CN214307677U - Semiconductor heat exchanger and refrigeration equipment - Google Patents
Semiconductor heat exchanger and refrigeration equipment Download PDFInfo
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- CN214307677U CN214307677U CN202120391937.1U CN202120391937U CN214307677U CN 214307677 U CN214307677 U CN 214307677U CN 202120391937 U CN202120391937 U CN 202120391937U CN 214307677 U CN214307677 U CN 214307677U
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 49
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Abstract
The utility model discloses a semiconductor heat exchanger and refrigeration plant, wherein, this semiconductor heat exchanger includes hot junction heat transfer portion, cold junction heat transfer portion and semiconductor refrigeration piece, cold junction heat transfer portion is equipped with scattered cold liquid way, cold junction entry and cold junction export, the cold junction entry with the one end intercommunication of scattered cold liquid way, the cold junction export with the other end intercommunication of scattered cold liquid way, the semiconductor refrigeration piece is located hot junction heat transfer portion with between the cold junction heat transfer portion. The utility model discloses technical scheme can promote semiconductor heat exchanger's heat exchange efficiency.
Description
Technical Field
The utility model relates to a refrigeration technology field, in particular to semiconductor heat exchanger and refrigeration plant.
Background
The semiconductor refrigeration system generally comprises a cold-end heat exchange part, a hot-end heat exchange part and a semiconductor chip clamped between the cold-end heat exchange part and the hot-end heat exchange part, but the conventional semiconductor refrigeration system is generally low in heat exchange efficiency, so that the refrigeration capacity is small and the refrigeration effect is poor.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims at providing a semiconductor heat exchanger aims at promoting heat exchange efficiency.
In order to achieve the above object, the utility model provides a semiconductor heat exchanger, include:
a hot end heat exchanging portion;
the cold end heat exchange part is provided with a cold dispersion liquid channel, a cold end inlet and a cold end outlet, the cold end inlet is communicated with one end of the cold dispersion liquid channel, and the cold end outlet is communicated with the other end of the cold dispersion liquid channel; and
and the semiconductor refrigerating piece is arranged between the hot end heat exchanging part and the cold end heat exchanging part.
Optionally, cold junction heat transfer portion is including loosing cold main part and cold cover plate looses, it is equipped with cold junction runner groove to loose cold main part, the one end of cold junction runner groove with cold junction entry intercommunication, the other end with cold junction export intercommunication, it closes to loose cold cover plate the cold junction runner groove, in order to form it says to loose cold liquid.
So can make the simple structure of cold apron that looses, be convenient for production and processing is favorable to reduction in production cost.
Optionally, the hot end heat exchanging part is provided with a heat dissipating liquid channel, a hot end inlet and a hot end outlet, the hot end inlet is communicated with one end of the heat dissipating liquid channel, and the hot end outlet is communicated with the other end of the heat dissipating liquid channel; or,
the hot end heat exchange part comprises a heat dissipation base body and a plurality of heat dissipation fins, the heat dissipation fins are arranged on one side, away from the semiconductor refrigeration sheet, of the heat dissipation base body, and the heat dissipation fins are sequentially distributed on the heat dissipation base body at intervals.
When the hot end heat exchange part is provided with the heat dissipation liquid channel, more heat is taken away by the heat exchange liquid flowing through the heat dissipation liquid channel, and the heat exchange efficiency of the semiconductor heat exchanger can be improved. When hot junction heat transfer portion includes heat dissipation base member and a plurality of radiating fin, also can realize better heat dissipation, the structure is comparatively simple moreover, and spare part quantity is less, the assembly of being convenient for.
Optionally, the cold end inlet is disposed at one end of the cold end heat exchange portion, and the hot end inlet is disposed at one end of the hot end heat exchange portion away from the cold end inlet.
So can avoid cold junction entry and hot junction entry to interfere when the assembly, can be convenient for semiconductor heat exchanger's assembly.
Optionally, the semiconductor heat exchanger includes at least two hot end heat exchanging portions, the cold end heat exchanging portion is disposed between the two opposite hot end heat exchanging portions, and the semiconductor cooling fin is disposed between each hot end heat exchanging portion and the cold end heat exchanging portion.
The number of the hot-end heat exchanging parts and the number of the semiconductor refrigerating pieces are increased, so that the refrigerating capacity of the semiconductor heat exchanger can be increased. Meanwhile, the structure of storing cold in the middle is favorable for heat preservation of the cold-end heat exchange part, and two opposite sides of the cold-end heat exchange part are respectively provided with a hot-end heat exchange part, so that heat dissipation of the hot-end heat exchange part is facilitated.
