CN212199411U - 包括受保护以防褪色的银表面的基材 - Google Patents
包括受保护以防褪色的银表面的基材 Download PDFInfo
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- CN212199411U CN212199411U CN201921583061.XU CN201921583061U CN212199411U CN 212199411 U CN212199411 U CN 212199411U CN 201921583061 U CN201921583061 U CN 201921583061U CN 212199411 U CN212199411 U CN 212199411U
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Abstract
本实用新型涉及一种基材(1),它包括最终银表面,该最终银表面通过保护层(4)来防止银褪色,该保护层具有介于1nm和200nm之间的厚度。所述保护层(4)包括第一Al2O3层(4a),该第一Al2O3层设置在所述最终银表面上并且具有介于0.5nm和100nm之间的厚度,所述保护层还包括在该第一Al2O3层(4a)上的第二TiO2层(4b),该第二TiO2层具有介于0.5nm和100nm之间的厚度。
Description
技术领域
本实用新型涉及一种基材,它包括最终银表面,该银表面由保护层保护以防止银褪色(失去光泽,变暗)。特别地,这种包括银表面的基材可以是覆有银的薄层的钟表元件,例如表盘、镶字块或指针。本实用新型还涉及这种基材的制造工艺。
背景技术
在钟表领域,为了赋予钟表元件洁白且独特的银色外观,通常通过在基材上覆盖银的薄层来制成钟表元件,该薄层优选通过电镀的方式设置。例如,这种钟表元件可以是由黄铜或金制成的表盘,它覆盖有银的薄层。
然而,银具有会随着时间的推移而失去光泽的缺点。为解决这一问题,已知通过涂亮漆的方法保护钟表元件的敏感的银表面。亮漆是一种可在溶剂中稀释的纤维素清漆。涂亮漆是这样的方法,即,通过诸如喷涂等方式在待保护的表面涂覆多个亮漆式清漆层,然后进行烘烤以加速其固化。最终涂层的总厚度介于约8μm至15μm之间。
然而,这种亮漆式清漆对敏感金属的保护不够完善。另外,所需涂覆的亮漆式清漆的厚度会模糊结构上的细节,例如常用于装饰表盘的扭索纹。扭索纹的细节因而未能被突出,甚至可能消失于数层清漆之下。结果,数层亮漆式清漆通过改变参数L*(CIE L*a*b*色彩空间),从而改变了受保护的银表面的颜色和外观。
为替代涂亮漆方法,提出通过ALD工艺在敏感的银表面上设置保护层,如专利EP1994202中所述的。通过这种方法,可以设置极薄(介于 50nm和100nm之间)且具有高保护性的覆层,所获得的保护高于通常涂覆10μm的亮漆式清漆时所获得的保护。
然而,这种ALD工艺具有这样的缺点,即,基材的银表面上如果设置了不适当的保护层,则会降低银的亮度和颜色,改变银表面的美学效果。
另外,这种ALD工艺还有这样的缺点,即,可能在基材的银表面上形成与所述银表面之间黏附性较低的保护层,从而使得通过ALD工艺设置的保护层在最轻微的应力下都可能分解,例如,在通过移印工艺或其他工艺进行最终的装饰工序时。
实用新型内容
本实用新型为了消除这些缺点而提出一种基材,该基材具有受保护的银表面(含银表面,银色表面),可以有效地防止银褪色,同时,还可以保持所述银表面的最终外观,特别是银的亮度和颜色。
因此,本实用新型涉及一种基材,它包括最终银表面,该最终银表面被保护层保护以防止银褪色,该保护层的厚度介于1nm和200nm之间。
