CN212205228U - Refrigerating device and refrigeration equipment - Google Patents
Refrigerating device and refrigeration equipment Download PDFInfo
- Publication number
- CN212205228U CN212205228U CN202020873353.3U CN202020873353U CN212205228U CN 212205228 U CN212205228 U CN 212205228U CN 202020873353 U CN202020873353 U CN 202020873353U CN 212205228 U CN212205228 U CN 212205228U
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- Prior art keywords
- cold
- plate
- semiconductor refrigeration
- air supply
- guide plate
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 80
- 239000004065 semiconductor Substances 0.000 claims abstract description 53
- 238000007710 freezing Methods 0.000 claims abstract description 21
- 230000008014 freezing Effects 0.000 claims abstract description 20
- 238000009413 insulation Methods 0.000 claims description 22
- 239000003507 refrigerant Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 26
- 238000010622 cold drawing Methods 0.000 description 23
- 230000000694 effects Effects 0.000 description 10
- 238000001816 cooling Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011232 storage material Substances 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a refrigerating plant and refrigeration plant, wherein, refrigerating plant includes: the semiconductor refrigeration device comprises a storage structure and a semiconductor refrigeration module, wherein a cavity is formed in the storage structure, the storage structure comprises a bottom plate and a first cold guide plate arranged on the bottom plate, an opening is formed in the bottom plate, and the first cold guide plate covers the opening; the cold end of the semiconductor refrigeration module is in contact with one surface of the first cold guide plate, which is away from the cavity. The utility model discloses a refrigerating plant can make the storage eat material quick freezing.
Description
Technical Field
The utility model relates to a refrigeration technology field especially relates to a refrigerating plant and refrigeration plant.
Background
Along with the improvement of people's living standard, people often purchase during a large amount of edible material places refrigeration plant to take out edible material according to the demand, because the refrigeration requirement of various edible materials differs, people are also higher and higher to these edible material refrigeration effects moreover, though present refrigeration plant has walk-in, freezer and temperature-variable chamber, nevertheless, to the edible material that needs quick freezing, not yet be provided with quick freezing region.
In view of the above-mentioned drawbacks, it is necessary to provide a new refrigerating apparatus and a refrigerating device.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a refrigerating plant and refrigeration plant, the problem that the material can not be frozen fast is eaten in the freezer storage that aims at solving current refrigeration plant.
In order to achieve the above object, the present invention provides a refrigerating apparatus comprising: the semiconductor refrigeration device comprises a storage structure and a semiconductor refrigeration module, wherein a cavity is formed in the storage structure, the storage structure comprises a bottom plate and a first cold guide plate arranged on the bottom plate, an opening is formed in the bottom plate, and the first cold guide plate covers the opening; the cold end of the semiconductor refrigeration module is in contact with one surface, away from the cavity, of the first cold guide plate.
Preferably, the refrigerating device further comprises an air supply structure connected with the storage structure, the air supply structure is provided with an air supply duct, the air supply duct comprises a first end and a second end, the first end is used for being communicated with an air supply outlet of the refrigerating duct, and the second end is used for transferring the refrigerant to the hot end of the semiconductor refrigerating module.
Preferably, the freezing device further comprises a wind shielding structure connected with the second end, and the wind shielding structure is connected with one side, away from the cavity, of the bottom plate.
Preferably, the wind shielding structure is formed with an air return opening, and the air return opening is located on one side of the wind shielding structure far away from the second end.
Preferably, the refrigeration device further comprises a radiator connected with the hot end of the semiconductor refrigeration module.
Preferably, the refrigerating device further comprises a first heat insulation plate, the first heat insulation plate is arranged on one side, away from the cavity, of the first cold guide plate, and the first heat insulation plate circumferentially surrounds the semiconductor refrigeration module.
Preferably, the refrigerating device further comprises a second heat insulation plate arranged on one side of the bottom plate, which is far away from the cavity.
Preferably, the storage structure further includes a second cold guide plate disposed at the bottom of the cavity and contacting the first cold guide plate.
Preferably, the bottom plate is positioned in the edge of the opening and is recessed inwards to form a clamping groove, and the periphery of the first cold conduction plate is clamped in the clamping groove.
Preferably, a refrigeration apparatus comprises a freezing device as described above.
