CN212342588U

CN212342588U - Chip carrier

Info

Publication number: CN212342588U
Application number: CN202021577040.XU
Authority: CN
Inventors: 顾凯
Original assignee: Zte Photoelectric Technology Co ltd
Current assignee: Zte Photoelectric Technology Co ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2021-01-12
Anticipated expiration: 2030-07-31

Abstract

The application provides a chip carrier, including carrying thing board and bottom plate: the carrying plate is used for adsorbing the chip and is provided with a through hole for placing the chip; the bottom plate is provided with a boss matched with the through hole, and the boss separates the chip from the object carrying plate in a state of penetrating through the through hole. The utility model discloses a setting has the bottom plate and the through-hole of boss, and the boss on the bottom plate passes the through-hole from the below of through-hole, will be located the chip jack-up on the through-hole for the chip separates with carrying the thing board, thereby is convenient for the vacuum suction pen absorbs the chip.

Description

Chip carrier

Technical Field

The embodiment of the application relates to the technical field of chip storage, in particular to a chip carrier.

Background

The existing semiconductor chip needs to be protected and treated in the process of storage or transportation, and the chip is small in size and easy to shake in the process of transportation, so that the preferred chip carrier is provided with an adsorption substrate with certain viscosity, the chip is contained in a mode that the chip is adhered to the adsorption substrate, and the chip is further prevented from shaking. However, since the adsorption substrate has a certain viscosity, when the chip is taken, it is difficult to directly suck the chip by the vacuum suction pen, and when the chip is clamped by other clamps, the damage to the surface of the chip is caused, which affects the characteristics of the chip.

SUMMERY OF THE UTILITY MODEL

The main objective of this application is to provide a chip carrier, can be in be convenient for absorb the chip with the vacuum suction pen in the chip carrier, avoid the chip to damage.

The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

According to a first aspect of the present application, there is provided a chip carrier comprising:

carry thing board and bottom plate: the carrying plate is used for adsorbing the chip and is provided with a through hole for placing the chip;

the bottom plate is provided with a boss matched with the through hole, and the boss separates the chip from the object carrying plate in a state of penetrating through the through hole.

Adopt the chip carrier of this application, the boss on the bottom plate passes the through-hole from the below of through-hole, will be located the chip jack-up on the through-hole for the chip with carry the thing board separation, thereby be convenient for the vacuum suction pen suction chip.

Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the claimed subject matter and are incorporated in and constitute a part of this specification, illustrate embodiments of the subject matter and together with the description serve to explain the principles of the subject matter and not to limit the subject matter.

FIG. 1 is a perspective view of one embodiment of a chip carrier according to the present application;

FIG. 2 is a perspective view of one embodiment of a carrier plate of the chip carrier of the present application;

FIG. 3 is a perspective view of one embodiment of a chip carrier according to the present application;

FIG. 4 is a perspective view of one embodiment of a chip carrier of the present application with chips sucked;

fig. 5 is a perspective view of an embodiment of a chip carrier in accordance with the present application.

Reference numerals:

100-carrying plate, 110-through hole, 120-first layer, 130-second layer, 121-first hole, 131-second hole, 200-bottom plate, 210-boss, 300-chip, 400-box, 500-vacuum suction pen.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. In the present application, the embodiments and features of the embodiments may be arbitrarily combined with each other without conflict.

The terms first, second and the like in the description and in the claims, and the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that if an orientation description is referred to, such that the directions or positional relationships indicated, for example, up, down, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings, it is only for convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be taken as limiting the present application.

With the rapid development of integrated chips, the memory problem of the chips is increasingly highlighted. The following takes a silicon optical chip as an example:

the silicon optical chip is an integrated circuit manufactured by silicon optical materials and devices through a special process, and mainly comprises a light source, a modulator, a detector, a passive waveguide device and the like. The silicon optical chip has the characteristics of high integration level, low cost, higher transmission bandwidth and the like. Because the silicon optical chip takes silicon as a substrate of an integrated chip, more optical devices can be integrated. Because the quantity of silicon optical chip is less than traditional electric chip, consequently, still use the mode of the absorption substrate of traditional chip to deposit, when taking, because the chip is adsorbed on the substrate, reasons such as the viscidity of substrate and atmospheric pressure can lead to the chip to be difficult for breaking away from the substrate, consequently can not directly absorb through the vacuum suction pen, and need press from both sides through anchor clamps such as tweezers and get. For some silicon photonics chips, especially for silicon-based photonics chips with side-coupled or light-emitting structures, the clamping of the chip may damage the chip completely.

The following disclosure provides many different embodiments, or examples, for implementing different aspects of the disclosure.

As shown in fig. 1, a chip carrier includes a carrier plate 100 and a base plate 200: the object carrying plate 100 is used for adsorbing the chip 300, and the object carrying plate 100 is provided with a through hole 110 for placing the chip 300; the base plate 200 is provided with a boss 210 fitted to the through hole 110, and the boss 210 separates the chip 300 from the carrier plate 100 in a state of passing through the through hole 110.

