TWM589771U - Cooling module with air flow channel and air conditioning device with cooling module - Google Patents

Abstract

A cooling module with an airflow channel and an air-conditioning device with a cooling module, the low temperature generated by the low-temperature measurement of the cooling module can be conducted to a structure with an airflow channel and good thermal conductivity, and then generate cooling in the airflow channel Air and cold air can be brought into the environmental space through natural convection or forced convection, which lowers the temperature in the environmental space and provides a way to effectively exert the performance of each cold chip, and reduce the heat load effect, reduce the volume and Refrigeration module capable of generating a sufficient amount of cold air, which can be used in air-conditioning devices and can be used as household air conditioners

Description

Refrigeration module with airflow channel and air conditioning device with refrigeration module

A cooling module with an airflow channel and an air-conditioning device with a cooling module, in particular, the low temperature generated by the low-temperature measurement of the cooling module can be conducted to a structure with an airflow channel and good thermal conductivity, and then the airflow channel Cold air is generated, which can be brought into the environmental space through natural convection or forced convection, and the temperature in the environmental space drops.

Thermoelectric Cooling Chip (Thermoelectric Cooling Chip) is a semiconductor element made of N-type semiconductor and P-type semiconductor materials connected into a galvanic pair through a circuit. After passing a DC current into the circuit, energy transfer can be generated and can be freely controlled for cooling , Heating, temperature control. The temperature difference between the two sides of the wafer is affected by the magnitude of the current. The greater the current, the greater the temperature difference.

Compared with the use of compressors and refrigerants for general refrigeration cycles, the refrigeration chip has the following characteristics: no mechanical parts and no noise; no refrigerant is used, which is more environmentally friendly; small and lightweight, the shape is easy to select; only the input current is Can be cooled or heated; long life, simple operation and easy maintenance.

Please refer to Taiwan's new patent bulletin No. M571113, "Fan Mechanism for Cooling Chip Cooling", which includes at least one fan; at least one cold air evaporator, including a water flow line located before or behind the fan, and the external water system Injected into the water flow line, the injected water flows out through the water flow line; the fan can draw air through the cold air evaporator and the fan to form a cool wind; the uniform cooling group is connected to the cold air evaporator for cooling into the water flow line Line of cooling water; a pumping device is connected to the water pipe of the refrigeration group to drive water to flow between the refrigeration group and the water flow line; the refrigeration group includes at least a uniform cooling device, the refrigeration The device includes: a heat exchange box, the water flow of the water flow line passes through the heat exchange box; a uniform cold wafer is attached to one side of the heat exchange box, used to absorb the heat of the water flow in the heat exchange box to reduce the water temperature A water cooling mechanism is attached to the other side of the cooling wafer, the external water system is input to the water cooling mechanism to dissipate heat from the cooling wafer, and then discharged from the water cooling mechanism.

Although the cooling chip is used to cool the water flow line, and the wind flow through the fan can generate cool wind, but it is only cool wind after all, and there is a considerable gap between the temperature of the air outlet of the air conditioner and the temperature of about 13~15 degrees Celsius, so the application of cooling The fan mechanism of the chip can only be used as a cooler fan, and cannot be used as a household air conditioner.

The above patent uses water cooling on both sides of the cooling wafer to cool down or dissipate heat. For example, cooling water on the cooling surface of the cooling wafer, the cooling water will flow through the water flow line of the cold air evaporator, and the cold air evaporator uses air The cooling method evaporates the cooling air and brings it out by the fan, but it is obvious that the temperature of the heat load of the cooling water will rise when flowing through the water flow line of the cold air evaporator, and the water flow line is located inside the cold air evaporator , The outside temperature of the cold air evaporator is slightly higher than that of the water flow line; even, the fan draws the outside air outside the cold air evaporator. When the outside air temperature is high, even if the outside temperature of the cold air evaporator is low, it is blown out by the fan The temperature of the wind is only lower than the outside air.

Therefore, it is necessary to provide a cooling module that can effectively exert the performance of each uniform cooling chip, reduce the heat load effect, reduce the volume, and generate a sufficient amount of cold air, which can be applied to the air conditioning device and can be used as a household air conditioner .

