CN211907432U - TOP type four-in-one full-color LED support and packaging structure thereof - Google Patents
TOP type four-in-one full-color LED support and packaging structure thereof Download PDFInfo
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- CN211907432U CN211907432U CN201922224355.XU CN201922224355U CN211907432U CN 211907432 U CN211907432 U CN 211907432U CN 201922224355 U CN201922224355 U CN 201922224355U CN 211907432 U CN211907432 U CN 211907432U
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Abstract
The utility model discloses a TOP type four unification full-color LED support and packaging structure thereof, including metal crate, set up plastic encapsulated body and four bowl cups on metal crate, all be provided with pouring sealant, chip solid crystal district, negative pole bonding district and total positive bonding district in every bowl cup, all put the tricolor chip admittedly on the chip solid crystal district in every bowl cup: r, G, B chip, the tricolor chip is connected with the cathode bonding region and the common anode bonding region of the same color through bonding wires; eight outer pins are symmetrically arranged on the metal frame, are respectively positioned on two sides of the metal frame and are respectively connected with the negative electrode bonding area and the common anode bonding area; the structure is beneficial to improving the packaging efficiency and the packaging air tightness.
Description
Technical Field
The utility model relates to a TOP type four unification full-color LED support and packaging structure thereof belongs to LED device technical field.
Background
The TOP type bracket of the traditional full-color display LED is a bottom metal structure and a single plastic cup, and when the bracket of the single cup is used as a small-size bracket, the bracket can not be made smaller due to size limitation; in addition, the cost reduction space of a single bowl support is limited; meanwhile, due to the fact that the number of the leading-out pins of the single bowl cup support is large, the air tightness of the bowl cup of the support is poor, external moisture easily enters the interior of the bowl cup from the pins of the support after a finished product is packaged, and the poor air tightness of the finished product packaged by the LED is prone to failure. Therefore, the defects of the existing products and technologies still need to be solved.
SUMMERY OF THE UTILITY MODEL
The utility model overcomes prior art exists not enough, and the technical problem that solve provides a TOP type four unification full-color LED support and packaging structure thereof, does benefit to and improves encapsulation efficiency, improvement encapsulation gas tightness.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
the utility model provides a TOP type four unification full-color LED packaging structure, includes metal crate, sets up plastic encapsulated body and four bowls on metal crate: first bowl cup, second bowl cup, third bowl cup and fourth bowl cup all are provided with potting adhesive, chip solid crystal district, negative pole bonding district and total positive bonding district in every bowl cup, all fix on the chip solid crystal district in every bowl cup and put the tricolor chip: r, G, B chip, the tricolor chip is connected with the cathode bonding region and the common anode bonding region of the same color through bonding wires;
the tricolor chips in the first bowl cup are all arranged on the same chip die bonding area and are connected with the R chip die bonding area of the fourth bowl cup; the tricolor chips of the second bowl cup are all arranged on the same chip die bonding area and are connected with the R chip die bonding area of the third bowl cup; the chip G and the chip B of the third bowl cup are fixedly arranged in the same chip die bonding area; the chip G and the chip B of the fourth bowl cup are fixedly arranged in the same chip die bonding area;
the first bowl cup and the second bowl cup share the anode, and the third bowl cup and the fourth bowl cup share the anode; r, G, B chips fixed in the first bowl are respectively connected with R, G, B chips fixed in the fourth bowl in a same color and collinear way; r, G, B chips fixed in the second bowl are respectively connected with R, G, B chips fixed in the third bowl in the same color and the same line;
eight outer pins are symmetrically arranged on the metal frame, are respectively positioned on two sides of the metal frame and are respectively connected with the cathode bonding area and the common anode bonding area.
Preferably, the metal frame is further provided with a supporting clamping point, and the supporting clamping point supports the plastic encapsulation body.
Preferably, the surface of the plastic envelope is provided with a polarity identification mark.
