CN219454122U

CN219454122U - Thermoelectric semiconductor air conditioner

Info

Publication number: CN219454122U
Application number: CN202320252163.3U
Authority: CN
Inventors: 谭志有
Original assignee: Youvalue Technology Zhuhai Co ltd
Current assignee: Youvalue Technology Zhuhai Co ltd
Priority date: 2023-02-20
Filing date: 2023-02-20
Publication date: 2023-08-01
Anticipated expiration: 2033-02-20

Abstract

The utility model aims to provide a thermoelectric semiconductor air conditioner which has compact structure, convenient use and good heat exchange effect. The heat-dissipating box comprises a box body, a plurality of fan groups and a heat-dissipating module, wherein the fan groups are arranged on the box body, a heat-insulating plate and a bearing block are arranged in the box body, the heat-insulating plate is arranged in the middle of the box body, the bearing block is arranged at the lower part of the box body and is in bearing fit with the heat-dissipating module, a yielding hole matched with the heat-dissipating module is formed in the heat-insulating plate, the heat-dissipating module transfers heat below the box body to the upper part of the box body, and the fan groups rotate to accelerate the flow of internal air. The utility model is applied to the technical field of semiconductor air conditioning devices.

Description

Thermoelectric semiconductor air conditioner

Technical Field

The utility model relates to the technical field of semiconductor air conditioning devices, in particular to a thermoelectric semiconductor air conditioning device.

Background

Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. The semiconductor refrigeration technology is widely applied in the prior refrigeration technology, and when direct current is introduced, joule heat is generated at the joint of a circuit and heat is released, the other joint absorbs the heat, and the heat-generating side and the heat-absorbing side are respectively provided with a heat-radiating fin, so that the heat-absorbing and heat-radiating effects in the space can be improved.

As disclosed in chinese patent publication No. CN211823255U, the semiconductor refrigerating device includes a box, a flow guiding member is disposed in the box, at least one group of semiconductor thermopiles is disposed in the flow guiding member, an outer air inlet is disposed at the upper side of the left end of the box, an outer air outlet is disposed at the lower side of the left end of the box, an inner air inlet is disposed at the upper side of the right end of the box, an inner air outlet is disposed at the lower side of the right end of the box, the outer air inlet is communicated with the outer air inlet via the flow guiding member to form an outer circulation air duct, the inner air inlet is communicated with the inner air outlet via the flow guiding member to form an inner circulation air duct, the semiconductor thermopiles include heat absorption areas and heat release areas which are disposed at intervals, and the heat exchange effect is achieved by the principle of thermal expansion and contraction of internal gas.

Disclosure of Invention

The utility model aims to solve the technical problem of overcoming the defects of the prior art and providing the thermoelectric semiconductor air conditioner which has compact structure, convenient use and good heat exchange efficiency.

The technical scheme adopted by the utility model is as follows: the heat-dissipating box comprises a box body, a plurality of fan groups and a heat-dissipating module, wherein the fan groups are arranged on the box body, a heat-insulating plate and a bearing block are arranged in the box body, the heat-insulating plate is arranged in the middle of the box body, the bearing block is arranged at the lower part of the box body and is in bearing fit with the heat-dissipating module, a yielding hole matched with the heat-dissipating module is formed in the heat-insulating plate, the heat-dissipating module transfers heat below the box body to the upper part of the box body, and the fan groups rotate to accelerate the flow of internal air.

Further, the heat dissipation module comprises a heat dissipation end, a heat absorption end, a first heat conduction plate, a second heat conduction plate, a thermoelectric piece and two groups of heat conduction gaskets, wherein the heat dissipation end is fixedly connected with the second heat conduction plate, the heat absorption end is in pressing fit with the supporting block, the first heat conduction plate and the second heat conduction plate are fixedly connected with the heat insulation plate, the two groups of heat conduction gaskets are respectively arranged on two sides of the thermoelectric piece, and the two groups of heat conduction gaskets are correspondingly and tightly attached to the first heat conduction plate and the second heat conduction plate.

Further, the heat dissipation end and the heat absorption end are correspondingly and fixedly connected with the first heat conduction plate and the second heat conduction plate through welding.

Further, the heat conduction gasket is of a soft carbon plate structure.

Further, the heat dissipation end and the heat absorption end are both fin type heat conduction structures.

Further, the box body is made of foaming materials.

Further, a drain is further arranged at the lower part of the box body, and the drain is arranged at one side of the fan group.

Further, a filter cover is arranged on the outer side of the fan group.

Further, the lower extreme of box is equipped with the air inlet, air inlet department is equipped with the isolation net.

Further, the two fan groups positioned at the upper part of the box body are all arranged at an inclined angle of 20-30 degrees.

