CN215062571U - Cooling fan - Google Patents

Abstract

The utility model discloses a cooling fan, this cooling fan include casing, semiconductor refrigerating system and first fan subassembly, and the casing has air-out wind channel, wind channel air intake and wind channel air outlet, and the same surface of casing is located to wind channel air intake and wind channel air outlet, and all communicates with the air-out wind channel. The semiconductor refrigeration system is arranged in the shell and comprises a cold end heat exchanger, a hot end heat exchanger and a semiconductor refrigeration sheet, the hot end heat exchanger is in heat conduction connection with the hot end of the semiconductor refrigeration sheet, the cold end heat exchanger is in heat conduction connection with the cold end of the semiconductor refrigeration sheet, and the cold end heat exchanger is at least partially arranged in the air outlet duct. The first fan assembly is arranged in the air outlet duct and used for driving outside airflow to be sucked from the air inlet duct and blown out from the air outlet duct after flowing through the cold end heat exchanger for heat exchange. The utility model discloses technical scheme can avoid the too big condition of humidity in the cold wind air current that the thermantidote sent out.

Description

Cooling fan

Technical Field

The utility model relates to a fan technical field, in particular to thermantidote.

Background

At present, the thermantidote on the market is mainly for direct evaporation formula thermantidote, generally makes hot-air pass through evaporation cooling medium (wet curtain), fully carries out the heat exchange with water in evaporation cooling medium, then evaporates the heat absorption and the cooling obtains cool air, and cool air is sent out by the fan to reach the purpose of cooling. However, the airflow blown to the user is the humidified airflow, and a large amount of moisture is carried in the airflow, so that the user experience is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a thermantidote, the too big condition of humidity in the cold wind air current that aims at avoiding the thermantidote to send out.

In order to achieve the above object, the utility model provides a cooling fan, include:

the air outlet of the air channel is communicated with the air outlet channel;

the semiconductor refrigeration system is arranged in the shell and comprises a cold end heat exchanger, a hot end heat exchanger and a semiconductor refrigeration sheet, the hot end heat exchanger is in heat conduction connection with the hot end of the semiconductor refrigeration sheet, the cold end heat exchanger is in heat conduction connection with the cold end of the semiconductor refrigeration sheet, and at least part of the cold end heat exchanger is arranged in the air outlet duct; and

the first fan assembly is arranged in the air outlet duct and used for driving outside airflow to be sucked from the air duct air inlet and flow through the cold end heat exchanger for heat exchange and then blow out from the air duct air outlet.

Optionally, the casing further has a heat dissipation air duct separated from the air outlet duct, the hot-end heat exchanger is at least partially disposed in the heat dissipation air duct, the cooling fan further includes a second fan assembly disposed in the heat dissipation air duct, and the second fan assembly is configured to blow out a heat dissipation airflow, which is subjected to heat exchange by the hot-end heat exchanger, toward the outside of the casing.

When the heat dissipation air duct separated from the air outlet duct is arranged on the shell to dissipate heat of the hot end heat exchanger of the semiconductor refrigeration system, interference between heat dissipation air flow of the hot end heat exchanger and cold air flow in the air outlet duct can be avoided, and better cold air fan-out effect is ensured.

Optionally, the housing has a heat dissipation air outlet, the heat dissipation air outlet is communicated with the heat dissipation air duct, and the heat dissipation air outlet and the air duct air inlet are respectively disposed on two opposite sides of the housing.

Because the same surface of casing is located to wind channel air intake and wind channel air outlet, so also make the distance of heat dissipation air outlet and wind channel air outlet far away to reduce the hot-blast air current that the heat dissipation air outlet sent out and directly converge with the cold wind that the wind channel air outlet blew off and lead to the possibility that the air-out temperature rises, guarantee that cold wind fan-out cold wind effect is better.

Optionally, the casing includes two opposite side plates, a front plate located between the two side plates, and a back plate located between the two side plates and opposite to the front plate, the air duct air inlet and the air duct air outlet are disposed on the front plate, the heat dissipation air outlet is disposed on the back plate, and at least one of the side plates is provided with a heat dissipation air inlet communicated with the heat dissipation air duct.

When the heat dissipation air inlet is arranged on the side plate, the possibility that hot air flow sent out from the heat dissipation air outlet directly enters the heat dissipation air channel from the heat dissipation air inlet can be reduced, the temperature of the air flow entering the heat dissipation air channel from the heat dissipation air inlet is lower, and the heat dissipation effect is improved.

Optionally, a partition plate is arranged between the heat dissipation air duct and the air outlet duct, the partition plate is connected between the two side plates, the heat dissipation air duct is formed between the partition plate and the back plate, and the air outlet duct is formed between the partition plate and the front plate.

So be equivalent to the heat dissipation wind channel and separate at the rear side in air-out wind channel through the baffle, can make the distance of heat dissipation air outlet and air duct air intake and the wind channel air outlet in air-out wind channel all far away. And the size of the air outlet duct in the arrangement direction of the two side plates is larger, so that the distance between the air inlet of the air duct and the air outlet of the air duct is set to be larger as much as possible, and the interference between the air inlet flow and the air outlet flow of the air outlet duct is reduced.

Optionally, the hot end heat exchanger includes a hot end heat exchange main body and a hot end heat exchange water drain, the hot end heat exchange main body is in heat conduction connection with the hot end of the semiconductor refrigeration sheet, the hot end heat exchange main body is provided with a heat dissipation liquid channel, a hot end inlet connected to one end of the heat dissipation liquid channel, and a hot end outlet connected to the other end of the heat dissipation liquid channel, the hot end outlet is communicated with the water inlet of the hot end heat exchange water drain, the second fan assembly is arranged on one side of the hot end heat exchange water drain, the hot end heat exchange water drain is arranged in the heat dissipation air channel, a heat dissipation channel is arranged in the hot end heat exchange water drain, and the second fan assembly blows out hot air after heat exchange through the heat dissipation channel out of the housing.

So when the hot junction heat exchanger carries out the heat exchange through the mode that adopts the liquid cooling and semiconductor refrigeration piece, promote the heat exchange efficiency between hot junction heat exchanger and the semiconductor refrigeration piece, promote the radiating effect. And the consumption of heat exchange liquid in the hot-end heat exchanger can be reduced, so that resources are saved, and for example, when the heat exchange liquid is water, the water resources can be saved. And the air current can avoid air current and water contact at the in-process that the hot junction heat transfer log raft, and then can avoid the condition that increases steam in the air current when the air current passes through the hot junction heat exchanger, has avoided the condition that humidity increases in the thermantidote heat dissipation air current promptly.

Optionally, the cold end heat exchanger includes the cold base member of loosing and locates a plurality of cold fins that loose on the cold base member, it is a plurality of cold fins that loose interval distribution in proper order, adjacent two form the cold wind channel that looses between the cold fins, loose the cold base member with the cold junction heat-conduction of semiconductor refrigeration piece is connected, loose the cold wind channel with the air inlet side or the air-out side intercommunication of first fan subassembly.

So set up, can simplify the structure of cold junction heat exchanger, and then can simplify the structure of thermantidote.

Optionally, the first fan assembly comprises a fan and an air guide, the fan and the cold-end heat exchanger are arranged in the arrangement directions of the two side plates of the shell, the air inlet side of the fan is communicated with the air inlet of the air duct, the air guide is communicated with the air outlet side of the fan and the cold air duct, and the cold air duct is far away from one end of the air guide and communicated with the air outlet of the air duct.

