CN212519808U - Integrated circuit heat dissipation device - Google Patents
Integrated circuit heat dissipation device Download PDFInfo
- Publication number
- CN212519808U CN212519808U CN202021392917.8U CN202021392917U CN212519808U CN 212519808 U CN212519808 U CN 212519808U CN 202021392917 U CN202021392917 U CN 202021392917U CN 212519808 U CN212519808 U CN 212519808U
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- CN
- China
- Prior art keywords
- heat dissipation
- integrated circuit
- heat
- access door
- top side
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of integrated circuit, and an integrated circuit heat abstractor is disclosed, including integrated circuit, integrated circuit's bottom side is provided with the heat dissipation case, the bottom of heat dissipation case is provided with the access door, the equal fixed mounting in both sides on access door top side has the heat dissipation fan, the top side fixed mounting of heat dissipation fan has a plurality of conducting strips that are located the integrated circuit bottom side, one side fixed mounting of conducting strip has two fixed blocks that are located heat dissipation case top side both ends respectively. The device is through the heat dissipation case, access door, heat dissipation fan, conducting strip, fixed block, bolt, lag, observation window, logical groove and radiator-grid that set up, when using, at first in the heat dissipation incasement portion is transmitted the heat that integrated circuit produced through the conducting strip, the rethread heat dissipation fan cools down the conducting strip, is convenient for carry on heat conduction once more, arranges the inside heat of radiator-grid to the outside air in simultaneously to quick cooling to integrated circuit.
Description
Technical Field
The utility model relates to an integrated circuit technical field specifically is an integrated circuit heat abstractor.
Background
An integrated circuit is a microelectronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function.
The prior art has the following technical problems:
when the existing integrated circuit heat dissipation device is used, the heat dissipation effect is poor, and the problem that electronic devices on an integrated circuit are overheated and damaged is often caused.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides an integrated circuit heat abstractor possesses that the radiating effect is good, avoids the electron device on the integrated circuit to take place advantages such as overheated damage, and it is poor to have solved current integrated circuit heat abstractor radiating effect, often can lead to the electron device on the integrated circuit to take place the problem of overheated damage.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an integrated circuit heat abstractor, includes integrated circuit, integrated circuit's bottom side is provided with the heat dissipation case, the bottom of heat dissipation case is provided with the access door, the equal fixed mounting in both sides on access door top side has the heat dissipation fan, the top side fixed mounting of heat dissipation fan has a plurality of conducting strips that are located the integrated circuit bottom side, one side fixed mounting of conducting strip has two fixed blocks that are located heat dissipation case top side both ends respectively, the fixed block passes through bolt fixed connection with integrated circuit, the outside cover of bolt is equipped with the lag, one side fixed mounting of lag has the observation window that is located heat dissipation case surface, a plurality of logical grooves that are located heat dissipation case top are seted up to one side of observation window, the equal fixed mounting in both sides that leads to the groove has the radiator-grid that is located.
Preferably, the top side of the heat dissipation box is rectangular, and the heat dissipation box is made of aluminum alloy.
Preferably, the heat dissipation box is movably connected with the access door through a hinge.
Preferably, the left side of the heat conducting fin is square, and the heat conducting fin is made of copper alloy.
Preferably, the protective sleeve is made of rubber materials, and the length of the protective sleeve is larger than that of the fixing block.
Preferably, a plurality of the heat-conducting fins are movably penetrated through the corresponding through grooves.
Preferably, the left side of the heat dissipation net is rectangular, and the heat dissipation net is made of stainless steel.
Compared with the prior art, the utility model provides an integrated circuit heat abstractor possesses following
Has the advantages that:
this integrated circuit heat abstractor, through the heat dissipation case that sets up, the access door, the heat dissipation fan, the conducting strip, the fixed block, the bolt, the lag, the observation window, logical groove and radiator-grid, when using, at first in heat transmission to the radiator-grid inside that integrated circuit produced through the conducting strip, rethread radiator-grid cools down the conducting strip, be convenient for carry out heat conduction once more, arrange the outside air through the radiator-grid to the heat of radiator-grid inside simultaneously, thereby it is quick to cool down integrated circuit, faster than traditional radiating effect, and can protect bolt and fixed block through the lag that sets up, avoid bolt and fixed block to rust, lead to dismantling the difficulty, and through the access door on the radiator-grid, be convenient for overhaul conducting strip and radiator-grid.
Drawings
FIG. 1 is a schematic view of the internal structure of the present invention;
FIG. 2 is a front view of the exterior of the present invention;
fig. 3 is a perspective view of the heat dissipation box of the present invention.
