CN102468288A - 发光二极管模组 - Google Patents

发光二极管模组 Download PDF

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CN102468288A
CN102468288A CN2010105520729A CN201010552072A CN102468288A CN 102468288 A CN102468288 A CN 102468288A CN 2010105520729 A CN2010105520729 A CN 2010105520729A CN 201010552072 A CN201010552072 A CN 201010552072A CN 102468288 A CN102468288 A CN 102468288A
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emitting diode
light
base plate
circuit structure
substrate
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罗杏芬
柯志勋
詹勋伟
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Rongchuang Energy Technology Co ltd
Zhanjing Technology Shenzhen Co Ltd
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Priority to CN2010105520729A priority Critical patent/CN102468288A/zh
Priority to US13/224,341 priority patent/US8449153B2/en
Publication of CN102468288A publication Critical patent/CN102468288A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
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    • H05K2201/09018—Rigid curved substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

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  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

本发明涉及一种发光二极管模组，包括基板，装设于基板上的发光二极管元件，该发光二极管元件左右两边分别伸出电极，以及铺设于基板上表面并与该发光二极管元件电连接的电路结构，该基板左右两边沿各向内伸出一个弹性悬臂，与基板上表面构成夹式结构，所述发光二极管元件的电极夹在该弹性悬臂内。需更换发光二极管元件时可以掰开基板的弹性悬臂即可将发光二极管元件轻易地取出。如此，可简便的实现发光二极管元件的替换，大大的提高整个发光二极管模组的使用寿命。

Description

发光二极管模组
技术领域
本发明涉及一种光源模组，特别是以发光二极管作为光源的光源模组。
背景技术
相比于传统的发光源，发光二极管(Light Emitting Diode，LED)具有重量轻、体积小、污染低、寿命长等优点，其作为一种新型的发光源，已经被越来越多地应用到各领域当中，如路灯、交通灯、信号灯、射灯及装饰灯等等。以发光二极管模组作为光源模组的照明装置，其通常是将发光二极管元件以焊锡的方式固定于灯条或灯板的电路结构层并与之形成电性连接。
然而，若该照明装置中有一颗发光二极管元件损坏，又因为用焊锡方式的连接不容易拆卸，则整个灯条或灯板即无法使用，拆分单个发光二极管元件又很麻烦，由此造成极大的不便。
发明内容
有鉴于此，本发明旨在提供一种容易替换的发光二极管模组结构。
一种发光二极管模组，包括基板，装设于基板上的发光二极管元件，该发光二极管元件左右两边分别伸出电极，以及铺设于基板上表面并与该发光二极管元件电连接的电路结构，该基板左右两边沿各向内伸出一个弹性悬臂，与基板上表面构成夹式结构，所述发光二极管元件的电极夹在该弹性悬臂内。
装入发光二极管元件时只需打开夹式基板，将发光二极管元件的电极压置于电极上即可完成电连接和固定，避免采用锡膏，简化安装和拆卸过程。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1为本发明一实施例的发光二极管模组的俯视示意图。
图2为本发明一实施例的发光二极管模组沿图1中的线II-II的剖面示意图。
图3为本发明一实施例的发光二极管模组基板的剖视示意图。
主要元件符号说明
基板                        10
底板                        12
上表面                      14
弹性悬臂                    16
自由端                      161
电路结构                    20
间隔                        21
发光二极管元件              30
封装基板                    31
电极                        32
伸出端                      321
发光二极管芯片              33
封装层                      34
壳体                        35
具体实施方式
请参考图1和图2，该发光二极管模组包括基板10，铺布于基板10上的电路结构20，以及装设于该基板10上并与电路结构20电性连接的发光二极管元件30。
请同时参阅图3，所述基板10呈长条形，具有平坦的底板12，该底板12具有上表面14，该基板10的左右两长边沿向上延伸后向内弯曲各形成一个弹性悬臂16，该弹性悬臂16也呈长条状。该弹性悬臂16具有一个与底板12平行的自由端161，自由端161与底板12之间具有一个预设距离d。该基板10采用弹性较好的材料制成，如金属材料铝合金等。该弹性悬臂16与基板10的底板12形成一个夹式结构，向上拉动弹性悬臂16的自由端161，可使距离d增大。
所述电路结构20铺设于基板10的上表面14，在本实施例中，该电路结构20为一电路板，其中间具有一段间隔21使该电路结构20呈两条长条状平铺于底板12的左右两侧，将基板10的上表面14露出一部分，所述发光二极管元件30贴设于基板10露出的上表面14上。该电路结构20可以为高热导系数铝基板，配合前述基板10，以使该发光二极管模组具有更高的散热效率。当然，在其他实施例中，该电路结构20也可以为传统的PCB板等。在其他实施例中，根据该电路结构20的布线不同，其也可为一整块条形板状结构平铺于底板12上，中间无间隔，所述发光二极管元件30贴设于该电路结构20上。此外，该电路结构20可以直接于基板10的底板12上表面进行蚀刻并布线形成，而不需另外装设电路板于基板10上。
该发光二极管元件30是发光二极管封装结构，包括封装基板31，设置于该封装基板31上的电极32，装设于封装基板31上并与电极32电连接的发光二极管芯片33，形成于封装基板31上的壳体35以及封装于壳体35内、覆盖发光二极管芯片33和封装基板31的封装层34。该发光二极管元件30装设于前述电路结构20之间露出的基板10的上表面14。该左右电极32为金属导线架，从封装基板31左右两边向外伸出，并弯折向下形成伸出端321用于与前述电路结构20接触。该电极32的伸出端321被弹性悬臂16的自由端161压持，由此达到发光二极管元件30的固定与电连接。在其他实施例中，若电路结构20为整块板状结构，中间不具有间隔，则发光二极管元件30可直接贴设于电路结构20上，发光二极管元件30的电极32同样从左右两边伸出，与电路结构20电连接。前述弹性悬臂16与底板12的预设距离d小于该电极32和电路结构20两者厚度之和。当发光二极管元件30装入该基板10后，弹性悬臂16与底板12的距离d’等于电极32与电路结构20厚度之和，利用弹性悬臂16的夹紧力牢固固定发光二极管元件30。
该发光二极管模组在安装时，先将基板10左右两边的弹性悬臂16的自由端161向上掰开，从侧面(如图1箭头A所指方向)将发光二极管元件30的电极32的伸出端321置于弹性悬臂16之下并推入该基板10，此时电极32的伸出端321在电路结构20上向内滑动，到达预设位置后松开自由端161，使弹性悬臂16将电极32压紧，完成该发光二极管元件30的安装。另外，由于电路结构20连续地分布于基板10的两侧，故可以任意调整发光二极管元件30的间距，通过改变装设的发光二极管元件30的疏密程度，从而达到不同的发光效果。此结构同时也避免了重新设计新的具有不同容置发光二极管元件30间隔的基板结构。
若需更换该发光二极管模组的发光二极管元件30时，只需掰开基板10的自由端161，同时将发光二极管元件30从侧向推出，再置换新的发光二极管元件30即可。
本发明的技术内容及技术特点已揭露如上，然而本领域技术人员仍可能基于本发明的教示及揭示而作出种种不背离本发明精神的替换及修饰。因此，本发明的保护范围应不限于实施例所揭示的内容，而应包括各种不背离本发明的替换及修饰，并为所附的权利要求所涵盖。