When distributing the fan and the cold end heat exchanger in the direction of arranging of two curb plates, can avoid the thermantidote oversize in the cold wind channel extending direction (the direction of arranging of front bezel and backplate) that looses for the thermantidote is less in the size of the direction of arranging of two curb plates, is favorable to promoting the compact structure nature of thermantidote. And the air guide piece is arranged between the fan and the cooling air dispersing channel for guiding air, so that the air flow sent out from the fan can be ensured to flow through the cooling air dispersing channel more fully and then be sent out towards the outside of the shell, and the possibility of air leakage between the fan and the cooling air dispersing channel is reduced.

Optionally, the fan is a cross-flow fan, the air inlet of the air duct is formed in the front plate of the housing, the air guide channel of the air guide member is arc-shaped, and the cross-flow fan is closer to the back plate than the cold-end heat exchanger in the direction between the front plate of the housing and the back plate of the housing.

Through distributing the cross-flow fan and the cold end heat exchanger in the arrangement directions of the two side plates, and when the cross-flow fan is adopted, the air inlet side of the cross-flow fan and the air inlet of the air channel can be arranged just opposite to each other, so that the air flow entering the air inlet of the air channel can directly flow to the cross-flow fan, and the air inlet along the air suction direction of the cross-flow fan is facilitated.

Optionally, the cold junction heat exchanger includes cold junction heat transfer main part and cold junction heat transfer log raft, the cold junction heat transfer main part with the cold junction heat-conduction of semiconductor refrigeration piece is connected, the cold junction heat transfer main part be equipped with scattered cold liquid way, connect in the cold junction entry of the one end of scattered cold liquid way with connect in the cold junction export of the other end of scattered cold liquid way, the cold junction export with the water inlet intercommunication of cold junction heat transfer log raft, cold junction heat transfer log raft sets up in the air outlet duct, first fan subassembly is located one side of cold junction heat transfer log raft, cold junction heat transfer log raft inside is equipped with scattered cold air duct, first fan subassembly will pass through refrigeration air current after the cold air duct heat transfer of loosing towards the shell is external to blow off.

When the cold junction heat exchanger carries out the heat exchange with the semiconductor refrigeration piece through the mode that adopts the liquid cooling, promote the heat exchange efficiency between cold junction heat exchanger and the semiconductor refrigeration piece for the cold volume of transmitting to cold junction heat transfer log raft department is more, thereby is favorable to promoting the refrigeration effect of thermantidote.

The utility model discloses technical scheme is through setting up semiconductor refrigerating system in the thermantidote, make semiconductor refrigerating system's cold junction heat exchanger at least part locate the air-out wind channel, so when the cold junction heat exchanger is flowed through to the drive air current through first fan subassembly, the air current of cold junction heat exchanger of flowing through can carry out the heat exchange with the cold junction heat exchanger, thereby take away the cold volume of cold junction heat exchanger, make the air current that blows out outside towards the casing behind the cold junction heat exchanger be the cold air stream, realize cold air fan-out cold wind, wherein when locating the same surface of casing with wind channel air intake and wind channel air outlet, can make the wind channel air intake keep away from the hot junction heat exchanger, thereby can reduce the air current that gets into from the wind channel air intake and the possibility of the heat transfer that the hot junction heat exchanger gived off. Compare in the mode that the thermantidote adopted the cooling of wet curtain structure, so make the air-out air current at the in-process through the cold junction heat exchanger, can avoid air-out air current and water contact, and then can avoid the air-out air current increase the condition of steam in the air-out air current when passing through the cold junction heat exchanger, avoided the too big condition of humidity in the cold air current that the thermantidote sent out promptly. And when the air current flows through the cold end heat exchanger, the water vapor in the air current can be condensed on the cold end heat exchanger, so that the water vapor in the air current can be reduced.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural view of an embodiment of a cooling fan of the present invention;

FIG. 2 is a schematic structural view of a back plate of the cooling fan in FIG. 1;

FIG. 3 is a cross-sectional view of the cooling fan of FIG. 1;

FIG. 4 is a schematic structural view of the semiconductor refrigeration system and the first fan assembly of FIG. 3;

FIG. 5 is a schematic diagram of the cold side heat exchanger and the hot side heat exchanger of FIG. 4;

FIG. 6 is an exploded view of the cold-end heat exchanger of FIG. 4;

FIG. 7 is an exploded view of the semiconductor refrigeration system and first fan assembly of FIG. 4;

FIG. 8 is an exploded view of the semiconductor refrigeration system of FIG. 4;

FIG. 9 is a schematic flow diagram of the hot end heat exchanger of FIG. 2;

fig. 10 is a schematic structural view of another embodiment of the cooling fan of the present invention;

FIG. 11 is a schematic structural view of the back plate of the cooling fan in FIG. 10;

fig. 12 is a sectional view of the cooling fan of fig. 10;

FIG. 13 is a schematic diagram of a portion of the semiconductor refrigeration system of FIG. 11;

FIG. 14 is an exploded view of the semiconductor refrigeration system of FIG. 13;

fig. 15 is a schematic flow diagram of the cold-end heat exchanger of fig. 12.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture, and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides a thermantidote.

In the embodiment of the present invention, please refer to fig. 1 to fig. 3, the cooling fan includes a housing 10, a semiconductor cooling system 20 and a first fan assembly 40, the housing 10 has an air outlet duct 14, an air inlet 141 and an air outlet 142, the air inlet 141 and the air outlet 142 are disposed on the same surface of the housing 10, and are all communicated with the air outlet duct 14. Semiconductor refrigerating system 20 sets up in casing 10, and semiconductor refrigerating system 20 includes cold junction heat exchanger 21, hot junction heat exchanger 22 and semiconductor refrigeration piece 23, and hot junction heat exchanger 22 is connected with the hot junction heat-conduction of semiconductor refrigeration piece 23, and cold junction heat exchanger 21 is connected with the cold junction heat-conduction of semiconductor refrigeration piece 23, and air outlet duct 14 is located to cold junction heat exchanger 21 at least part. The first fan assembly 40 is disposed in the air outlet duct 14, and the first fan assembly 40 is configured to drive an external airflow to be sucked from the air inlet duct 141 and to be blown out from the air outlet duct 142 after passing through the cold end heat exchanger 21 for heat exchange.

Particularly, after semiconductor refrigeration piece 23 lets in the electric current, the cold junction temperature of semiconductor refrigeration piece 23 reduces and produces cold volume, and the hot junction temperature of semiconductor refrigeration piece 23 risees and produces heat, when being connected through the cold junction heat-conduction with cold junction heat exchanger 21 and semiconductor refrigeration piece 23, can be so that the cold junction low temperature of semiconductor refrigeration piece 23 transmits to cold junction heat exchanger 21. The first fan assembly 40 drives the airflow to flow through the cold end heat exchanger 21, so that the airflow flowing through the cold end heat exchanger 21 exchanges heat with the cold end heat exchanger 21, and the temperature of the airflow blown out of the casing 10 from the air duct air outlet 142 after passing through the cold end heat exchanger 21 is reduced. When the cold-end heat exchanger 21 is in heat conduction connection with the hot end of the semiconductor refrigeration sheet 23, the cold-end heat exchanger 21 can discharge heat at the hot end of the semiconductor refrigeration sheet 23. When the hot-end heat exchanger 22 is in heat conduction connection with the hot end of the semiconductor refrigerating sheet 23, the hot-end heat of the semiconductor refrigerating sheet 23 can be transferred to the hot-end heat exchanger 22, so that the hot-end heat exchanger 22 discharges the heat at the hot end of the semiconductor refrigerating sheet 23, and the heat dissipation of the semiconductor refrigerating system 20 is realized.

