, is inserted with contact in jack, and the top of this contact is uncovered shape, is convenient to the insertion of aging chip pin.TO packaging aging clamp comprises ceramic base circuit board, multiple ceramic socket and high-temperature cable, the socket of grafting chip and circuit board is all made with pottery, make its can long-term work in hot environment.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the structural representation of the utility model embodiment ceramic socket;
Fig. 2 is the structural representation of the utility model embodiment contact;
Fig. 3 is the structural representation of another embodiment ceramic socket of the utility model;
Fig. 4 is the structural representation of the utility model the 3rd embodiment ceramic socket;
Fig. 5 is the structural representation of the utility model the 4th embodiment ceramic socket;
Fig. 6 is the stereogram of the utility model embodiment TO packaging aging clamp;
Fig. 7 is the front view of the utility model embodiment TO packaging aging clamp;
Fig. 8 is the structural representation one of the utility model embodiment TO packaging aging clamp;
Fig. 9 is the structural representation two of the utility model embodiment TO packaging aging clamp;
Figure 10 is the schematic diagram of the utility model embodiment TO packaging aging clamp shell.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
The ceramic socket of the utility model embodiment, for plugging aging chip.As shown in Figure 1, this ceramic socket 8 is provided with multiple jack 81, is inserted with contact 82 in jack.The top of this contact 82 is uncovered shape, and a pin is synthesized in below, and this pin stretches out described jack 81.Aging chip inserted is on this contact 82.The top of contact 82 is opened wide, and the pin being convenient to aging chip directly inserts.
Contact 82 is for inserting the pin of aging chip.In an embodiment of the present utility model, described contact 82 is made for copper material, and surface adopts craft of gilding.The pin of the bottom of contact 82 extends outside ceramic socket so that with the welding of circuit board.Owing to there being contact 82 directly to weld on circuit boards, other fixture is not therefore needed to be fixed by contact 82.
Described contact 82 can be set to up big and down small, as shown in Figure 2, can be Y type or X-type contact.Top can certainly be set to U-shaped, as long as the larger pin of aging chip that facilitates of open top inserts.
Described ceramic socket 8 is column structure, and as in Figure 3-5, can be cylinder, also can be polygonal column agency.The number of jack 81 is determined according to the pin number of aging chip.
As shown in figures 1 and 3 to 5, described jack 81 is evenly distributed on around described ceramic socket center, and its concrete distribution is also determine according to the pin distribution of aging chip.
In order to measure multiple aging chip simultaneously, can by the ceramic socket grafting of above-described embodiment on a circuit board.As shown in Figure 6, be the TO packaging aging clamp of the utility model embodiment, comprise:
Ceramic base circuit board 3, its back side is provided with burn in test circuit, this ceramic base circuit board 3 is also provided with and organizes jack more;
Multiple ceramic socket 8, described ceramic socket 8 is the ceramic socket of above-described embodiment, it is arranged on described ceramic base circuit board 3 front, each ceramic socket 8 is provided with multiple jack 81, be inserted with contact 82 in jack 81, the pin of burn-in test chip 2 is connected with burn in test circuit by this contact.Described ceramic base circuit board 3 can weld many group ceramic sockets 8, concrete quantity can determine according to actual needs.
High-temperature cable 6, its one end is communicated with burn in test circuit, and the other end connects aging testing system.Can by all sides needing the connecting line connecting aging testing system to focus on circuit board on ceramic base circuit board 3, then be connected to aging testing system (CPU as burn-in test) by high-temperature cable 6, high-temperature cable 6 is connected with aging testing system by bus interface.In an embodiment of the present utility model, as shown in FIG. 8 and 9, a lateral edges of described shell 1 is provided with pipe clamp fixed head 4, it is provided with pipe clamp 5, described high-temperature cable 6 is locked by described pipe clamp 5, is fixed on pipe clamp fixed head 4 by pipe clamp 5 finally by fixed screw 9.
As shown in FIG. 7 and 8, this aging clamp also comprises shell 1, and described ceramic base circuit board 3 is fixed on this shell 1.
In an embodiment of the present utility model, as shown in Figure 9 and Figure 10, described shell 1 is provided with interior slot, and described ceramic base circuit board 3 is fixed on this shell 1 by this interior slot, and ceramic base circuit board 3 can be made to be fix better.In other embodiments of the present utility model, ceramic base circuit board 3 can also pass through screw or colloid and shell 1 to be fixed, and therefore fixed form is not construed as limiting.
In order to increase the stability of ceramic base circuit board 3 further, as shown in Figure 9, can also arrange support column 7 at described outer casing bottom, described ceramic base circuit board is supported by this support column 7.
Manufacture craft of the present utility model is as follows: first according to encapsulation and the size of aging chip 2, selects the ceramic socket 8 of appropriate size.Second step is welded on ceramic base circuit board 3 by the ceramic socket 8 high temperature solder stick chosen, and is then welded on ceramic base circuit board 3 by high-temperature cable 6 according to circuit definitions high temperature solder stick, specifically can with reference to figure 4.Support column 7 is screwed in shell 1, for supporting ceramic base circuit board 3 (as shown in Figure 5).Finally insert in shell in slot by the ceramic base circuit board 3 welded, high-temperature cable 6 is locked on pipe clamp fixed head 4 by pipe clamp 5, and pipe clamp fixed head 4 is arranged on shell 1.