Provide a cooling module with air flow channels, including a cooling chip, a high-temperature conductive structure and a low-temperature conductive structure; the cooling chip has a cold generating surface that generates low temperature and a heat generating surface that generates high temperature; the high-temperature conductive structure is substantially in contact with The heat generating surface contains a heat exchange fluid that can flow. The heat exchange fluid is discharged to the high-temperature conduction structure and is cooled. The cooled heat exchange fluid is returned to the high-temperature conduction structure; One side of the low-temperature conduction structure substantially abuts on the cold-generation surface and has a plurality of airflow channels for gas to pass through. The low-temperature of the cold-generation surface is directly conducted to the surfaces of the airflow channels and then the airflow channels are transferred by heat radiation Among.

In one embodiment, the low-temperature conductive structure includes a substrate and a plurality of spacers, the substrate has two sides with a large surface area, one side is attached to the cold generating surface, and the other side is opposite to one end of the spacers In connection, an air flow channel is defined by any two partition plates and the base plate, and there is a gap between any two partition plates.

In some embodiments, a cover plate is further provided, the cover plate corresponding to one side of the substrate is connected to the free ends of the partition plates, and the airflow channels are formed by the cover plate, the two partition plates and the substrate Define.

In some embodiments, the surface of a spacer is flat, wavy, or irregularly shaped.

In some embodiments, an airflow channel or the airflow channels penetrate longitudinally, laterally, or diagonally through the low-temperature conductive structure.

In some embodiments, the low temperature conductive structure is a honeycomb structure or a grid structure.

In one embodiment, it further includes a heat dissipation device that receives the fluid led by the high-temperature conductive structure to cool the fluid, and then delivers the fluid to the high-temperature conductive structure and repeats the cycle.

An air conditioner with a cooling module is provided, which includes a main body, a fan, and a cooling module; the main body has an air duct, the air duct runs through the main body, and both sides of the main body are an air inlet and an air outlet, the The air duct is between the air inlet and the air outlet; the fan is disposed at the air inlet and can generate a wind flow.

The cooling module includes a cooling chip, a high-temperature conductive structure and a low-temperature conductive structure; the cooling chip has a cold generating surface that generates low temperature and a heat generating surface that generates high temperature; the high-temperature conductive structure is substantially in contact with the heat generating surface, inside Accommodating a heat exchange fluid that can flow, the heat exchange fluid will be discharged to the high temperature conduction structure and be cooled, and the cooled heat exchange fluid will be returned to the high temperature conduction structure; one side of the low temperature conduction structure It is substantially in contact with the cold generating surface and has a plurality of gas flow channels for the gas to pass through. The low temperature of the cold generating surface is directly transmitted to the surfaces of the gas flow channels and then transferred into the gas flow channels by heat radiation.

When the fan is running, a wind flow will be generated in the air duct, and the wind flow will pass through the air duct and the airflow passages to take out the cold air of the airflow passages from the air outlets.

Provided is an air conditioner with a refrigeration module, which includes a main body, a fan, a plurality of refrigeration modules, and a high-temperature conduction structure. The main body has a plurality of air ducts penetrating the main body, and two sides of the main body are an air inlet and an air outlet, the air passages are interposed between the air inlet and the air outlet; the fan is disposed at the air inlet and can Generate a Merry.

Each uniform cooling module includes a cooling chip and a low-temperature conducting structure; the cooling chip has a cold generating surface and a heat generating surface; the low-temperature conducting structure is disposed on the cold generating surface and is in substantial contact with a plurality of gas flow channels for gas to pass through, The low temperature of the cold generating surface is directly transmitted to the surfaces of the airflow channels, and then transferred into the airflow channels by heat radiation to generate cold air in the airflow channels; the high temperature conductive structure is simultaneously in contact with the refrigerants The heat generating surface of the module contains a heat exchange fluid that can flow. The heat exchange fluid will be discharged to the high temperature conductive structure and be cooled. The cooled heat exchange fluid will be returned to the high temperature conductive structure. .