The utility model discloses technical scheme is through setting up semiconductor refrigerating system 20 in the thermantidote, make the cold junction heat exchanger 21 at least part of semiconductor refrigerating system 20 locate air-out wind channel 14, so when cold junction heat exchanger 21 is flowed through to the drive air current through first fan subassembly 40, the air current of cold junction heat exchanger 21 of flowing through can carry out the heat exchange with cold junction heat exchanger 21, thereby take away the cold volume of cold junction heat exchanger 21, make the air current that blows off outward towards casing 10 behind cold junction heat exchanger 21 be the cold air stream, realize cold wind fan-out cold wind, wherein when locating the same surface of casing with wind channel air intake 141 and wind channel air outlet 142, can make wind channel air intake 141 keep away from hot end heat exchanger 22, thereby can reduce the air current that gets into from wind channel air intake 141 and the possibility of the heat exchange that hot end heat exchanger 22 gived off. Compare in the mode that the thermantidote adopted the cooling of wet curtain structure, so make the air-out air current at the in-process through cold junction heat exchanger 21, can avoid air-out air current and water contact, and then can avoid the air-out air current to increase the condition of steam in the air-out air current when passing through cold junction heat exchanger 21, avoided the too big condition of humidity in the cold air current that the thermantidote sent out promptly. And when the air current flows through cold end heat exchanger 21, the steam in the air current can also condense on cold end heat exchanger 21, can reduce the steam in the air current.

In an embodiment, the casing 10 further has a heat dissipation air duct 15 separated from the air outlet duct 14, the hot-end heat exchanger 22 is at least partially disposed in the heat dissipation air duct 15, the cooling fan further includes a second fan assembly 227 disposed in the heat dissipation air duct 15, and the second fan assembly 227 is configured to blow out a heat dissipation air flow after heat exchange by the hot-end heat exchanger 22 toward the outside of the casing 10. Specifically, the casing 10 is provided with a heat dissipation air inlet 151 and a heat dissipation air outlet 152, the heat dissipation air inlet 151 and the heat dissipation air outlet 152 are both communicated with the heat dissipation air duct 15, and the second fan assembly 227 is used for driving external air flow to be sucked from the heat dissipation air inlet 151 and blown out from the heat dissipation air outlet 152 after flowing through the hot-end heat exchanger 22 for heat exchange. That is, under the action of the second fan assembly 227, the external air flow enters the heat dissipation air duct 15 from the heat dissipation air inlet 151, and when the air flow flows through the hot-end heat exchanger 22, the air flow is sent out from the heat dissipation air outlet 152 after exchanging heat with the hot-end heat exchanger 22, so that the heat dissipation of the semiconductor refrigeration system 20 is realized. When the heat-end heat exchanger 22 of the semiconductor refrigeration system 20 is cooled by arranging the heat-dissipating air duct 15 separated from the air-outlet duct 14 on the housing 10, the interference between the heat-dissipating air flow of the heat-end heat exchanger 22 and the cold air flow in the air-outlet duct 14 can be avoided, and the better cold air fan-out effect can be ensured. Of course, in other embodiments, a heat dissipation water path may be provided in hot side heat exchanger 22 to remove heat from hot side heat exchanger 22 by flowing water through the heat dissipation water path connected to a tap water line or an external water tank (or a water tank provided in the housing).

In one embodiment, the heat dissipating outlet 152 and the duct inlet 141 are disposed on two opposite sides of the housing 10. With such an arrangement, the distance between the heat dissipation air outlet 152 and the air duct air inlet 141 is relatively long, so that the possibility that the hot air flow sent out from the heat dissipation air outlet 152 directly enters the air outlet duct 14 from the air duct air inlet 141 is reduced. In addition, because the air duct inlet 141 and the air duct outlet 142 are disposed on the same surface of the housing 10, the distance between the heat dissipation outlet 152 and the air duct outlet 142 is further, so as to reduce the possibility that the hot air flow sent out by the heat dissipation outlet 152 directly joins with the cold air blown out by the air duct outlet 142 to cause the outlet air temperature to rise, and ensure a better cold air fan-out effect. Of course, in other embodiments, the heat dissipating air outlet 152 may also be disposed on a surface of the housing 10 adjacent to the surface where the air duct inlet 141 is disposed.

In one embodiment, the housing 10 includes two opposite side plates 13, a front plate 11 located between the two side plates 13, and a back plate 12 located between the two side plates 13 and opposite to the front plate 11. The front plate 11, the back plate 12 and the two side plates 13 may be both flat plates or arc plates, and also portions of the front plate 11, the back plate 12 and the two side plates 13 may be flat plates, and the rest portions may be arc plates. When the front plate 11, the back plate 12 and the two side plates 13 are flat plates, the housing 10 is prism-shaped. The front plate 11, the back plate 12 and the two side plates 13 are all arc plates, and the curvatures of the front plate 11, the back plate 12 and the two side plates 13 are the same, that is, the housing 10 is cylindrical.

In one embodiment, the air inlet 141 and the air outlet 142 are disposed on the front panel 11, the heat dissipating air outlet 152 is disposed on the back panel 12, and at least one of the side panels 13 is disposed with the heat dissipating air inlet 151 communicating with the heat dissipating air duct 15. When the heat dissipation air inlet 151 is disposed on the side plate 13, the possibility that the hot air flow sent out from the heat dissipation air outlet 152 directly enters the heat dissipation air duct 15 from the heat dissipation air inlet 151 can be reduced, the temperature of the air flow entering the heat dissipation air duct 15 from the heat dissipation air inlet 151 is ensured to be low, and the heat dissipation effect is improved. Of course, in other embodiments, the heat dissipation air inlet 151 may be disposed at the top or the bottom of the housing 10.

In an embodiment, a partition 16 is disposed between the heat dissipation air duct 15 and the air outlet duct 14, the partition 16 is connected between the two side plates 13, the heat dissipation air duct 15 is formed between the partition 16 and the back plate 12, and the air outlet duct 14 is formed between the partition 16 and the front plate 11. Specifically, the heat radiation air inlet 151 is provided on the side plate 13 and behind the partition plate 16. The heat dissipation air duct 15 is located in a space defined by the partition 16 and the back plate 12, and the portion of each of the two side plates 13 located between the partition 16 and the back plate 12, and the air outlet duct 14 is located in a space defined by the portion of each of the two side plates 13 located between the partition 16 and the front plate 11, and the partition 16 and the front plate 11. In this way, the heat dissipation air duct 15 is separated from the rear side of the air outlet duct 14 by the partition 16, so that the distances between the heat dissipation air outlet 152 and the air inlet 141 and the air outlet 142 of the air outlet duct 14 are relatively long. And the size of the air outlet duct 14 in the arrangement direction of the two side plates 13 is relatively large, so that the distance between the duct air inlet 141 and the duct air outlet 142 is relatively large as much as possible, and interference between the air inlet flow and the air outlet flow of the air outlet duct 14 is reduced. Of course, in other embodiments, the partition 16 may also extend in the front-back direction to connect between the front plate 11 and the back plate 12, that is, the partition 16 and one of the side plates 13 form a heat dissipation air duct, and the partition 16 and the other side plate 13 form an air outlet duct 14.

In an embodiment, the two side plates 13 of the housing 10 are both provided with heat dissipation air inlets 151, and the heat dissipation air inlets 151 on the two side plates 13 are both communicated with the heat dissipation air duct 15, so that the air inlet area of the heat dissipation air duct 15 can be increased, which is beneficial to increasing the air inlet amount of the heat dissipation air duct 15 and improving the heat dissipation effect.

