CN212442633U

CN212442633U - Bonding lead belt cleaning device

Info

Publication number: CN212442633U
Application number: CN202021158993.2U
Authority: CN
Inventors: 不公告发明人
Original assignee: Hebei Lintai Electronic Technology Co ltd
Current assignee: Hebei Lintai Electronic Technology Co ltd
Priority date: 2020-06-19
Filing date: 2020-06-19
Publication date: 2021-02-02
Anticipated expiration: 2030-06-19

Abstract

The utility model belongs to the technical field of the technique of metal bonding silk processing and specifically relates to a bonding lead belt cleaning device is related to, including wasing the case and articulating the case lid on wasing the case, the mouth of walking that supplies bonding lead to pass is seted up at the both ends of wasing the case, the symmetry is provided with the inlet tube on wasing the case, two the inlet tube runs through and washs the case and extends towards the direction that is close to each other, two formed the clearance that supplies bonding lead to pass through between the delivery port of inlet tube, be provided with the drain on the washing case. The utility model discloses can wash bonding lead, guarantee bonding lead's surface cleaning.

Description

Bonding lead belt cleaning device

Technical Field

The utility model belongs to the technical field of the technique of metal bonding wire processing and specifically relates to a bonding lead belt cleaning device is related to.

Background

The lead bonding is a critical process for realizing electrical connection between a semiconductor chip and the outside in a packaging process, a connecting wire for interconnecting the chip and a frame lead is called a bonding lead through an ultrasonic or thermosonic pressure welding process, and the commonly used bonding leads are gold, silver, copper and the like. The bonding lead for interconnecting the chip and the frame pin is a vital material no matter in integrated circuit packaging or discrete device packaging, the semiconductor technology is promoted to the direction of small volume, high performance, high density and multiple chips, the requirement on the lead material of the integrated circuit packaging is thinner and thinner, the lead is required to have good electrical conductivity and thermal conductivity, and the requirements are met by four metals of gold, silver, copper and aluminum.

The processing flow of the bonding lead mainly comprises the working procedures of rough drawing, intermediate drawing, plating, fine drawing, micro drawing and the like. After micro-pulling, the bonding wire needs to be cleaned, and waste materials attached to the bonding wire are washed down to ensure the cleanness of the surface of the bonding wire.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a bonding lead belt cleaning device can wash bonding lead, guarantees bonding lead's surface cleaning.

The above technical purpose of the present invention can be achieved by the following technical solutions:

the utility model provides a bonding lead belt cleaning device, includes washs the case and articulates the case lid on wasing the case, the mouth of walking that supplies bonding lead to pass is seted up at the both ends of wasing the case, the symmetry is provided with the inlet tube on wasing the case, two the inlet tube runs through to wash the case and extends towards the direction that is close to each other, two formed the clearance that supplies bonding lead to pass through between the delivery port of inlet tube, be provided with the drain on the washing case.

Through adopting above-mentioned technical scheme, bonding wire passes through from the mouth of passing through of washing case one end, wears out from the mouth of passing through of the other end. The part that the bonding lead is located and washs the incasement can receive the washing away of two inlet tube exhaust rivers, because two inlet tubes set up for the symmetry for the mutual offset of exhaust rivers, thereby offset partly impact force, prevent that the bonding lead from taking place to be crooked under the impact of rivers. Meanwhile, the two sides of the bonding lead are simultaneously washed by water flow, so that dead corners can not exist when the bonding lead is washed, and the washing effect is better.

The utility model discloses further set up to: one end of the water inlet pipe, which is positioned in the cleaning box, is connected with a spray head.

Through adopting above-mentioned technical scheme, the shower nozzle can make rivers become more even after discharging from the inlet tube, and the dynamics of scouring away is more stable, is difficult for taking place great fluctuation to bonded lead is more stable when having guaranteed to wash bonded lead, is difficult for taking place great degree skew.

The utility model discloses further set up to: the spray head is a duckbill spray head.

Through adopting above-mentioned technical scheme, duckbilled's shower nozzle can make the bonding lead receive the scope grow that rivers washed simultaneously, has prolonged the bonding lead and has received the time that rivers washed, has promoted the washing effect.

The utility model discloses further set up to: and a water flow bubbler is arranged between the water inlet pipe and the spray head.

Through adopting above-mentioned technical scheme, the rivers bubbler can let the water and the air intensive mixing that flow through, forms the effect of foaming for rivers become softer, reduce the impact force of rivers, simultaneously, can make rivers become more even, effectively reduced rivers and dashed the back and take place the splash on the bonding lead.

The utility model discloses further set up to: the cleaning box is provided with a guide wheel at the position of the passing hole in a rotating mode, and the circumferential surface of the guide wheel is provided with a guide groove.

