CN212161806U

CN212161806U - High-reflection ultrathin backlight circuit board

Info

Publication number: CN212161806U
Application number: CN202021094163.8U
Authority: CN
Inventors: 陈锦东
Original assignee: Sankyo Seiko Science & Technology Ltd
Current assignee: Sankyo Seiko Science & Technology Ltd
Priority date: 2020-06-15
Filing date: 2020-06-15
Publication date: 2020-12-15
Anticipated expiration: 2030-06-15

Abstract

The utility model relates to the technical field of circuit boards, in particular to a high-reflection ultrathin backlight circuit board, which comprises a substrate, wherein the top surface of the substrate is provided with a first groove, a second groove and a third groove at equal intervals, and a first light-emitting mechanism, a second light-emitting mechanism and a third light-emitting mechanism are respectively arranged in the first groove, the second groove and the third groove, the utility model can effectively reduce the whole thickness of the high-reflection backlight circuit board by embedding the first light-emitting mechanism, the second light-emitting mechanism and the third light-emitting mechanism into the substrate, can effectively enhance the brightness of light emitted by a light-emitting diode core by arranging a brightness enhancement sheet, and can concentrate light sources which are scattered downwards and around by arranging the reflection sheet, so that the light is uniformly scattered upwards, the brightness or the brightness loss is reduced, and further the whole brightness of the high-reflection backlight circuit board is effectively enhanced, the reflectivity of light is greatly improved, and the process of pasting the aluminum foil in the prior art is simplified.

Description

High-reflection ultrathin backlight circuit board

Technical Field

The utility model belongs to the technical field of the circuit board technique and specifically relates to ultra-thin backlight circuit board of high reflection.

Background

Light-Emitting diodes (LEDs) were first introduced in 1965, and with the improvement of LED packaging technology and Light-Emitting efficiency, LEDs with small size, low power consumption, long lifetime, and rapid operation response were also introduced. In addition, in response to the demand for energy saving and carbon reduction and the rising awareness of environmental protection, LEDs are widely used as backlight sources for signal lamps, advertisement lamps, light sources for automobiles and motorcycles, outdoor or household lighting devices, displays, and computer peripherals.

In the prior art, LEDs in electronic products are often disposed on a backlight circuit board, and in order to improve the overall brightness of the backlight circuit board, reflective materials such as aluminum foil are usually attached to a solder mask layer around the LEDs, so as to improve the overall brightness of the backlight circuit board by using the aluminum foil to reflect light. However, the aluminum foil attachment not only complicates the manufacturing process, but also increases the overall thickness of the backlight circuit board. On the other hand, other electronic components already arranged on the circuit board are easily damaged in the process of attaching the aluminum foil, so that the yield of manufacturing the backlight circuit board is reduced.

Disclosure of Invention

To prior art not enough, the utility model provides a high-reflection ultra-thin circuit board in a poor light, this circuit board in a poor light is through improving the back, can effectively solve the problem that proposes among the above-mentioned background art.

The technical scheme of the utility model is that:

the high-reflection ultrathin backlight circuit board is characterized in that: the LED packaging structure comprises a substrate, wherein a first groove, a second groove and a third groove are respectively arranged on the top surface of the substrate at equal intervals, a first light-emitting mechanism, a second light-emitting mechanism and a third light-emitting mechanism are respectively arranged in the first groove, the second groove and the third groove, the second light-emitting mechanism and the third light-emitting mechanism are identical to the first light-emitting mechanism except for position installation, the first light-emitting mechanism comprises a first connecting terminal, a second connecting terminal, a conductive coating, a P-pole connecting pad, an N-pole connecting pad and a light-emitting diode core, the first connecting terminal and the second connecting terminal are respectively arranged at the inner bottom of the first groove, the peripheries of the first connecting terminal and the second connecting terminal are respectively and electrically connected with the conductive coating, the top surface of the conductive coating is respectively and electrically connected with the P-pole connecting pad and the N-pole connecting pad, the P-pole connecting pad is electrically connected with the first connecting, the N-pole connecting pad is electrically connected with the second connecting terminal, the P-pole connecting pad and the N-pole connecting pad are electrically connected with a light-emitting diode core, the anode of the light-emitting diode core is connected with the P-pole connecting pad, the cathode of the light-emitting diode core is connected with the N-pole connecting pad, the top surface of the substrate is connected with a brightness enhancement sheet, and the top surface of the substrate, which is positioned above the brightness enhancement sheet, is connected with a reflector sheet.