Optionally, the semiconductor heat exchanger further includes two fixing members and a locking member connecting the two fixing members, one of the fixing members is disposed on one side of the hot end heat exchanging portion away from the cold end heat exchanging portion, and the other fixing member is disposed on one side of the other hot end heat exchanging portion away from the cold end heat exchanging portion.
So set up the mounting in addition and fix hot junction heat transfer portion and cold junction heat transfer portion, can simplify the structure of hot junction heat transfer portion and cold junction heat transfer portion.
Optionally, each of the fixing members is provided with an installation portion on two opposite sides of the hot end heat exchange portion in the width direction, the installation portion extends out towards the side direction of the hot end heat exchange portion, the installation portion is provided with at least two installation holes distributed at intervals along the length direction of the hot end heat exchange portion, and the locking member penetrates through the installation holes in the two fixing members, which correspond to one another, so as to lock the two fixing members.
So set up for the structure of mounting and retaining member is all comparatively simple, and when the installation department was equipped with two at least mounting holes along hot junction heat transfer portion length direction interval distribution, can set up two at least retaining members in hot junction heat transfer portion length direction in other words and fix, can guarantee to fix firmly, and can also rationally set up the interval between two adjacent mounting holes, guarantee that two mountings are even to the fixed of hot junction heat transfer portion and cold junction heat transfer portion.
Optionally, two opposite sides of the hot end heat exchanging portion are respectively provided with a connecting portion, the connecting portions are arranged in a protruding manner towards the lateral direction of the cold end heat exchanger, and the connecting portions of the two hot end heat exchanging portions are connected in a one-to-one correspondence manner.
So be equivalent to through two hot junction heat transfer portions with cold junction heat transfer portion clamp well to realize the fixed of cold junction heat transfer portion, reduced the connection structure on the cold junction heat transfer portion, make the simple structure of cold junction heat transfer portion, can also reduce the heat exchange that takes place through connection structure between cold junction heat transfer portion and the hot junction heat transfer portion.
Optionally, the hot end heat exchanging portion is provided with a positioning boss, and the semiconductor refrigeration piece is arranged on the positioning boss.
Therefore, the semiconductor refrigerating sheet can be conveniently installed and positioned.
Optionally, the semiconductor heat exchanger further comprises a heat insulation piece, the heat insulation piece is arranged between the hot end heat exchange portion and the cold end heat exchange portion, an assembly hole is formed in the heat insulation piece, the semiconductor refrigeration piece is arranged in the assembly hole, the hot end face of the semiconductor refrigeration piece is in contact with the hot end heat exchange portion, and the cold end face of the semiconductor refrigeration piece is in contact with the cold end heat exchange portion.
The hot junction heat transfer portion and the cold junction heat transfer portion are separated through the heat insulation part, heat exchange between the hot junction heat transfer portion and the cold junction heat transfer portion can be reduced, and heat exchange efficiency of the semiconductor heat exchanger is improved.
Optionally, at least two semiconductor refrigeration pieces are arranged between the hot end heat exchanging portion and the cold end heat exchanging portion at intervals, and the number of the assembly holes is consistent with that of the semiconductor refrigeration pieces.
The number of the semiconductor refrigerating pieces is increased, and the refrigerating capacity of the semiconductor heat exchanger can be increased.
The utility model also provides a refrigeration plant, include as above semiconductor heat exchanger.
Optionally, refrigeration plant is the water-cooling fan, the water-cooling fan includes fan, water receiving tank and wet curtain, the water inlet of water receiving tank with semiconductor heat exchanger's cold junction exit linkage, the water droplet that the water receiving tank flows falls wet on the curtain.
So set up the cold wind effect that can promote water-cooling fan, also can avoid the user to additionally add ice-cube or ice crystal in to the water tank, the user of being convenient for uses.