根据本实用新型,所述保护层包括第一Al2O3层和在该第一Al2O3层上的第二TiO2涂层,该第一Al2O3层设置(沉积)在所述最终银表面上并且具有介于0.5nm和100nm之间的厚度,该第二TiO2层具有介于0.5nm 和100nm之间的厚度。
优选地,该基材包括处于保护层的下面的基本为纯银(基本上纯净的银)的层或银合金的层,它的厚度介于1微米和3微米之间。该厚度使得可以:
-恰当地封闭该基本为纯银的层或银合金的层,也就是形成没有孔隙的层。该没有孔隙的层形成完全均匀的表面,以用于设置该保护层。这样,该基材上没有暴露的区域,特别是在设置保护层后可能可见的非银部分上。
-维持在5微米以下,如果厚度大于或等于5微米的话,将会磨光装饰,如表盘。例如,手工扭索纹的深度介于30微米和50微米之间,会随着沉积厚度的增加而模糊。
本发明还涉及这种包括由保护层来防止银褪色的最终银表面的基材的制造工艺,所述制造工艺包括如下步骤:
a)准备具有最终银表面的基材;
b)在步骤a)的所述最终银表面的至少一部分上设置至少一个防止银褪色的保护层,该保护层的厚度介于1nm和200nm之间,所述步骤b) 包括第一步骤b1),在该第一步骤b1)中,在步骤a)的所述最终银表面的至少一部分上设置厚度介于0.5nm和100nm之间的第一Al2O3层,所述步骤b)还包括第二步骤b2),在该第二步骤b2)中,在由步骤b1)获得的第一Al2O3层上设置厚度介于0.5nm和100nm之间的第二TiO2层。
出人意料,第一Al2O3层和第二TiO2层的顺序和厚度可以获得防止银褪色的保护层,在最大限度上使银的颜色更洁白,保持基材的最终表面的银的亮度。
根据本实用新型,该工艺包括步骤a3),在该步骤a3)中,在所述基材上设置基本为纯银的层以获得所述最终银表面,所述基本为纯银的层的厚度优选介于1000nm和3000nm之间。
根据一种变型,该制造工艺包括步骤a1),在该步骤a1)中,在所述基材上设置形成所述最终银表面的基础银铜合金的层,其中,“基础银铜合金”是指相对于合金的总重量铜的重量百分比介于0.1%和10%之间的银铜合金,所述基础银铜合金的层的厚度优选介于1000nm和3000nm之间。
附图说明
从下面参考附图以非限制性示例给出的说明中,将清楚本实用新型的其他特征和优点。在附图中:
-图1是根据本实用新型的基材的第一变型的示意图。
-图2是根据本实用新型的基材的第二变型的示意图。
-图3是根据本实用新型的基材的第三变型的示意图。
具体实施方式
本实用新型涉及这样的基材,该基材包括最终银表面,该银表面由保护层保护以防止银失去光泽。
这种基材例如是钟表元件或珠宝元件,特别是钟表装配元件。特别地,基材可以是钟表的表盘,它的表面上具有一定的结构,例如扭索纹,即一组具有细节的线条,它们彼此相交以获得装饰效果。基材还可以是标记、表盘上镶嵌的装饰(月相或其他装饰)或指针。
基材优选是金属的。它可以由黄铜、黄金、白金、银或任何其他适当的贵金属、贵金属合金或非贵金属、非贵金属合金制成。
基材可以具有或不具有初始银表面。
基材可以具有初始银表面,因此,所述基材的原料为银(纯银或银合金,特别是银的重量百分比大于90%的银合金),并且原本就具有所述初始银表面,这一初始银表面也形成最终银表面。因此,保护层直接沉积在原料为银(以银为基础物质)的基材上。
参考图1,图中示出根据本实用新型第一变型的基材1,该基材1可以不具有初始银表面,或者原本就包括银表面。在第一种情况下,基材可以例如由黄铜、黄金、白金或除银以外所有适当的贵金属、贵金属合金或非贵金属、非贵金属合金制成。在第二种情况下,基材1的原料是银,例如由整块的(实心的)银制成,并且原本就具有初始银表面。