Further, the light emitting diode core extends to the outside of the substrate.

Furthermore, the section of the brightness enhancement sheet is in a semi-elliptical shape.

Furthermore, the first light-emitting mechanism, the second light-emitting mechanism and the third light-emitting mechanism are all located inside the brightness enhancement film.

Furthermore, the conductive coating is made of pure copper.

Furthermore, the first connecting terminal and the second connecting terminal are made of alloy.

The utility model has the advantages that: the utility model discloses the practicality is strong, through with first luminous mechanism, the inside of second luminous mechanism and third luminous mechanism embedding base plate, can effectively reduce the holistic thickness of high reflection backlight circuit board, through being equipped with the brightness enhancement piece, the brightness that the brightness enhancement piece can effectively strengthen the emitting diode core and send light, the rethread is equipped with the reflector plate, the reflector plate can be concentrated downwards and to the light source that scatters and disappears all around, let the unified scattering up of light, multiplicable luminance or reduction luminance loss, and then effectively promote the holistic luminance of high reflection backlight circuit board, make the reflectivity of light improve greatly, and simultaneously, the processing procedure that the aluminium foil pasted among the prior art covered has also been simplified.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure, 1, a substrate; 2. a first groove; 3. a second groove; 4. a third groove; 5. a first light emitting mechanism; 6. a second light emitting mechanism; 7. a third light emitting mechanism; 8. a first connection terminal; 9. a second connection terminal; 10. a conductive plating layer; 11. a P-electrode connecting pad; 12. an N-pole connecting pad; 13. a light emitting diode core; 14. a brightness enhancement film; 15. a reflective sheet.

Detailed Description

The following description of the embodiments of the present invention will be made with reference to the accompanying drawings:

as shown in fig. 1, the high-reflection ultra-thin backlight circuit board comprises a substrate 1, wherein a first groove 2, a second groove 3 and a third groove 4 are respectively arranged on the top surface of the substrate 1 at equal intervals, a first light-emitting mechanism 5, a second light-emitting mechanism 6 and a third light-emitting mechanism 7 are respectively arranged in the first groove 2, the second groove 3 and the third groove 4, the second light-emitting mechanism 6 and the third light-emitting mechanism 7 are respectively identical to the first light-emitting mechanism 5 except for position installation, the first light-emitting mechanism 5 comprises a first connection terminal 8, a second connection terminal 9, a conductive plating layer 10, a P-electrode connection pad 11, an N-electrode connection pad 12 and a light-emitting diode core 13, the first connection terminal 8 and the second connection terminal 9 are respectively arranged at the inner bottom of the first groove 2, the peripheries of the first connection terminal 8 and the second connection terminal 9 are electrically connected with the conductive plating layer 10, the top surface of the conductive coating 10 is electrically connected with a P-pole connecting pad 11 and an N-pole connecting pad 12 respectively, the P-pole connecting pad 11 is electrically connected with a first connecting terminal 8, the N-pole connecting pad 12 is electrically connected with a second connecting terminal 9, the P-pole connecting pad 11 and the N-pole connecting pad 12 are electrically connected with a light-emitting diode core 13, the positive pole of the light-emitting diode core 13 is connected with the P-pole connecting pad 11, the negative pole of the light-emitting diode core 13 is connected with the N-pole connecting pad 12, the top surface of the substrate 1 is connected with a brightness enhancement sheet 14, and the top surface of the substrate 1, which is positioned above the brightness enhancement sheet.

The led die 13 extends to the outside of the substrate 1. The function is as follows: the led die 13 can emit light conveniently, and the brightness can be enhanced.