Referring to fig. 3 to 9, in an embodiment, the cold-side heat exchanger 21 includes a cooling-dissipating base 211 and a plurality of cooling-dissipating fins 212 disposed on the cooling-dissipating base 211, the cooling-dissipating fins 212 are sequentially distributed at intervals, a cooling-dissipating air channel 213 is formed between two adjacent cooling-dissipating fins 212, the cooling-dissipating base 211 is in heat-conduction connection with the cold side of the semiconductor chilling plate 23, and the cooling-dissipating air channel 213 is communicated with an air inlet side or an air outlet side of the first fan assembly 40. Specifically, the cooling dissipating base 211 and the cooling dissipating fins 212 are integrally formed, and the cooling dissipating air duct 213 is provided between two adjacent cooling dissipating fins 212, that is, the cooling dissipating air duct 213 may be formed by only two adjacent cooling dissipating fins 212, or may be formed by two adjacent cooling dissipating fins 212 and other structures. The cold end heat exchanger 21 may be disposed on the air inlet side of the first fan assembly 40, and at this time, the cold air dispersing duct 213 is communicated with the air inlet side of the first fan assembly 40, so that under the action of the first fan assembly 40, the external air flow enters the air outlet duct 14 from the air duct air inlet 141 of the air outlet duct 14, and then passes through the cold air dispersing duct 213 for heat exchange, and then passes through the first fan assembly 40 and then is sent out from the air duct air outlet 142 of the air outlet duct 14. Or the cool air dispersing duct 213 is communicated with the air outlet side of the first fan assembly 40, so that under the action of the first fan assembly 40, the external air flow enters the air outlet duct 14 from the air inlet 141 of the air outlet duct 14, and then is subjected to heat exchange by the first fan assembly 40, and then is sent out from the air outlet 142 of the air outlet duct 14 after being subjected to heat exchange by the cool air dispersing duct 213. So set up, can simplify cold junction heat exchanger 21's structure, and then can simplify the structure of thermantidote.

In an embodiment, the cold-end heat exchanger 21 includes two cooling-dissipating bases 211, each cooling-dissipating base 211 is provided with a plurality of cooling-dissipating fins 212, and the sides of the two cooling-dissipating bases 211 provided with the cooling-dissipating fins 212 are arranged oppositely. That is, the cold-end heat exchanger 21 is formed by splicing two parts, so that the protruding height of the cooling fins 212 on each cooling base 211 relative to the cooling base 211 is smaller, the cooling fins 212 can be conveniently machined and formed, and the manufacturing difficulty is reduced. Of course, in other embodiments, the two cold end bases 211 of the cold end heat exchanger 21 may be integrally formed.

In one embodiment, the cooling fins 212 on the two cooling base bodies 211 are in one-to-one correspondence and the ends of the cooling fins 212 are abutted, and the cooling base bodies 211 and the cooling fins 212 cooperate to form a cooling air duct 213. Therefore, the width of the cold air dispersing channel 213 in the arrangement direction of the two cold base bodies 211 is larger, more air flows flowing through the cold air dispersing channel are ensured, and the heat exchange efficiency is favorably improved.

In another embodiment, a cooling fin 212 of any one of the two cooling substrates 211 is inserted between two adjacent cooling fins 212 of the other cooling substrate 211, and the cooling substrates 211 and the cooling fins 212 cooperate to form a cooling air duct 213. Therefore, the distance between two adjacent cooling fins 212 on each cooling base body 211 is larger, and the manufacturing difficulty of the cold-end heat exchanger 21 is reduced. In other embodiments, one cooling fin 212 on one cooling base 211 may be disposed between two adjacent cooling fins 212 on the other cooling base 211, and the cooling fins 212 on the cooling base 211 are not overlapped in the arrangement direction of the two cooling bases 211.

Referring to fig. 3, 4 and 7, in an embodiment, the first fan assembly 40 includes a fan 41 and an air guide 42, the fan 41 and the cold-end heat exchanger 21 are distributed in the arrangement direction of the two side plates 13 of the housing 10, an air inlet side of the fan 41 is communicated with the air duct inlet 141, the air guide 42 is communicated with an air outlet side of the fan 41 and the cool air dispersing duct 213, and an end of the cool air dispersing duct 213 away from the air guide 42 is communicated with the air duct outlet 142.

Specifically, the arrangement direction of the fan 41 and the cold-end heat exchanger 21 in the casing 10 is substantially the same as the arrangement direction of the two side plates 13, and taking the arrangement direction of the two side plates 13 as the left-right direction as an example, the fan 41 and the cold-end heat exchanger 21 are distributed in the left-right direction. The cold-end heat exchanger 21 and the semiconductor refrigeration piece 23 are distributed along the arrangement direction of the two side plates 13, that is, the cold-end heat exchanger 21 and the semiconductor refrigeration piece 23 are distributed in the left-right direction. The air guide 42 has an air guide channel 421 and two adjacent installation surfaces arranged at an included angle, one end of the air guide channel 421 penetrates through one of the installation surfaces, and the other end penetrates through the other installation surface. One of the mounting surfaces of the air guide 42 is mounted at the air outlet side of the fan 41 so that one end of the air guide channel 421 communicates with the air outlet side of the fan 41, and the other mounting surface of the air guide 42 is mounted at the cool air dispersing duct 213 so that the other end of the air guide channel 421 communicates with the cool air dispersing duct 213.

In order to ensure sufficient heat exchange of the air flow in the cold dissipation air duct 213 and ensure that the number of the cold dissipation air ducts 213 is large, the size of the cold-end heat exchanger 21 in the extending direction of the cold dissipation air duct 213 and the size of the cold-end heat exchanger 21 in the arrangement direction of the plurality of cold dissipation fins 212 are generally larger than the size of the semiconductor refrigeration system 20 in the arrangement direction of the cold-end heat exchanger 21 and the semiconductor refrigeration sheets 23, that is, the size of the semiconductor refrigeration system 20 in the arrangement direction of the cold-end heat exchanger 21 and the semiconductor refrigeration sheets 23 is smaller.

When the fan 41 and the cold-end heat exchanger 21 are distributed in the arrangement directions of the two side plates 13, the cold fan can be prevented from being too large in the extension direction (the arrangement direction of the front plate 11 and the back plate 12) of the cooling air duct 213, so that the size of the cold fan in the arrangement directions of the two side plates 13 is small, and the improvement of the compactness of the cold fan is facilitated. Moreover, by providing the air guide 42 between the fan 41 and the cool air dispersing duct 213 for air guiding, it is ensured that the air flow sent out from the fan 41 can be sent out to the outside of the casing 10 after flowing through the cool air dispersing duct 213 more sufficiently, and the possibility of air leakage between the fan 41 and the cool air dispersing duct 213 is reduced. Of course, in other embodiments, the fan 41 and the semiconductor refrigeration system may be distributed in the arrangement direction of the front plate 11 and the back plate 12. Of course, in other embodiments, the air outlet side of the fan 41 may be directly disposed at one end of the cool air dispersing duct 213.

In one embodiment, fan 41 is a crossflow fan. When the plurality of cooling fins 212 are sequentially distributed at intervals, it is equivalent to that the plurality of cooling air channels 213 are also sequentially distributed at intervals, so that the air inlet side of the cooling area formed by the plurality of cooling air channels 213 on the cold-end heat exchanger 21 is in a strip shape, and the air inlet side of each cooling air channel 213 is communicated with the air outlet end of the air guide channel 421. By adopting the cross flow fan 41, the length of the air outlet side of the cross flow fan 41 can be equal to the length of the air inlet side of a cold dissipation area formed by a plurality of cold dissipation air channels 213 on the cold end heat exchanger 21, so that certain air pressure can be overcome, the air quantity loss is small, and a large air outlet range can be realized. Of course, in other embodiments, a centrifugal fan, an axial fan, or the like may be used.