Preferably, the surface of the plastic envelope is frosted.
Preferably, the back of the metal frame is provided with an injection molding water gap, and the injection molding water gap is connected with the plastic encapsulation body.
Preferably, the back of the metal frame is provided with two symmetrical back concave notches.
A TOP type four-in-one full-color LED bracket comprises a metal frame, four subareas arranged on the metal frame and outer pins, wherein each subarea internally comprises a die bonding area and a bonding area;
the outer pins are eight symmetrically arranged: the first R negative electrode outer pin, the second R negative electrode outer pin, the first G negative electrode outer pin, the second G negative electrode outer pin, the first B negative electrode outer pin, the second B negative electrode outer pin, the first common-anode outer pin and the second common-anode outer pin;
the solid crystal region comprises four regions which are respectively arranged in the four regions:
four R chip die attach regions: a first R chip die bonding area, a second R chip die bonding area, a third R chip die bonding area and a fourth R chip die bonding area;
four G chip die attach regions: the first G chip die bonding area, the second G chip die bonding area, the third G chip die bonding area and the fourth G chip die bonding area;
four B chip die bonding areas: a first B chip die bonding area, a second B chip die bonding area, a third B chip die bonding area and a fourth B chip die bonding area;
the first R chip die bonding area, the first G chip die bonding area, the first B chip die bonding area and the fourth R chip die bonding area are integrated and connected with the first R cathode outer pin;
the second R chip die bonding area, the second G chip die bonding area, the second B chip die bonding area and the third R chip die bonding area are integrated and connected with a second R negative electrode outer pin;
the third G chip die bonding area and the third B chip die bonding area are integrated and are connected with the first B cathode outer pin;
the fourth G chip die bonding area and the fourth B chip die bonding area are integrated and are connected with a second B cathode outer pin;
the bonding region comprises four regions respectively arranged in the four regions:
four anodic bonding regions: a first anodic bonding region, a second anodic bonding region, a third anodic bonding region and a fourth anodic bonding region;
the first anode bonding region and the second anode bonding region are connected to form a first common anode bonding region and are connected with a first common anode outer lead;
the third anodic bonding area and the fourth anodic bonding area are connected to form a second common-anode bonding area and are connected with a second common-anode outer lead;
twelve R, G, B negative electrode bonding regions, wherein the first G negative electrode bonding region is connected with the fourth G negative electrode bonding region and is connected with the first G negative electrode outer lead; the second G negative electrode bonding region is connected with the third G negative electrode bonding region and is connected with a second G negative electrode outer lead.
Preferably, the root parts of the outer pins are provided with anti-seepage grooves.
Preferably, the first common positive bonding area and the second common positive bonding area are both in an I-shaped structure.
Preferably, the metal frame is further provided with a support clamping point.
Compared with the prior art, the utility model following beneficial effect has:
the utility model discloses a TOP structural style, packaging structure reliability is higher, and the back pad is few, is favorable to reduce cost.
1) The four bowls are combined on one metal support body, so that the packaging efficiency is improved;
2) the four bowls are combined on the metal support body, and the structure that the feet of a single bowl 4 are arranged and the feet of the four bowls are 16 in the prior art is changed into a common-positive structure with 8 feet in a four-in-one combined structure through the function areas connected inside, so that the external leading feet are reduced, the packaging air tightness is improved, and the reliability is improved;
3) the root parts of the 8 leading-out pins are provided with anti-seepage grooves so as to increase the entry resistance of moisture;
4) the two metal common-anode bonding areas are designed to be in an I shape, so that the strength of plastic cladding is increased;
5) the surface of the plastic packaging body is frosted to reduce the light reflected by the surface; the back of the plastic encapsulating body is provided with an injection water gap, and the back is provided with two symmetrical back concave notches so as to reduce the stress of the plastic encapsulating body;
6) the metal frame is provided with a supporting clamping point supporting plastic encapsulation body; one corner of the surface of the plastic envelope is provided with a polarity identification mark; when the formed bracket is used, the R/G/B tricolor chips are respectively and fixedly placed in the bowl cup, then the keys and the leads are used for connecting each functional area, and then the bowl cup is filled with pouring sealant.
