CN212304193U - Cold plate for high-power semiconductor laser - Google Patents

Abstract

The utility model provides a cold drawing for high power semiconductor laser, the cold drawing includes cold drawing hypoplastron, cold drawing upper plate, sealing strip, inlet and outlet joint. One side of the cold plate lower plate is provided with a plurality of snakelike runners with turbulence fins and a weight reduction cavity, the runner processing structure is compact, the heat exchange area is large, and the cooling liquid is disturbed in real time. The plurality of flow passages are mutually independent and are respectively connected with the inlet connector and the outlet connector. The cold plate lower plate is provided with a sealing groove which changes along with the shape of the snake-shaped flow channel, and the sealing strip is used for sealing the flow channel of the cold plate upper plate. And a high-power semiconductor laser is arranged on the other surface of the lower plate of the cold plate. The cold plate upper plate and the cold plate lower plate are connected through screws. The cold plate has the advantages of compact structure, strong heat dissipation capability, good temperature uniformity, high flow passage cleaning and maintenance performance and easy installation and maintenance.

Description

Cold plate for high-power semiconductor laser

Technical Field

The utility model relates to a cooling technical field of laser instrument, in particular to high power semiconductor laser's heat dissipation.

Background

With the continuous development of high-power lasers, the power requirement on the laser pump source is higher and higher. The pump source is a component for converting electric energy into light energy, a large amount of heat energy is generated in the conversion process, and the pump source can be rapidly heated due to untimely heat dissipation, so that the service performance and the service life of the pump source are seriously influenced. The large amount of heat generated by the pump source is typically dissipated using a cold plate. The commonly used cold plate has a copper-embedded tube type, a brazing type, a friction welding type and a high-molecular diffusion welding type structure. Usually, the copper tube embedded type cold plate is suitable for heat dissipation of a pump source of a medium-low power laser, and the brazing type, friction welding type and high-molecular diffusion welding type cold plates are suitable for heat dissipation of a high-power pump source, but the processing cost is high, the flow channel is physically sealed, and the flow channel is not beneficial to dredging and removing dirt. To the not enough of above-mentioned cold drawing, the utility model relates to a cold drawing that has vortex fin and sealing washer is sealed dispels the heat to high power semiconductor laser.

SUMMERY OF THE UTILITY MODEL

For solving the not enough of prior art, the utility model discloses combine prior art, from practical application, provide a cold board for high power semiconductor laser, this cold board overall structure is compact, can guarantee the quick samming cooling of high power semiconductor laser, satisfies the heat dissipation demand of high power laser.

In order to achieve the above object, the technical solution of the present invention is as follows.

The utility model provides a cold drawing for high power semiconductor laser, including cold drawing hypoplastron, cold drawing upper plate, sealing strip, inlet and outlet joint. And one surface of the lower plate of the cold plate is provided with a plurality of snakelike runners with turbulence fins and a weight reduction cavity. The plurality of flow passages are mutually independent and are respectively connected with the inlet connector and the outlet connector. The cold plate lower plate is provided with a sealing groove which changes along with the shape of the snake-shaped flow passage, and the sealing strip is used for sealing the flow passage by the cold plate upper plate. And a high-power semiconductor laser is arranged on the other surface of the lower plate of the cold plate.

Furthermore, the positions of the turbulence fins in the flow channel are overlapped with a heat source of the semiconductor laser, and the shapes of the turbulence fins can be processed into a single strip shape, a plurality of strip shapes, a cylindrical shape, a staggered cylindrical shape and a staggered strip shape according to actual needs and cost control.

Furthermore, the inlet and outlet joints of the same flow passage are positioned on the same side of the cold plate, and the water inlets and water outlets of different flow passages are respectively arranged on two sides of the cold plate.

Further, the inlet and outlet connectors of the flow channel are arranged on two sides of the cold plate through threads.

Further, the cold plate upper plate and the cold plate lower plate are connected and fastened through screws.

The utility model has the advantages that: the utility model discloses a set up many independent snakelike runners and the vortex fin has been processed in the runner, be applicable to the heat dissipation of high power semiconductor laser, the coolant liquid passes through the inlet joint, flows through inside runner, flows out through the outlet joint again, realizes locating the samming cooling of the semiconductor laser module on cold plate surface; the design of sealing by the sealing strips is adopted, so that the upper cold plate and the lower cold plate are disassembled, the regular cleaning and maintenance are facilitated, the runner is effectively protected from being corroded, and the runner is prevented from being blocked.

Drawings

Figure 1 is the utility model discloses split structure sketch map.

Fig. 2 is a schematic view of the flow channel structure of the present invention.

Figure 3 is the utility model discloses runner vortex fin pattern sketch map.

Fig. 4 is a schematic view of the overall structure of the present invention.

