CN214013394U

CN214013394U - Heat dissipation mechanism of laser assembly

Info

Publication number: CN214013394U
Application number: CN202022971982.2U
Authority: CN
Inventors: 李成林
Original assignee: Chongqing Jiawang Metal Co ltd
Current assignee: Chongqing Jiawang Metal Co ltd
Priority date: 2020-12-11
Filing date: 2020-12-11
Publication date: 2021-08-20
Anticipated expiration: 2030-12-11

Abstract

The utility model relates to the technical field of laser heat dissipation, in particular to a heat dissipation mechanism of a laser component, which comprises a lower heat sink, one end of the top of the lower heat sink is connected with a fixed block, two sides of the fixed block are provided with a heat source part, the top of the lower heat sink is connected with an upper heat sink, the bottom of one end of the upper heat sink is connected with a laser chip, the inside of the other end of the upper heat sink is provided with a groove, one side of the upper heat sink is provided with a water gap, the inner wall of the groove is connected with a heat dissipation block, two sides of the heat dissipation block are provided with heat dissipation grooves, the inner wall of the heat dissipation grooves is provided with heat dissipation channels, the top of the heat dissipation block is connected with a connecting strip, the bottom of the heat dissipation block is connected with a water through plate, the upper part of the groove is provided with a guide plate, low cost, long service life and high-efficiency heat dissipation.

Description

Heat dissipation mechanism of laser assembly

Technical Field

The utility model relates to a laser instrument heat dissipation technical field specifically is a heat dissipation mechanism of laser instrument subassembly.

Background

The laser is a device capable of emitting laser, the types of the laser are more and more nowadays, the laser can be divided into a gas laser, a solid laser, a semiconductor laser and a dye laser according to working media, a free electron laser is developed recently, the high-power laser is generally in pulse type output, along with the improvement of the power of an electronic device, the thermal diffusion of a matrix material causes the change of stress, and due to the deposition of heat, the temperature of a chip of the semiconductor laser is increased, the output wavelength is changed, so that the semiconductor laser cannot normally work, and therefore, a heat dissipation mechanism of a laser component is a big problem which cannot be ignored.

However, in the conventional laser component, due to the deposition of heat, the laser component cannot normally work, and the heat dissipation mechanism has high production cost and poor stability, so that the heat dissipation mechanism of the laser component is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat dissipation mechanism of laser instrument subassembly to solve the thermal deposit of above-mentioned laser instrument subassembly, make the laser instrument subassembly normally work, and the manufacturing cost of heat dissipation mechanism is higher, the relatively poor problem of stability.

For realizing the above-mentioned purpose, the utility model discloses a pair of laser subassembly's heat dissipation mechanism, including heat sink down, the one end at heat sink top is connected with the fixed block down, the both sides of fixed block are provided with heat source spare, heat sink's top is connected with down heat sink, the bottom of going up heat sink one end is connected with laser chip, the inside of going up the heat sink other end is provided with the recess, the one side of going up heat sink is provided with the mouth of a river, the inner wall connection of recess has the radiating block, the both sides of radiating block are provided with the radiating groove, the inner wall of radiating groove is provided with heat dissipation channel, the top of radiating block is connected with the connecting strip, the bottom of radiating block is connected with the water service plate, the internal connection of water service plate has the limbers, the top of recess is provided with the guide plate.

One end of the top of the lower heat sink is fixedly connected with the fixing block, the lower heat sink is rectangular, and two sides of the fixing block are welded with the heat source component.

The top of the lower heat sink is detachably connected with the upper heat sink, the bottom of one end of the upper heat sink is connected with the laser chip card, and an accommodating groove is formed in the inner portion of the upper heat sink, located at the bottom of the groove.

The inner part of the other end of the upper heat sink is fixedly connected with the groove, one side of the upper heat sink is movably connected with the water port, and the water port is divided into an inlet and an outlet.

The inner wall of the groove is connected with the radiating block in a clamped mode, the size of the radiating block is matched with that of the groove, and two sides of the radiating block are fixedly connected with the radiating groove.

The inner wall and the heat dissipation channel joint of radiating groove, the top and the connecting strip welding of radiating block, the quantity of connecting strip is a plurality of groups, the bottom and the logical water board welding of radiating block.

The water guide plate is characterized in that the inside of the water guide plate is connected with the water through holes in an inserting mode, the number of the water through holes is a plurality of groups, the water through holes are rectangular in shape, the upper portion of the groove is connected with the guide plate in a clamping mode, and a guide groove is formed in the lower surface of the guide plate.