Wherein the cooling modules are arranged at intervals in an air duct, the low-temperature conduction structures of the cooling modules must be located in the air duct, and the airflow channels of the cooling modules are connected to the air duct; When the fan is running, a wind flow will be generated in each of the wind channels, and the wind flow will pass through the wind channel and the air flow channels to take out the cold air of the air flow channels from the air outlets.

Preferably, the high-temperature conductive structure is further provided with one or more heat dissipation holes, which can improve the heat dissipation effect.

The following describes the implementation of this creation in more detail with the help of diagrams and component symbols, so that those skilled in the art can implement it after studying this manual.

The two physical quantities such as "hot" or "high temperature", "cold" or "low temperature" mentioned in the following embodiments are a relative concept existing between the two physical quantities, and hot or high temperature means relatively higher (greater than) cold Or low-temperature temperature phenomenon, conversely, cold or low temperature refers to a temperature phenomenon that is relatively lower (less than) heat or high temperature, and there will be a temperature difference between hot and cold.

The cooling wafers referred to in the following embodiments are also called cooling wafers or electric cooling wafers.

FIG. 1 is a schematic diagram showing the combination of the refrigeration module according to the described embodiment, and FIG. 2 is a schematic cross-sectional view showing the refrigeration module according to the described embodiment. As shown in FIG. 1, the cooling module 1 may include a cooling chip 11, a high-temperature conductive structure 12 and a low-temperature conductive structure 13.

The cooling wafer 11 is a semiconductor element composed of N-type semiconductor and P-type semiconductor materials connected into a galvanic pair through a circuit. When a DC current is passed into the circuit, energy transfer can be generated to cool the cooling surface of the cooling wafer 11 11a generates an endothermic effect to lower the temperature, and the opposite heat generating surface 11b generates an exothermic effect to increase the temperature.

Referring to FIGS. 1 and 2, the high-temperature conductive structure 12 has a body 120. The body 120 can be formed into a rectangular body or other suitable shape with a hollow inner space 121 using copper alloy material or aluminum alloy material, and is located at an appropriate position on the side wall of the body 120 At least one inlet 122 connecting the inner space 121 and the outside, and at least one outlet 123 connecting the inner space 121 and the outside; for example, the inlet 122 and the outlet 123 may be provided on opposite sides of the body 120, or the inlet 122 and the outlet 123 are provided on the same side of the body 120.

Connect the fluid inlet pipe 124A and the fluid outlet pipe 124B to the inlet 122 and outlet 123 of the high-temperature conductive structure 12, and then input the heat exchange fluid into the body 120 through the fluid inlet pipe 124A; the heat exchange fluid may be water or any suitable type fluid. When the cooling wafer 11 is energized with electric current, the cold generating surface 11a can lower the temperature due to heat absorption, and the heat generating surface 11b can increase the temperature due to heat radiation.

At this time, the heat exchange fluid in the body 120 can absorb heat to the heat generating surface 11b of the cooling wafer 11 to perform heat exchange, and then make the heat exchange fluid flow out through the fluid output tube 124B, and the outflowed heat exchange fluid can pass through another The heat exchange equipment (not shown in the figure) is radiated and recycled, that is, the heat exchange fluid after being cooled by the external heat dissipation device will be sent back to the body 120, so the heat exchange fluid will be in the external heat dissipation device The high-temperature conductive structures flow between each other.

In the first embodiment, when the cooling chip 11 is combined with the high-temperature conductive structure 12 and the low-temperature conductive structure 13 to form the cooling module 1, the thermally conductive adhesive can be applied to the opposite sides of the cooling chip 11, that is, cold generation The surface 11a and the heat generating surface 11b, and then adhere the heat generating surface 11b of the cooling chip 11 to the outer side wall of the body 120 of the high-temperature conductive structure 12 through the thermal conductive adhesive, and the cold generating surface 11a of the cooling chip 11 through the thermal conductive adhesive It adheres to one side of the low-temperature conductive structure 13.

FIG. 3 is a schematic diagram of a low-temperature conduction structure according to the described embodiment. As shown in FIG. 3, the low-temperature conduction structure 13 includes a substrate 131 and a plurality of partition plates 133, and the substrate 131 and the plurality of partition plates 133 constitute a plurality of air flows Channel 135.

