CN202957232U

CN202957232U - Fractal fin radiator

Info

Publication number: CN202957232U
Application number: CN 201220544607
Authority: CN
Inventors: 徐鹏; 邱淑霞; 乔宪武
Original assignee: China Jiliang University
Current assignee: China Jiliang University
Priority date: 2012-10-14
Filing date: 2012-10-14
Publication date: 2013-05-29
Anticipated expiration: 2022-10-14

Abstract

The utility model relates to a cooling apparatus, in particular to a fractal fin radiator, which is used for a square electronic equipment cooling system and is high in efficiency and uniform in temperature. In the process of use, the fin radiator is designed to be H-shaped to form a fractal furcation network structure, the fractal fin radiator, an insulating pad and an electronic chip are entirely packaged, and fins with a rectangular cross section are easy in processing and mounting and are suitable for batch production. The fractal fin radiator can fully utilize the surface space of the electronic chip, enables the heat exchange surface area of the fins to be increased, and reduces airflow by-pass capacity among the fins, thereby increasing the heat radiation efficiency; the fractal fin radiator is especially suitable for the design of a square chip heat radiation system; and simultaneously, the fractal fins have excellent space distribution uniform characteristics, thereby effectively reducing the temperature distribution nonuniformity of the chip, eliminating the local heat spots of the surface of the chip, preventing the chip from being damaged, and effectively prolonging the service life of the chip.

Description

Fractal fin slices radiator

Technical field

The invention belongs to microelectronics technology, relate to a kind of cooling device, relate in particular to the uniform fin slices radiator design of a kind of efficient and temperature for electronic device cooling system.

Background technology

In recent years, integrated and microminiaturized constantly upgrading along with electronic device, its power and integrated level increase substantially, the density of heat flow rate of power device constantly rises, heat radiation becomes the major obstacle that microelectronic industry further develops, only have the heat dissipation element of electronic equipment and complete machine or system are adopted to suitable cooling technology and structural design, their temperature rise is controlled, guarantee electronic equipment or system are normally, work reliably.

For three kinds of basic heat transfer types, the heat transfer of any mode all is directly proportional to heat transfer area, so increasing heat transfer area is a kind of effective way that improves heat output.In Thermal Design of Electronic Equipments, for the heat-sinking capability of strengthening electronic element, adopted various forms of radiators to increase the area of dissipation of element.The simplest radiator is flat radiator, and it is simple in structure, easily self-control, but radiating effect is poor, and area occupied is larger.When the flat radiator rate of heat dispation can not meet the demands, usually to expand heat transfer area, adopt fin slices radiator.

The overall size of electronic equipment, quality, consume metal material and flow resistance performance increases under few prerequisite, adopt the heat dissipation capacity maximum of fin slices radiator can increase an order of magnitude.Section Bar Heat Sinks, interdigital radiator and cylindrical needle rib radiator are several fin slices radiators of commonly using.But structure and spatial distribution limitation that most of fin slices radiators are arranged due to fin, cause the temperature distributing disproportionation on electronic chip even.Chinese invention patent CN101394730A has announced a kind of radial fin slices radiator, and wherein fin is designed to the bifurcated structure, and this radiator can take full advantage of fin space radially, improves heat exchange area.But this patent is better for column electronic equipment dissipating heat effect, be not suitable for promoting in the design of square heat dissipation of electronic chip system, and this patent does not solve the even problem of temperature distributing disproportionation.Chinese utility model patent CN2552167Y has announced a kind of linearity and has erect the radiating fin distributed, and has solved the fin ventilating problem, has strengthened fin intensity.But this radiator still can not solve the problem of temperature distributing disproportionation.And the Temperature Distribution of regional area key of operating characteristic during to be impact be cooled is also the important indicator of estimating the microelectronics cooling system.The inhomogeneities of electronic chip Temperature Distribution (particularly maximum temperature), can cause chip to damage when serious, affect the useful life of electronic equipment.

Summary of the invention

The technical problem to be solved in the present invention is to provide a kind of fin slices radiator, take full advantage of the plane space of square electronic chip, improve radiating efficiency by increasing heat transfer surface area, this fin slices radiator has good spatial distribution uniform characteristics, can overcome radiator temperature shortcoming pockety, extend the useful life of electronic chip.