Drawings
Fig. 1 is a front view of the structure of the LED bracket of the present invention.
Fig. 2 is a schematic structural diagram of the LED support after injection molding and encapsulation.
Fig. 3 is a schematic diagram of the package of the LED bracket of the present invention.
Fig. 4 is a schematic view of the die bonding and wire bonding structure of the LED bracket of the present invention.
FIG. 5 is a schematic diagram of the front structure of the LED package structure of the present invention
Fig. 6 is a schematic diagram of a bottom structure of the LED package structure of the present invention.
Fig. 7 is a schematic diagram of a side structure of a finished product of the LED package structure of the present invention.
Fig. 8 is a schematic diagram of the LED package structure of the present invention.
In the figure: 000: metal frame, 005: seepage-proofing groove, 007: support stuck point, 008-1: first common positive bonding region, 008-2: second co-anodic bonding region, 100: plastic envelope, 101: first bowl, 102: second bowl, 103: third bowl, 104: fourth bowl, 105: polarity identification, 106: injection nozzle, 107: back side undercut, 202: bonding wire, 203: pouring sealant, 301: r chip, 302: g chip, 303: b, chip;
001-1, namely a first R chip solid crystal region, 001-2, 001-3, 001-4, 001-5, 001-6, namely a first anode bond and region;
002-1 parts of a second R chip solid crystal region, namely a second R negative electrode bonding region, 002-2 parts of a second G chip solid crystal region, 002-3 parts of a second B chip solid crystal region, 002-4 parts of a second G negative electrode bonding region, 002-5 parts of a second B negative electrode bonding region and 002-6 parts of a second anode bond and region;
003-1, namely a third R chip crystal fixing region, 003-2, 003-3, 003-4, 003-5, namely a third B chip crystal fixing region, and 003-6, namely a third anode bond and region;
004-1 of a fourth R chip crystal fixing area, namely a fourth R negative electrode bonding area, 004-2 of a fourth G chip crystal fixing area, 004-3 of a fourth B chip crystal fixing area, 004-4 of a fourth G negative electrode bonding area, 004-5 of a fourth B negative electrode bonding area and 004-6 of a fourth anode bond and area;
006-1: a first G negative electrode external pin, 006-2: a first R negative electrode external pin, 006-3: a first common anode external pin, 006-4: second R negative electrode outer pin, 006-5: a second G negative electrode external pin 006-6, a first B negative electrode external pin 006-7, a second common anode external pin 006-8: and a second B cathode outer pin.
Detailed Description
The invention will be further explained with reference to the drawings and the specific embodiments.
Example 1
A TOP type four-in-one full color LED package structure comprises a metal frame,
eight outer leads (a first R cathode outer lead 006-2, a second R cathode outer lead 006-4, a first G cathode outer lead 006-1, a second G cathode outer lead 006-5, a first B cathode outer lead 006-6, a second B cathode outer lead 006-8, a first co-anode outer lead 006-3 and a second co-anode outer lead 006-7) are symmetrically arranged on the metal frame 000, the eight outer leads are respectively positioned at two sides of the metal frame, 4 on each side and respectively connected with a cathode bonding area and a co-anode bonding area, so that when the leads at two sides of the packaged device are subjected to SMT reflow soldering, the tin absorption and the stress at two sides are consistent, and the device balance is kept.