In one embodiment, the substrate 131 and the spacer 133 are plates with appropriate thicknesses. The substrate 131 includes two opposite sides. For a clearer description of this embodiment, the opposite sides of the substrate 131 will be described in terms of surface area in the following The larger left side and right side are used for explanation; at different angles, the two opposite side surfaces of the substrate 131 can also be regarded as top and bottom surfaces.

In an embodiment, the entire substrate 131 is parallel to the cooling wafer 11, or the side with the largest surface area of the substrate 131 corresponds to the cold generating surface of the cooling wafer 11, for example, the right side of the substrate 231 can be attached or covered On the cold generating surface, preferably, the area of the right side surface of the substrate 231 may be slightly larger than the cold generating surface 11a of the cooling wafer 11 to spread the low temperature with a larger area.

The plurality of spacers 133 as a whole are not parallel to the cooling wafer 11; for example, in the relative relationship between the two, a plurality of spacers 133 and the cooling wafer 11 or between the spacer 133 and the substrate 131 form an angle or a right angle A substrate 131 is provided between the partition plate 133 and the cooling wafer.

The thicknesses of the plurality of partition plates 133 do not need to be uniform, and the intervals between them need not be equal.

In some embodiments, the substrate 131 and the plurality of spacers 133 are integrally formed, or a low-temperature conductive structure is formed by combining, welding, or other suitable methods. The materials of the substrate 131 and the plurality of spacers 133 are highly thermally conductive Metal or thermally conductive plastic.

Since the right side of the substrate 131 is flatly attached to the cold generating surface 11a of the cooling wafer 11, the low temperature generated by the cold generating surface 11a can be directly transmitted to the right side of the substrate 131, for example, the substrate 131 is a metal material with good thermal conductivity With an appropriate thickness, the substrate 131 can quickly and uniformly conduct the low temperature directly from the right side to the left side and the surface of the plurality of partition plates. The low temperature on the surface of the substrate 131 and each partition plate is transferred to by the heat radiation The air flow path 135 constituted by the plurality of partition plates 133 fills the air flow path 135 with cold air.

In one embodiment, the plurality of partition plates 133 are arranged parallel to each other, and one end of the plurality of partition plates 133 is connected to the left side surface of the substrate 131, and any two adjacent partition plates 133 are appropriately spaced. The space enclosed by 133 and the substrate 131 constitutes the airflow channel 135.

In addition, as shown in FIG. 4, a cover plate 137 is further provided; basically, the cover plate 137 is the same as the installation method of the substrate 131 in the structure itself, except that the substrate 131 is connected to the right side of the partition plate 133, and the cover plate 137 is Connected to the left side of the partition plate 133; that is, the cover plate 137 is connected to the free ends of the plurality of partition plates corresponding to the side of the substrate 131. In terms of appearance, the low-temperature conductive structure 13 is open only on the front side and the rear side The box, as shown in FIG. 4, makes the air flow channel 135 penetrate only in a single direction, so that the cold air is not easily dispersed.

In some embodiments, the surface of the partition plate 133 is flat, or the surface of the partition plate 133 is wavy (see FIG. 5), uneven surface, etc., to improve the surface of the partition plate 133 Surface area, which makes the surface area that generates low temperature larger.

As shown in FIGS. 6 and 7, the low-temperature conductive structure 13 is a grid-like structure, a honeycomb-like structure, or other structures with channels.

Fig. 8a is a perspective assembly view of an air-conditioning apparatus with a refrigeration module according to the described embodiment, and Fig. 8b is a schematic horizontal cross-sectional view of the AA section line of Fig. 8a; as shown in Fig. 8a, with a cooling mold The air conditioner 100 of the group includes a cooling module 1, a main body 3, and a fan 5.

The main body 3 has an air passage 31 and the air passage 31 penetrates the main body 3. The penetration direction of the air passage 31 through the main body can match the direction of the airflow channel of the refrigeration module 1, for example, the two are in the same direction.