Claims (8)

1.一种发光二极管模组，包括基板，装设于基板上的发光二极管元件，以及铺设于基板上表面并与该发光二极管元件电连接的电路结构，其特征在于：该基板两边沿各向内伸出一个弹性悬臂，与基板上表面构成夹式结构，该发光二极管元件两边分别伸出电极，所述电极夹在该弹性悬臂内并与电路结构电连接。
2.如权利要求1所述的发光二极管模组，其特征在于：所述弹性悬臂距基板上表面有一个预设距离，该预设距离小于所述电极与电路结构的厚度之和。
3.如权利要求1所述的发光二极管模组，其特征在于：所述电极弯折向下形成伸出部，该伸出部经弹性悬臂夹置，压于所述电路结构上，形成电连接。
4.如权利要求1所述的发光二极管模组，其特征在于：所述发光二极管元件包括封装基板，装设于封装基板上的发光二极管芯片，形成于封装基板上的壳体以及封装于壳体内并覆盖发光二极管芯片和封装基板的封装层，所述电极设置于该封装基板上并与发光二极管芯片电连接。
5.如权利要求1所述的发光二极管模组，其特征在于：所述电路结构铺设于所述基板上表面，所述发光二极管元件贴设于该电路结构上。
6.如权利要求1所述的发光二极管模组，其特征在于：所述电路结构铺设于所述基板上表面，且该电路结构在中间隔开，露出基板上表面，所述发光二极管元件贴设于露出的基板上表面上。
7.如权利要求1至6任一项所述的发光二极管模组，其特征在于：所述电路结构为在基板上表面经蚀刻并布线形成。
8.如权利要求1至6任一项所述的发光二极管模组，其特征在于：所述电路结构为贴设于基板上表面的电路板。
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CN103594602A (zh) * 2013-10-30 2014-02-19 王定锋 贴有绝缘材料的smd-led支架、贴片型led及其制造方法
CN108475712A (zh) * 2015-12-01 2018-08-31 夏普株式会社 图像形成元件
CN113924662A (zh) * 2019-05-29 2022-01-11 首尔伟傲世有限公司 具有悬臂电极的发光元件、具有其的显示面板及显示装置

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US20140264393A1 (en) * 2013-03-14 2014-09-18 Abl Ip Holding Llc Light engine

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