The utility model provides an among the technical scheme, refrigerating plant's storage structure includes the bottom plate and is fixed in the first cold drawing of leading of bottom plate, first cold drawing covers the opening part at the bottom plate, and, first cold drawing covers the part of opening part and exposes in the appearance intracavity of storage structure, thereby can with put into the storage that holds the intracavity and eat the material contact, one side through leading the cold drawing at first chamber of keeping away from holding the chamber sets up semiconductor refrigeration module, semiconductor refrigeration module's cold junction and first cold drawing contact, make first cold drawing transmit the temperature of cold junction to holding the intracavity, can so hold the storage of intracavity and eat the material quick freezing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a storage structure and a semiconductor refrigeration module according to an embodiment of the present invention;
FIG. 2 is a schematic view of the cross-sectional structure A-A of FIG. 1;
FIG. 3 is an enlarged view of FIG. 2 at B;
fig. 4 is a schematic structural view of a refrigerating apparatus according to an embodiment of the present invention;
fig. 5 is an exploded schematic view of a refrigeration apparatus according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1 | |
31 | |
| 11 | Containing |
311 | |
| 12 | |
312 | |
| 121 | Opening of the |
4 | |
| 122 | |
41 | |
| 13 | First cold guide plate | 5 | |
| 14 | Second cold guide plate | 6 | First |
| 2 | Semiconductor refrigeration module | 7 | Second |
| 3 | Air supply structure |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
The utility model provides a refrigerating plant and refrigeration plant aim at solving current refrigeration plant's freezer storage and eat the problem that the material can not quick freezing.
Referring to fig. 1 and 2, the freezing device includes: the semiconductor refrigeration system comprises a storage structure 1 and a semiconductor refrigeration module 2, wherein a cavity 11 is formed in the storage structure 1, the storage structure 1 comprises a bottom plate 12 and a first cold conduction plate 13 arranged on the bottom plate 12, an opening 121 is formed in the bottom plate 12, and the opening 121 is covered by the first cold conduction plate 13; the cold end of the semiconductor refrigeration module 2 is in contact with the surface of the first cold conducting plate 13 departing from the cavity 11.
The utility model discloses a refrigerating plant's storage structure 1 includes bottom plate 12 and the first cold drawing 13 of leading that is fixed in bottom plate 12, first cold drawing 13 of leading covers opening 121 department at bottom plate 12, and, first cold drawing 13 of leading covers the part in opening 121 department and exposes in storage structure 1's appearance chamber 11, thereby can with put into the storage that holds the intracavity 11 and eat material direct contact, one side through leading cold drawing 13 to deviate from holding the intracavity 11 at first sets up semiconductor refrigeration module 2, semiconductor refrigeration module 2's cold junction and first cold drawing 13 contact of leading, make first cold drawing 13 transmit the temperature of cold junction and hold the intracavity 11, can be so that the storage that holds the intracavity 11 eats the material quick freezing. The refrigerating device of the utility model can be arranged in a refrigerator freezing chamber, the storage structure 1 can be a drawer, the bottom of the drawer is provided with a bottom plate 12 with an opening 121, a first cold guide plate 13 covers the opening 121 and is exposed out of the containing chamber 11 of the drawer, a semiconductor refrigeration module 2 is arranged at one side of the first cold guide plate 13, which is far away from the containing chamber 11, the cold end of the semiconductor refrigeration module 2 is contacted with the first cold guide plate 13, the storage food material put into the drawer is directly contacted with the first cold guide plate 13, the fresh-keeping effect is better, the first cold guide plate 13 transmits the temperature of the cold end to the storage food material, thereby the storage food material is rapidly frozen, the storage structure 1 can also be in a shelf form, the bottom of the shelf is provided with the bottom plate 12 with the opening 121, similarly, the first cold guide plate 13 and the semiconductor refrigeration module 2 are sequentially arranged, so that the storage, first cold drawing 13 of leading transmits the cold junction temperature for the storage to eat the material quick freezing for the storage, fresh-keeping effect is better. The first cold conducting plate 13 may be a metal plate with large thermal conductivity, such as an aluminum plate or a copper plate; the number of the semiconductor refrigeration modules 2 can be one or more, the semiconductor refrigeration modules 2 are thermoelectric refrigeration sheets and are composed of a plurality of pairs of thermopiles, and the thermoelectric refrigeration module has the advantages of no sliding part and application in occasions with limited space, high reliability requirement and no refrigerant pollution. By utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that the aim of refrigeration can be fulfilled, the semiconductor refrigeration module 2 can be overlapped in two stages or multiple stages, and the cold energy of the cold end of the semiconductor refrigeration module 2 is utilized for dissipating heat of the hot end of the overlapped semiconductor refrigeration module 2, so that the lower temperature of the cold end and the first cold conducting plate 13 is realized; in addition, when the user does not select the quick-freezing mode, the storage structure can be normally used as a storage container, energy is saved, consumption is reduced, and the practicability of the refrigerating device is greatly improved.