Generally, the carrier plate 100 usually includes an adhesive layer, such as a silicone film, a coating, etc., for adsorbing the chip 300 placed on the carrier plate 100. In the present embodiment, the carrier plate 100 is provided with a plurality of through holes 110, the chips 300 can be placed on the through holes 110 without falling into the through holes 110, and the chips 300 are partially adhered to the carrier plate 100. The number of through holes 110 may correspond to the size of the carrier plate 100 and the size of the chip 300 to be placed. The size of the through-hole 110 is related to the size of the chip 300 that needs to be placed. For larger size chips 300, the through holes 110 may be larger, as long as it is ensured that the chips 300 are partially adhered to the carrier plate 100; for smaller size chips 300, the through-holes 110 should be set smaller to prevent the chips 300 from falling out of the through-holes 110. The base plate 200 is provided with a plurality of bosses 210, and the bosses 210 are configured to pass through the through holes 110 and protrude, so that the chip 300 located on the through holes 110 can be lifted up, and the chip 300 is separated from the carrier plate 100.

When it is necessary to suck the chip 300, the carrier plate 100 is placed on the base plate 200 such that the through hole 110 corresponds to the boss 210, and the carrier plate 100 is pressed downward, or the base plate 200 is lifted upward such that the boss 210 passes through the through hole 110 and protrudes, thereby lifting the chip 300 from the carrier plate 100. Since the chip 300 is lifted up and loses its connection with the loading plate 100, the chip 300 can be sucked up without any trouble by using the vacuum suction pen 500. In this process, the chip 300 is separated from the carrier plate 100 by the pushing of the boss 210, and then is sucked by the vacuum wand 500 without contacting rigid jigs such as tweezers, thereby ensuring that the suction of the vacuum wand 500 is more convenient and avoiding the surface damage of the chip 300. It should be noted that the carrier plate 100 should be rigid in its entirety, not only to ensure a smooth chip 300, but also to ensure that the bumps 210 smoothly pass through the through holes 110 of the carrier plate 100.

As shown in fig. 2, in some embodiments, to ensure that the carrier plate 100 allows the boss 210 to pass through smoothly while adsorbing the chip 300, the carrier plate 100 may include a first layer 120 and a second layer 130, the first layer 120 being capable of adsorbing and supporting the chip 300, the first layer 120 being disposed above the second layer 130, and the second layer 130 being capable of carrying the first layer 120. Specifically, the first layer 120 may be a flexible material, such as a silicone film, a plastic film with an adhesive coating, or the like. Since the first layer 120 is disposed above the second layer 130, and the second layer 130 can support the first layer 120 and the chip 300, the second layer 130 can be a rigid material, such as a plastic plate. It should be noted that the first layer 120 and the second layer 130 should be made of a material having an antistatic property, so that the chip 300 can be prevented from being damaged due to the generation of static electricity during the process of sucking the chip 300.

As shown in fig. 2, in some embodiments, in order to allow the boss 210 to simultaneously penetrate through the first layer 120 and the second layer 130, the through hole 110 may include a first hole 121 and a second hole 131, a plurality of first holes 121 may be formed in the first layer 120, a plurality of second holes 131 may be formed in the second layer 130, the first holes 121 and the second holes 131 respectively communicate with each other, and the communicated first holes 121 and second holes 131 may allow the boss 210 to penetrate therethrough. Wherein, the top size of the boss 210 may correspond to the through hole 110 after the first hole 121 and the second hole 131 are communicated, ensuring that the boss 210 can pass through the first hole 121 and the second hole 131 without obstruction.

In some embodiments, to avoid the second layer 130 from interfering with the penetration of the mesa 210, while, to avoid the chip 300 from falling off, the first hole 121 may be smaller than or equal to the second hole 131. When the size of the first hole 121 is equal to the second hole 131, the boss 210 can pass through without obstruction; when the first hole 121 is smaller than the second hole 131, the boss 210 is only aligned with the first hole 121 when it is lifted up, thereby being smoothly passed through.

As shown in fig. 1 and 2, in some embodiments, in order to reduce the thickness of the boss 210 passing through and avoid the boss 210 from being jammed in the through hole 110, the through hole 110 includes a first hole 121 and a second hole 131, a plurality of first holes 121 are opened in the first layer 120, and the size of the boss 210 is matched with the size of the first holes 121. The second hole 131 is provided in the second layer 130, and the second hole 131 may simultaneously allow the plurality of bosses 210 to pass therethrough. By such a design, it is not only ensured that the bosses 210 pass through the through holes 110 having a small thickness, but also that the flexible first layer 120 can be supported by the second layer 130.

In some embodiments, to avoid the long path traversed by the boss 210, the first layer 120 and the second layer 130 are each 3mm to 5mm thick. The first layer 120 and the second layer 130 having a certain thickness can stably support the chip 300 and prevent a large amount of consumables.

As shown in fig. 3, in some embodiments, in order to utilize the space of the carrier plate 100 to the maximum and to place more chips 300, the through holes 110 may be arranged in a matrix, and correspondingly, the bosses 210 may also be arranged in a matrix, so that a certain number of chips 300 may be adsorbed in a certain space in an orderly and efficient manner.