The utility model discloses technical scheme is through being equipped with scattered cold liquid way, cold junction entry and cold junction export in cold junction heat transfer portion for heat transfer liquid flows in from the cold junction entry, after the cold liquid way that looses flows through, flows out from the cold junction export. In the process that the heat exchange liquid flows through the cold dispersion liquid channel, the cold quantity of the cold end heat exchange part can be taken away by the heat exchange liquid, so that the heat exchange of the cold end heat exchange part is realized. Compared with the mode of realizing the heat exchange of the cold end heat exchange part through the airflow flow, the cold quantity taken away by the heat exchange liquid flowing through the cold dispersion liquid channel is more, the heat exchange efficiency is obviously improved, and the heat exchange efficiency of the semiconductor heat exchanger is improved. And when the cold end heat exchanger adopts heat exchange liquid for heat exchange, the application scene of semiconductor heat exchanger is wider.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an embodiment of a semiconductor heat exchanger according to the present invention;
FIG. 2 is an exploded view of the semiconductor heat exchanger of FIG. 1;
fig. 3 is a schematic structural diagram of another embodiment of the semiconductor heat exchanger of the present invention;
fig. 4 is a schematic structural diagram of an embodiment of the refrigeration apparatus of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | Hot end |
22 | |
| 11 | |
30 | |
| 12 | |
40 | |
| 13 | Heat radiation |
41 | |
| 14 | Radiating cover plate | 42 | |
| 15 | Connecting |
50 | Locking piece |
| 16 | |
60 | |
| 20 | Cold end |
61 | |
| 21 | |
70 | Water- |
| 71 | |
72 | |
| 73 | |
74 | |
| 75 | Heat radiation assembly |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a semiconductor heat exchanger for refrigeration plant, this refrigeration plant can be for cooling by water fan (like tower fan, thermantidote), refrigerator, water dispenser or air conditioner etc..
The embodiment of the utility model provides an in, please refer to fig. 1 and fig. 2, this semiconductor heat exchanger includes hot junction heat transfer portion 10, cold junction heat transfer portion 20 and semiconductor refrigeration piece 30, and cold junction heat transfer portion 20 is equipped with scattered cold liquid way, cold junction entry 21 and cold junction export 22, and cold junction entry 21 communicates with the one end of scattered cold liquid way, and cold junction export 22 communicates with the other end of scattered cold liquid way, and semiconductor refrigeration piece 30 is located between hot junction heat transfer portion 10 and the cold junction heat transfer portion 20.
Specifically, the cold dispersion liquid channel is used for flowing heat exchange liquid, i.e. the heat exchange liquid flows in from the cold end inlet 21 and flows out from the cold end outlet 22 after flowing through the cold dispersion liquid channel. In the process that the heat-exchange liquid flows through the cold-dispersing liquid channel, the cold quantity of the cold-end heat-exchanging part 20 can be taken away by the heat-exchange liquid, so that the heat exchange of the cold-end heat-exchanging part 20 is realized. Wherein, the heat exchange liquid can be water, mixed liquid of water and glycol, or other liquid. In addition, one side of the semiconductor refrigeration sheet 30 is connected with the hot-end heat exchanging part 10 in a heat conduction mode, and the other side, opposite to the semiconductor refrigeration sheet 30, is connected with the cold-end heat exchanging part 20 in a heat conduction mode.
The utility model discloses technical scheme is through being equipped with scattered cold liquid way, cold junction entry 21 and cold junction export 22 at cold junction heat transfer portion 20 for heat transfer liquid flows in from cold junction entry 21, behind the cold liquid way of scattering in the flow-through, flows out from cold junction export 22. In the process that the heat-exchange liquid flows through the cold-dispersing liquid channel, the cold quantity of the cold-end heat-exchanging part 20 can be taken away by the heat-exchange liquid, so that the heat exchange of the cold-end heat-exchanging part 20 is realized. Compared with the mode of realizing the heat exchange of the cold-end heat exchange part 20 by airflow flowing, the cold quantity taken away by the heat exchange liquid flowing through the cold dispersion liquid channel is more, the heat exchange efficiency is obviously improved, and the heat exchange efficiency of the semiconductor heat exchanger is improved. And when the cold end heat exchanger 20 adopts heat exchange liquid for heat exchange, the application scene of the semiconductor heat exchanger is wider.