In one embodiment, the blower 41 is a cross-flow blower, the air duct inlet 141 is disposed on the front plate 11 of the housing, the air duct 421 of the air duct 42 is arc-shaped, and the cross-flow blower 41 is closer to the back plate 12 than the cold-end heat exchanger 21 in a direction between the front plate 11 and the back plate 12. Through the distribution of the cross flow fan 41 and the cold end heat exchanger 21 in the arrangement direction of the two side plates 13, and when the cross flow fan 41 is a cross flow fan, the air inlet side of the cross flow fan 41 and the air duct air inlet 141 can be arranged just opposite to each other, so that the air flow entering the air duct air inlet 141 can directly flow to the cross flow fan 41, and the air inlet along the air suction direction of the cross flow fan 41 is facilitated. When cross-flow fan 41 and cold-end heat exchanger 21 distribute in the direction of arranging of two curb plates 13, be equivalent to that air guide 42 is located one side that cold-end heat exchanger 21 deviates from front bezel 11, through with cross-flow fan 41 more be close to backplate 12 setting than cold-end heat exchanger 21 in the direction between front bezel 11 and backplate 12, can make cross-flow fan 41's air-out side more be close to air guide 42, thereby can avoid increasing air guide 42's size to cooperate cross-flow fan 41, be favorable to simplifying air guide 42's structure, also can make air guide 42, cross-flow fan 41 and cold-end heat exchanger 21's cooperation compacter, promote the compact structure nature of thermantidote.

Different from the embodiment in which the cold-end heat exchanger 21 includes the cold dissipation base 211 and the plurality of cold dissipation fins 212, please refer to fig. 10 to 15, in an embodiment, the cold-end heat exchanger 21 includes a cold-end heat exchange main body 214 and a cold-end heat exchange water discharge 217, the cold-end heat exchange main body 214 is in heat-conduction connection with the cold end of the semiconductor refrigeration sheet 23, the cold-end heat exchange main body 214 is provided with a cold dissipation liquid channel, a cold-end inlet 215 connected to one end of the cold dissipation liquid channel, and a cold-end outlet 216 connected to the other end of the cold dissipation liquid channel, the cold-end outlet 216 is communicated with a water inlet of the cold-end heat exchange water discharge 217, the cold-end heat exchange water discharge 217 is disposed in the air outlet channel 14, the first fan assembly 40 is disposed on one side of the cold-end heat exchange water discharge 217, the cold dissipation air channel is disposed inside the cold dissipation water discharge 217, and the first fan assembly 40 blows out the refrigeration air flow passing through the cold dissipation air channel toward the outside of the housing 10.

That is, the cold-side inlet 215 is used for the inflow of the heat-exchange liquid, and when the semiconductor refrigeration system 20 is in operation, the cold energy at the cold side of the semiconductor refrigeration sheet 23 can be conducted to the cold-side heat-exchange main body 214. The heat-exchange liquid is introduced into the cold end heat dissipation liquid channel through the cold end inlet 215, so that the heat-exchange liquid exchanges heat with the cold end heat exchange main body 214 in the process of flowing through the cold end heat dissipation liquid channel, and the heat-exchange liquid flowing from the cold end outlet 216 to the cold end heat exchange water discharge 217 is in a low-temperature state. In the process that the heat-exchange liquid flows through the cold-end heat-exchange water discharge 217, the heat-exchange liquid exchanges heat with the cold-end heat-exchange water discharge 217 again, and the temperature of the cold-end heat-exchange water discharge 217 is reduced. The cold end heat exchange water discharge 217 is generally provided with a plurality of small water pipes arranged side by side in the vertical direction, wavy fins are arranged between the adjacent water pipes, and grooves/bulges of the wavy fins are hollowed out to form a cold dissipation air duct through which air can pass, and the air exchanges heat with the fins when passing through. When the first fan assembly 40 drives the outlet air flow to flow through the cold-end heat exchange water discharge 217, the outlet air flow and the cold-end heat exchange water discharge 217 can exchange heat, the temperature of the outlet air flow flowing through the cold-end heat exchange water discharge 217 is reduced, and the cold air can be fanned out. When cold end heat exchanger 21 carries out the heat exchange with semiconductor refrigeration piece 23 through the mode that adopts the liquid cooling, promote the heat exchange efficiency between cold end heat exchanger 21 and the semiconductor refrigeration piece 23 for the cold volume of transmitting to cold end heat transfer log raft 217 department is more, thereby is favorable to promoting the refrigeration effect of thermantidote, makes semiconductor refrigerating system 20's refrigeration efficiency more than 40%. Wherein, the heat exchange liquid can be water or other refrigerant media. Of course, in other embodiments, the cold-end heat exchange water discharge 217 may also be a structure in which water tubes are arranged through fins.

In one embodiment, the cold end heat exchange body 214 includes a cold dissipating body provided with a cold end runner channel having one end communicating with the cold end inlet 215 and the other end communicating with the cold end outlet 216, and a cold dissipating cover plate covering the cold end runner channel to form a cold dissipating fluid channel. Specifically, cold end runner groove, cold end inlet 215 and cold end outlet 216 all locate the scattered cold main part, and the sealed notch that closes in cold end runner groove of scattered cold apron. So can make the simple structure of cold apron that looses, be convenient for production and processing is favorable to reduction in production cost. Of course, in other embodiments, cold end inlet 215 and cold end outlet 216 may be provided to the cold dispersion cover plate. In addition, the cold end heat exchange body 214 may also be formed by splicing two cold dissipating bodies provided with cold end runner channels.

In one embodiment, the liquid cooling dispersion channel is arranged between the cold end inlet 215 and the cold end outlet 216 in a winding way, which means that the liquid cooling dispersion channel is bent or continuously bent, and the like. The cold dispersion liquid channel is used for flowing heat exchange liquid, namely the heat exchange liquid flows in from the cold end inlet 215 and flows out from the cold end outlet 216 after flowing through the cold dispersion liquid channel. In the process that the heat-exchange liquid flows through the cold-dispersing liquid channel, the heat-exchange liquid can take away the low-temperature cold quantity of the cold-end heat-exchange main body 214. By providing a cold sink fluid path that meanders between cold end inlet 215 and cold end outlet 216. Compare in scattered cold liquid way and be the mode that directly extends to cold end export 216 from cold end entry 215, so can increase the length and the heat transfer area of scattered cold liquid way, be favorable to promoting cold end heat exchanger's heat exchange efficiency, can only set up a cold end entry 215 and a cold end export 216 on cold end heat transfer portion 20 in addition, be favorable to simplifying cold end heat exchanger 21's structure.

In an embodiment, cold end outlet 216 and cold end inlet 215 are located same one end of cold end heat transfer main part 214, so when the pipeline of cold end outlet 216 and cold end inlet 215 is connected in the installation, can be convenient for concentrate the installation, be favorable to promoting assembly efficiency.

In one embodiment, the cooling fan further comprises a first water tank 50, the cold-end inlet 215 is communicated with the first water tank 50, and the outlet of the cold-end heat exchange water discharge 217 is communicated with the first water tank 50. That is, water in the first water tank 50 flows in from the cold end inlet 215 first, flows through after cold liquid duct and cold end heat transfer water drainage 217 in proper order, flows to the first water tank 50 from the delivery port of cold end heat transfer water drainage 217 again, so make the heat transfer water of cold end heat exchanger 21 can cyclic utilization, compare in the thermantidote that adopts wet curtain structure, so can reduce the number of times of adding water, the water economy resource. Of course, in other embodiments, the cold end inlet 215 may be externally connected to a water source, such as a tap water line externally connected to the cold end inlet 215.