By adopting the technical scheme, the bonding lead can be lapped in the guide groove on the guide wheel, when the bonding lead moves, the guide wheel rotates along with the bonding lead, a certain protection effect is achieved on the bonding lead, and the bonding lead is prevented from being scratched and rubbed with the cleaning box.

The utility model discloses further set up to: the cleaning box is characterized in that support frames are symmetrically arranged on the inner wall of the cleaning box, a pressing plate is arranged on the support frames, cleaning cloth is detachably arranged on the pressing plate, and the two cleaning cloths are mutually attached together.

By adopting the technical scheme, when the bonding lead passes through the two pressing plates, the two cleaning cloths can scrub the bonding lead, so that impurities attached to the bonding lead are cleaned, and the cleaning effect on the bonding lead is improved. Meanwhile, the cleaning cloth can be detachably arranged on the pressing plate, so that the cleaning cloth can be replaced by workers to keep the cleaning effect of the cleaning cloth.

The utility model discloses further set up to: the pressing plate is positioned between the water outlets of the two water inlet pipes, and a plurality of through holes for water flow to pass through are formed in the pressing plate.

By adopting the technical scheme, water flow passes through the through hole on the pressing plate and impacts the cleaning cloth, and the two cleaning cloths are extruded towards the direction close to the bonding lead, so that the bonding lead is scrubbed by the cleaning cloth. Meanwhile, the pressing plate and the cleaning cloth play a role in slowing water flow, so that the water flow is softer.

The utility model discloses further set up to: the two ends of the pressing plate are provided with clamps used for clamping cleaning cloth, and the clamps are positioned on one sides of the two pressing plates, which deviate from each other.

Through adopting above-mentioned technical scheme, open the clip and can carry out the change of cleaning cloth, simple structure changes convenient and fast, has reduced staff's the operation degree of difficulty.

To sum up, the utility model discloses a beneficial technological effect does:

1. the water flow penetrates through the through hole in the pressing plate to be washed on the cleaning cloth, the cleaning cloth can play a role in slowing the water flow, so that the water flow can wash the bonding lead more softly, and meanwhile, the cleaning cloth can also scrub the bonding lead to clean the bonding lead;

2. the guide wheel arranged on the cleaning box can play a role in positioning and guiding the bonding lead, and meanwhile, the guide wheel can also play a role in supporting, so that the bonding lead is not easy to scratch with the cleaning box, and a certain protection effect is achieved on the bonding lead.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a plan view of the present invention.

Reference numerals: 1. a cleaning tank; 11. a box cover; 12. a puncture opening; 13. a sewage draining outlet; 2. a water inlet pipe; 21. a spray head; 22. a water stream bubbler; 3. a guide wheel; 31. a guide groove; 4. a support frame; 41. pressing a plate; 42. a cleaning cloth; 43. and (4) a clamp.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

Referring to fig. 1 and 2, for the embodiment of the present invention discloses a bonding lead cleaning device, which includes a cleaning box 1 with an open top end and a box cover 11 hinged at the open end of the cleaning box 1. Two ends of the cleaning box 1 are provided with through openings 12 for the bonding wires to pass through, and the two through openings 12 are aligned with each other. The cleaning box 1 is symmetrically provided with water inlet pipes 2, and the water inlet pipes 2 and the passing openings 12 are arranged on different sides. Two inlet tubes 2 run through and wash case 1 and extend towards the direction that is close to each other, and the one end that inlet tube 2 is located and washs 1 outer is the water inlet, and the one end that is located and washs 1 incasement is the delivery port. The delivery ports of two inlet tubes 2 align each other, have formed the clearance that supplies the bonding lead wire to pass through between the delivery ports of two inlet tubes 2 for two strands of rivers have realized the offset. The bottom end of the cleaning box 1 is provided with a sewage outlet 13, so that the waste water after washing is discharged out of the cleaning box 1.

And cleaning liquid is introduced into the water inlet pipe 2 and enters the cleaning tank 1 along the water inlet pipe 2. Because the delivery ports of two inlet tubes 2 align each other for mutual convection has been realized to two strands of washing liquids, thereby offset the scouring force of rivers each other, avoid crooked the production that erodees the bonding lead wire. Meanwhile, the cleaning effect of the two strands of cleaning fluid convection on the bonding wire is better.

Referring to fig. 1 and 2, in order to make the water flow discharged from the water inlet pipe 2 more uniform and to improve the washing effect of the bonding wire, a nozzle 21 is disposed at one end of the water inlet pipe 2 located in the washing tank 1.

Further, referring to fig. 1 and 2, in order to widen the washing range, the head 21 is provided as a duckbill type head such that the water stream ejected from the head 21 is flat. The length direction of the water outlet of the spray head 21 is consistent with the trend of the bonding lead, so that the cleaning area of the bonding lead is enlarged.