Compared with the prior art, the beneficial effects of the utility model are that:

through increasing the combined action that sets up radiating block and guide plate structure, cooperate with the limbers of the connecting strip at radiating block top and bottom, and a plurality of heat dissipation channel and a plurality of parallelly connected radiating groove that set up through both sides dispel the heat jointly, the heat dissipation area of contact of refrigerant liquid with the radiating block has been increased, and form torrent swirl between heat dissipation channel and radiating groove, the heat-sinking capability of radiating block has been strengthened greatly, make the heat dissipation mechanism processing degree of difficulty little, and is with low costs, and life is high and can high-efficiently dispel the heat.

Drawings

Fig. 1 is an external structural view of a heat dissipation mechanism of a laser module according to the present invention;

fig. 2 is a view showing a heat sink on a heat dissipation mechanism of a laser module according to the present invention;

fig. 3 is a schematic structural view of a heat dissipation block of a heat dissipation mechanism of a laser module according to the present invention;

fig. 4 is a schematic bottom structure view of a heat dissipation block of a heat dissipation mechanism of a laser module according to the present invention;

fig. 5 is a schematic structural view of a heat sink of a heat dissipation mechanism of a laser module according to the present invention.

In the figure: 1. a lower heat sink; 2. a fixed block; 3. a heat source element; 4. an upper heat sink; 5. a laser chip; 6. a groove; 7. a water gap; 8. a heat dissipating block; 9. a heat sink; 10. a heat dissipation channel; 11. a connecting strip; 12. a water passing plate; 13. a water through hole; 14. a baffle.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-5, the utility model provides a heat dissipation mechanism of laser instrument subassembly, including heat sink 1 down, the one end at heat sink 1 top is connected with fixed block 2 down, the both sides of fixed block 2 are provided with heat source 3, the top of heat sink 1 is connected with heat sink 4 down, the bottom of going up heat sink 4 one end is connected with laser chip 5, the inside of going up the heat sink 4 other end is provided with recess 6, one side of going up heat sink 4 is provided with mouth of a river 7, the inner wall connection of recess 6 has radiating block 8, the both sides of radiating block 8 are provided with radiating groove 9, the inner wall of radiating groove 9 is provided with heat dissipation channel 10, the top of radiating block 8 is connected with connecting strip 11, the bottom of radiating block 8 is connected with water service plate 12, the internal connection of water service plate 12 has limbers 13, the top of recess 6 is provided with guide plate 14.

In the embodiment, by adding the combined action of the structures of the radiating block 8 and the guide plate 14 and matching the connecting strip 11 at the top of the radiating block 8 with the water through hole 13 at the bottom, the radiating mechanism has the advantages of small processing difficulty, low cost, long service life and high-efficiency heat radiation.

Furthermore, one end of the top of the lower heat sink 1 is fixedly connected with the fixing block 2, the lower heat sink 1 is rectangular, and two sides of the fixing block 2 are welded with the heat source part 3.

In the present embodiment, the heat source member 3 can be fixed by the fixing block 2, so that the heat dissipation capability of the light spot on the laser chip 5 is relatively uniform, and the junction temperature of each light emitting point is uniform.

Further, the top of lower heat sink 1 and last heat sink 4 can be dismantled and be connected, go up the bottom and the 5 joints of laser chip of 4 one ends of heat sink, the inside bottom that is located recess 6 of going up heat sink 4 is provided with the holding tank.

In the embodiment, the heat dissipation block 8 can conduct and refrigerate by the material to dissipate heat by the capacity of the accommodating groove in the upper heat sink 4, so that the problem of limited heat dissipation capacity is solved.

Furthermore, the inside of the other end of the upper heat sink 4 is fixedly connected with the groove 6, one side of the upper heat sink 4 is movably connected with the water gap 7, and the water gap 7 is divided into an inlet and an outlet.

In the embodiment, the water inlet and the water outlet are formed by dispersing the water gap 7, so that the water flow direction is not single, and the problems of low heat transfer coefficient, heat accumulation in the water flow direction and uneven heat dissipation are solved.

Further, the inner wall of the groove 6 is connected with the radiating block 8 in a clamping mode, the size of the radiating block 8 is matched with that of the groove 6, and two sides of the radiating block 8 are fixedly connected with the radiating groove 9.

In the embodiment, the processing difficulty of the laser is reduced by increasing the heat dissipation block 8 in the upper heat sink 4, the manufacturing cost is low, and the service life of the laser is prolonged.

Furthermore, the inner wall of the radiating groove 9 is clamped with the radiating channel 10, the top of the radiating block 8 is welded with the connecting strips 11, the connecting strips 11 are in a plurality of groups, and the bottom of the radiating block 8 is welded with the water passing plate 12.