The beneficial effects of the utility model are as follows: the heat insulation plate divides the box body into the upper heat dissipation area and the lower heat absorption area, the heat dissipation module is electrified to generate a temperature difference, one side of the heat dissipation module generates heat to do work, the other side of the heat dissipation module absorbs environmental heat, two groups of fan groups are arranged in the upper heat dissipation area of the box body, the two groups of fan groups are opposite in arrangement direction, the flow speed of internal air is improved, hot air flows out of the heat dissipation area faster, the heat dissipation efficiency is improved, meanwhile, a group of fan groups are arranged at the lower part of the box body, and the cooled air is blown out while the air outside the heat absorption area is sucked, so that the gas circulation efficiency is improved; the contact surfaces of the thermoelectric piece, the heat dissipation end and the heat absorption end are provided with a certain convexity in the manufacturing process, the whole body is in an uneven state, the soft carbon sheet structure can better fill gaps among the thermoelectric piece, the heat dissipation end and the heat absorption end, so that the thermoelectric piece, the heat dissipation end and the heat absorption end are tightly attached, meanwhile, the soft carbon sheet has a certain hardness, has good high temperature resistance, and can keep good heat conduction performance for a long time when being used at a high temperature.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is another view of a schematic structural diagram of the present utility model;

FIG. 3 is a schematic view of the structure of the case and the heat dissipation module of the present utility model;

FIG. 4 is another view of the structure of the case and the heat dissipation module according to the present utility model;

FIG. 5 is a schematic diagram of a heat dissipating module according to the present utility model;

FIG. 6 is a cross-sectional view of the present utility model;

fig. 7 is a partial enlarged view of a portion a in fig. 6.

Detailed Description

As shown in fig. 1 to 7, in this embodiment, the present utility model includes a case 1, a plurality of fan groups 2 and a heat dissipation module 3, the plurality of fan groups 2 are disposed on the case 1, a heat insulation board 11 and a supporting block 12 are disposed in the case 1, the heat insulation board 11 is disposed in the middle of the case 1, the supporting block 12 is disposed at the lower portion of the case 1 and is in supporting fit with the heat dissipation module 3, a relief hole adapted to the heat dissipation module 3 is disposed on the heat insulation board 11, the heat dissipation module 3 transfers the heat below the case 1 to the upper portion of the case 1, the plurality of fan groups 2 rotate to accelerate the flow of internal air, the heat insulation board 11 separates the case 1 into an upper heat dissipation area and a lower heat absorption area, the heat dissipation module 3 is electrified to generate a temperature difference, one side generates heat and applies work, the other side absorbs ambient heat, two fan groups 2 are disposed in the upper portion of the case 1, the directions of the two fan groups 2 are opposite, the flow of internal air is increased, the hot air flows out from the heat dissipation area more quickly, and the lower heat dissipation efficiency is increased, and the air is cooled by the fan groups 2 are disposed at the lower portion of the lower heat dissipation area, and the heat absorption area is cooled.

In this embodiment, the heat dissipation module 3 includes a heat dissipation end 31, a heat absorption end 32, a first heat conduction plate 33, a second heat conduction plate 34, a thermoelectric element 35 and two sets of heat conduction gaskets 36, the heat dissipation end 31 is fixedly connected with the second heat conduction plate 34, the heat absorption end 32 is in pressing fit with the supporting block, the first heat conduction plate 33 and the second heat conduction plate 34 are fixedly connected with the heat insulation plate 11, the two sets of heat conduction gaskets 36 are respectively arranged at two sides of the thermoelectric element 35, the two sets of heat conduction gaskets 36 are correspondingly and tightly attached to the first heat conduction plate 33 and the second heat conduction plate 34, the thermoelectric element 35 is connected with an external power supply, one side of the thermoelectric element is heated and the other side is heated, the heat dissipation end 31 is arranged at one end of the thermoelectric element 35, the heat absorption end 32 is arranged at one end of the thermoelectric element 35, the whole heat dissipation module 3 is vertically arranged, the whole structure is compact and light, the whole occupation space is small, the whole design is capable of independently controlling the cooling efficiency, and no additional mechanical noise is generated, and the cooling effect is achieved.

In this embodiment, the heat dissipation end 31 and the heat absorption end 32 are respectively and correspondingly fixedly connected with the first heat conduction plate 33 and the second heat conduction plate 34 through welding.

In this embodiment, the heat conducting pad 36 is a soft carbon sheet structure, and has a certain convexity between the contact surfaces of the thermoelectric element 35, the heat dissipation end 31 and the heat absorption end 32 in the manufacturing process, and the whole body presents an uneven state, so that the soft carbon sheet structure can better fill the gaps between the thermoelectric element 35, the heat dissipation end 31 and the heat absorption end 32, and make the gaps closely attached, and meanwhile, the soft carbon sheet has a certain hardness, has good high temperature resistance, and can keep good heat conducting performance for long-time use in high temperature.