In an embodiment, the cold-end heat exchanging portion 20 includes a cold-end dissipating main body and a cold-end dissipating cover plate, the cold-end dissipating main body is provided with a cold-end runner groove, one end of the cold-end runner groove is communicated with the cold-end inlet 21, the other end of the cold-end runner groove is communicated with the cold-end outlet 22, and the cold-end runner groove is covered by the cold-end dissipating cover plate to form a cold-dissipating fluid passage. Specifically, cold main part looses is all located to cold junction runner groove, cold junction entry 21 and cold junction export 22, and the sealed notch that closes in cold junction runner groove of cold junction of loosing cold apron. So can make the simple structure of cold apron that looses, be convenient for production and processing is favorable to reduction in production cost. Of course, in other embodiments, the cold end inlet 21 and the cold end outlet 22 may be provided in the cold dispersion cover plate. In addition, the cold heat exchanging portion 20 may also be formed by two grooves which are spliced together.
The hot side heat exchanger 10 has a plurality of heat exchanging methods, for example, in an embodiment, the hot side heat exchanger 10 is provided with a heat dissipating fluid passage, a hot side inlet 11 and a hot side outlet 12, the hot side inlet 11 is communicated with one end of the heat dissipating fluid passage, and the hot side outlet 12 is communicated with the other end of the heat dissipating fluid passage. Specifically, the heat-dissipating fluid channel is used for flowing heat-exchanging fluid, i.e. the heat-exchanging fluid flows in from the hot-end inlet 11 and flows out from the hot-end outlet 12 after flowing through the heat-dissipating fluid channel. In the process that the heat-exchange liquid flows through the heat-dissipation liquid channel, the heat of the hot-end heat-exchange portion 10 can be taken away by the heat-exchange liquid, so that the heat exchange of the hot-end heat-exchange portion 10 is realized. Compared with the mode of realizing heat exchange of the hot-end heat exchange part 10 by airflow flowing, the heat exchange liquid flows through the heat dissipation liquid channel to take away more heat, and the heat exchange efficiency of the semiconductor heat exchanger can be improved.
In another embodiment, the hot-side heat exchanging part 10 includes a heat dissipating substrate and a plurality of heat dissipating fins, which are disposed on a side of the heat dissipating substrate away from the semiconductor chilling plate 30 and are sequentially spaced on the heat dissipating substrate. Specifically, the heat dissipation substrate and the heat dissipation fins are integrally formed, a heat dissipation gap is formed between every two adjacent heat dissipation fins, air can flow in the heat dissipation gap through the fan assembly, and heat on the hot-end heat exchange portion 10 is taken away. So also can realize better heat dissipation, the structure is comparatively simple moreover, and spare part quantity is less, the assembly of being convenient for.
In one embodiment, the hot-end heat exchanging part 10 includes a heat dissipating body 13 and a heat dissipating cover plate 14, the heat dissipating body 13 is provided with a hot-end channel, one end of the hot-end channel is communicated with the hot-end inlet 11, the other end is communicated with the hot-end outlet 12, and the cover plate covers the hot-end channel to form a heat dissipating liquid channel. Specifically, the hot end runner groove, the hot end inlet 11 and the hot end outlet 12 are all arranged on the heat dissipation main body 13, and the heat dissipation cover plate 14 is sealed and covered on the notch of the hot end runner groove. Therefore, the heat dissipation cover plate 14 is simple in structure, convenient to produce and process and beneficial to reducing production cost. Of course, in other embodiments, the hot side inlet 11 and the hot side outlet 12 may be provided on the heat-radiating cover plate 14. In addition, the hot end heat exchanging part 10 may also be formed by splicing two tank bodies.
In one embodiment, the cold inlet 21 is disposed at one end of the cold heat exchanger 20, and the hot inlet 11 is disposed at one end of the hot heat exchanger 10 away from the cold inlet 21. That is, the end of the cold-end heat exchanger 20 having the cold-end inlet 21 and the end of the hot-end heat exchanger 10 having the hot-end inlet 11 are away from each other, and are equivalent to the cold-end inlet 21 and the hot-end inlet 11 being respectively disposed on two opposite sides of the semiconductor heat exchanger. Thus, interference between the cold end inlet 21 and the hot end inlet 11 during assembly can be avoided, and assembly of the semiconductor heat exchanger can be facilitated. Of course, in one embodiment, the cold side inlet 21 and the hot side inlet 11 may be disposed on the same side of the semiconductor heat exchanger.
In an embodiment, scattered cold liquid way is circuitous tortuous setting, and cold end export 22 is located the same one end of cold end heat transfer portion 20 with cold end entry 21, so when the pipeline of cold end export 22 and cold end entry 21 is connected in the installation, can be convenient for concentrate the installation, be favorable to promoting assembly efficiency. Similarly, in an embodiment, the heat dissipating fluid channel is arranged in a winding manner, and the hot end outlet 12 and the hot end inlet 11 are arranged at the same end of the hot end heat exchanging portion 10, so that when the pipeline connecting the hot end outlet 12 and the hot end inlet 11 is installed, centralized installation can be facilitated, and the assembly efficiency can be improved.