The hot end of the semiconductor refrigeration module 2 is used for being arranged corresponding to the air supply outlet of the cold air duct, the air supply outlet of the cold air duct is arranged at a position corresponding to the hot end of the semiconductor refrigeration module 2, and when the semiconductor refrigeration module 2 is used for refrigerating, the refrigerant in the cold air duct is blown to the hot end of the semiconductor refrigeration module 2 from the air supply outlet, so that the temperature of the hot end of the semiconductor refrigeration module 2 is reduced, and the refrigeration effect of the semiconductor refrigeration module 2 is better.
Further, as shown in fig. 4 and fig. 5, as an embodiment, the refrigeration apparatus further includes an air supply structure 3 connected to the storage structure 1, the air supply structure 3 forms an air supply duct 31, the air supply duct 31 includes a first end 311 and a second end 312, the first end 311 is used for communicating with an air supply outlet of the refrigeration duct, and the second end 312 is used for delivering the refrigerant to the hot end of the semiconductor refrigeration module 2. In order to improve the refrigeration effect, periphery at storage structure 1 sets up air supply structure 3, air supply structure 3 forms air supply duct 31, air supply duct 31's first end 311 is used for the supply-air outlet intercommunication with freezing wind channel, second end 312 is used for the hot junction transmission refrigerant for semiconductor refrigeration module 2, make semiconductor refrigeration module 2's hot junction by the cooling, semiconductor refrigeration module 2 obtains better refrigeration effect, and improved the heat exchange efficiency of storage edible material and first cold conduction board 13, make the cooling speed of storage edible material faster, and, in an embodiment, air supply structure 3 designs into an organic whole, the manufacturability is good and sealed effectual, the wind channel resistance is little. In addition, in the refrigerating device arranged in the refrigerating chamber of the refrigerator, the air supply structure 3 can avoid the temperature influence on other chambers below the storage structure 1.
Further, the freezing device further comprises a wind shielding structure 4 connected to the second end 312, and the wind shielding structure 4 is connected to a side of the bottom plate 12 facing away from the cavity 11. The wind shielding structure 4 is connected to the second end 312 of the air supply duct 31, and is connected to one side of the bottom plate 12 away from the cavity 11, and the refrigerant coming out from the second end 312 is blocked between the wind shielding structure 4 and the bottom plate 12, so that the refrigerant can dissipate heat at the hot end of the semiconductor refrigeration module 2, and the refrigerant after heat dissipation cannot blow outside from the wind shielding structure 4.
In addition, as shown in fig. 4 and fig. 5, in an embodiment, the wind shielding structure 4 is formed with a return air opening 41, and the return air opening 41 is located on a side of the wind shielding structure 4 away from the second end 312. The wind shielding structure 4 is provided with an air return opening 41 at a side far away from the second end 312, and the refrigerant passing through the hot end is transmitted out from the air return opening 41 to a preset position, where the preset position can be a chamber where an evaporator of the refrigerator is located, so that the chamber around the storage structure 1 can be ensured not to be affected by the hot end.
Wherein, the refrigerating device also comprises a radiator 5 connected with the hot end of the semiconductor refrigerating module 2. The heat radiator 5 is in direct contact with the hot end of the semiconductor refrigeration module 2, in an embodiment, a fin is disposed on a side of the heat radiator 5 away from the hot end to increase a heat exchange area, so as to achieve a heat dissipation effect of the hot end of the semiconductor, and it should be noted that, in order to improve the heat exchange efficiency, the heat radiator 5 may be designed as a heat pipe structure. In addition, in an embodiment, the air blowing structure 3 is used for dissipating heat of the heat sink 5, so that the heat dissipation efficiency of the heat sink 5 is higher, and the cooling effect of the semiconductor cooling module 2 is better.
Further, in order to realize multiple functions, the refrigerating device further comprises a first heat insulation plate 6, the first heat insulation plate 6 is arranged on one side, away from the accommodating cavity 11, of the first cold conducting plate 13, and the first heat insulation plate 6 circumferentially surrounds the semiconductor refrigeration module 2. The first heat insulation plate 6 is arranged on one side, deviating from the accommodating cavity 11, of the first cold conduction plate 13, so that one side, deviating from the accommodating cavity 11, of the first cold conduction plate 13 is isolated from the outside and insulated, the first heat insulation plate 6 can be one or more, selection is made according to actual conditions, the first heat insulation plate 6 circumferentially surrounds the semiconductor refrigeration module 2, the cold end and the hot end of the semiconductor refrigeration module 2 are isolated from each other, refrigeration efficiency is improved, and the first heat insulation plate 6 can be heat insulation sponge and heat insulation cloth.
In addition, in the above embodiment, the freezing apparatus further includes a second heat insulation plate 7 disposed on a side of the bottom plate 12 facing away from the cavity 11. The second heat insulation board 7 is arranged on one side of the bottom board 12 departing from the cavity 11, so that the bottom board 12 is insulated and insulated from the outside, wherein the first heat insulation board 6 can be heat insulation sponge and heat insulation cloth.