Further, referring to fig. 1 and 2, a water stream bubbler 22 is provided between the water feed pipe 2 and the spray head 21 in order to enhance the cleaning effect. The water flow bubbler 22 can fully mix the flowing cleaning liquid with air, and due to the addition of the air, the water flow is softer, the washing is not easy to splash on the bonding lead, and meanwhile, the water-saving effect is achieved.

Referring to fig. 1 and 2, in order to prevent the bonding wire from being scratched with the cleaning tank 1 when passing through the through opening 12, a guide wheel 3 is rotatably provided on the cleaning tank 1 at the through opening 12. A guide groove 31 matching with the bonding wire is formed along the circumferential side surface of the guide wheel 3. Meanwhile, the guide groove 31 is polished, so that the surface roughness of the guide groove 31 is reduced, and the bonding wire is protected.

Referring to fig. 1 and 2, in order to further improve the cleaning effect of the bonding wire, support frames 4 are symmetrically arranged on the inner wall of the cleaning tank 1. The support frame 4 is fixedly provided with a pressing plate 41, and the surfaces of the two pressing plates 41 are parallel to each other. The pressure plates 41 are detachably provided with cleaning cloth 42, a gap for the bonding wire to pass through is formed between the two pressure plates 41, and the bonding wire does not touch the pressure plates 41 when moving. The cleaning cloths 42 are attached to each other to sandwich the bonding wire, thereby scrubbing the bonding wire.

Referring to fig. 1 and 2, in order to further reduce the scouring force of the water flow, the support frame 4 and the water inlet pipe 2 are arranged on the same side, and two pressing plates 41 are positioned between the nozzles 21 of the two water inlet pipes 2. The pressing plate 41 is provided with a plurality of through holes which are horizontally arranged, so that water flow can wash the cleaning cloth 42 after passing through the through holes, the two cleaning cloths 42 are further attached together under the action of the water flow, and the bonding lead is scrubbed.

Referring to fig. 1 and 2, clips 43 for clamping the cleaning cloth 42 are fixedly provided at both ends of the pressure plate 41. The clips 43 are located on the sides of the two pressure plates 41 facing away from each other so that the clips 43 do not interfere with the bonding wires as they pass between the two pressure plates 41.

The implementation principle of the embodiment is as follows: the bonding lead penetrates through the through hole 12 at one end of the cleaning box 1 and penetrates out of the through hole 12 at the other end of the cleaning box, and the bonding lead is lapped in the guide groove 31 on the guide wheel 3, so that the bonding lead cannot be scratched with the cleaning box 1 in the moving process. When the bonding wire passes through the space between the two pressing plates 41, the cleaning liquid is sprayed from the spray head 21, passes through the through hole on the pressing plate 41 and washes the cleaning cloth 42, so that the two cleaning cloths 42 are further attached to the outer wall of the bonding wire.

The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.

Claims

1. A bonding wire cleaning device is characterized in that: including wasing case (1) and articulating case lid (11) on wasing case (1), the both ends of wasing case (1) are seted up and are supplied the line mouth (12) that wears that the bonding lead wire passed, it is provided with inlet tube (2), two to wash the symmetry on case (1) inlet tube (2) run through and wash case (1) and extend towards the direction that is close to each other, two formed the clearance that supplies the bonding lead wire to pass through between the delivery port of inlet tube (2), be provided with drain (13) on wasing case (1).

2. The bonding wire cleaning apparatus of claim 1, wherein: one end of the water inlet pipe (2) which is positioned in the cleaning box (1) is connected with a spray head (21).

3. The bonding wire cleaning apparatus of claim 2, wherein: the spray head (21) is a duckbill-shaped spray head.

4. The bonding wire cleaning apparatus of claim 2, wherein: a water flow bubbler (22) is arranged between the water inlet pipe (2) and the spray head (21).

5. The bonding wire cleaning apparatus of claim 1, wherein: the cleaning box (1) is rotatably provided with a guide wheel (3) at the passing opening (12), and a guide groove (31) is formed in the circumferential surface of the guide wheel (3).

6. The bonding wire cleaning apparatus of claim 1, wherein: the cleaning box is characterized in that support frames (4) are symmetrically arranged on the inner wall of the cleaning box (1), a pressing plate (41) is arranged on the support frames (4), cleaning cloth (42) is detachably arranged on the pressing plate (41), and the two cleaning cloth (42) are mutually attached together.

7. The bonding wire cleaning apparatus of claim 6, wherein: the pressing plate (41) is positioned between the water outlets of the two water inlet pipes (2), and a plurality of through holes for water flow to pass through are formed in the pressing plate (41).

8. The bonding wire cleaning apparatus of claim 6, wherein: the two ends of the pressing plate (41) are provided with clips (43) used for clamping the cleaning cloth (42), and the clips (43) are located on the side where the two pressing plates (41) deviate from each other.