In the described preferred embodiment, the air duct 31 penetrates the main body 3 along the horizontal direction, and is maintained in the same direction as the air flow channel 135 surrounded by the partition plate 133, so that the air duct 31 can be connected with the air flow The channel 135 can communicate, but it is not limited to this, that is, the penetration direction of the air channel 31 and the manner of the air flow channel depend on actual requirements. In principle, as long as the air channel can communicate with the air channel.

Air inlets 33 and air outlets 35 are provided on both sides of the main body 3, preferably, the air inlets 33 and air outlets 35 are provided on opposite sides of the main body 3, and the air passage 31 is interposed between the air inlet 33 and the air outlet 35 It is connected to the air inlet 33 and the air outlet 35; the fan 5 is installed at the air inlet 33 of the main body 3, and the fan 5 generates air flow when the fan is running, and the air flow generated by the fan 5 passes through the air duct 31, and then from the air outlet 35 outflow to the outside world.

The structure of the refrigeration module 1 is substantially the same as the previous embodiment, but mainly the low-temperature conduction structure 13 is to be disposed in the air duct 31, so each airflow channel 135 of the low-temperature conduction structure 13 will communicate with the air duct 31; when cooling When the module 1 is powered on, each airflow channel 135 will be gradually filled with cold air, so the wind flow generated when the fan is running, because the wind flow will pass through the air duct and the air flow channel, the wind flow will bring the cold air of the air flow channel out of the air outlet And into the environmental space.

Multiple sets of cooling modules 1 are provided in the air duct 31, and the cooling modules can be arranged in pairs, and the multiple sets of cooling modules are arranged in the air duct at an interval from each other. Therefore, when each cooling module is energized During operation, the cold air in the air flow channels of each cooling module will be filled in the air duct, so that the air duct is filled with cold air. For example, the fan has a faster wind speed, which may also produce a wind chill effect, which can change the temperature of the environmental space. Effective decline.

9b shows another structure that can be implemented in the main body of the air conditioner. The main body 3 is formed with two air passages 31, 32. The two air passages 31, 32 can independently penetrate the main body 3, and the opposite of the main body 3 The two outer side walls have a plurality of openings 37, and the opening 37 and the air duct are in communication with each other. In the air duct of FIG. 9b, a cooling module of upper and lower layers can be provided, and only the cooling module of the lower layer is shown in FIG. 9c; The setting principles and principles of the embodiments are basically the same as those of the foregoing embodiments, and the following is only to illustrate the implementation mode if the main body has two air ducts or more.

As in the embodiment shown in FIG. 8b, multiple sets of refrigeration modules 1 are also provided in each air duct 31 in FIG. 9c, and the multiple sets of cooling modules 1 are arranged at an interval from each other in the air duct 31 In FIG. 32, each cooling module 1 can be disposed in the air ducts 31, 32 through the opening 37, and the low-temperature conduction structure 13 of each cooling module 1 is disposed in the air ducts 31, 32.

Preferably, each refrigeration module 1 shares a high-temperature conduction structure 12, that is, the high-temperature conduction structure 12 is substantially in contact with the heat generation surface of each refrigeration module (the refrigeration module provided in the same air duct) at the same time The inside of the high-temperature conductive structure contains a heat exchange fluid that can flow. The heat-exchange fluid will be discharged to the high-temperature conductive structure and be cooled. The cooled heat-exchange fluid will be returned to the high-temperature conductive structure. ; And the high-temperature conductive structure is further provided with one or more heat dissipation holes to increase heat dissipation efficiency.

The advantage of this embodiment is that the cooling chips arranged in the same air duct can share the same high-temperature conductive structure 12, and the number of high-temperature conductive structures 12 can be saved, and the high-temperature conductive structure 12 can also be provided with an appropriate number of heat dissipation holes 125 To improve heat dissipation.

Similarly, when each cooling module is powered on, the cold air in the airflow channel of each cooling module will be filled in the air duct, so that the air duct is filled with cold air. If the fan speed is faster, it may also be generated. Wind chill effect can effectively reduce the temperature of the environmental space.

The above are only the preferred embodiments to explain this creation, not to attempt to restrict the creation in any way, so any modification or change to the creation under the same spirit of creation , Should still be included in the scope of protection of this creative intention.

