CN212033010U - Novel extensible heat dissipation module - Google Patents
Novel extensible heat dissipation module Download PDFInfo
- Publication number
- CN212033010U CN212033010U CN201922127203.8U CN201922127203U CN212033010U CN 212033010 U CN212033010 U CN 212033010U CN 201922127203 U CN201922127203 U CN 201922127203U CN 212033010 U CN212033010 U CN 212033010U
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- China
- Prior art keywords
- base
- base plate
- heat dissipation
- heat
- dissipation module
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 230000005855 radiation Effects 0.000 abstract description 7
- 230000000630 rising effect Effects 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel extensible heat dissipation module, including heat radiation fins, base plate, heat pipe and base, the base upper end is equipped with the base plate, and the base plate upper end is equipped with heat radiation fins, is equipped with a plurality of heat pipe between base plate and the base, and a plurality of upper groove has been seted up to the terminal surface under the base plate, has seted up the corresponding low groove of a plurality of and upper groove on the base, and the heat pipe is located the cavity that upper groove and low groove formed. The utility model discloses a heat pipe is laid to the cavity that the upper groove of base plate lower extreme and the lower flute profile of base upper end formed, reaches different radiating effect through the quantity of adjusting the heat pipe, improves the radiating effect through the material that changes heat radiation fins simultaneously.
Description
Technical Field
The utility model discloses heat abstractor technical field, concretely relates to novel extensible heat dissipation module.
Background
Because a chip manufacturer often needs to bear the requirements of different frog numbers on a chip designed on a mainboard, along with the rise of the wattage of the chip, a heat dissipation module needs to remove larger heat energy, and the heat dissipation requirement quantity will be increased. In the past along with the rising of wafer wattage or the renewal of wafer, the thermal module group need load bigger heat energy, when the wattage rises to a certain extent, need to update whole set of thermal module group in order to solve the heat dissipation problem promptly when the thermal module group can't load the heat dissipation demand, can cause the rising of material cost and mould cost like a little, consequently, to above-mentioned problem, the utility model provides a new technical scheme.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a number that increases the pipe through upper groove and low groove reaches the heat dissipation module who improves the radiating effect.
The utility model discloses a realize through following technical scheme:
the utility model provides a novel extensible heat dissipation module, includes heat radiation fins, base plate, heat pipe and base, the base upper end is equipped with the base plate, the base plate upper end is equipped with heat radiation fins, be equipped with a plurality of heat pipe between base plate and the base, a plurality of upper groove has been seted up to the terminal surface under the base plate, set up a plurality of and the corresponding low groove of upper groove on the base, the heat pipe is located the cavity that upper groove and low groove formed.
Furthermore, the heat dissipation fins are made of aluminum or copper.
Furthermore, the heat dissipation fins are connected with the substrate in a screw locking mode.
Furthermore, the base plate is connected with the base in a screw locking mode.
Further, the distance between two adjacent upper grooves is the same, and the distance between two adjacent lower grooves is the same.
The utility model discloses an effective fruit is: the utility model discloses a heat pipe is laid to the cavity that the upper groove of base plate lower extreme and the lower flute profile of base upper end formed, reaches different radiating effect through the quantity of adjusting the heat pipe, improves the radiating effect through the material that changes heat radiation fins simultaneously.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is an exploded view of the present invention.
Wherein: 1. the heat pipe comprises heat radiating fins, a base plate 2, a heat pipe 3, a heat pipe 4, a base 5, an upper groove 6 and a lower groove.
Detailed Description
The present invention will be further described with reference to the following description of the drawings.
As shown in fig. 1-2, a novel expandable heat dissipation module includes heat dissipation fins 1, a substrate 2, heat pipes 3 and a base 4, the substrate 2 is disposed at the upper end of the base 4, the heat dissipation fins 1 are disposed at the upper end of the substrate 2, a plurality of heat pipes 3 are disposed between the substrate 2 and the base 4, a plurality of upper grooves 5 are disposed on the lower end surface of the substrate 2, a plurality of lower grooves 6 corresponding to the upper grooves 5 are disposed on the base 4, and the heat pipes 3 are located in a cavity formed by the upper grooves 5 and the lower grooves 6; the radiating fins 1 are made of aluminum or copper materials, the radiating fins 1 are connected with the base plate 2 in a screw locking mode, the base plate 2 is connected with the base 4 in a screw locking mode, the distance between two adjacent upper grooves 5 is the same, and the distance between two adjacent lower grooves 6 is the same.
In the technical scheme, the radiating fins 1 are locked on the substrate 2 in a screw locking manner, the heat pipe 3 is placed between the substrate 2 and the base 4 through the upper groove 5 and the lower groove 6, the base 4 is contacted with a wafer, and when the wattage of the wafer is increased or the wafer is updated, the radiating effect is increased by replacing the radiating fins 1, for example, the radiating fins 1 made of aluminum materials are replaced by the radiating fins 1 made of copper materials to improve the radiating effect; meanwhile, a plurality of cavities are formed between the substrate 2 and the base 4 through the upper grooves 5 and the lower grooves 6, and the heat dissipation effect is achieved by adding heat pipes in the cavities.
The utility model discloses a heat pipe is laid to the cavity that the upper groove of base plate lower extreme and the lower flute profile of base upper end formed, reaches different radiating effect through the quantity of adjusting the heat pipe, improves the radiating effect through the material that changes heat radiation fins simultaneously.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (5)
1. The utility model provides a novel extensible heat dissipation module, includes cooling fin, base plate, heat pipe and base, its characterized in that: the heat pipe heat dissipation device comprises a base, and is characterized in that a base plate is arranged at the upper end of the base, heat dissipation fins are arranged at the upper end of the base plate, a plurality of heat pipes are arranged between the base plate and the base, a plurality of upper grooves are formed in the lower end face of the base plate, a plurality of lower grooves corresponding to the upper grooves are formed in the base, and the heat pipes are located in cavities formed by the upper grooves and the lower grooves.
2. The novel expandable heat dissipation module as claimed in claim 1, wherein: the radiating fins are made of aluminum materials or copper materials.
3. The novel expandable heat dissipation module as claimed in claim 1, wherein: the radiating fins are connected with the substrate in a screw locking mode.
4. The novel expandable heat dissipation module as claimed in claim 1, wherein: the base plate is connected with the base in a screw locking mode.
5. The novel expandable heat dissipation module as claimed in claim 1, wherein: the distance between two adjacent upper grooves is the same, and the distance between two adjacent lower grooves is the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922127203.8U CN212033010U (en) | 2019-12-03 | 2019-12-03 | Novel extensible heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922127203.8U CN212033010U (en) | 2019-12-03 | 2019-12-03 | Novel extensible heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212033010U true CN212033010U (en) | 2020-11-27 |
Family
ID=73478351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922127203.8U Active CN212033010U (en) | 2019-12-03 | 2019-12-03 | Novel extensible heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212033010U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116075110A (en) * | 2021-11-04 | 2023-05-05 | 英业达科技有限公司 | Liquid cooling modules and electronic devices |
-
2019
- 2019-12-03 CN CN201922127203.8U patent/CN212033010U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116075110A (en) * | 2021-11-04 | 2023-05-05 | 英业达科技有限公司 | Liquid cooling modules and electronic devices |
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