In one embodiment, the first water tank 50 is disposed at the bottom of the casing 10, and the cooling fan further includes a first water pump 60, wherein the first water pump 60 is configured to pump the water in the first water tank 50 to the cold-end heat-exchange water discharge 217 and the cold-end heat-exchange water discharge. Through setting up first water tank 50 the bottom of casing 10, can reduce the focus of thermantidote for the thermantidote during operation is more stable. The first water pump 60 may be a submersible pump or a self-priming pump. In addition, in other embodiments, the first water tank 50 may also be disposed at the top of the housing 10, and at this time, a water pump may be disposed to pump the water discharged from the cold-end heat exchange water discharge 217 to the first water tank 50, or the water pump may not be disposed to directly discharge the water discharged from the cold-end heat exchange water discharge 217.

In one embodiment, a first opening is formed at an outer side of the housing 10, and the first water tank 50 is detachably installed in the housing 10 from the first opening. That is, the first water tank 50 can be put into the housing 10 through the first opening, and can also be taken out from the housing 10 through the first opening, so that the water can be conveniently added into the first water tank 50 by a user, and the use by the user is convenient. The first opening may be provided in the side plate 13, the front plate 11, or the back plate 12 of the housing 10. In one embodiment, the first opening is provided in the front plate 11 of the housing 10, which can facilitate the operation of the user. In addition, in other embodiments, the water tank may be non-detachably mounted in the housing 10.

In one embodiment, the first fan assembly 40 includes at least one first axial fan 43, and the first axial fan 43 is disposed on the air inlet side or the air outlet side of the cold side heat exchange water discharge 217. In this embodiment, the first axial fan 43 is disposed on the air outlet side of the cold-end heat-exchange water discharge 217, that is, the first axial fan 43 is disposed between the cold-end heat-exchange water discharge 217 and the air duct air outlet 142 of the air outlet duct 14. When the first axial fan 43 is adopted, the thickness of the first axial fan 43 can be smaller, the structural compactness of the cooling fan can be improved, and the overall size of the cooling fan can be reduced. The number of the first axial fans 43 may be set according to the size of the housing 10, and the number of the first axial fans 43 may be two, three, four or more, and the like. In this embodiment, the air duct inlet (not shown in this embodiment) may be disposed at the side, above, or below the air duct outlet 142. In other embodiments, the air inlet of the air duct may also be the side plate 13 of the housing 10.

In addition, in the embodiment where the cold-end heat exchanger 21 includes the cold-end heat exchange main body 214 and the cold-end heat exchange water discharge 217 disposed in the air outlet duct 14, the first fan assembly 40 may also adopt a cross-flow fan or a centrifugal fan.

In an embodiment, the first fan assembly 40 includes two first axial fans 43, the two first axial fans 43 are installed side by side on the air outlet side of the cold-end heat-exchange water discharge device 217, the air outlet duct 14 is provided with an air duct air outlet 142 corresponding to each first axial fan 43, so that the heat exchange efficiency of the cold-end heat-exchange water discharge device 217 and the air volume of the cooling fan can be increased.

Referring to fig. 3, 5, 8 and 9, or 12 to 15, in an embodiment, the hot-side heat exchanger 22 includes a hot-side heat exchange main body 221 and a hot-side heat exchange water discharge 226, the hot-side heat exchange main body 221 is connected to the hot side of the semiconductor cooling fins 23 in a heat conduction manner, the hot-side heat exchange main body 221 is provided with a heat-dissipating liquid passage, a hot-side inlet 224 connected to one end of the heat-dissipating liquid passage, and a hot-side outlet 225 connected to the other end of the heat-dissipating liquid passage, the hot-side outlet 225 is communicated with a water inlet of the hot-side heat exchange water discharge 226, the second fan assembly 227 is disposed on one side of the hot-side heat exchange water discharge 226, the hot-side heat exchange water discharge 226 is disposed in the heat-dissipating air passage 15, a heat-dissipating passage is disposed inside the hot-side heat exchange water discharge 226, and the second fan assembly 227 blows out the hot air flow outside the hot air housing 10 after heat exchange through the heat-dissipating passage.

Specifically, the hot side inlet 224 is used for the inflow of the heat-exchange liquid, and when the semiconductor refrigeration system 20 is in operation, the heat at the hot side of the semiconductor refrigeration fins 23 can be conducted to the hot side heat-exchange main body 221. The heat-exchange liquid is introduced into the cold-sink liquid channel through the hot-side inlet 224, so that the heat-exchange liquid exchanges heat with the hot-side heat exchange body 221 while flowing through the cold-sink liquid channel, and then flows to the hot-side heat-exchange water discharge 226 from the hot-side outlet 225. The heat-exchange liquid, in turn, exchanges heat with the hot side heat exchange water discharge 226 as it flows through the hot side heat exchange water discharge 226. The hot end heat exchange water discharge 226 is generally vertically provided with a plurality of small water pipes arranged side by side, a wavy fin is arranged between adjacent water pipes, and a groove/protrusion of the wavy fin is hollowed out to form a heat dissipation channel through which wind can pass, and the wind exchanges heat with the fin when passing. Under the action of the second fan component 227, the external air flow enters the heat dissipation air duct 15 from the heat dissipation air inlet 151 of the heat dissipation air duct 15, and when the air flow passes through the hot-end heat-exchange water discharge 226, the air flow and the hot-end heat-exchange water discharge 226 can carry out heat exchange and then be sent out from the heat dissipation air outlet 152 of the air outlet duct 14. Therefore, the heat conducted from the semiconductor refrigeration sheet 23 to the hot-end heat exchange main body 221 can be taken away, and the heat dissipation of the semiconductor refrigeration system 20 is realized.

So hot junction heat exchanger 22 carries out the heat exchange through the mode that adopts the liquid cooling and semiconductor refrigeration piece 23, promotes the heat exchange efficiency between hot junction heat exchanger 22 and the semiconductor refrigeration piece 23, promotes the radiating effect. And the consumption of the heat exchange liquid in the hot-end heat exchanger 22 can be reduced, which is beneficial to saving resources, for example, when the heat exchange liquid is water, the water resource can be saved. And the air current can avoid the air current to contact with water in the process of passing through the hot end heat exchange water discharge 226, so that the condition that water vapor is added to the air current when the air current passes through the hot end heat exchanger 22, namely the condition that the humidity in the cooling air current of the cooling fan is increased, can be avoided. Of course, in other embodiments, the heat-exchange liquid after heat exchange by the hot-end heat-exchange body 221 may also be directly discharged out of the cooling fan. Of course, in other embodiments, heat dissipation fins may be disposed on the hot-side heat exchange body 221 for heat dissipation. In addition, in other embodiments, the hot side heat exchange water discharge 226 may also be a structure in which water pipes are arranged through the fins.

In one embodiment, the hot side heat exchange body 221 includes a heat dissipation body 222 and a heat dissipation cover plate 223, the heat dissipation body 222 is provided with a hot side channel groove, one end of the hot side channel groove is communicated with the hot side inlet 224, the other end is communicated with the hot side outlet 225, and the heat dissipation cover plate 223 covers the hot side channel groove to form a heat dissipation liquid channel. Specifically, the hot side runner groove, the hot side inlet 224 and the hot side outlet 225 are all disposed on the heat dissipating body 222, and the heat dissipating cover plate 223 is sealed to the notch of the hot side runner groove. So can make the simple structure of heat dissipation apron 223, the production and processing of being convenient for is favorable to reduction in production cost. Of course, in other embodiments, the hot side inlet 224 and the hot side outlet 225 may be disposed on the heat-dissipating cover plate 223. In addition, the hot-side heat exchange body 221 may also be formed by splicing two heat dissipation bodies 222 provided with hot-side runner grooves.