In one embodiment, the semiconductor heat exchanger includes at least two hot side heat exchanging portions 10, a cold side heat exchanging portion 20 is disposed between two opposite hot side heat exchanging portions 10, and a semiconductor cooling plate 30 is disposed between each hot side heat exchanging portion 10 and the cold side heat exchanging portion 20. The number of the hot end heat exchanging portions 10 may be two, three, four or more, and when the number of the hot end heat exchanging portions 10 is more than two, the hot end heat exchanging portions 10 may be distributed around the cold end heat exchanging portion 20. In the present embodiment, the semiconductor heat exchanger includes two hot-side heat exchanging portions 10, but the present invention is not limited thereto, that is, the two hot-side heat exchanging portions 10 are respectively disposed on two opposite sides of the cold-side heat exchanging portion 20. Therefore, the semiconductor heat exchanger forms a structure with cold storage in the middle and heat dissipation at two ends. The number of the hot-end heat exchanging part 10 and the semiconductor refrigerating sheet 30 is increased, so that the refrigerating capacity of the semiconductor heat exchanger can be increased. Meanwhile, the structure of storing cold in the middle is favorable for the heat preservation of the cold-end heat exchanging portion 20, and the two opposite sides of the cold-end heat exchanging portion 20 are respectively provided with a hot-end heat exchanging portion 10, which is favorable for the heat dissipation of the hot-end heat exchanging portion 10. This scheme can promote semiconductor heat exchanger's heat exchange efficiency promptly by a wide margin. Of course, in other embodiments, the semiconductor heat exchanger may include only one cold-side heat exchange portion 20 and one hot-side heat exchange portion 10.
The hot end heat exchanger 10 and the cold end heat exchanger 20 may be installed in various manners, for example, in an embodiment, two opposite sides of the hot end heat exchanger 10 are respectively provided with a connecting portion 15, the connecting portions 15 are arranged to protrude towards the lateral side of the cold end heat exchanger, and the connecting portions 15 of the two hot end heat exchangers 10 are connected in a one-to-one correspondence manner. In this embodiment, the connecting portion 15 is provided with a mounting hole 42, and the connecting portions 15 of the two hot end heat exchanging portions 10 are connected by bolts, that is, the connecting portion 15 of the end heat exchanging portion and the connecting portion 15 of the cold end heat exchanging portion 20 are connected by bolts. So be equivalent to through two hot junction heat transfer portions 10 with cold junction heat transfer portion 20 clamp at well to realize cold junction heat transfer portion 20 fixed, reduced the connection structure on cold junction heat transfer portion 20, make cold junction heat transfer portion 20's simple structure. And the cold-end heat exchanging part 20 can be prevented from contacting the bolt, so that the possibility of heat exchange between the hot-end heat exchanging part 10 and the cold-end heat exchanging part 20 through the bolt can be reduced. And fix through the double-phase offside of hot junction heat transfer portion 10, can guarantee that hot junction heat transfer portion 10 and cold junction heat transfer portion 20 atress are even, are favorable to promoting connection stability. Of course, in other embodiments, the connecting portion 15 may be a snap structure.
Referring to fig. 3, in another embodiment, the semiconductor heat exchanger further includes two fixing members 40 and a locking member 50 connecting the two fixing members 40, wherein one fixing member 40 is disposed on one side of one hot side heat exchanging portion 10 away from the cold side heat exchanging portion 20, and the other fixing member 40 is disposed on one side of the other hot side heat exchanging portion 10 away from the cold side heat exchanging portion 20. That is, the cold end heat exchanger 20 and the hot end heat exchanger 10 are sandwiched between two fixing members 40, and the two fixing members 40 are connected by the locking member 50, so that the hot end heat exchanger 10 and the cold end heat exchanger 20 can be fixed. So set up mounting 40 in addition and fix hot junction heat transfer portion 10 and cold junction heat transfer portion 20, can simplify the structure of hot junction heat transfer portion 10 and cold junction heat transfer portion 20. In the embodiment that the hot end heat exchanging portion 10 includes the heat dissipating body 13 and the heat dissipating cover plate 14, the heat dissipating cover plate 14 may be pressed by the fixing member 40, so that the heat dissipating cover plate 14 can cover the hot end channel groove more tightly, and the sealing performance of the heat dissipating liquid channel is ensured to be better.
