CN201014253Y - Light emitting diode lighting device and heat dissipation module thereof - Google Patents

Abstract

The utility model relates to a light-emitting diode lighting device and thermal module thereof, it increases light-emitting diode's heat conduction efficiency to use a thermal module, this thermal module is including the circuit board that can supply the light-emitting diode installation, and set up heat radiation structure in the circuit board back, and heat radiation structure comprises integrated into one piece's body and a plurality of heat radiation fins, by this, not only can improve light-emitting diode's radiating efficiency, increase light-emitting diode lighting device's luminous efficacy, and can make overall structure intensity improve and prolong product life.

Description

Light emitting diode lighting device and heat dissipation module thereof

technical field

The utility model relates to a light-emitting diode lighting device, in particular to a light-emitting diode lighting device capable of improving the heat dissipation efficiency of the light-emitting diode and a heat dissipation module thereof.

Background technique

Light Emitting Diode (Light Emitting Diode; Light Emitting Diode) is a semiconductor component, which is different from traditional incandescent bulbs that heat up the filament to emit light with a large current. The energy released makes the light-emitting diodes only require a very small current to excite considerable light. Light-emitting diodes have the advantages of small size, long life, low driving voltage, low power consumption, fast response, excellent shock resistance, and good monochromaticity. They are expected to replace some light bulbs and be widely used in various lighting devices in the future.

However, the biggest technical problem of LEDs at present is heat dissipation; LEDs are usually accompanied by heat accumulation during operation, especially for high-brightness or arrayed LEDs, the temperature rise will affect the light emission of LEDs. Efficiency and quality have a negative impact, so whether the heat dissipation is good or not also determines the working efficiency of the LED lighting device.

In order to solve the heat dissipation problem of light-emitting diodes, it is usually necessary to install fans to assist in heat dissipation. Although the use of fans can achieve a uniform heat dissipation effect, as the number of light-emitting diodes increases, the number of fans used will also increase accordingly. , the noise generated by a large number of fans will more or less cause some troubles to users. Moreover, adding cooling fans to the LED lighting device will easily lead to a huge product size. In addition, there is also a mechanism that uses heat pipes to assist in heat dissipation, but the arrangement and design of the heat pipes are not easy, which easily affects the heat transfer efficiency generated by them.

Contents of the invention

In view of the above problems, the main purpose of this utility model is to provide a light-emitting diode lighting device and its heat dissipation module, which adopts an integrally formed heat dissipation structure, which can achieve silent heat dissipation, and can improve the heat dissipation efficiency of the light-emitting diode, so that the light-emitting diode can emit light The performance is further improved.

Another object of the present invention is to provide a light-emitting diode lighting device and its heat dissipation module. The integrally formed heat dissipation structure has the advantage of structural strengthening, which can prolong the service life of the product and improve the competitiveness of the product.

In order to achieve the above object, the utility model proposes a light-emitting diode lighting device, which has a heat dissipation module. The heat dissipation module includes a circuit board and a heat dissipation structure. More than one light-emitting diode can be installed on the circuit board, and the heat dissipation structure is arranged on the Under the circuit board, the heat dissipation structure is integrally formed with a body and multiple heat dissipation fins, which can shorten the heat conduction path and optimize the heat dissipation effect. However, the structure of the heat dissipation structure of the present utility model is simple, and it is easy to match the type of the required LED lighting device or change according to the required heat dissipation effect. The shape and area of the heat dissipation structure can be matched with the arrangement of the circuit board and the LED array. Matching to apply to different lighting places.

The utility model has the advantages: the heat dissipation structure of the utility model is integrally formed, compared with the non-integrated heat dissipation structure, it can reduce the loss phenomenon during the heat conduction process, and the overall area is quite large, It helps to increase the heat capacity, effectively improve the heat dissipation effect, reduce the temperature of the light-emitting diode, and increase the light-emitting efficiency of the light-emitting diode. Moreover, this heat dissipation structure can be produced by injection molding or die casting, and the cost is not high, and it has great potential for mass production. It also has excellent reliability in terms of structural strength and can prolong the service life.

Regarding the features and implementation of the present utility model, several preferred embodiments are listed below in detail in conjunction with the drawings.