In one embodiment, the heat sink fluid path is serpentine between the hot side inlet 224 and the hot side outlet 225, meaning that the heat sink fluid path is bent or continuously bent, etc. The coolant channels are used for flowing heat-exchange liquid, i.e. heat-exchange liquid flows in from the hot-side inlet 224 and flows out from the hot-side outlet 225 after flowing through the coolant channels. In the process that the heat-exchange liquid flows through the heat-dissipation liquid channel, the heat of the hot-end heat-exchange main body 221 can be taken away by the heat-exchange liquid, so that heat dissipation of the hot-end heat-exchange main body 221 is realized. By providing a tortuous path for the coolant between hot side inlet 224 and hot side outlet 225. Compared with the way that the heat-dissipating liquid channel extends from the hot-end inlet 224 to the hot-end outlet 225, the length and the heat-exchanging area of the heat-dissipating liquid channel can be increased, which is beneficial to improving the heat-exchanging efficiency of the hot-end heat exchanger 22, and only one hot-end inlet 224 and one hot-end outlet 225 can be arranged on the hot-end heat-exchanging main body 221, which is beneficial to simplifying the structure of the hot-end heat exchanger 22.

In an embodiment, the heat dissipating fluid channel is arranged in a winding manner, and the hot end outlet 225 and the hot end inlet 224 are arranged at the same end of the hot end heat exchanging body 221, so that when the pipeline connecting the hot end outlet 225 and the hot end inlet 224 is installed, centralized installation can be facilitated, and the assembly efficiency can be improved.

Referring to fig. 3, 5, 8 and 9, in an embodiment, the cooling fan further includes a second water tank 70, a hot-end inlet 224 is communicated with the second water tank 70, and a water outlet of the hot-end heat-exchange water discharge 226 is communicated with the second water tank 70. That is, the water in the second water tank 70 firstly flows in from the hot end inlet 224, flows through the heat dissipation liquid channel and the hot end heat exchange water discharge 226 in sequence, and then flows to the first water tank 50 from the water outlet of the hot end heat exchange water discharge 226, so that the heat exchange water of the hot end heat exchanger 22 can be recycled, and compared with a cooling fan adopting a wet curtain structure, the water adding frequency can be reduced, and the water resource is saved. Of course, in other embodiments, hot side inlet 224 may be connected externally to a water source, such as hot side inlet 224 connected externally to a water supply line.

In one embodiment, the second fan assembly 227 includes at least one second axial fan 228, and the second axial fan 228 is disposed on the air inlet side or the air outlet side of the hot side heat exchange water discharge 226. In this embodiment, the second axial fan 228 is disposed on the air outlet side of the cold-end heat-exchange water discharge 217, that is, the second axial fan 228 is disposed between the cold-end heat-exchange water discharge 217 and the air duct air outlet 142 of the air outlet duct 14. When the second axial fan 228 is adopted, the thickness of the second axial fan 228 can be smaller, so that the structural compactness of the cooling fan can be improved, and the overall size of the cooling fan can be reduced. The number of the second axial fans 228 may be set according to the size of the housing 10, and the number of the second axial fans 228 may be two, three, four or more, and so on.

In one embodiment, the second fan assembly 227 includes two second axial fans 228, the two second axial fans 228 are installed side by side on the air outlet side of the hot-end heat-exchange water discharge 226, and the heat-dissipation air duct 15 is provided with a heat-dissipation air outlet 152 corresponding to each second axial fan 228, so as to increase the heat-exchange efficiency of the hot-end heat-exchange water discharge 226.

In one embodiment, the second water tank 70 is disposed at the bottom of the casing 10, and the cooling fan further includes a second water pump 80, and the second water pump 80 is configured to pump the water in the second water tank 70 to the cooling fluid channel and the hot-end heat-exchange water discharge 226. Through setting up the bottom of casing 10 with second water tank 70, can reduce the focus of thermantidote for the thermantidote during operation is more stable. The second water pump 80 may be a submersible pump or a self-priming pump. In addition, in other embodiments, the second water tank 70 may also be disposed at the top of the housing 10, and a water pump may be disposed to pump the water discharged from the hot-end heat-exchange water discharge 226 to the second water tank 70, or the water pump may not be disposed to directly discharge the water discharged from the hot-end heat-exchange water discharge 226.

In one embodiment, the second opening 18 is formed at an outer side of the housing 10, and the second water tank 70 is detachably installed in the housing 10 from the second opening 18. That is, the second water tank 70 can be installed in the housing 10 through the second opening 18, and can also be taken out of the housing 10 through the second opening 18, so that the user can add water into the second water tank 70 conveniently, and the user can use the water conveniently. The second opening 18 may be provided in the side plate 13, the front plate 11, or the back plate 12 of the housing 10. When setting up first water tank 50, be equivalent to first water tank 50 and second water tank 70 mutual independence for cold junction heat exchanger 21's heat transfer water route and hot junction heat exchanger 22's heat transfer water route mutual independence, so can avoid cold junction heat exchanger 21 and hot junction heat exchanger 22 mutual interference, guarantee that cold junction heat exchanger 21 and hot junction heat exchanger 22's heat transfer effect is all better. Of course, in other embodiments, the cold side heat exchanger 21 and the hot side heat exchanger 22 may share a common water tank, for example, the hot side inlet 224 is in communication with the first water tank 50, and the outlet of the hot side heat exchange water discharge 226 is in communication with the first water tank 50. In addition, in other embodiments, the water tank may be non-detachably mounted in the housing 10.

Referring to fig. 5 and 8, or referring to fig. 13 and 14, in an embodiment, the semiconductor refrigeration system 20 includes at least two hot side heat exchangers 22, a cold side heat exchanger 21 is disposed between two opposite hot side heat exchangers 22, and a semiconductor refrigeration sheet 23 is disposed between each hot side heat exchanger 22 and the cold side heat exchanger 21.

In this embodiment, the semiconductor refrigeration system 20 is provided with two hot-end heat exchangers 22, the two hot-end heat exchangers 22 are respectively disposed on two opposite sides of the cold-end heat exchanger 21, one side of the semiconductor refrigeration sheet 23 is in heat-conducting connection with the hot-end heat exchanger 22, and the other side, opposite to the semiconductor refrigeration sheet 23, is in heat-conducting connection with the cold-end heat exchanger 21. Of course, in other embodiments, the number of hot side heat exchangers 22 may also be three, four or more, and so on, and a plurality of hot side heat exchangers 22 may be distributed around the cold side heat exchanger 21.

Through locating cold-side heat exchanger 21 between two relative hot side heat exchangers 22, and all be equipped with semiconductor refrigeration piece 23 between each hot side heat exchanger 22 and cold-side heat exchanger 21 for semiconductor refrigeration system 20 forms middle cold storage, the radiating structure in both ends. The number of the hot-end heat exchangers 22 and the number of the semiconductor refrigerating sheets 23 are increased, so that the refrigerating capacity of the semiconductor refrigerating system 20 can be increased. Meanwhile, the structure of storing cold in the middle is favorable for the heat preservation of the cold-end heat exchanger 21, and the hot-end heat exchanger 22 is arranged on the two opposite sides of the cold-end heat exchanger 21, so that the heat dissipation of the hot-end heat exchanger 22 is favorable. This scheme can promote semiconductor refrigerating system 20's heat exchange efficiency promptly by a wide margin.