有利地,基材1包括银铜合金的层2,以形成所述最终银表面,其中所述银铜合金是相对于合金的总重量铜的重量百分比介于0.1%和10%之间的“基础银铜合金”。银铜合金的层2可以直接沉积在基材1上、特别是当基材1的原料不是银时,该银铜合金的层可以替代惯用的薄银覆层。可以通过任何适当的工艺沉积银铜合金的层2,如PVD(闪蒸沉积)工艺或以适当的银铜电镀浴进行电镀。
参考图2,其中示出根据本实用新型第二变型的基材10,该基材10 的原料不是银并且包括基本为纯银的层20,以形成所述最终银表面。这种层20优选通过电镀工艺沉积。基材10自身可以由黄铜制成,并且覆盖有贵金属的层例如金层,该层例如通过电镀工艺设置。基材10还可以由整块的贵金属制成,例如由整块金制成。如有需要,可以使用本领域技术人员已知的中间金属层来避免因热处理或ALD工艺而导致的某些金属之间可能出现的扩散现象。
参考图3,其中示出根据本实用新型第三变型的基材100,该基材100 的原料不是银并且包括银铜合金的层2以形成所述最终银表面,其中所述银铜合金是相对于合金的总重量铜的重量百分比介于0.1%和10%之间的“基础银铜合金”。另外,在所述基材100和所述银铜合金的层2之间,基材100包括基本为纯银的层20。
无论哪个具有基本为纯银的层的变型,所述基本为纯银的层20的厚度均介于200nm和3000nm之间。
根据一种实施方式,基本为纯银的层20的厚度介于200nm和600nm 之间,优选介于300nm和500nm之间,以形成薄的银覆层。
根据一种优选实施方式,基本为纯银的层20的厚度介于1000nm和 3000nm之间,优选介于1500nm和2500nm之间,以形成厚的银覆层。
这种厚的银覆层有利地用于获得无孔隙的基本为纯银的中间层或最终层,以使得基材能获得无孔隙的最终银表面,并且因此确保用于防止银褪色的保护层在所述最终银表面上具有更强的黏附性。
无论哪个具有银铜合金的层的变型,所述银铜合金的层2的厚度均介于200nm和600nm之间,有利地介于300nm和400nm之间,或者,优选地,其厚度介于1000nm和3000nm之间,优选地介于1500nm和2500nm 之间,以形成具有上述优点的厚的覆层。
优选地,在银铜合金中,相对于银铜合金的总重量,铜的重量百分比介于0.2%和8%之间的银铜合金称为“第一特定基础银铜合金”,铜的重量百分介于0.5%和7%之间的银铜合金称为“第二特定基础银铜合金”。因为银铜合金形成基材的最终银表面,所以铜与银的比例选择为,使得在表面产生足够的铜自由基,这在不改变银的颜色的情况下,确保了用于防止银褪色的保护层的黏附性。
基材的最终银表面—无论是基材1或100的银铜合金层2,还是基材10的基本为纯银的层20,或是自身原料为银的基材的初始银表面—均由保护层4保护以防止银褪色,所述保护层4的厚度介于1nm和200nm之间,优选介于1nm和100nm之间,更优选介于40nm和100nm之间。
根据本实用新型,所述保护层4包括第一Al2O3层4a和处于该第一 Al2O3层4a上的第二TiO2层4b,该第一Al2O3层4a设置在所述最终银表面上并具有介于0.5nm和100nm之间且优选介于0.5nm和50nm之间的厚度,该第二TiO2层4b具有介于0.5nm和100nm之间且优选介于0.5nm 和50nm之间的厚度。
特别优选地,第一Al2O3层4a的厚度介于30nm和50nm之间,第二 TiO2层4b的厚度介于10nm和50nm之间。
有利地,通过从包括ALD工艺(原子层沉积)、PVD工艺(物理气相沉积)、CVD工艺(化学气相沉积)和溶胶凝胶工艺的组中选择的方法来设置保护层4。优选地,保护层4通过ALD工艺设置。通过ALD工艺相继设置第一Al2O3层4a和第二TiO2层4b可以形成紧凑的层,并且可以获得极薄且具有高保护性的覆层,这具有特别好的美学效果。本领域技术人员熟知这种ALD工艺的细节和参数。它例如在专利EP1994202中被描述。Al2O3层可通过前体TMA(三甲基铝)获得,该前体的氧化可以通过 H2O、O2或O3来进行。TiO2层可通过TTIP(四异丙醇钛)或TiCl4(四氯化钛)获得,其氧化可以通过H2O、O2或O3来进行。
