CN212210003U

CN212210003U - Multi-channel laser

Info

Publication number: CN212210003U
Application number: CN202021292046.2U
Authority: CN
Inventors: 刘杰; 雷谢福; 张艳春; 杨国文; 赵卫东
Original assignee: Suzhou Dugen Optoelectronic Device Co ltd
Current assignee: Suzhou Dugen Optoelectronic Device Co ltd
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2020-12-22
Anticipated expiration: 2030-07-02

Abstract

The embodiment of the present application provides a multi-channel laser, the multi-channel laser includes: the cooling module is internally provided with a plurality of cooling loops; a thermally conductive sheet disposed on a first side of the cooling module; a laser module disposed on the heat-conducting plate, the laser module including at least one laser unit. This application has realized improving the radiating effect of laser instrument, promotes the laser instrument performance.

Description

Multi-channel laser

Technical Field

The application relates to the technical field of lasers, in particular to a multi-channel laser.

Background

The semiconductor laser, also called laser diode, is a laser using semiconductor material as working substance, and has the advantages of small volume, large power, stable performance, etc. With the wide application of semiconductor lasers in the fields of imaging, communication, machining and the like, the performance requirements of semiconductor lasers are higher and higher, and the performance of semiconductor lasers is related to heat dissipation and packaging of lasers besides epitaxial materials.

The heat dissipation mode of the laser mainly comprises wind cooling and water cooling, and the noise of the water cooling is smaller than that of the wind cooling, and the temperature control of the water cooling is more accurate than that of the wind cooling, so that the water cooling heat dissipation is mostly adopted in the packaging of the semiconductor laser at present. The traditional multi-channel laser only has one water inlet and one water outlet, and has temperature difference from the water inlet to the water outlet, and the performance of the laser can be influenced to a great extent, so that the heat dissipation requirement of the semiconductor laser with higher power and higher heat productivity is difficult to meet.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the present application is to provide a multi-channel laser, so as to improve the heat dissipation effect of the laser and improve the performance of the laser.

A first aspect of an embodiment of the present application provides a multi-channel laser, including: the cooling module is internally provided with a plurality of cooling loops; a thermally conductive sheet disposed on a first side of the cooling module; a laser module disposed on the heat-conducting plate, the laser module including at least one laser unit.

In an embodiment, a first cooling channel, a second cooling channel and a third cooling channel are disposed in the cooling module, and the third cooling channel is respectively communicated with the first cooling channel and the second cooling channel.

In an embodiment, a first opening, a second opening, and a third opening are sequentially disposed on the second side surface of the cooling module, the first opening is communicated with the first cooling channel, the third opening is communicated with the second cooling channel, and the second opening is communicated with the third cooling channel.

In one embodiment, the first cooling channel includes a first conduit disposed along the second side in communication with the first opening; the second pipeline with first pipeline parallel arrangement, the one end of second pipeline through heat dissipation tooth passageway with first pipeline intercommunication, the other end of second pipeline with third cooling channel intercommunication.

In one embodiment, the second cooling channel includes:

a third pipe disposed along a third side, the third side being opposite the first side, the third pipe being in communication with the third opening; a fourth conduit disposed along a fourth side, the fourth side opposite the second side, the fourth conduit in communication with the third conduit; and the fifth pipeline is parallel to the fourth pipeline, one end of the fifth pipeline is communicated with the fourth pipeline through a heat dissipation tooth channel, and the other end of the fifth pipeline is communicated with the third cooling channel.

In an embodiment, a fourth cooling channel and a plurality of fifth cooling channels are disposed in the cooling module, the fourth cooling channel is disposed along a third side surface opposite to the first side surface, the plurality of fifth cooling channels are vertically communicated with the fourth cooling channel, and the plurality of fifth cooling channels are parallel to each other.

In one embodiment, a laser chip; the laser chip comprises a first heat sink and a second heat sink, wherein the first heat sink and the second heat sink are respectively arranged on two sides of the laser chip.

In an embodiment, the first heat sink and the second heat sink are diamond heat sinks.

In an embodiment, a laser anode and a laser cathode are disposed on a third side surface of the water cooling module.

In one embodiment, the heat conducting sheet is a single crystal silicon carbide material.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a multi-channel laser according to an embodiment of the present application;

FIG. 2 is a partially enlarged view of a multi-channel laser according to an embodiment of the present application;

FIG. 3 is a schematic view of a cooling circuit of a multi-channel laser according to an embodiment of the present application;

FIG. 4 is a schematic cooling circuit of a multi-channel laser according to another embodiment of the present application.