Referring to fig. 8 or 14, in an embodiment, the hot-end heat exchange body 221 is provided with a positioning boss 229, and the semiconductor cooling fins 23 are provided on the positioning boss 229. Specifically, the positioning boss 229 is protruded from the surface of the hot-side heat exchange body 221 facing the cold-side heat exchanger 21, so as to facilitate the installation and positioning of the semiconductor cooling fins 23. Of course, in other embodiments, a positioning groove may be provided on the surface of the hot-end heat exchange body 221 facing the cold-end heat exchanger 21, and the semiconductor cooling plate 23 may be disposed in the positioning groove.

In an embodiment, the semiconductor refrigeration system further includes a heat insulating member 90, the heat insulating member 90 is disposed between the hot end heat exchange main body 221 and the cold end heat exchanger 21, an assembly hole 91 is formed in the heat insulating member 90, the semiconductor refrigeration sheet 23 is disposed in the assembly hole 91, the hot end of the semiconductor refrigeration sheet 23 contacts the hot end heat exchange main body 221, and the cold end of the semiconductor refrigeration sheet 23 contacts the cold end heat exchanger 21. That is, the hot side heat exchange main body 221 and the cold side heat exchanger 21 are separated by the heat insulation member 90, so that the heat exchange between the hot side heat exchange main body 221 and the cold side heat exchanger 21 can be reduced, and the heat exchange efficiency of the semiconductor refrigeration system is improved. The hot end of the semiconductor chilling plate 23 may be directly abutted against the hot end heat exchange main body 221, or a heat conducting medium may be coated between the hot end of the semiconductor chilling plate 23 and the hot end heat exchange main body 221. Similarly, the cold end of the semiconductor refrigeration piece 23 and the cold end heat exchanger 21 can be directly abutted, and a heat-conducting medium can be coated between the cold end of the semiconductor refrigeration piece 23 and the cold end heat exchanger 21. The insulation 90 may be insulation foam or foam, or the like.

In one embodiment, at least two semiconductor cooling fins 23 are disposed between the hot side heat exchanger 22 and the cold side heat exchanger 21. Specifically, at least two semiconductor refrigeration sheets 23 are arranged between each hot-side heat exchanger 22 and each cold-side heat exchanger 21. A plurality of semiconductor refrigerating sheets 23 between any one hot-end heat exchanger 22 and any one cold-end heat exchanger 21 are all laid in a flat way. By increasing the number of the semiconductor cooling fins 23, the cooling capacity of the semiconductor cooling system 20 can be increased. Through setting up each semiconductor refrigeration piece 23 equal interval between hot junction heat exchanger 22 and the cold junction heat exchanger 21, can reduce the interconversion between each semiconductor refrigeration piece 23, promote heat exchange efficiency. Wherein, the number of the semiconductor chilling plates 23 can be two, three, four or more, etc. Of course, in other embodiments, only one semiconductor cooling plate 23 may be disposed between the hot side heat exchanger 22 and the cold side heat exchanger 21.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. The utility model provides a thermantidote, its characterized in that includes:

the air outlet of the air channel is communicated with the air outlet channel;

the semiconductor refrigeration system is arranged in the shell and comprises a cold end heat exchanger, a hot end heat exchanger and a semiconductor refrigeration sheet, the hot end heat exchanger is in heat conduction connection with the hot end of the semiconductor refrigeration sheet, the cold end heat exchanger is in heat conduction connection with the cold end of the semiconductor refrigeration sheet, and at least part of the cold end heat exchanger is arranged in the air outlet duct; and

the first fan assembly is arranged in the air outlet duct and used for driving outside airflow to be sucked from the air duct air inlet and flow through the cold end heat exchanger for heat exchange and then blow out from the air duct air outlet.

2. The cooling fan according to claim 1, wherein the casing further has a heat dissipation air duct separated from the air outlet duct, the hot-end heat exchanger is at least partially disposed in the heat dissipation air duct, and the cooling fan further includes a second fan assembly disposed in the heat dissipation air duct, and the second fan assembly is configured to blow out a heat dissipation airflow after heat exchange by the hot-end heat exchanger toward the outside of the casing.

3. The cooling fan according to claim 2, wherein the casing has a heat dissipation outlet, the heat dissipation outlet is communicated with the heat dissipation air duct, and the heat dissipation outlet and the air duct inlet are respectively disposed at two opposite sides of the casing.

4. The cooling fan according to claim 3, wherein the casing includes two opposite side plates, a front plate located between the two side plates, and a back plate located between the two side plates and opposite to the front plate, the air duct inlet and the air duct outlet are disposed on the front plate, the heat dissipation air outlet is disposed on the back plate, and at least one of the side plates is provided with a heat dissipation air inlet communicated with the heat dissipation air duct.

5. The cooling fan according to claim 4, wherein a partition is disposed between the heat dissipation air duct and the air outlet duct, the partition is connected between the two side plates, the heat dissipation air duct is formed between the partition and the back plate, and the air outlet duct is formed between the partition and the front plate.

6. The cooling fan according to any one of claims 2 to 5, wherein the hot-end heat exchanger includes a hot-end heat exchange body and a hot-end heat exchange water drain, the hot-end heat exchange body is thermally connected to the hot end of the semiconductor cooling fins, the hot-end heat exchange body is provided with a heat-dissipating fluid passage, a hot-end inlet connected to one end of the heat-dissipating fluid passage, and a hot-end outlet connected to the other end of the heat-dissipating fluid passage, the hot-end outlet is communicated with a water inlet of the hot-end heat exchange water drain, the second fan assembly is disposed on one side of the hot-end heat exchange water drain, the hot-end heat exchange water drain is disposed in the heat-dissipating fluid passage, a heat-dissipating channel is disposed in the hot-end heat exchange water drain, and the second fan assembly blows hot air after heat exchange through the heat-dissipating channel out of the casing.

7. The cooling fan according to any one of claims 1 to 5, wherein the cold-end heat exchanger includes a cooling-dissipating base and a plurality of cooling-dissipating fins disposed on the cooling-dissipating base, the cooling-dissipating fins are sequentially spaced apart from each other, a cooling-dissipating air duct is formed between two adjacent cooling-dissipating fins, the cooling-dissipating base is in heat-conduction connection with the cold end of the semiconductor cooling fin, and the cooling-dissipating air duct is communicated with an air inlet side or an air outlet side of the first fan assembly.

8. The cooling fan according to claim 7, wherein the first fan assembly includes a fan and an air guide, the fan and the cold-end heat exchanger are distributed in the arrangement direction of the two side plates of the casing, an air inlet side of the fan is communicated with the air inlet of the air duct, the air guide is communicated with an air outlet side of the fan and the cooling air duct, and an end of the cooling air duct, which is far away from the air guide, is communicated with the air outlet of the air duct.

9. The cooling fan according to claim 8, wherein the fan is a cross-flow fan, the air inlet of the air duct is provided in the front plate of the casing, the air guide channel of the air guide member is curved, and the cross-flow fan is closer to the back plate than the cold-end heat exchanger in a direction between the front plate of the casing and the back plate of the casing.

10. The cooling fan according to claim 1, wherein the cold-end heat exchanger includes a cold-end heat exchange body and a cold-end heat exchange water discharge, the cold-end heat exchange body is connected to the cold end of the semiconductor cooling fin in a heat-conducting manner, the cold-end heat exchange body is provided with a cold-end discharge passage, a cold-end inlet connected to one end of the cold-end discharge passage, and a cold-end outlet connected to the other end of the cold-end discharge passage, the cold-end outlet is communicated with a water inlet of the cold-end heat exchange water discharge, the cold-end heat exchange water discharge is disposed in the air discharge passage, the first fan assembly is disposed on one side of the cold-end heat exchange water discharge, the cold-end heat exchange water discharge is provided with a cold-discharge passage inside, and the first fan assembly blows out the cooling air after passing through the cold-discharge passage.

Images