1‧‧‧Refrigeration module

11‧‧‧Refrigeration chip

12‧‧‧High temperature conductive structure

13‧‧‧Low temperature conduction structure

11a‧‧‧ Cold surface

11b‧‧‧heat generation surface

120‧‧‧Body

121‧‧‧Inner space

122‧‧‧ Entrance

123‧‧‧Export

124A‧‧‧fluid input tube

124B‧‧‧Fluid output tube

125‧‧‧Ventilation holes

131‧‧‧ substrate

133‧‧‧ spacer

135‧‧‧air flow channel

137‧‧‧cover

100‧‧‧Air conditioner with refrigeration module

3‧‧‧Main

31, 32

33‧‧‧Air inlet

35‧‧‧Outlet

37‧‧‧ opening

5‧‧‧Fan

FIG. 1 is a schematic diagram showing the combination of a refrigeration module according to an embodiment described. FIG. 2 is a schematic cross-sectional view showing the refrigeration module of one embodiment described when viewed from above. FIG. 3 shows a schematic diagram of a low-temperature conduction structure according to the described embodiment. FIG. 4 is a schematic diagram of the low temperature conductive structure further including a cover plate. FIG. 5 is a schematic diagram showing that the spacer of the low-temperature conductive structure is wavy. FIG. 6 is a schematic diagram of the low-temperature conduction structure as a grid-like structure. FIG. 7 is a schematic diagram showing that the low-temperature conductive structure is a honeycomb structure. FIG. 8a is a perspective assembly view of an air-conditioning apparatus with a refrigeration module according to the described embodiment. FIG. 8b is a schematic horizontal sectional view taken along the line A-A of FIG. 8a. FIG. 9a is a perspective assembly view of an air-conditioning apparatus with a refrigeration module according to the described embodiment. Figure 9b shows a schematic view of the main body of Figure 9a. 9c is a schematic horizontal cross-sectional view taken along the line A-A of FIG. 9a.

1‧‧‧Refrigeration module

11‧‧‧Refrigeration chip

12‧‧‧High temperature conductive structure

13‧‧‧Low temperature conduction structure

11a‧‧‧ Cold surface

11b‧‧‧heat generation surface

124A‧‧‧fluid input tube

124B‧‧‧Fluid output tube

131‧‧‧ substrate

133‧‧‧ spacer

135‧‧‧air flow channel

Claims (17)

