CN212511045U - High-power LED heat dissipation substrate improvement structure - Google Patents
High-power LED heat dissipation substrate improvement structure Download PDFInfo
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- CN212511045U CN212511045U CN202020902563.0U CN202020902563U CN212511045U CN 212511045 U CN212511045 U CN 212511045U CN 202020902563 U CN202020902563 U CN 202020902563U CN 212511045 U CN212511045 U CN 212511045U
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- heat dissipation
- heat
- base plate
- substrate
- ventilation pipes
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 81
- 239000000758 substrate Substances 0.000 title claims abstract description 58
- 238000009423 ventilation Methods 0.000 claims abstract description 33
- 238000009413 insulation Methods 0.000 claims description 7
- 239000007770 graphite material Substances 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
The utility model discloses a belong to LED packaging material technical field, specifically be a high power LED heat dissipation base plate improvement structure, it includes: the heat dissipation base plate comprises a heat dissipation base plate body, a main base plate body, a heat dissipation insulating plate, a circuit board and a light emitting module, wherein a plurality of heat dissipation grooves are formed in the bottom end of the heat dissipation base plate body, the top end of the heat dissipation base plate body is connected with the main base plate body, a plurality of heat conduction columns are arranged in the main base plate body and are multiple, first ventilation pipes are arranged in the heat conduction columns, the two ends of the first ventilation pipes extend to the outside of the heat dissipation base plate body, a plurality of second ventilation pipes are arranged in the main base plate body, and the two ends of the second ventilation pipes. This high power LED radiating substrate improvement structure not only can control radar angle of adjustment, and detection range is bigger, can absorb the impact force when the device receives the impact moreover, prevents that the device from damaging, and life is not long.
Description
Technical Field
The utility model relates to a LED packaging material technical field specifically is a high power LED heat dissipation base plate improvement structure.
Background
The LED is a solid semiconductor component, has the remarkable characteristics of high efficiency, energy conservation, environmental protection, long service life and the like, and is widely applied to circuits such as signal indication, illumination, backlight sources and the like. As a fourth generation light source following incandescent lamps, fluorescent lamps, and high-pressure gas lamps, LEDs are particularly spotlighted in various countries as application prospects in the lighting market. For a power type LED, in the aspect of system heat dissipation, a proper substrate is selected, which has important influence on the heat dissipation and reliability of the power type LED, and the material of the power type LED heat dissipation substrate is required to have high electrical insulation, high stability, high thermal conductivity, thermal expansion coefficient of chip matching, smoothness and higher strength. However, the existing device has a single heat dissipation mode, heat cannot be transferred to the outside, and the heat dissipation effect is poor.
SUMMERY OF THE UTILITY MODEL
This section is for the purpose of summarizing some aspects of embodiments of the invention and to briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and in the abstract of the specification and the title of the application to avoid obscuring the purpose of this section, the abstract of the specification and the title of the application, and such simplifications or omissions are not intended to limit the scope of the invention.
In view of the above and/or the problems existing in the conventional heat dissipation substrate improvement structure, the present invention is provided.
Therefore, the utility model aims at providing a high power LED heat dissipation base plate improvement structure can shift light emitting module's temperature to other positions through the heat-conducting component to the heat dissipation of heat-conducting component is accomplished through the flow of air, dispels the heat jointly through multiple structure, and the radiating mode is diversified, and the radiating effect is better.
For solving the technical problem, according to the utility model discloses an aspect, the utility model provides a following technical scheme:
an improved structure of a high-power LED heat dissipation substrate comprises: the LED lamp comprises a heat dissipation substrate, a main substrate, a heat dissipation insulating plate, a circuit board and a light emitting module, wherein the bottom end of the heat dissipation substrate is provided with a plurality of heat dissipation grooves, the top end of the heat dissipation substrate is connected with a main substrate, a plurality of heat conduction columns are arranged in the main substrate, first ventilation pipes are arranged in the heat conduction columns, two ends of the first ventilation pipes extend out of the heat dissipation substrate, a plurality of second ventilation pipes are arranged in the main substrate, two ends of the second ventilation pipes extend out of the main substrate, a plurality of heat exchange blocks are arranged on the second ventilation pipes and are positioned at two sides of the heat conduction columns, the top end of the main substrate is provided with a heat dissipation insulating plate, a plurality of heat conduction columns penetrate through the heat dissipation insulating plate, the heat dissipation insulating plate is provided with a plurality of circuit boards, a plurality of light emitting modules are arranged on the circuit boards, and a plurality of heat conduction columns are attached to the bottom ends of the light emitting modules.
As a preferred scheme of high power LED heat dissipation base plate improvement structure, wherein: the plurality of radiating grooves are rectangular grooves which are arranged at equal intervals.