Reference numerals:

10-multichannel laser, 100-cooling module, 101-first cooling channel, 1011-first pipe, 1012-second pipe, 102-second cooling channel, 1021-third pipe, 1022-fourth pipe, 1023-fifth pipe, 103-third cooling channel, 104-fourth cooling channel, 105-fifth cooling channel, 106-first opening, 107-second opening, 108-third opening, 109-cooling tooth channel, 1091-first cooling tooth channel, 1092-second cooling tooth channel, 110-first side, 111-second side, 112-third side, 113-fourth side, 114-fourth opening, 115-fifth opening, 200-heat conducting sheet, 300-laser module, 310-laser unit, 311-laser chip, 312-first heat sink, 313-second heat sink, 400-laser anode, 500-laser cathode.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of the present application, the terms "first," "second," and the like are used for distinguishing between descriptions and do not denote an order of magnitude, nor are they to be construed as indicating or implying relative importance.

In the description of the present application, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are absolutely required to be horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, the terms "upper", "lower", "left", "right", "front", "back", "inner", "outer", and the like refer to orientations or positional relationships that are based on orientations or positional relationships shown in the drawings, or orientations or positional relationships that are conventionally found in the products of the application, and are used for convenience in describing the present application, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present application.

In the description of the present application, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Please refer to fig. 1, which is a schematic structural diagram of a multi-channel laser 10 according to an embodiment of the present application. The multi-channel laser 10 includes a cooling module 100, a heat conducting sheet 200, and a laser module 300, wherein a plurality of cooling circuits are disposed in the cooling module 100, a first side 110 of the cooling module 100 is opposite to a third side 112, and a second side 111 is opposite to a fourth side 113. The heat conducting sheet 200 is disposed on the first side surface 110 of the cooling module 100, and in one embodiment, the heat conducting sheet 200 is a single crystal silicon carbide material. The third side 112 of the cooling module 100 is provided with a laser anode 400 and a laser cathode 500, the laser anode 400 is arranged at one end close to the second side 111, and the laser cathode 500 is arranged at one end close to the fourth side 113. The laser module 300 is disposed on the heat conductive sheet 200.

Fig. 2 is a partially enlarged view of the multi-channel laser 10 according to an embodiment of the present application. The laser module 300 includes at least one laser unit 310, the laser unit 310 including: a laser chip 311, a first heat sink 312, and a second heat sink 313. The first heat sink 312 and the second heat sink 313 are respectively provided on both sides of the laser chip 311, and both the first heat sink 312 and the second heat sink 313 are fixed on the heat conductive sheet 200. The first heat sink 312 and the second heat sink 313 may be made of the same material or different materials, and in an embodiment, the first heat sink 312 and the second heat sink 313 are both diamond heat sinks.

Fig. 3 is a schematic diagram of a cooling circuit of the multi-channel laser 10 according to an embodiment of the present application. A first cooling channel 101, a second cooling channel 102 and a third cooling channel 103 are arranged in the cooling module 100, and the third cooling channel 103 is respectively communicated with the first cooling channel 101 and the second cooling channel 102. The second side 111 of the cooling module 100 is provided with a first opening 106, a second opening 107 and a third opening 108 in sequence, the first opening 106 is communicated with the first cooling channel 101, the third opening 108 is communicated with the second cooling channel 102, and the second opening 107 is communicated with the third cooling channel 103.

A plurality of heat dissipation teeth are further disposed in the cooling module 100, the heat dissipation teeth are uniformly arranged along the first side surface 110, and gaps between the heat dissipation teeth form heat dissipation tooth channels 109. In one embodiment, the heat dissipation tooth channel 109 includes a first heat dissipation tooth channel 1091 and a second heat dissipation tooth channel 1092, the first heat dissipation tooth channel 1091 and the second heat dissipation tooth channel 1092 are not communicated with each other, and the first heat dissipation tooth channel 1091 is communicated with the first cooling channel 101, and the second heat dissipation tooth channel 1092 is communicated with the second cooling channel 102.

The first cooling passage 101 includes: a first conduit 1011 and a second conduit 1012. The first pipe 1011 is disposed along the second side 111, and one end of the first pipe 1011 communicates with the first opening 106 and the other end communicates with the first radiation tooth passage 1091. The second pipe 1012 is arranged in parallel with the first pipe 1011, one end of the second pipe 1012 is communicated with the first pipe 1011 through the first radiation tooth passage 1091, and the other end of the second pipe 1012 is communicated with the third cooling passage 103. The cooling medium flows in from the first opening 106, flows through the first pipe 1011, the first radiating tooth channel 1091, the second pipe 1012 and the third cooling channel 103 in sequence, and flows out from the second opening 107, so that a cooling loop can be formed. In one embodiment, the cooling medium may be in a liquid state or a gaseous state.