In this embodiment, the heat dissipation end 31 and the heat absorption end 32 are both fin type heat conduction structures, the fin type heat conduction structures in unit space have high heat dissipation cotton knots and heat exchange efficiency, floating sundries are not easy to accumulate in the long-time use process, daily cleaning is convenient and efficient, and operation and maintenance costs are reduced.

In this embodiment, the case 1 is made of a foaming material, which has light weight, high strength and good heat insulation, so that heat conduction from the wall of the case 1 is effectively reduced, and the heat insulation effect of the whole mechanism is improved.

In this embodiment, a drain 4 is further disposed at the lower portion of the case 1, and the drain 4 is disposed at one side of the fan set 2.

In this embodiment, a filter cover 5 is disposed on the outer side of the fan assembly 2.

In this embodiment, an air inlet 6 is provided at the lower end of the box 1, and an isolation net is provided at the air inlet 6.

In this embodiment, the two fan sets 2 located at the upper part of the box 1 are all arranged at an inclination angle of 20-30 degrees, and the air flow enters the upper heat dissipation area along the fan sets 2.

The working principle of the utility model is as follows:

the thermoelectric element 35 is powered on to generate a temperature difference, one side absorbs heat, the other side emits heat, the heat dissipation end 31 and the heat absorption end 32 are respectively connected with two sides of the thermoelectric element 35, the heat absorption end 32 absorbs heat from the heat absorption area, the heat dissipation end 31 emits the heat absorbed by the heat absorption area, and the fan set 2 pushes air in the heat absorption area and the heat dissipation area respectively to accelerate the flow speed.

While the embodiments of this utility model have been described in terms of practical aspects, they are not to be construed as limiting the meaning of this utility model, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.

Claims

1. The utility model provides a thermoelectric semiconductor air conditioner, it includes box (1) and a plurality of fan group (2), a plurality of fan group (2) set up on box (1), its characterized in that: the semiconductor air conditioner device further comprises a heat radiation module (3), a heat insulation plate (11) and a bearing block (12) are arranged in the box body (1), the heat insulation plate (11) is arranged in the middle of the box body (1), the bearing block (12) is arranged at the lower part of the box body (1) and is in supporting fit with the heat radiation module (3), a yielding hole matched with the heat radiation module (3) is formed in the heat insulation plate (11), the heat radiation module (3) transfers heat below the box body (1) to the upper part of the box body (1), and a plurality of fan groups (2) rotate to accelerate internal air flow.

2. The thermoelectric semiconductor air conditioning apparatus as set forth in claim 1, wherein: the heat dissipation module (3) comprises a heat dissipation end (31), a heat absorption end (32), a first heat conduction plate (33), a second heat conduction plate (34), a thermoelectric piece (35) and two groups of heat conduction gaskets (36), wherein the heat dissipation end (31) is fixedly connected with the second heat conduction plate (34), the heat absorption end (32) is in pressing fit with a supporting block, the first heat conduction plate (33) and the second heat conduction plate (34) are fixedly connected with the heat insulation plate (11), the two groups of heat conduction gaskets (36) are respectively arranged on two sides of the thermoelectric piece (35), and the two groups of heat conduction gaskets (36) are correspondingly tightly attached to the first heat conduction plate (33) and the second heat conduction plate (34).

3. A thermoelectric semiconductor air conditioning apparatus as set forth in claim 2, wherein: the heat dissipation end (31) and the heat absorption end (32) are fixedly connected with the first heat conduction plate (33) and the second heat conduction plate (34) correspondingly through welding.

4. A thermoelectric semiconductor air conditioning apparatus as set forth in claim 2, wherein: the heat conducting pad (36) is of a soft carbon sheet structure.

5. A thermoelectric semiconductor air conditioning apparatus as set forth in claim 2, wherein: the heat dissipation end (31) and the heat absorption end (32) are of fin type heat conduction structures.

6. The thermoelectric semiconductor air conditioning apparatus as set forth in claim 1, wherein: the box body (1) is made of foaming materials.

7. The thermoelectric semiconductor air conditioning apparatus as set forth in claim 1, wherein: the lower part of the box body (1) is also provided with a drainage piece (4), and the drainage piece (4) is arranged at one side of the fan group (2).

8. The thermoelectric semiconductor air conditioning apparatus as set forth in claim 1, wherein: the outside of the fan group (2) is provided with a filter cover (5).

9. The thermoelectric semiconductor air conditioning apparatus as set forth in claim 1, wherein: the lower extreme of box (1) is equipped with air inlet (6), air inlet (6) department is equipped with the isolation network.

10. The thermoelectric semiconductor air conditioning apparatus as set forth in claim 1, wherein: the two fan groups (2) positioned at the upper part of the box body (1) are arranged at an inclined angle of 20-30 degrees.