In the embodiment, heat is radiated jointly through the plurality of heat radiating channels 10 and the plurality of heat radiating grooves 9 connected in parallel, so that the heat radiating contact area of the refrigerant liquid and the heat radiating block 8 is increased, turbulent vortex is formed between the heat radiating channels 10 and the heat radiating grooves 9, and the heat radiating capacity of the heat radiating block 8 is greatly enhanced.

Furthermore, the inside of the water passing plate 12 is inserted into the water passing holes 13, the number of the water passing holes 13 is a plurality of groups, the water passing holes 13 are rectangular, the upper part of the groove 6 is clamped with the guide plate 14, and the lower surface of the guide plate 14 is provided with a guide groove.

In this embodiment, the water passage plate 12 is connected to the back surface of the heat dissipation block 8, and has a plurality of water passages 13 for blocking the blocking portion existing in the heat dissipation channel 10, wherein the guide plate 14 conducts the heat of the laser chip 5, and the heat dissipation and cooling operation of the laser chip 5 is completed by the heat dissipation block 8 and the internal structure.

Working principle and implementation flow: this kind of heat dissipation mechanism of laser instrument subassembly is at the during operation, at first can pour the coolant liquid into the holding tank in last heat sink 4 from recess 6, block the inner wall at recess 6 with radiating block 8 tight card, then with guide plate 14 joint in recess 6's top, at this moment the coolant liquid flows in a plurality of radiating passage 10 along the predetermined direction through mouth of a river 7's import, through radiating block 8's heat dissipation and guide plate 14's water conservancy diversion, the heat is along with coolant liquid along mouth of a river 7 along export discharge, wherein guide plate 14 is conducting laser chip 5's heat, accomplish laser chip 5's heat dissipation cooling work through radiating block 8 and inside structure.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A heat dissipation mechanism of a laser assembly comprises a lower heat sink (1), and is characterized in that: one end of the top of the lower heat sink (1) is connected with a fixed block (2), heat source parts (3) are arranged on two sides of the fixed block (2), the top of the lower heat sink (1) is connected with an upper heat sink (4), the bottom of one end of the upper heat sink (4) is connected with a laser chip (5), a groove (6) is formed in the other end of the upper heat sink (4), a water gap (7) is formed in one side of the upper heat sink (4), a heat dissipation block (8) is connected to the inner wall of the groove (6), heat dissipation grooves (9) are formed in two sides of the heat dissipation block (8), heat dissipation channels (10) are formed in the inner wall of each heat dissipation groove (9), a connecting strip (11) is connected to the top of each heat dissipation block (8), a water passing plate (12) is connected to the bottom of each heat dissipation block (8), and a water passing hole (13) is connected to the inside of the water passing plate (12), a guide plate (14) is arranged above the groove (6).

2. The heat dissipation mechanism of a laser assembly of claim 1, wherein: one end of the top of the lower heat sink (1) is fixedly connected with the fixing block (2), the lower heat sink (1) is rectangular, and two sides of the fixing block (2) are welded with the heat source part (3).

3. The heat dissipation mechanism of a laser assembly of claim 1, wherein: the top of lower heat sink (1) can be dismantled with last heat sink (4) and be connected, go up the bottom and the laser chip (5) joint of heat sink (4) one end, the bottom that the inside that goes up heat sink (4) is located recess (6) is provided with the holding tank.

4. The heat dissipation mechanism of a laser assembly of claim 1, wherein: go up the inside and recess (6) fixed connection of heat sink (4) other end, go up one side and mouth of a river (7) swing joint of heat sink (4), mouth of a river (7) divide into import and export.

5. The heat dissipation mechanism of a laser assembly of claim 1, wherein: the inner wall of recess (6) and radiating block (8) joint, the size of radiating block (8) agrees with mutually with the size of recess (6), the both sides and radiating groove (9) fixed connection of radiating block (8).

6. The heat dissipation mechanism of a laser assembly of claim 1, wherein: the inner wall and heat dissipation channel (10) joint of radiating groove (9), the top and the connecting strip (11) welding of radiating block (8), the quantity of connecting strip (11) is a plurality of groups, the bottom and the logical water board (12) welding of radiating block (8).

7. The heat dissipation mechanism of a laser assembly of claim 1, wherein: the inside and the limbers (13) of limbers (12) are pegged graft, the quantity of limbers (13) is a plurality of groups and the shape is the rectangle, the top and guide plate (14) the joint of recess (6), the lower surface of guide plate (14) is provided with the guiding gutter.