As a preferred scheme of high power LED heat dissipation base plate improvement structure, wherein: the heat dissipation base plate, the main base plate and the heat dissipation insulation plate are provided with fixing holes at four corners of a rectangular structure, and internal threads are formed in the four fixing holes.
As a preferred scheme of high power LED heat dissipation base plate improvement structure, wherein: the heat conducting columns are all made of heat conducting graphite materials.
Compared with the prior art: the high-power LED radiating substrate improves the structure, can transfer the temperature of the light-emitting module to other positions through the heat conducting part, and can dissipate the heat of the heat conducting part through the flowing of the air, the heat dissipation is carried out through various structures, and the heat dissipation modes are diversified, the heat dissipation effect is better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail with reference to the accompanying drawings and detailed embodiments, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor. Wherein:
fig. 1 is a top view of the present invention;
fig. 2 is a sectional view of the main substrate of the present invention;
fig. 3 is a cross-sectional view of the present invention.
In the figure: 100 heat dissipation substrates, 110 heat dissipation grooves, 200 main substrates, 210 heat conduction columns, 220 first ventilation pipes, 230 second ventilation pipes, 240 heat exchange blocks, 300 heat dissipation insulation plates, 400 circuit boards, 500 light emitting modules and 600 fixing holes.
Detailed Description
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways than those specifically described herein, and one skilled in the art may similarly generalize the present invention without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Next, the present invention will be described in detail with reference to the schematic drawings, and in the detailed description of the embodiments of the present invention, for convenience of explanation, the sectional view showing the device structure will not be partially enlarged according to the general scale, and the schematic drawings are only examples, and should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
In order to make the objects, technical solutions and advantages of the present invention clearer, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
The utility model provides a high power LED heat dissipation base plate improvement structure can shift light emitting module 500's temperature to other positions through heat-conducting component to the heat dissipation to heat-conducting component is accomplished in the flow through the air, dispels the heat jointly through multiple structure, and the radiating mode is diversified, and the radiating effect is better, please refer to and draw figure 1, figure 2 and figure 3, include: a heat dissipation substrate 100, a main substrate 200, a heat dissipation insulating plate 300, a circuit board 400, and a light emitting module 500;
referring to fig. 1, 2 and 3 again, twenty heat dissipation grooves 110 are formed at the bottom end of the heat dissipation substrate 100, the top end of the heat dissipation substrate 100 is connected to a main substrate 200, nine heat conduction columns 210 are arranged in the main substrate 200, nine heat conduction columns 210 are all provided with first ventilation pipes 220, two ends of nine first ventilation pipes 220 extend out of the heat dissipation substrate 100, four second ventilation pipes 230 are arranged in the main substrate 200, two ends of four second ventilation pipes 230 extend out of the main substrate 200, twelve heat exchange blocks 240 are arranged on four second ventilation pipes 230, twelve heat exchange blocks 240 are located at two sides of nine heat conduction columns 210, a heat dissipation insulating plate 300 is arranged at the top end of the main substrate 200, nine heat conduction columns 210 all penetrate through the heat dissipation insulating plate 300, six circuit boards 400 are arranged on the heat dissipation insulating plate 300, and nine light emitting modules 500 are arranged on six circuit boards 400, nine heat-conducting columns 210 are attached to the bottom end of the light-emitting module 500, specifically, twenty heat-radiating grooves 110 are formed in the bottom end of the heat-radiating substrate 100, the top end of the heat-radiating substrate 100 is connected with a main substrate 200 in an adhesive manner, nine heat-conducting columns 210 are arranged in the main substrate 200, first ventilation pipes 220 are embedded and connected in the nine heat-conducting columns 210, two ends of the nine first ventilation pipes 220 extend out of the heat-radiating substrate 100, four second ventilation pipes 230 are arranged in the main substrate 200, two ends of the four second ventilation pipes 230 extend out of the main substrate 200, twelve heat-exchanging blocks 240 are welded on the four second ventilation pipes 230, the twelve heat-exchanging blocks 240 are located on two sides of the nine heat-conducting columns 210, a heat-radiating insulating plate 300 is attached to the top end of the main substrate 200, the nine heat-conducting columns 210 all penetrate through the heat-radiating insulating plate 300, and six circuit boards 400 are embedded and connected on the, the six circuit boards 400 are connected with nine light emitting modules 500 through bolts and threads, the bottom ends of the nine light emitting modules 500 are attached to nine heat conducting columns 210, the heat dissipation base plate 100, the main base plate 200 and the heat dissipation insulation plate 300 are used for being matched to form the light emitting modules 500 fixed above a rectangular structure, the heat dissipation groove 110 is used for providing a heat dissipation function, the heat conducting columns 210 are used for conducting heat of the light emitting modules 500 to the bottom ends, the first ventilation pipe 220 is used for enabling outside air to pass through so as to dissipate heat of the heat conducting columns 210, the second ventilation pipe 230 is used for enabling outside air to pass through, the heat exchange block 240 is used for enabling the second ventilation pipe 230 to exchange heat with the outside, the heat dissipation insulation plate 300 is used for providing a heat dissipation function and dissipating heat for the circuit boards 400, the circuit boards 400 are used for controlling the light;
when the light-emitting module 500 is used specifically, the main substrate 200 and the heat-dissipating insulating plate 300 are matched to form the light-emitting module 500 above the fixed rectangular structure, the heat-dissipating groove 110 provides a heat-dissipating function, the heat-conducting column 210 conducts the heat of the light-emitting module 500 to the bottom end, the first ventilation pipe 220 enables the external air to pass through, thereby completing the heat dissipation of the heat-conducting column 210, the second ventilation pipe 230 enables the external air to pass through, the heat-exchanging block 240 enables the second ventilation pipe 230 to exchange heat with the outside, the first ventilation pipe 220 assists in completing the heat dissipation of the outside of the heat-conducting column 210, the heat-dissipating insulating plate 300 provides a heat-dissipating function, thereby dissipating the heat of the circuit board 400, the circuit board 400 controls the.