特别优选地,防止银褪色的保护层4可以通过由ALD工艺设置厚度介于30nm和50nm之间的第一Al2O3层4a和厚度介于10nm和50nm之间的第二TiO2层4b来获得。
出人意料,第一Al2O3层和第二TiO2层的顺序和厚度的组合使得能获得防止银褪色的保护层,该保护层在最大限度上使银的颜色更洁白,并能保持基材的最终表面的银的亮度。
通过包括如下步骤的制造工艺获得根据本实用新型的基材:
a)提供具有最终银表面的基材1、10、100;
b)在步骤a)的所述最终银表面的至少一部分上设置至少一个防止银褪色的保护层4,该保护层的厚度介于1nm和200nm之间,优选介于1nm 和100nm之间,更优选介于40nm和100nm之间,所述步骤b)包括第一步骤b1),在该第一步骤b1)中,在步骤a)的所述最终银表面的至少一部分上设置第一Al2O3层4a,其厚度介于0.5nm和100nm之间且优选介于0.5nm和50nm之间,所述步骤b)还包括第二步骤b2),在该第二步骤b2)中,在通过步骤b1)获得的第一Al2O3层4a上设置第二TiO2层4b,其厚度介于0.5nm和100nm之间且优选介于0.5nm和50nm之间。
特别优选地,第一Al2O3层4a的厚度介于30nm和50nm之间,第二 TiO2层4b的厚度介于10nm和50nm之间。
有利地,通过从包括ALD工艺、PVD工艺、CVD工艺和溶胶凝胶工艺的组中选择的方法完成步骤b)。
特别优选地,通过ALD工艺完成步骤b)。
有利地,本实用新型的方法可以在步骤b2)之前和/或之后将保护层的设置与等离子体—通常为氩气等离子体—的处理相结合,以降低所设置的保护层的内部张力。这种结合可以柔化保护层,使其在诸如机械应力、热应力或其他应力等环境应力的作用下不那么易碎。
有利地,本实用新型的基材的制造方法在步骤a)和步骤b)之间可以包括至少一个步骤c),在该步骤c)中,通过等离子体预处理在步骤a) 中获得的基材的最终银表面。
通过等离子体进行预处理的步骤c)旨在为基材的最终银表面除垢,以便尤其消除基材暴露于空气时其表面自然形成的硫化物AgS/Ag2S,这些硫化物会影响保护层4的黏附性。
有利地,该步骤c)包括通过氩气等离子体或氩气/氢气等离子体进行的预处理。
根据本实用新型的基材的制造方法的一种实施方式,步骤b)直接在步骤c)之后进行,无需其他补充预处理。
根据另一种实施方式,本实用新型的基材的制造方法在步骤c)和步骤b)之间包括补充的中间步骤d),该中间步骤d)为氧化预处理,以允许建立AgO/Ag2O位点,它们在第一层4a所包含的Al2O3和基材的最终银表面所包含的银之间形成共价键,以促进保护层4在基材上的黏附性。
根据一种变型,步骤d)的氧化预处理可以包括使用诸如氧气或氩气/ 氧气等氧化剂所进行的等离子体预处理,以允许建立AgO/Ag2O位点。
为足够建立AgO/Ag2O位点,等离子体中的O2的剂量必须非常精确,但AgO/Ag2O位点有使银变黄的倾向,因此需同时确保银的洁白程度。
本领域技术人员已知等离子体处理工艺的参数,无需在此提供进一步的详细信息。
根据另一变型,步骤d)的氧化预处理在于将液态水或液态过氧化氢注入真空的预处理室中,使得水或过氧化氢蒸发,与基材接触,从而形成 AgO/Ag2O位点。所注入的水或过氧化氢的量约为几十微摩尔。
特别有利地,在步骤c)和步骤d)之间不通风的情况下完成所述步骤 d)。为此目的,根据步骤c)预处理的基材在不破坏真空的情况下根据步骤d)进行补充的预处理。