Description of drawings

Fig. 1 is a schematic cross-sectional view of a light-emitting diode lighting device provided by an embodiment of the present invention;

Fig. 2 is a perspective view of the appearance of the light-emitting diode lighting device provided by the embodiment of the present invention;

Fig. 3 is a perspective view of the appearance of the light-emitting diode lighting device provided by the embodiment of the present invention with cooling fins arranged horizontally;

Fig. 4 is a schematic diagram of the application of the light-emitting diode lighting device provided by the embodiment of the present invention to a street lamp;

5 and 6 are perspective views of the appearance of the heat dissipation module of a single light emitting diode light strip provided by the embodiment of the present invention, and Fig. 5 and Fig. 6 have heat dissipation fins with equal height and gradually decreasing height respectively; and

FIG. 7 and FIG. 8 are perspective views of the appearance of the heat dissipation module for multiple LED light bars provided by the embodiment of the present invention, and FIG. 7 and FIG. 8 respectively have heat dissipation fins with equal and decreasing heights.

Explanation of reference signs: 10 LED; 20 circuit board; 30 heat dissipation structure; 31 body; 32 accommodation space; 33 heat dissipation fin; 40 cover plate; 41 LED lamp holder; 70 heat dissipation structure; 71 heat dissipation fins; 80 heat dissipation structure; 81 heat dissipation fins.

Detailed ways

Please refer to FIG. 1 and FIG. 2 , which are respectively a schematic cross-sectional view and a perspective view of the appearance of the LED lighting device provided by the embodiment of the present invention. The light-emitting diode lighting device of this embodiment uses a plurality of light-emitting diodes 10 to provide lighting sources. These light-emitting diodes 10 are arranged in an array on the circuit board 20. The circuit board 20 can use traditional printed circuit boards, flexible boards ( FPC) or metal base printed circuit board, and the heat dissipation structure 30 used as auxiliary light-emitting diode 10 heat dissipation below the circuit board 20, in this embodiment, the heat dissipation structure 30 is directly used as the shell of the light-emitting diode lighting device, and the heat dissipation structure 30 body 31 It extends along the periphery of the circuit board 20 to form an accommodating space 32, which can accommodate the circuit board 20 and the light-emitting diode 10, and a cover plate 40 can be matchedly assembled above the accommodating space 32, and the cover plate 40 has A plurality of light-emitting diode lamp holders 41 are used to install and fix the above-mentioned light-emitting diodes 10, and a plurality of parallel and spaced vertical cooling fins 33 extend from the bottom of the heat dissipation structure 30 body 31, and the body 31 and the heat dissipation fins 33 It is integrally formed so that the heat generated and accumulated by the aforementioned light emitting diodes 10 can be dissipated to the outside through the heat dissipation fins 33 .

The radiating fins 33 of this embodiment are elongated metal sheets arranged vertically, which are quite large in number and arranged very closely with each other, thus creating quite a lot of longitudinal slits, and in this way, the radiating fins are enlarged. 33 is in contact with the air. This will help to remove heat from the LED 10. In practice, in order to enhance the effect of heat dissipation, the heat dissipation fins 33 can also be arranged horizontally, as shown in FIG. 3 .

Furthermore, since the heat dissipation structure of the present utility model is integrally formed, compared with a non-integral heat dissipation structure, it can reduce the loss phenomenon in the process of heat conduction, and the overall area is quite large, which contributes to The heat capacity can be more, which can effectively improve the heat dissipation effect, reduce the temperature of the LED, and increase the luminous efficiency of the LED. Moreover, this heat dissipation structure can be produced through injection molding or die casting, and the cost is not high, which has great potential for mass production. It also has excellent reliability in terms of structural strength and can prolong the service life.

In addition, the LED lighting device of the present utility model can increase or decrease the number of LEDs according to actual needs; please refer to FIG. The required lighting brightness increases the number of light-emitting diodes. The light-emitting diode lighting device of the utility model has an integrated heat dissipation structure. Even hundreds of light-emitting diodes will not reduce their illuminance or be damaged due to overheating. It is very suitable for use in outdoor lighting.