As shown in fig. 1 and 3, in some embodiments, in order to suck more chips 300 at a time, the number of the bosses 210 is equal to the number of the through holes 110, so that when the bottom plate 200 is placed under the carrier plate 100, all the chips 300 stored on the carrier plate 100 can be ejected at a time, and thus all the chips 300 can be sucked and removed by the vacuum suction pen 500.

As shown in fig. 4, in some embodiments, in order to suck the chips 300 in batches, the number of the through holes 110 may be greater than the number of the bosses 210, so that the chips 300 to be taken may be ejected through the bosses 210. When the through holes 110 are arranged in a matrix, the number of the bosses 210 can be reduced by a proper multiple in the longitudinal and lateral numbers of the through holes 110, and thus, it is possible to not only satisfy the batch ejection of the chips 300 but also sequentially move the base plate 200 and eject the chips 300 in the order of the through holes 110.

In some embodiments, to completely separate chip 300 from carrier plate 100, the height of boss 210 may be greater than the thickness of carrier plate 100. If the height of the boss 210 is equal to the thickness of the carrier plate 100, the height of the boss 210 is equal to the length of the through hole 110, and thus the chip 300 cannot be completely peeled off from the carrier plate 100, which may cause difficulty in sucking the chip 300 using the vacuum suction pen 500.

In some embodiments, to ensure that the chip 300 is completely separated from the carrier plate 100, and at the same time avoid the chip 300 from falling off the top of the boss 210, the height of the boss 210 differs from the thickness of the carrier plate 100 by 1mm to 5 mm. If the difference between the height of the boss 210 and the thickness of the carrier plate 100 is large, after the boss 210 ejects the chip 300, the chip 300 may be dropped because the surface of the boss 210 does not have the adsorption function. Preferably, the difference between the height of the boss 210 and the thickness of the carrier plate 100 is 3mm to 5 mm.

In some embodiments, the shape of the through-hole 110 may be circular, triangular, quadrilateral or pentagonal in order to accommodate chips 300 of different shapes and structures. The shape of the boss 210 may be consistent with the shape of the through-hole 110, for example, when the shape of the through-hole 110 is set to be circular, the shape of the boss 210 may also be set to be circular; the shape of the boss 210 may not be consistent with the shape of the through hole 110 as long as the through hole 110 can pass through the through hole 110, for example, when the shape of the through hole 110 is circular, the shape of the boss 210 may be set to a triangular shape that is circumscribed by the circular through hole 110, and the ejection of the chip 300 may also be achieved. Preferably, the through-hole 110 is circular in shape.

As shown in fig. 5, in some embodiments, the chip carrier further includes a box 400, and a receiving cavity is formed in the box 400, and the carrier plate 100 is located in the receiving cavity. The box 400 can isolate the chip 300 from the external environment, and the box 400 can prevent the chip 300 from shaking and wearing, so that the external dust is prevented from falling onto the chip 300 to influence the use effect of the chip 300. In addition, the case 400 may be waterproof, preventing the chip 300 from being damaged after water contacts the chip 300. The combination of the case 400, the loading plate 100, and the bottom plate 200 can prevent the chip 300 from shaking, wearing, and colliding in all directions. Preferably, the height of the case 400 is higher than the height at which the chip 300 is placed, so that the chip 300 can be prevented from falling off from the case 400.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are included in the scope of the present invention defined by the claims.

Claims

1. A chip carrier is characterized by comprising an object carrying plate and a bottom plate:

the carrying plate is used for adsorbing the chip and is provided with a through hole for placing the chip;

2. The chip carrier of claim 1, wherein the carrier plate comprises a first layer and a second layer, the first layer is disposed over the second layer, the first layer is flexible, and the second layer is rigid.

3. The chip carrier as claimed in claim 2, wherein the through holes include a first hole and a second hole, the first layer defines a plurality of first holes, and the second layer defines a plurality of second holes communicating with the first holes.

4. The chip carrier of claim 3, wherein the first hole is less than or equal to the second hole.

5. The chip carrier as claimed in claim 2, wherein the through holes include a first hole and a second hole, the first layer has a plurality of first holes, the second layer has a second hole, and the second hole allows a plurality of bosses to pass through simultaneously.

6. The chip carrier of claim 2, wherein the first layer and the second layer are each 3mm to 5mm thick.

7. The chip carrier according to claim 1 or 3, wherein the through holes are arranged in a matrix, and correspondingly, the bosses are arranged in a matrix.

8. The chip carrier according to claim 7, wherein the number of bosses is equal to the number of through holes.

9. The chip carrier of claim 7, wherein the number of through holes is greater than the number of bosses.

10. The chip carrier of claim 1, wherein the height of the boss is greater than the thickness of the carrier plate.

11. The chip carrier of claim 10, wherein the difference between the height of the boss and the thickness of the carrier plate is 1mm to 5 mm.

12. The chip carrier according to claim 1, wherein the through hole has a circular, triangular, quadrangular or pentagonal shape.

13. The chip carrier according to claim 1, further comprising a box body, wherein a receiving cavity is formed in the box body, and the carrier plate is located in the receiving cavity.