In an embodiment, each of the fixing members 40 is provided with a mounting portion 41 on two opposite sides of the hot side heat exchanger 10 in the width direction, the mounting portion 41 extends toward the side of the hot side heat exchanger 10, the mounting portion 41 is provided with at least two mounting holes 42 spaced apart along the length direction of the hot side heat exchanger 10, and the locking members 50 are disposed through the corresponding mounting holes 42 of the two fixing members 40 to lock the two fixing members 40. Specifically, the fixing members 40 have a plate shape, the locking members 50 are bolts, and the mounting holes 42 of the two fixing members 40 are disposed in one-to-one correspondence. The width of the fixing member 40 is greater than the width of the hot end heat exchanging portion 10 and greater than the width of the cold end heat exchanging portion 20, that is, in the width direction of the hot end heat exchanging portion 10, the hot end heat exchanging portion 10 and the cold end heat exchanging portion 20 are both located between the two mounting portions 41. So that the cold heat exchanging part 20 and the hot heat exchanging part 10 are located between the locking members 50 of the two mounting parts 41 when the locking members 50 are mounted in the mounting holes 42 of the two mounting parts 41. So set up for mounting 40 and retaining member 50's structure is all comparatively simple, and when installation department 41 was equipped with two at least mounting holes 42 along hot junction heat transfer portion 10 length direction interval distribution, can set up two at least retaining member 50 in hot junction heat transfer portion 10 length direction in other words and fix, can guarantee to fix firmly, and can also rationally set up the interval between two adjacent mounting holes 42, guarantee that two mountings 40 are even to the fixed of hot junction heat transfer portion 10 and cold junction heat transfer portion 20. In addition, the cold heat exchange part 20 can be prevented from contacting the locking member 50, so that the possibility of heat exchange between the hot heat exchange part 10 and the cold heat exchange part 20 through the locking member 50 can be reduced. Of course, in other embodiments, the locking member 50 can be a snap or the like.
Referring to fig. 1 and 2, in an embodiment, the hot-side heat exchanging portion 10 is provided with a positioning boss 16, and the semiconductor cooling plate 30 is provided on the positioning boss 16. Specifically, the positioning boss 16 is protruded on the surface of the hot-side heat exchanging part 10 facing the cold-side heat exchanging part 20, so as to facilitate the installation and positioning of the semiconductor chilling plate 30. Of course, in other embodiments, a positioning groove may be disposed on the surface of the hot heat exchanging portion 10 facing the cold heat exchanging portion 20, and the semiconductor cooling plate 30 may be disposed in the positioning groove.
In an embodiment, the semiconductor heat exchanger further includes a heat insulating member 60, the heat insulating member 60 is disposed between the hot-end heat exchanging portion 10 and the cold-end heat exchanging portion 20, an assembly hole 61 is formed in the heat insulating member 60, the semiconductor refrigeration sheet 30 is disposed in the assembly hole 61, a hot end surface of the semiconductor refrigeration sheet 30 is in contact with the hot-end heat exchanging portion 10, and a cold end surface of the semiconductor refrigeration sheet 30 is in contact with the cold-end heat exchanging portion 20. That is, the hot end heat exchanging portion 10 and the cold end heat exchanging portion 20 are separated by the heat insulating member 60, so that the heat exchange between the hot end heat exchanging portion 10 and the cold end heat exchanging portion 20 can be reduced, and the heat exchange efficiency of the semiconductor heat exchanger is improved. The hot end surface of the semiconductor refrigeration sheet 30 may be directly abutted to the hot end heat exchanging portion 10, or a heat conducting medium may be coated between the hot end surface of the semiconductor refrigeration sheet 30 and the hot end heat exchanging portion 10. Similarly, the cold end surface of the semiconductor refrigeration piece 30 and the cold end heat exchanging portion 20 may be directly abutted, or a heat conducting medium may be coated between the cold end surface of the semiconductor refrigeration piece 30 and the cold end heat exchanging portion 20. The insulation 60 may be insulation foam or foam, or the like.