The ceramic socket 8 of quality structure is selected to plug aging chip 2 in the utility model embodiment, then by high temperature solder stick, ceramic socket 8 and high-temperature cable 6 are welded on ceramic base circuit board 3, ceramic base circuit board 3 often will be organized ceramic socket 8 to be connected with high-temperature cable 6, then be connected with aging testing system (CPU as burn-in test) carry out burn-in test by high-temperature cable 6.Ceramic socket 8 and ceramic base circuit board 3 can the work of long-term normal table under high temperature rated, signal or delivery of electrical energy performance unaffected, and have longer useful life.Therefore can overcome the deficiency in background technology, ensure that this aging clamp device long-term work is the stability of 200 DEG C.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to the utility model claims.
Claims (10)
1. a ceramic socket, for the aging chip of grafting, it is characterized in that, this ceramic socket is provided with multiple jack, is inserted with contact in jack, and the top of this contact is uncovered shape, and a pin is synthesized in below, and this pin stretches out described jack.
2. ceramic socket according to claim 1, is characterized in that, described contact is that copper material is made, surface gold-plating.
3. ceramic socket according to claim 2, is characterized in that, described contact is Y type or X-type contact.
4. ceramic socket according to claim 1, is characterized in that, described ceramic socket is column structure.
5. ceramic socket according to claim 1, is characterized in that, described jack is evenly distributed on around described ceramic socket center.
6. a TO packaging aging clamp, is characterized in that, comprising:
Ceramic base circuit board, its back side is provided with burn in test circuit, this ceramic base circuit board is also provided with and organizes jack more;
Multiple ceramic socket, the ceramic socket of described ceramic socket according to any one of claim 1-5, it is arranged on described ceramic base circuit board front, each ceramic socket is provided with multiple jack, be inserted with contact in jack, the pin of burn-in test chip is connected with burn in test circuit by this contact;
High-temperature cable, its one end is communicated with burn in test circuit, and the other end connects aging testing system.
7. TO packaging aging clamp according to claim 6, it is characterized in that, this aging clamp also comprises shell, and described ceramic base circuit board is fixed on this shell.
8. TO packaging aging clamp according to claim 7, it is characterized in that, described shell is provided with interior slot, and described ceramic base circuit board is fixed on this shell by this interior slot.
9. TO packaging aging clamp according to claim 7, it is characterized in that, described outer casing bottom is provided with support column, and described ceramic base circuit board is supported by this support column.
10. TO packaging aging clamp according to claim 7, is characterized in that, a lateral edges of described shell is provided with pipe clamp fixed head, and it is provided with pipe clamp, and described high-temperature cable is locked by described pipe clamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420745718.9U CN204304040U (en) | 2014-12-02 | 2014-12-02 | Ceramic socket and TO packaging aging clamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420745718.9U CN204304040U (en) | 2014-12-02 | 2014-12-02 | Ceramic socket and TO packaging aging clamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204304040U true CN204304040U (en) | 2015-04-29 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420745718.9U Active CN204304040U (en) | 2014-12-02 | 2014-12-02 | Ceramic socket and TO packaging aging clamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204304040U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104889905A (en) * | 2015-05-06 | 2015-09-09 | 周玉萍 | Machine chip clamping jig for high temperature and high pressure test |
| CN106771407A (en) * | 2017-01-22 | 2017-05-31 | 长安大学 | A kind of pluggable piezoelectric polarization device high temperature test fixture |
| CN109061233A (en) * | 2018-07-27 | 2018-12-21 | 广州华望汽车电子有限公司 | A kind of multipurpose drawer and its trolley |
| CN112557710A (en) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | Test fixture and test device for optical device |
-
2014
- 2014-12-02 CN CN201420745718.9U patent/CN204304040U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104889905A (en) * | 2015-05-06 | 2015-09-09 | 周玉萍 | Machine chip clamping jig for high temperature and high pressure test |
| CN106771407A (en) * | 2017-01-22 | 2017-05-31 | 长安大学 | A kind of pluggable piezoelectric polarization device high temperature test fixture |
| CN109061233A (en) * | 2018-07-27 | 2018-12-21 | 广州华望汽车电子有限公司 | A kind of multipurpose drawer and its trolley |
| CN112557710A (en) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | Test fixture and test device for optical device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 430074 No. 999, hi tech Avenue, East Lake New Technology Development Zone, Hubei, Wuhan Patentee after: WUHAN JUANLONG TECHNOLOGY CO., LTD. Address before: 430074 Wuhan Province, East Lake New Technology Development Zone, high tech Avenue, No. 999, No. Patentee before: WUHAN JUNNO TECHNOLOGIES CO., LTD. |