The second cooling passage 102 includes a third duct 1021, a fourth duct 1022, and a fifth duct 1023, the third duct 1021 being disposed along the third side 112 and communicating with the third opening 108. A fourth duct 1022 is provided along the fourth side 113, and one end of the fourth duct 1022 communicates with the third duct 1021, and the other end communicates with the second radiation tooth passage 1092. Fifth duct 1023 is arranged in parallel with fourth duct 1022, one end of fifth duct 1023 communicates with fourth duct 1022 through second radiating tooth passage 1092, and the other end of fifth duct 1023 communicates with third cooling passage 103. The cooling medium flows in from the third opening 108, flows through the third pipe 1021, the fourth pipe 1022, the second heat dissipation tooth channel 1092, the fifth pipe 1023, and the third cooling channel 103 in this order, and flows out from the second opening 107, thereby forming a cooling circuit.

Fig. 4 is a schematic cooling circuit diagram of a multi-channel laser 10 according to another embodiment of the present application. The first side 110 of the cooling module 100 is opposite to the third side 112 and the second side 111 is opposite to the fourth side 113. The second side 111 of the cooling module 100 is provided with a fifth opening 115 and a fourth opening 114 in sequence, the fifth opening 115 is arranged at one end close to the first side 110, and the fourth opening 114 is arranged at one end close to the third side 112. A fourth cooling channel 104 and a plurality of fifth cooling channels 105 are arranged in the cooling module 100, the fourth cooling channel 104 is arranged along the third side 112 and is communicated with the fourth opening 114, the plurality of fifth cooling channels 105 are respectively vertically communicated with the fourth cooling channel 104, and the plurality of fifth cooling channels 105 are parallel to each other. The cooling module 100 is provided with a heat dissipation tooth channel 109 formed by a heat dissipation tooth gap, and the fifth cooling channels 105 are respectively vertically communicated with the heat dissipation tooth channel 109. The cooling medium flows into the fourth cooling channels 104 from the fourth openings 114, then is branched to each fifth cooling channel 105, flows in the fifth cooling channels 105 in the direction from the third side surface 112 to the first side surface 110, merges to the heat dissipation tooth channels 109, and finally flows out from the fifth openings 115, and a plurality of cooling circuits can be configured.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A multiple channel laser, comprising:

the cooling module is internally provided with a plurality of cooling loops;

a thermally conductive sheet disposed on a first side of the cooling module;

a laser module disposed on the heat-conducting plate, the laser module including at least one laser unit.

2. The multiple channel laser of claim 1, wherein the cooling module has disposed therein a first cooling channel, a second cooling channel, and a third cooling channel, the third cooling channel being in communication with the first cooling channel and the second cooling channel, respectively.

3. The multiple channel laser as claimed in claim 2, wherein the cooling module has a first opening, a second opening and a third opening disposed on the second side surface thereof, the first opening is in communication with the first cooling channel, the third opening is in communication with the second cooling channel, and the second opening is in communication with the third cooling channel.

4. The multiple channel laser of claim 3 wherein the first cooling channel comprises:

a first conduit disposed along the second side in communication with the first opening;

the second pipeline with first pipeline parallel arrangement, the one end of second pipeline through heat dissipation tooth passageway with first pipeline intercommunication, the other end of second pipeline with third cooling channel intercommunication.

5. The multiple channel laser of claim 3 wherein the second cooling channel comprises:

a third pipe disposed along a third side, the third side being opposite the first side, the third pipe being in communication with the third opening;

a fourth conduit disposed along a fourth side, the fourth side opposite the second side, the fourth conduit in communication with the third conduit;

and the fifth pipeline is parallel to the fourth pipeline, one end of the fifth pipeline is communicated with the fourth pipeline through a heat dissipation tooth channel, and the other end of the fifth pipeline is communicated with the third cooling channel.

6. The multiple channel laser of claim 1 wherein a fourth cooling channel and a plurality of fifth cooling channels are disposed within the cooling module, the fourth cooling channel being disposed along a third side opposite the first side, the plurality of fifth cooling channels being in perpendicular communication with the fourth cooling channel, and the plurality of fifth cooling channels being parallel to each other.

7. The multiple channel laser of claim 1, wherein the laser unit comprises:

a laser chip;

the laser chip comprises a first heat sink and a second heat sink, wherein the first heat sink and the second heat sink are respectively arranged on two sides of the laser chip.

8. The multiple channel laser of claim 7 wherein the first and second heatsinks are diamond heatsinks.

9. The multiple channel laser of claim 1 wherein the third side of the cooling module has a laser anode and a laser cathode disposed thereon.

10. The multiple channel laser of claim 1 wherein the thermally conductive sheet is a single crystal silicon carbide material.