In one embodiment, at least two semiconductor chilling plates 30 are arranged between the hot-side heat exchanging part 10 and the cold-side heat exchanging part 20 at intervals, and the number of the assembling holes 61 is the same as that of the semiconductor chilling plates 30. Namely, at least two semiconductor refrigeration sheets 30 are arranged between each hot-side heat exchanging part 10 and each cold-side heat exchanging part 20. The plurality of semiconductor chilling plates 30 between any one hot-end heat exchanging part 10 and the cold-end heat exchanging part 20 are all tiled, and the heat insulation part 60 is provided with an assembling hole 61 corresponding to each semiconductor chilling plate 30. The number of the semiconductor refrigerating pieces 30 is increased, so that the refrigerating capacity of the semiconductor heat exchanger can be increased. The number of the semiconductor cooling fins 30 may be two, three, four or more, etc. Of course, in other embodiments, only one semiconductor cooling plate 30 may be disposed between each hot heat exchanging portion 10 and each cold heat exchanging portion 20.
In one embodiment, the semiconductor cooling fins 30 between the hot heat exchanging part 10 and the cold heat exchanging part 20 are arranged at intervals. Therefore, mutual heat exchange among the semiconductor refrigeration pieces 30 can be reduced, and the heat exchange efficiency is improved.
The utility model discloses still provide a refrigeration plant, this refrigeration plant includes equipment principal and semiconductor heat exchanger, and above-mentioned embodiment is referred to this semiconductor heat exchanger's concrete structure, because this refrigeration plant has adopted the whole technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer given here. Wherein, the semiconductor heat exchanger is arranged on the equipment main body. The refrigerating equipment can be an air conditioner, a water dispenser or a refrigerator and the like.
Referring to fig. 1 and 4, in an embodiment, the refrigeration device is a water-cooling fan 70, the water-cooling fan 70 includes a blower 72, a water receiving tank 71 and a wet curtain 73, an inlet of the water receiving tank 71 is connected to the cold outlet 22 of the semiconductor heat exchanger, and water flowing out of the water receiving tank 71 drops onto the wet curtain 73. Specifically, the water receiving tank 71 is located at a water inlet below the cold-end outlet 22 of the semiconductor heat exchanger, the water cooling fan 70 further includes a water tank 74 and a water pump, the water tank 74 is located at the bottom of the water cooling fan 70, the water pump is connected between the cold-end inlet 21 of the semiconductor heat exchanger and the water tank 74, and the water pump is used for pumping water in the water tank 74 to the cold-end inlet 21, so that the water in the water tank 74 can flow through the cold-dispersing liquid channel of the cold-end heat exchanging portion 20 for cooling. The cooled cold water can flow from the cold end outlet 22 to the water receiving tank 71, and drip onto the wet curtain 73 through the water receiving tank 71, and blow toward the wet curtain 73 through the fan 72, and the air flow blown out by the fan 72 is cooled by the cold water after passing through the wet curtain 73, so that the cooled cold air is blown out of the water cooling fan 70. The cold air effect of the water cooling fan 70 can be improved, and the phenomenon that ice cubes or ice crystals are additionally added into the water tank 74 by a user can be avoided, so that the use by the user is facilitated. Of course, in other embodiments, the water tank 74 may be disposed at the top or middle of the water-cooled fan 70. In addition, the water tank 74 may not be provided, for example, the cold inlet of the semiconductor heat exchanger may be directly connected to an external water pipe, and in this case, a suction pump may not be provided.
In one embodiment, the water cooling fan 70 further includes a heat dissipation assembly 75, and the heat dissipation assembly 75 is in heat conduction connection with the hot side heat exchanging portion 10 of the semiconductor heat exchanger to dissipate heat of the hot side heat exchanging portion 10.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (13)
1. A semiconductor heat exchanger, comprising:
a hot end heat exchanging portion;
the cold end heat exchange part is provided with a cold dispersion liquid channel, a cold end inlet and a cold end outlet, the cold end inlet is communicated with one end of the cold dispersion liquid channel, and the cold end outlet is communicated with the other end of the cold dispersion liquid channel; and
and the semiconductor refrigerating piece is arranged between the hot end heat exchanging part and the cold end heat exchanging part.
2. The semiconductor heat exchanger of claim 1, wherein the cold side heat exchange portion includes a cold dissipating body having a cold side runner channel with one end in communication with the cold side inlet and the other end in communication with the cold side outlet, and a cold dissipating cover plate covering the cold side runner channel to form the cold dissipating runner.