In one embodiment, the storage structure 1 further includes a second cold conducting plate 14, and the second cold conducting plate 14 is disposed at the bottom of the cavity 11 and is in contact with the first cold conducting plate 13. The cold drawing 14 is led to the second is located and is held chamber 11 bottom, the cold drawing 14 direct contact is led with the second to the storage of holding intracavity 11 material, the second is led cold drawing 14 to deviate from one side and the first cold drawing 13 direct contact of leading of eating the material of storage, the second is led cold drawing 14 and is received the first temperature of leading cold drawing 13 transmission, and eat the material for the storage with the temperature transfer, because the area that the cold drawing 14 was led to the second is bigger than the first cold drawing 13 of leading, the second leads cold drawing 14 makes the temperature in holding chamber 11 more even, thereby can make the storage eat material multi-angle refrigeration, freezing speed is faster, the refrigeration effect is better, and, the second is led cold drawing 14 and can be followed and easily take out and wash in. In addition, in order to make the freezing faster and the effect better, the periphery of the second cold guiding plate 14 is bent and extended towards one side far away from the first cold guiding plate 13 to form an accommodating space, the storage food material is put into the accommodating space, and a cover plate can be arranged above the accommodating space, so that the storage food material in the accommodating space is isolated from the outside.
Further, as shown in fig. 3, the bottom plate 12 is recessed into the edge of the opening 121 to form a slot 122, and the periphery of the first cold conduction plate 13 is inserted into the slot 122. The periphery of the first cold conduction plate 13 is clamped into the clamping groove 122, so that no gap exists between the periphery of the first cold conduction plate 13 and the opening 121, liquid in the food storage material above the first cold conduction plate 13 is prevented from flowing to the semiconductor refrigeration module 2 below the first cold conduction plate 13, and the semiconductor refrigeration module 2 is protected from being damaged.
In addition, a refrigeration device comprises the refrigeration device. The refrigeration equipment has all the advantages of the refrigeration device described above, and the description is omitted here.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (11)
1. A freezer apparatus, comprising:
the storage structure comprises a bottom plate and a first cold guide plate arranged on the bottom plate, wherein an opening is formed in the bottom plate, and the first cold guide plate covers the opening;
and the cold end of the semiconductor refrigeration module is in contact with one surface of the first cold guide plate, which is away from the accommodating cavity.
2. The refrigeration device according to claim 1, wherein the hot end of the semiconductor refrigeration module is arranged corresponding to the air supply outlet of the cold air duct.
3. The freezing apparatus according to claim 1, further comprising an air supply structure connected to the storage structure, wherein the air supply structure forms an air supply duct, the air supply duct includes a first end and a second end, the first end is used for communicating with an air supply outlet of the freezing duct, and the second end is used for delivering the refrigerant to the hot end of the semiconductor refrigeration module.
4. A freezer unit as claimed in claim 3, further comprising a wind-blocking structure connected to the second end, the wind-blocking structure being connected to a side of the base plate facing away from the cavity.
5. A freezer unit as claimed in claim 4, wherein the air baffle means is formed with an air return opening at a side of the air baffle means remote from the second end.
6. The freezer of claim 1, further comprising a heat sink connected to the hot side of the semiconductor refrigeration module.
7. The freezing apparatus as claimed in any one of claims 1 to 6, further comprising a first heat insulation plate disposed on a side of the first cold guide plate facing away from the cavity, the first heat insulation plate circumferentially surrounding the semiconductor refrigeration module.
8. A cold appliance according to claim 7, wherein the cold appliance further comprises a second heat insulating panel provided on a side of the base panel facing away from the cavity.
9. A freezer apparatus as claimed in any one of claims 1 to 6, wherein the storage structure further comprises a second cold guide plate disposed at the base of the cavity and in contact with the first cold guide plate.
10. A freezer unit as claimed in any one of claims 1 to 6, wherein the base plate is recessed within the edge of the opening to form a pocket into which the periphery of the first cold conducting plate is snapped.
11. Refrigeration appliance, characterized in that it comprises a freezing device according to any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020873353.3U CN212205228U (en) | 2020-05-21 | 2020-05-21 | Refrigerating device and refrigeration equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020873353.3U CN212205228U (en) | 2020-05-21 | 2020-05-21 | Refrigerating device and refrigeration equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212205228U true CN212205228U (en) | 2020-12-22 |
Family
ID=73815916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020873353.3U Expired - Fee Related CN212205228U (en) | 2020-05-21 | 2020-05-21 | Refrigerating device and refrigeration equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212205228U (en) |
-
2020
- 2020-05-21 CN CN202020873353.3U patent/CN212205228U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201222 |
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| CF01 | Termination of patent right due to non-payment of annual fee |