For solving the problems of the technologies described above, the present invention is designed to fin slices radiator the fractal bifurcated network configuration of " H " type.The present invention is by electronic chip, and heat insulating washer and fin slices radiator form.Its operation principle is: the heat that electronic chip produces mainly passes to fin slices radiator with heat-conducting mode by heat insulating washer, and fin slices radiator arrives surrounding environment by the fin Internet Transmission.Fin slices radiator is that the mode according to the fractal bifurcated network of " H " type is combined and is connected by the rectangle fin, and the rectangle fin has identical height, then by fractal fin Cyber process on the substrate of same material.Fractal fin network is symmetrical bifurcated network, and every one-level mother stock props up bifurcated and goes out two identical sub-branches, and same fraction brace has identical width and length; Bifurcation angle is 90 degree; The Length Ratio of adjacent two-stage fin and width are than keeping constant, i.e. the lenth ratio α=l of the length of k+1 level fin and k level fin _K+1/ l _kWith width than β=d _K+1/ d _kIrrelevant with bifurcated progression, remain unchanged; Choose width ratio and Length Ratio α=β=2 ^-1/D, fractal dimension D=2 wherein, now fractal fin network has good spatial distribution uniform properties and plane space filling capacity; Choosing of 0 grade of branch's size of fractal fin network and total bifurcated progression n need to be determined and design according to concrete chip size and overall package requirements, follows simultaneously and avoids network from overlapping principle.

Fractal fin network is to be formed by connecting according to fractal bifurcated network by the rectangle fin, and the fin of square-section is easy to processing and installs, and is applicable to Mass production.

The beneficial effect that the present invention can produce:

1. the fractal fin slices radiator designed according to the fractal bifurcated network of " H " type, can take full advantage of the space surface of electronic chip, increases fin heat exchange surface area, improves radiating efficiency, is applicable to the design of square chip cooling system.

2. due to the fin gap smaller, there is screen effect, reduced air-flow bypass amount between fin.

Therefore 3. fractal fin network has good spatial distribution uniform properties, can effectively improve the uniformity that chip temperature distributes, and eliminates the local focus of chip surface, prevents that chip from damaging, and effectively extends chip useful life.

The accompanying drawing explanation

Fig. 1 is structural representation of the present invention

Fig. 2 is the structure chart of fin slices radiator

Fig. 3 has shown fractal fin network according to an embodiment of the invention, and it has 2 bifurcation structures of 5 grades

Fig. 4 has shown the elementary cell of fractal fin network

Embodiment

Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.

As shown in Figure 1, adopt cooling 100 * 72 * 20mm that is of a size of of fractal fin slices radiator ³Electronic chip 1.The heat that electronic chip 1 produces mainly passes to fin slices radiator 3 with heat-conducting mode by heat insulating washer 2, and fin slices radiator arrives surrounding environment by the fin Internet Transmission.The fractal bifurcated network of " H " type has good space uniform distribution characteristics.

As can be seen from Figure 4, choose Length Ratio (α=l _K-1/ l _k) and width than (β=d _K+1/ d _k) be all 2 ^-1/2, every one-level mother stock props up bifurcated and goes out two identical sub-branches." H " type bifurcated elementary cell shown in Fig. 4, according to above-mentioned bifurcation ratio iteration 5 times, is generated to 5 grades of bifurcated networks as shown in Figure 3, according to the electronic chip size, can determine that 0 grade of fin is of a size of 26.5 * 5.2 * 10mm ³, rectangle fin height is 10mm, substrate thickness is 5mm.Now, fractal fin network has good plane filling capacity, has very high heat transfer surface area, has the highest heat conduction efficiency simultaneously.

As can be seen from Figure 2, at first mold the radiator blank of being made by the aluminum extrudate, and fractal fin network 4 is processed on the substrate 5 of material of the same race.Then by fractal fin network 3 and heat insulating washer 2 and electronic chip 1 according to order overall package from top to bottom.

Claims

1. fractal fin slices radiator, include the electronic chip (1) be packaged together successively, heat insulating washer (2) and fin slices radiator (3), it is characterized in that: described fin slices radiator is designed to fractal bifurcated network structure, rectangle fin with equal height is connected according to the fractal bifurcation structure of " H " type, and fractal fin network (4) is processed on substrate (5), the female fin bifurcated of every one-level of described fractal fin network goes out the sub-fin of two symmetries, bifurcation angle is 90 degree, the Length Ratio of adjacent two-stage fin and width are than keeping constant, after, the length of one-level fin and the lenth ratio of previous stage fin are 2 ^-1/2, width is than also equaling 2 ^-1/2.

2. fractal fin slices radiator according to claim 1, the bifurcation ratio of fin slices radiator (3) keeps constant, and the size of 0 grade of fin and total bifurcated progression n determine according to chip size and overall package requirements, follow simultaneously and avoid network from overlapping principle.