The section of the brightness enhancement film 14 is semi-elliptical. The function is as follows: the area of the covering light is increased, and the brightness of the light emitted by the LED chip 13 is enhanced.

The first light-emitting mechanism 5, the second light-emitting mechanism 6 and the third light-emitting mechanism 7 are all located inside the brightness enhancement film 14. The function is as follows: the light emitted by the light receiving and emitting mechanism is exhausted, so that the loss of the brightness is reduced.

The conductive plating layer 10 is made of pure copper.

The first connecting terminal 8 and the second connecting terminal 9 are made of alloy.

The utility model discloses a theory of operation does: when the high-reflection backlight circuit board works, when the brightness emitted by the light emitting diode cores 13 on the first light emitting mechanism 5, the second light emitting mechanism 6 and the third light emitting mechanism 7 penetrates through the brightness enhancement sheet 14, the brightness emitted by the light emitting diode cores 13 can be effectively enhanced by the brightness enhancement sheet 14, when the brightness continues to penetrate through the reflector sheet 15, the reflector sheet 15 can concentrate light sources which scatter downwards and around, so that the light is uniformly scattered upwards, the brightness can be increased or the brightness loss can be reduced, the overall brightness of the high-reflection backlight circuit board can be effectively improved, and the reflectivity of the light is greatly improved.

It is worth mentioning that: the utility model provides a brightness enhancement piece 14 and reflector plate 15 all exist on the market, and this application is no longer repeated.

The foregoing embodiments and description have been provided to illustrate the principles and preferred embodiments of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed.

Claims

1. The high-reflection ultrathin backlight circuit board is characterized in that: the LED packaging structure comprises a substrate (1), wherein a first groove (2), a second groove (3) and a third groove (4) are respectively arranged on the top surface of the substrate (1) at equal intervals, a first light-emitting mechanism (5), a second light-emitting mechanism (6) and a third light-emitting mechanism (7) are respectively arranged in the first groove (2), the second groove (3) and the third groove (4), the second light-emitting mechanism (6) and the third light-emitting mechanism (7) are identical to the first light-emitting mechanism (5) except for position installation in structure, the first light-emitting mechanism (5) comprises a first connecting terminal (8), a second connecting terminal (9), a conductive coating (10), a P-pole connecting pad (11), an N-pole connecting pad (12) and a light-emitting diode core (13), the first connecting terminal (8) and the second connecting terminal (9) are respectively arranged at the inner bottom of the first groove (2), the peripheries of the first connecting terminal (8) and the second connecting terminal (9) are both electrically connected with a conductive plating layer (10), the top surface of the conductive plating layer (10) is respectively and electrically connected with a P pole connecting pad (11) and an N pole connecting pad (12), the P-pole connecting pad (11) is electrically connected with the first connecting terminal (8), the N-pole connecting pad (12) is electrically connected with the second connecting terminal (9), the P pole connecting pad (11) and the N pole connecting pad (12) are electrically connected with a light emitting diode core (13), the anode of the LED core (13) is connected with a P-pole connecting pad (11), the cathode of the LED core (13) is connected with an N-pole connecting pad (12), the top surface of the base plate (1) is connected with a brightness enhancement film (14), and the top surface of the base plate (1) above the brightness enhancement film (14) is connected with a reflection film (15).

2. The ultra-thin backlight circuit board of claim 1, wherein: the light emitting diode core (13) extends to the outside of the substrate (1).

3. The ultra-thin backlight circuit board of claim 2, wherein: the section of the brightness enhancement sheet (14) is semi-elliptical.

4. The ultra-thin backlight circuit board of claim 3, wherein: the first light-emitting mechanism (5), the second light-emitting mechanism (6) and the third light-emitting mechanism (7) are all located inside the brightness enhancement film (14).

5. The ultra-thin backlight circuit board of claim 4, wherein: the conductive coating (10) is made of pure copper.

6. The ultra-thin backlight circuit board of claim 5, wherein: the first connecting terminal (8) and the second connecting terminal (9) are made of alloy.