Wherein: 1. an integrated circuit; 2. a heat dissipation box; 3. an access door; 4. a heat dissipation fan; 5. a heat conductive sheet; 6. a fixed block; 7. a bolt; 8. a protective sleeve; 9. an observation window; 10. a through groove; 11. a heat-dissipating network.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the integrated circuit comprises an integrated circuit 1, a heat dissipation box 2 is arranged on the bottom side of the integrated circuit 1, the top side of the heat dissipation box 2 is rectangular, the heat dissipation box 2 is made of aluminum alloy, an access door 3 is arranged at the bottom end of the heat dissipation box 2, the heat dissipation box 2 is movably connected with the access door 3 through a hinge, heat dissipation fans 4 are fixedly arranged on both sides of the top side of the access door 3, a plurality of heat conduction fins 5 are fixedly arranged on the top side of the heat dissipation fans 4, the left sides of the heat conduction fins 5 are square, the heat conduction fins 5 are made of copper alloy, two fixing blocks 6 respectively arranged at both ends of the top side of the heat dissipation box 2 are fixedly arranged on one side of the heat conduction fins 5, the fixing blocks 6 are fixedly connected with the integrated circuit 1 through bolts 7, protective sleeves 8 are sleeved outside the bolts 7, and the protective sleeves 8 are made of, just the length of lag 8 is greater than the length of fixed block 6, one side fixed mounting of lag 8 has the observation window 9 that is located 2 surfaces of radiator box, a plurality of logical grooves 10 that are located 2 tops of radiator box are seted up to one side of observation window 9, and is a plurality of the equal activity of conducting strip 5 runs through in corresponding logical groove 10, the equal fixed mounting in both sides that leads to groove 10 has the radiator-grid 11 that is located 2 both sides of radiator box respectively, the left side of radiator-grid 11 is the rectangle, just radiator-grid 11 adopts stainless steel material to make.
When using, at first through 5 heat transfer to the integrated circuit 1 production of conducting strip in 2 insides of heat dissipation case, rethread heat dissipation fan 4 cools down conducting strip 5, be convenient for carry out heat conduction once more, simultaneously arrange outside air to the heat of 2 inside heat dissipation cases through radiator-grid 11, thereby it is quick to cool down integrated circuit 1, faster than traditional radiating effect, and can protect bolt 7 and fixed block 6 through the lag 8 that sets up, avoid bolt 7 and fixed block 6 to rust, lead to dismantling the difficulty, and through access door 3 on the heat dissipation case 2, be convenient for overhaul conducting strip 5 and heat dissipation fan 4.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An integrated circuit heat sink comprising an integrated circuit (1), characterized in that: the heat dissipation box (2) is arranged at the bottom side of the integrated circuit (1), the access door (3) is arranged at the bottom end of the heat dissipation box (2), heat dissipation fans (4) are fixedly mounted on the two sides of the top side of the access door (3), a plurality of heat conduction sheets (5) positioned at the bottom side of the integrated circuit (1) are fixedly mounted on the top side of the heat dissipation fan (4), two fixing blocks (6) respectively positioned at the two ends of the top side of the heat dissipation box (2) are fixedly mounted on one side of each heat conduction sheet (5), the fixing blocks (6) are fixedly connected with the integrated circuit (1) through bolts (7), a protective sleeve (8) is sleeved outside each bolt (7), an observation window (9) positioned on the surface of the heat dissipation box (2) is fixedly mounted on one side of the protective sleeve (8), a plurality of through grooves (10) positioned at the top end of the heat dissipation box (, and heat radiating nets (11) respectively positioned at two sides of the heat radiating box (2) are fixedly arranged at two sides of the through groove (10).
2. The integrated circuit heat dissipation device of claim 1, wherein: the top side of the heat dissipation box (2) is rectangular, and the heat dissipation box (2) is made of aluminum alloy.
3. The integrated circuit heat dissipation device of claim 1, wherein: the heat dissipation box (2) is movably connected with the access door (3) through a hinge.
4. The integrated circuit heat dissipation device of claim 1, wherein: the left side of the heat conducting fin (5) is square, and the heat conducting fin (5) is made of copper alloy.
5. The integrated circuit heat dissipation device of claim 1, wherein: the protective sleeve (8) is made of rubber materials, and the length of the protective sleeve (8) is larger than that of the fixing block (6).
6. The integrated circuit heat dissipation device of claim 1, wherein: the heat conducting fins (5) are movably penetrated through the corresponding through grooves (10).
7. The integrated circuit heat dissipation device of claim 1, wherein: the left side of radiator-grid (11) is the rectangle, just radiator-grid (11) adopt stainless steel material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021392917.8U CN212519808U (en) | 2020-07-15 | 2020-07-15 | Integrated circuit heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021392917.8U CN212519808U (en) | 2020-07-15 | 2020-07-15 | Integrated circuit heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212519808U true CN212519808U (en) | 2021-02-09 |
Family
ID=74436375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021392917.8U Active CN212519808U (en) | 2020-07-15 | 2020-07-15 | Integrated circuit heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212519808U (en) |
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2020
- 2020-07-15 CN CN202021392917.8U patent/CN212519808U/en active Active
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