Next, please refer to FIG. 5 and FIG. 6, which are perspective views showing the appearance of the heat dissipation module of the single LED light bar provided by the embodiment of the present invention, and the heat dissipation structures 70 and 80 in FIG. 5 and FIG. The heat dissipation fins 71, 81 whose height gradually decreases in the horizontal direction; the heat dissipation structures 70, 80 are directly adhered to the bottom of the circuit board 60 by high thermal conductivity adhesive to form a heat dissipation module, and the heat dissipation module is made into a strip shape, and is mounted on the circuit board 60 Through special circuit design, multiple light emitting diodes can be arranged in a specific arrangement, and the two poles of each light emitting diode can be installed according to the positive and negative polarity indications (+ or -) on the circuit board 60 to form a light emitting diode light. Strip-type LED lighting. Furthermore, multiple heat dissipation modules can also be used to form different LED light source patterns; please refer to FIG. 7 and FIG. 8 , which show the appearance of the heat dissipation module with multiple LED light strips provided by the embodiment of the present invention. In a perspective view, the heat dissipation structures 70 and 80 in FIG. 7 and FIG. 8 respectively have heat dissipation fins 71 and 81 with equal heights and gradually decreasing heights in the horizontal direction.

The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the implementation scope of the present utility model. Therefore, all equal changes or modifications made according to the shape, structure, characteristics and spirit of the claims of the utility model shall be included in the patent application scope of the utility model.

Claims (16)

1. a light emitting diode illuminating apparatus is characterized in that, comprising:

One circuit board;

More than one light emitting diode is arranged at described circuit board top; And

One radiator structure is arranged at the below of described circuit board, and has a body and a plurality of radiating fin, and described body and described radiating fin are formed in one.

2. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: described radiating fin is the elongated metal sheet that a plurality of parallel interval are erected in described body below.

3. light emitting diode illuminating apparatus as claimed in claim 2 is characterized in that: described radiating fin is vertically arrangement or transversely arranged in described body below.

4. light emitting diode illuminating apparatus as claimed in claim 2 is characterized in that: the height that described radiating fin protrudes in described body is an equal altitudes or toward horizontal direction decrescence.

5. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: described body is to extend around the described circuit board and be formed with can ccontaining described circuit board and the accommodation space of described light emitting diode.

6. light emitting diode illuminating apparatus as claimed in claim 5 is characterized in that: more comprise a cover plate, be assembled in to coupling described accommodation space top, and have more than one in order to the light emitting diode lamp socket of described light emitting diode to be installed.

7. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: the quantity of described light emitting diode is a plurality of, and arranges setting in the array mode.

8. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: described radiator structure is to be incorporated into described circuit board by a high-heat-conductivity glue.

9. a light emitting diode radiating module in order to more than one LED heat radiating to be provided, is characterized in that, described light emitting diode radiating module comprises:

One circuit board, described light emitting diode are arranged at described circuit board top; And

One radiator structure is arranged at the below of described circuit board, and has a body and a plurality of radiating fin, and described body and described radiating fin are formed in one.

10. light emitting diode radiating module as claimed in claim 9 is characterized in that: described radiating fin is the elongated metal sheet that a plurality of parallel interval are erected in described body below.

11. light emitting diode radiating module as claimed in claim 10 is characterized in that: described radiating fin is vertically arrangement or transversely arranged in described body below.

12. light emitting diode radiating module as claimed in claim 9 is characterized in that: the height that described radiating fin protrudes in described body is an equal altitudes or toward horizontal direction decrescence.

13. light emitting diode radiating module as claimed in claim 9 is characterized in that: described body is to extend around the described circuit board and be formed with can ccontaining described circuit board and the accommodation space of described light emitting diode.

14. light emitting diode radiating module as claimed in claim 13 is characterized in that: more comprise a cover plate, can be assembled in described accommodation space top with mating, and have more than one in order to the light emitting diode lamp socket of described light emitting diode to be installed.

15. light emitting diode radiating module as claimed in claim 14 is characterized in that: the quantity of described light emitting diode lamp socket is a plurality of, and arranges setting in the array mode.

16. light emitting diode radiating module as claimed in claim 9 is characterized in that: described radiator structure is to be incorporated into described circuit board by a high-heat-conductivity glue.

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