Reference numerals shown in the drawings: 1. cold plate upper plate; 2. cold plate upper plate; 3. a flow channel; 4. a turbulence fin; 5. a sealing groove; 6. a weight-reducing cavity; 7. a first flow channel inlet; 8. a second flow channel inlet; 9. a third flow channel inlet; 10. a fourth runner inlet; 11. a first flow channel outlet; 12. a second flow channel outlet; 13. a third flow channel outlet; 14. a fourth flow channel outlet; 15. a semiconductor laser; 16. a single strip-shaped turbulence fin; 17. a plurality of strip-shaped turbulence fins; 18. staggering the cylindrical turbulence fins; 19. the strip-shaped turbulence fins are staggered.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope defined in the present application.

As shown in fig. 1-4, a cold plate for a high-power semiconductor laser comprises an upper cold plate 1 and a lower cold plate 2, wherein a weight reduction cavity 6 and a plurality of serpentine runners 3 are processed on the lower cold plate 2, the runners 3 are mutually independent and are respectively provided with inlet and outlet connectors 7-14, turbulence fins 16 are arranged in an area, overlapped with a pump source heat source, inside the runner 3, along with the sealing grooves 5 formed in the shape of the runner 3, and the upper cold plate 1 is fixed on the lower cold plate 2 and used for sealing the runner 3. And a high-power semiconductor laser is arranged on the lower surface of the lower plate 2 of the cold plate.

The utility model discloses in, cold drawing hypoplastron 2 adopts aluminium base board or copper base plate, and many runners 3 and seal groove 5 are processed out through precision finishing's mode in its surface, and cold drawing upper plate 1 is installed at cold drawing hypoplastron 2 through the mode of screw locking, realizes runner 3's closure. During the use, semiconductor laser installs below cold drawing hypoplastron 2, and many runners 3 flow in the cold fluid through inlet joint 7 ~ 10 respectively, and outlet joint 11 ~ 14 outflow hot-fluid realizes giving semiconductor laser heat dissipation.

The utility model discloses in, in order to keep the temperature uniformity and can give the heat dissipation of the semiconductor laser of big thermal current density, heat source overlap region is equipped with vortex fin 16 in flow channel 3, realizes increasing heat transfer area, increases the effect of liquid stream disturbance, and then improves the heat transfer effect.

In order to guarantee the cooling effect that dispels the heat, the utility model discloses a runner 3 is many and mutual independence, when dispelling the heat for the medium and low power pump source, connects many runners 3 of establishing ties through exit joint 7 ~ 14, practices thrift the liquid flow when can guaranteeing the radiating effect. When the high-power pump source is used for heat dissipation, the multiple flow channels 3 work independently, and the heat dissipation capacity of the cold plate is effectively improved.

The utility model discloses in install the sealing strip in the seal groove 5 along with 3 shape changes of runner, the cold drawing runner 3 is maintained in the regular clearance of being convenient for to sealed mode, avoids runner 3 to appear runner jam and corruption.

Claims (7)

1. The utility model provides a cold drawing for high power semiconductor laser, includes cold drawing hypoplastron, cold drawing upper plate, sealing strip, inlet and outlet joint, its characterized in that: one surface of the lower plate of the cold plate is provided with a plurality of snakelike flow channels with turbulence fins and weight reduction cavities, and the shapes of the turbulence fins in the snakelike flow channels are diversified; the runner is mutually independent, installs the import and export joint respectively, cold plate hypoplastron processing has the type seal groove along with snakelike runner shape change, the cold plate upper plate uses the sealed runner of sealing strip, high power semiconductor laser is installed to cold plate hypoplastron another side.

2. The cold plate of claim 1, wherein: the cold plate lower plate is provided with a plurality of runners, the runners are independent from one another, and the runners can be independently communicated with cooling liquid or can be connected in series to form a runner for use.

3. The cold plate of claim 1, wherein: and the inlet and outlet connectors are respectively arranged on the independent flow passages and are respectively arranged on two sides of the cold plate.

4. The cold plate of claim 1, wherein: flow disturbing fins are arranged in a plurality of flow channels of the cold plate lower plate, the position areas of the flow disturbing fins are overlapped with the heat source area of the cold plate lower plate, and the flow disturbing fins can be in a single-strip shape, a plurality of strip shapes, a cylindrical shape, a staggered cylindrical shape and a staggered strip shape.

5. The cold plate of claim 1, wherein: the runner of the cold plate lower plate is sealed by the sealing strip, the sealing strip mounting groove is in the shape of a snake-shaped runner, and the section of the sealing strip can be rectangular, circular, oval, star-shaped or K-shaped.

6. The cold plate of claim 1, wherein: and a weight reduction cavity is processed in a non-flow passage area of the lower plate of the cold plate.

7. The cold plate of claim 1, wherein: the cold plate upper plate is connected with the cold plate lower plate through screws.

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