A cooling module with an air flow channel includes: a uniformly cooled chip with a cold generating surface that generates low temperature and a heat generating surface that generates high temperature; a high-temperature conductive structure that substantially contacts the heat generating surface and contains energy inside A flowing heat exchange fluid, the heat exchange fluid will be discharged to the high temperature conduction structure and be cooled, and the cooled heat exchange fluid will be returned to the high temperature conduction structure; and a low temperature conduction structure, one side is substantially It is close to the cold generating surface and has a plurality of gas flow channels for the gas to pass through. The low temperature of the cold generating surface is directly transmitted to the surfaces of the gas flow channels and then transferred into the gas flow channels by heat radiation. The refrigeration module with an air flow channel according to claim 1, wherein the low-temperature conductive structure includes a base plate and a plurality of partition plates, the base plate has two sides with a large surface area, and one side is attached to the cold generating surface, The other side is connected to one end of the partition plates. An air flow channel is defined by any two partition plates and the base plate, and there is a gap between any two partition plates. As described in claim 2, the cooling module having an airflow channel is further provided with a cover plate, the cover plate corresponding to the side of the base plate is connected with the free ends of the partition plates, and the airflow channels are formed by the cover The board, the two partition boards and the substrate are defined. The refrigeration module with airflow channels as described in claim 2, wherein the surface of a partition plate is flat, wavy, or irregularly convex. The refrigeration module with airflow channels as described in claim 2 or 3, wherein one airflow channel or the airflow channels penetrate longitudinally, laterally or diagonally through the low-temperature conduction structure. The refrigeration module with an air flow channel according to claim 1, wherein the low-temperature conduction structure is a honeycomb structure or a grid structure. The refrigeration module with an air flow channel according to claim 1, further comprising a heat dissipation device that receives the heat exchange fluid led by the high-temperature conductive structure to cool the heat exchange fluid, and then delivers the fluid Into the high temperature conductive structure. An air-conditioning device with a refrigeration module includes: a main body having an air duct penetrating the main body, two sides of the main body are an air inlet and an air outlet, the air passage is between the air inlet and the air outlet Between; a fan, installed at the air inlet, and capable of generating an air flow; and a uniform cooling module, including: a uniformly cold chip, having a cold generating surface and a heat generating surface; a heat sink, disposed at the heat generating The surface is substantially in contact with each other; and a low-temperature conduction structure is provided on the cold-generation surface and is in substantial contact with a plurality of airflow channels for gas to pass through, the low-temperature conduction structure is located in the air channel, and the airflow channels are connected to the air channel , The low temperature of the cold generating surface is directly transmitted to the surface of the airflow channels, and then transferred into the airflow channels by heat radiation to generate cold air in the airflow channels; when the fan is running, it will be in the An air current is generated in the air duct, and the air current passes through the air duct and the airflow channels to take out the cold air of the airflow channels from the air outlets. The air conditioner with a refrigeration module according to claim 8, further comprising a plurality of refrigeration modules, the refrigeration modules are arranged at intervals in the air ducts. The air conditioner with a refrigeration module according to claim 8, wherein the low-temperature conductive structure includes a base plate and a plurality of partition plates, the base plate has two sides with a large surface area, and one side is attached to the cold generating surface, The other side is connected to one end of the partition plates. An air flow channel is defined by any two partition plates and the base plate, and there is a gap between any two partition plates. According to claim 10, the air conditioner with a refrigeration module is further provided with a cover plate, the cover plate corresponding to one side of the base plate is connected with the free ends of the partition plates, and the air flow channels are formed by the cover The board, the two partition boards and the substrate are defined. The air conditioner with a refrigeration module as described in claim 10, wherein the surface of a partition plate is flat, wavy, or irregularly concave and convex. The air-conditioning apparatus having a refrigeration module according to claim 10 or 11, wherein an airflow channel or the airflow channels penetrate longitudinally, laterally, or diagonally through the low-temperature conduction structure. The air conditioner with a refrigeration module according to claim 8, wherein the low-temperature conductive structure is a honeycomb structure or a grid structure. An air conditioner with a refrigeration module includes: a main body having a plurality of air ducts penetrating the main body, and two sides of the main body are an air inlet and an air outlet, the air passages are interposed between the air inlet and the outlet Between the air outlets; a fan is provided at the air inlet and can generate an air flow; a plurality of cooling modules, the uniform cooling module includes: uniformly cooling chips, having a cold generating surface and a heat generating surface; and A low-temperature conduction structure is provided on the cold generating surface and is in substantial contact with a plurality of gas flow channels for the gas to pass through. The low temperature of the cold generating surface is directly conducted to the surfaces of the gas flow channels, and then the gas flows are transferred by heat radiation Cold air is generated in the air flow channels in the channel; and a high temperature conductive structure, which is in contact with the heat generating surface of the cooling modules at the same time, contains a heat exchange fluid that can flow inside, the heat exchange fluid will Is discharged from the high-temperature conduction structure and is cooled, and the cooled heat exchange fluid is returned to the high-temperature conduction structure; wherein, the cooling modules are arranged at intervals in an air duct The low-temperature conduction structure must be located in the air duct, and the air flow channels of the refrigeration modules are connected to the air duct; when the fan is running, a wind flow will be generated in each of the air ducts, and the air flow will pass through The air channel and the airflow channels are used to take out the cold air from the airflow channels from the air outlets. The air conditioner with a refrigeration module according to claim 15, wherein the low-temperature conductive structure includes a base plate and a plurality of partition plates, the base plate has two sides with a large surface area, and one side is attached to the cold generating surface, The other side is connected to one end of the partition plates. An air flow channel is defined by any two partition plates and the base plate, and there is a gap between any two partition plates. The air conditioner with a refrigeration module according to claim 15, wherein the high-temperature conductive structure is further provided with one or more heat dissipation holes.

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