另外,通过步骤a)获得基材,并且仅根据步骤c)或根据步骤c)和步骤d)对其进行预处理,然后,有利地,将基材在真空下转移至沉积、优选通过ALD工艺沉积,以在根据步骤c)或根据步骤c)和步骤d)进行预处理的基材上直接完成步骤d),无需对基材的最终银表面进行通风。
为此目的,有利地,预处理步骤c)和步骤d)以及保护层沉积—优选通过ALD工艺进行—的步骤b)在同一整体处理机器中完成,其中,根据步骤c)或根据步骤c)和步骤d)的预处理设备集成在保护层4的沉积—优选通过ALD工艺进行—设备中,在不对基材的最终银表面进行通风的情况下、优选在真空下进行整体的处理,以完成步骤c),或者d),如果存在步骤b),则也一并完成。
步骤a)的基材1、10、100是金属的,优选其原料为金或银。
步骤a)的所述基材可以包括初始银表面,因此,所述基材的原料为银,并且原本就具有所述初始银表面,该初始银表面也形成最终银表面。因此,根据步骤b),保护层4直接设置在原料为银的基材上。
根据另一变型,如果基材是整块银的,则其颜色不会像最终银那般洁白,因此,在设置保护层之前,可以通过电镀或真空工艺在该整块银上设置一层最终银。
根据另一优选变型,步骤a)的基材1、100具有或不具有初始银表面,根据本实用新型的基材的形成工艺可以包括步骤a1),在该步骤a1)中,在所述基材1、100上设置银铜合金的层2—其中相对于合金的总重量铜的重量百分比介于0.1%和10%之间—以获得所述最终银表面,如图1所示。
根据另一优选变型,如果步骤a)的基材100不具有初始银表面,则根据本实用新型的基材的形成工艺可以包括中间步骤a2),在该中间步骤 a2)中,在所述基材100和银铜合金的层2之间设置基本为纯银的层20,如图3所示。
根据另一优选变型,如果步骤a)的基材10不具有初始银表面,则根据本实用新型的基材的形成工艺可以包括步骤a3),在该步骤a3)中,在所述基材10上设置基本为纯银的层20,以获得所述最终银表面,如图2 所示。它同样适用于步骤a)的基材具有初始银表面的情况。
有利地,可在步骤a1)、步骤a2)或步骤a3)中的至少一个之前和/ 或在步骤b)之前对基材1、10、100进行热处理,以缓和与之前层的设置或加工的步骤相关的任何可能的内应力。热处理的温度和时间取决于基材和层的性质,并且,在沉积步骤b)的保护层之前,不得影响部件的美观。本领域技术人员熟知热处理工艺的参数,无需在此提供更详细的信息。
无论哪一具有基本为纯银的层的变型,所述基本为纯银的层20的厚度均介于200nm和3000nm之间。
根据一个实施方式,基本为纯银的涂层20的厚度介于200nm和600nm 之间、优选介于300nm和500nm之间,用以形成薄的银覆层。
根据另一优选实施方式,基本为纯银的层20的厚度介于1000nm和 3000nm之间,优选介于1500nm和2500nm之间,用以形成厚的银覆层,如上文中所说明的那样。
无论哪一具有银铜合金的层的变型,所述银铜合金的层2的厚度均介于200nm和600nm之间,有利地介于300nm和400nm之间,或者,优选地,其厚度介于1000nm和3000nm之间,优选于1500nm和2500nm之间,用以形成如上文所述的厚覆层。
优选地,银铜合金为铜的重量百分比相对于银铜合金的总重量介于 0.2%和8%之间的第一特定基础银铜合金,还优选为铜的重量百分比相对于银铜合金的总重量介于0.5%和7%之间的第二特定基础银铜合金。
当基材的表面上具有一定的结构如扭索纹时,根据本实用新型的基材的制造工艺的步骤a)包括一子步骤,根据该子步骤,在基材的表面上制成所述结构。
