CN212011026U - 具有悬臂电极的发光元件、具有其的显示面板及显示装置 - Google Patents

具有悬臂电极的发光元件、具有其的显示面板及显示装置 Download PDF

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CN212011026U
CN212011026U CN202020910752.2U CN202020910752U CN212011026U CN 212011026 U CN212011026 U CN 212011026U CN 202020910752 U CN202020910752 U CN 202020910752U CN 212011026 U CN212011026 U CN 212011026U
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China
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led stack
light
emitting element
electrode
cantilever
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Expired - Fee Related
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CN202020910752.2U
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English (en)
Chinese (zh)
Inventor
蔡钟炫
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Seoul Viosys Co Ltd
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Seoul Viosys Co Ltd
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Priority claimed from US16/877,258 external-priority patent/US11538784B2/en
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/832—Electrodes characterised by their material
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
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    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01204—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates
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    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
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    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07211—Treating the bond pad before connecting, e.g. by applying flux or cleaning
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07302—Connecting or disconnecting of die-attach connectors using an auxiliary member
    • H10W72/07304—Connecting or disconnecting of die-attach connectors using an auxiliary member the auxiliary member being temporary, e.g. a sacrificial coating
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/222—Multilayered bumps, e.g. a coating on top and side surfaces of a bump core
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    • H10W72/231—Shapes
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    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
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    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
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    • H10W72/261—Functions other than electrical connecting
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    • H10W72/321—Structures or relative sizes of die-attach connectors
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    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
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    • H10W74/00—Encapsulations, e.g. protective coatings
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    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Wire Bonding (AREA)
CN202020910752.2U 2019-05-29 2020-05-26 具有悬臂电极的发光元件、具有其的显示面板及显示装置 Expired - Fee Related CN212011026U (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962854257P 2019-05-29 2019-05-29
US62/854,257 2019-05-29
US16/877,258 2020-05-18
US16/877,258 US11538784B2 (en) 2019-05-29 2020-05-18 Light emitting device having cantilever electrode, LED display panel and LED display apparatus having the same

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Publication Number Publication Date
CN212011026U true CN212011026U (zh) 2020-11-24

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CN202080039836.6A Active CN113924662B (zh) 2019-05-29 2020-05-26 具有悬臂电极的发光元件、具有其的显示面板及显示装置

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US (2) US11876069B2 (enExample)
EP (1) EP3979341A4 (enExample)
JP (1) JP7546600B2 (enExample)
KR (1) KR102847853B1 (enExample)
CN (2) CN212011026U (enExample)
BR (1) BR112021023898A2 (enExample)
MX (1) MX2021013920A (enExample)

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CN113924662A (zh) * 2019-05-29 2022-01-11 首尔伟傲世有限公司 具有悬臂电极的发光元件、具有其的显示面板及显示装置
CN114535734A (zh) * 2020-11-25 2022-05-27 东莞市中麒光电技术有限公司 一种led的激光焊接方法

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CN113924662A (zh) * 2019-05-29 2022-01-11 首尔伟傲世有限公司 具有悬臂电极的发光元件、具有其的显示面板及显示装置
CN113924662B (zh) * 2019-05-29 2025-01-21 首尔伟傲世有限公司 具有悬臂电极的发光元件、具有其的显示面板及显示装置
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CN114535734B (zh) * 2020-11-25 2024-01-26 东莞市中麒光电技术有限公司 一种led的激光焊接方法

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US20240153905A1 (en) 2024-05-09
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BR112021023898A2 (pt) 2022-01-25
JP7546600B2 (ja) 2024-09-06

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