3. The semiconductor heat exchanger according to claim 1, wherein the hot end heat exchanger portion is provided with a heat-dissipating liquid channel, a hot end inlet and a hot end outlet, the hot end inlet being communicated with one end of the heat-dissipating liquid channel, the hot end outlet being communicated with the other end of the heat-dissipating liquid channel; or,
the hot end heat exchange part comprises a heat dissipation base body and a plurality of heat dissipation fins, the heat dissipation fins are arranged on one side, away from the semiconductor refrigeration sheet, of the heat dissipation base body, and the heat dissipation fins are sequentially distributed on the heat dissipation base body at intervals.
4. The semiconductor heat exchanger of claim 3, wherein the cold side inlet is located at one end of the cold side heat exchange portion and the hot side inlet is located at an end of the hot side heat exchange portion remote from the cold side inlet.
5. The semiconductor heat exchanger of claim 1, wherein the semiconductor heat exchanger comprises at least two hot end heat exchanging portions, the cold end heat exchanging portion is disposed between two opposite hot end heat exchanging portions, and the semiconductor refrigeration piece is disposed between each of the hot end heat exchanging portions and the cold end heat exchanging portion.
6. The semiconductor heat exchanger of claim 5, further comprising two fixing members and a retaining member connecting the two fixing members, wherein one of the fixing members is disposed on a side of one of the hot heat exchanging portions facing away from the cold heat exchanging portion, and the other fixing member is disposed on a side of the other of the hot heat exchanging portions facing away from the cold heat exchanging portion.
7. The semiconductor heat exchanger according to claim 6, wherein each of the fixing members is provided with a mounting portion at each of two opposite sides in a width direction of the hot end heat exchanging portion, the mounting portion extends toward a side of the hot end heat exchanging portion, the mounting portion is provided with at least two mounting holes spaced apart along a length direction of the hot end heat exchanging portion, and the locking members are inserted into the corresponding mounting holes of the two fixing members to lock the two fixing members.
8. The semiconductor heat exchanger according to claim 5, wherein two opposite sides of the hot end heat exchanging portion are respectively provided with a connecting portion, the connecting portions are arranged to protrude towards the lateral direction of the cold end heat exchanger, and the connecting portions of the two hot end heat exchanging portions are connected in a one-to-one correspondence manner.
9. The semiconductor heat exchanger as claimed in claim 1, wherein the hot end heat exchanging portion is provided with a positioning boss, and the semiconductor refrigeration sheet is provided on the positioning boss.
10. The semiconductor heat exchanger of claim 1, further comprising a heat insulating member disposed between the hot end heat exchanging portion and the cold end heat exchanging portion, wherein the heat insulating member has an assembly hole, the semiconductor refrigeration sheet is disposed in the assembly hole, a hot end surface of the semiconductor refrigeration sheet contacts the hot end heat exchanging portion, and a cold end surface of the semiconductor refrigeration sheet contacts the cold end heat exchanging portion.
11. The semiconductor heat exchanger of claim 10, wherein at least two semiconductor chilling plates are arranged at intervals between the hot-end heat exchanging part and the cold-end heat exchanging part, and the number of the assembling holes is consistent with that of the semiconductor chilling plates.
12. A refrigeration apparatus comprising a semiconductor heat exchanger as claimed in any one of claims 1 to 11.
13. The refrigeration device as recited in claim 12 wherein the refrigeration device is a water-cooled fan, the water-cooled fan comprises a blower, a water receiving tank and a wet curtain, a water inlet of the water receiving tank is connected with a cold end outlet of the semiconductor heat exchanger, and water from the water receiving tank drops onto the wet curtain.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120391937.1U CN214307677U (en) | 2021-02-22 | 2021-02-22 | Semiconductor heat exchanger and refrigeration equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120391937.1U CN214307677U (en) | 2021-02-22 | 2021-02-22 | Semiconductor heat exchanger and refrigeration equipment |
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| CN214307677U true CN214307677U (en) | 2021-09-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116007237A (en) * | 2022-04-15 | 2023-04-25 | 无锡暖芯半导体科技有限公司 | Semiconductor crystal refrigeration water-cooling heat exchange device and application method thereof |
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2021
- 2021-02-22 CN CN202120391937.1U patent/CN214307677U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116007237A (en) * | 2022-04-15 | 2023-04-25 | 无锡暖芯半导体科技有限公司 | Semiconductor crystal refrigeration water-cooling heat exchange device and application method thereof |
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