根据本实用新型的基材包括最终银表面,并通过保护层来防止银褪色,特别地,当保护层通过ALD工艺设置时,它具有银的非常洁白的外观和亮度,即使存在所述防止银褪色的保护层,也可以维持这种外观和亮度。如果基材上加工有扭索纹,即使存在所述防止银褪色的保护层,扭索纹的细节也依旧清晰可见。
另外,根据本实用新型的基材具有防止银褪色的保护层,并且其黏着性良好。
根据本实用新型的基材还可以用于生产珠宝、书写工具、眼镜和皮革制品。
Claims (41)
1.一种基材(1、10、100),它包括最终银表面,该最终银表面被保护层(4)保护以防止银褪色,该保护层的厚度介于1nm和200nm之间,所述保护层(4)包括第一Al2O3层(4a),该第一Al2O3层设置在所述最终银表面上并且具有介于0.5nm和100nm之间的厚度,该保护层(4)还包括在该第一Al2O3层(4a)上的第二TiO2层(4b),该第二TiO2层具有介于0.5nm和100nm之间的厚度,该基材的特征在于,所述基材包括形成所述最终银表面的基础银铜合金的层(2)。
2.根据权利要求1所述的基材,其特征在于,第一Al2O3层(4a)的厚度介于30nm和50nm之间;第二TiO2层(4b)的厚度介于10nm和50nm之间。
3.根据权利要求1所述的基材,其特征在于,该保护层(4)是通过ALD工艺设置的。
4.根据权利要求1所述的基材,其特征在于,该基材的原料为银。
5.根据权利要求1所述的基材,其特征在于,该基材的原料是除银以外的金属材料。
6.根据权利要求1所述的基材,其特征在于,所述基材不具有初始银表面;以及,该基材在所述基材和所述基础银铜合金的层(2)之间包括纯银的层(20)。
7.根据权利要求6所述的基材,其特征在于,该纯银的层(20)具有介于200nm和3000nm之间的厚度。
8.根据权利要求7所述的基材,其特征在于,该纯银的层(20)具有介于200nm和600nm之间的厚度。
9.根据权利要求7所述的基材,其特征在于,该纯银的层(20)具有介于300nm和500nm之间的厚度。
10.根据权利要求7所述的基材,其特征在于,该纯银的层(20)具有介于1000nm和3000nm之间的厚度。
11.根据权利要求7所述的基材,其特征在于,该纯银的层(20)具有介于1500nm和2500nm之间的厚度。
12.根据权利要求1至6之一所述的基材,其特征在于,该基础银铜合金的层(2)具有介于200nm和600nm之间的厚度。
13.根据权利要求1至6之一所述的基材,其特征在于,该基础银铜合金的层(2)具有介于300nm和400nm之间的厚度。
14.根据权利要求1至6之一所述的基材,其特征在于,该基础银铜合金的层(2)具有介于1000nm和3000nm之间的厚度。
15.根据权利要求1至6之一所述的基材,其特征在于,该基础银铜合金为第一特定基础银铜合金。
16.根据权利要求1至6之一所述的基材,其特征在于,该基础银铜合金为第二特定基础银铜合金。
17.根据权利要求1所述的基材,其特征在于,该基材(1、10、100)用于形成钟表元件。
18.根据权利要求1所述的基材,其特征在于,该基材具有表面结构。
19.根据权利要求1所述的基材,其特征在于,所述保护层的厚度介于1nm和100nm之间。
20.根据权利要求1所述的基材,其特征在于,所述第一Al2O3层具有介于0.5nm和50nm之间的厚度。
21.根据权利要求1所述的基材,其特征在于,所述第二TiO2层具有介于0.5nm和50nm之间的厚度。
22.一种基材(1、10、100),它包括最终银表面,该最终银表面被保护层(4)保护以防止银褪色,该保护层的厚度介于1nm和200nm之间,所述保护层(4)包括第一Al2O3层(4a),该第一Al2O3层设置在所述最终银表面上并且具有介于0.5nm和100nm之间的厚度,该保护层(4)还包括在该第一Al2O3层(4a)上的第二TiO2层(4b),该第二TiO2层具有介于0.5nm和100nm之间的厚度,该基材的特征在于,所述基材包括形成所述最终银表面的纯银的层(20)。