Referring to fig. 3 again, in order to make the heat dissipation grooves 110 provide uniform heat dissipation effect, twenty heat dissipation grooves 110 are rectangular grooves with equal distance.
Referring to fig. 1 and 3 again, fixing holes 600 are formed at four corners of a rectangular structure formed by the heat dissipation substrate 100, the main substrate 200, and the heat dissipation insulating plate 300, internal threads are formed in the four fixing holes 600, and the fixing holes 600 are used for conveniently fixing the device on external equipment.
Referring to fig. 2 and 3 again, in order to make the heat-conducting pillars 210 capable of providing heat-conducting effect, nine of the heat-conducting pillars 210 are made of heat-conducting graphite material.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the disclosed embodiments of the present invention can be used in any combination with each other, and the non-exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (4)
1. The utility model provides a high power LED heat dissipation base plate improvement structure which characterized in that includes: the heat dissipation substrate comprises a heat dissipation substrate (100), a main substrate (200), a heat dissipation insulating plate (300), a circuit board (400) and a light emitting module (500), wherein a plurality of heat dissipation grooves (110) are formed in the bottom end of the heat dissipation substrate (100), the main substrate (200) is connected to the top end of the heat dissipation substrate (100), a plurality of heat conduction columns (210) are arranged in the main substrate (200), first ventilation pipes (220) are arranged in the plurality of heat conduction columns (210), two ends of the plurality of first ventilation pipes (220) extend out of the heat dissipation substrate (100), a plurality of second ventilation pipes (230) are arranged in the main substrate (200), two ends of the plurality of second ventilation pipes (230) extend out of the main substrate (200), a plurality of heat exchange blocks (240) are arranged on the plurality of second ventilation pipes (230), and the plurality of heat exchange blocks (240) are located on two sides of the plurality of heat conduction columns (210), the heat dissipation insulation board (300) is installed on the top of main substrate (200), and is a plurality of heat conduction post (210) all run through heat dissipation insulation board (300), install a plurality of circuit boards (400) on heat dissipation insulation board (300), it is a plurality of install a plurality of light emitting module (500) on circuit board (400), it is a plurality of heat conduction post (210) are laminated to the bottom of light emitting module (500).
2. The improved structure of the high power LED heat dissipation substrate as recited in claim 1, wherein the heat dissipation grooves (110) are rectangular grooves with equal distance.
3. The improved structure of the high-power LED heat dissipation substrate as claimed in claim 1, wherein fixing holes (600) are formed at four corners of a rectangular structure formed by the heat dissipation substrate (100), the main substrate (200) and the heat dissipation insulating plate (300), and internal threads are formed in all four fixing holes (600).
4. The improved structure of the high-power LED heat dissipation substrate as recited in claim 1, wherein the heat-conducting pillars (210) are made of a heat-conducting graphite material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020902563.0U CN212511045U (en) | 2020-05-26 | 2020-05-26 | High-power LED heat dissipation substrate improvement structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020902563.0U CN212511045U (en) | 2020-05-26 | 2020-05-26 | High-power LED heat dissipation substrate improvement structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212511045U true CN212511045U (en) | 2021-02-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020902563.0U Expired - Fee Related CN212511045U (en) | 2020-05-26 | 2020-05-26 | High-power LED heat dissipation substrate improvement structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212511045U (en) |
-
2020
- 2020-05-26 CN CN202020902563.0U patent/CN212511045U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210209 |