23.根据权利要求22所述的基材,其特征在于,第一Al2O3层(4a)的厚度介于30nm和50nm之间;第二TiO2层(4b)的厚度介于10nm和50nm之间。
24.根据权利要求22所述的基材,其特征在于,该保护层(4)是通过ALD工艺设置的。
25.根据权利要求22所述的基材,其特征在于,该基材的原料为银。
26.根据权利要求22所述的基材,其特征在于,该基材的原料是除银以外的金属材料。
27.根据权利要求22所述的基材,其特征在于,该纯银的层(20)具有介于200nm和3000nm之间的厚度。
28.根据权利要求27所述的基材,其特征在于,该纯银的层(20)具有介于200nm和600nm之间的厚度。
29.根据权利要求27所述的基材,其特征在于,该纯银的层(20)具有介于300nm和500nm之间的厚度。
30.根据权利要求27所述的基材,其特征在于,该纯银的层(20)具有介于1000nm和3000nm之间的厚度。
31.根据权利要求27所述的基材,其特征在于,该纯银的层(20)具有介于1500nm和2500nm之间的厚度。
32.根据权利要求23至26之一所述的基材,其特征在于,该基础银铜合金的层(2)具有介于200nm和600nm之间的厚度。
33.根据权利要求23至26之一所述的基材,其特征在于,该基础银铜合金的层(2)具有介于300nm和400nm之间的厚度。
34.根据权利要求23至26之一所述的基材,其特征在于,该基础银铜合金的层(2)具有介于1000nm和3000nm之间的厚度。
35.根据权利要求23至26之一所述的基材,其特征在于,该基础银铜合金为第一特定基础银铜合金。
36.根据权利要求23至26之一所述的基材,其特征在于,该基础银铜合金为第二特定基础银铜合金。
37.根据权利要求22所述的基材,其特征在于,该基材(1、10、100)用于形成钟表元件。
38.根据权利要求22所述的基材,其特征在于,该基材具有表面结构。
39.根据权利要求22所述的基材,其特征在于,所述保护层的厚度介于1nm和100nm之间。
40.根据权利要求22所述的基材,其特征在于,所述第一Al2O3层具有介于0.5nm和50nm之间的厚度。
41.根据权利要求22所述的基材,其特征在于,所述第二TiO2层具有介于0.5nm和50nm之间的厚度。
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US6251759B1 (en) | 1998-10-03 | 2001-06-26 | Applied Materials, Inc. | Method and apparatus for depositing material upon a semiconductor wafer using a transition chamber of a multiple chamber semiconductor wafer processing system |
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US10072335B2 (en) * | 2014-08-29 | 2018-09-11 | University Of Maryland, College Park | Method of coating of object |
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