The metal frame is provided with a plastic packing body 100 and four bowls: first bowl cup 101, second bowl cup 102, third bowl cup 103 and fourth bowl cup 104 all are provided with casting glue 203, chip solid crystal district, negative pole bonding region and altogether positive bonding region 008 in every bowl cup, all firmly put the three primary colors chip on the chip solid crystal district in every bowl cup: r, G, B chip, the three primary color chip is connected with the cathode bonding area and the common anode bonding area of the same color through bonding wires 202;
the R chip die bonding area in each bowl cup is positioned on the R cathode bonding area.
The first bowl cup 101 and the second bowl cup 102 share the anode, and the connected first common anode bonding region 008-1 is I-shaped and is connected with a first common anode outer pin 006-3; the third bowl cup 103 and the fourth bowl cup 104 share the anode, and the connected second common anode bonding region 008-2 is I-shaped and is connected with a second common anode outer pin 006-7; the common anode bonding area of the two metals is of an I-shaped metal structure, so that the strength of plastic cladding is increased.
The three primary color chips in the first bowl 101 are all disposed on the same chip die bonding area (i.e., the first R negative bonding area 001-1 in the first bowl), connected to the R chip die bonding area of the fourth bowl (i.e., the fourth R negative bonding area 004-1 in the fourth bowl), and commonly connected to the first R negative outer lead 006-2.
The three primary color chips of the second bowl cup are all arranged on the same chip die bonding area (namely, the second R negative electrode bonding area 002-1 in the second bowl cup), are connected with the R chip die bonding area of the third bowl cup (namely, the third R negative electrode bonding area 003-1 in the third bowl cup), and are commonly connected with the second R negative electrode outer lead 006-4.
The G chip and the B chip of the third bowl cup are fixedly arranged in the same chip die bonding area (namely, the third B cathode bonding area 003-5 in the third bowl cup), are connected with the second B cathode bonding area 002-5 of the second bowl cup and are commonly connected with the first B cathode outer lead 006-6.
The G chip and the B chip of the fourth bowl cup are fixedly arranged in the same chip die bonding area (namely a fourth B cathode bonding area 004-5 in the fourth bowl cup), are connected with the first B cathode bonding area 001-5 of the first bowl cup and are commonly connected with the second B cathode outer lead 006-8.
The R chip 301 in each bowl cup is fixedly arranged on the R negative bonding region in the bowl cup and is connected with the anode bonding region of the bowl cup through a bonding lead 202; the G chip 302 and the B chip 303 in the first bowl cup 101 are both fixedly arranged on the first R negative bonding region and are respectively connected with the common anode bonding region and the same-color negative bonding region through bonding leads; the chip G and the chip B in the second bowl cup are fixedly arranged on the second R negative electrode bonding area and are respectively connected with the common anode bonding area and the same-color negative electrode bonding area through bonding leads; the chip G and the chip B in the third bowl cup are fixedly arranged on a third B negative electrode bonding region 003-5 in the third bowl cup and are respectively connected with the common anode bonding region and the same-color negative electrode bonding region through bonding leads; the G chip and the B chip in the fourth bowl cup are both fixedly arranged on a fourth B negative electrode bonding area 004-5 in the fourth bowl cup and are respectively connected with the common anode bonding area and the same-color negative electrode bonding area through bonding leads.
R, G, B chips fixed in the first bowl 101 are respectively connected with R, G, B chips fixed in the fourth bowl 104 in the same color and the same line; r, G, B chips fixed in the second bowl 102 are respectively connected with R, G, B chips fixed in the third bowl 103 in the same color and the same line;
the metal frame 000 is further provided with a support clamping point 007, and the support clamping point 007 supports the plastic envelope 100.
A corner of the surface of the plastic package 100 is provided with a polarity identifier 105, and the polarity identifier 105 is located on the front surface of the whole package structure.
The surface of the plastic enclosure 100 is frosted to reduce the light reflected from the surface.
The back of the metal frame 1 is provided with an injection molding water gap 106, and the injection molding water gap is connected with the plastic encapsulation body 100.
The back of the metal frame is provided with two symmetrical back concave notches 107 to reduce and release the stress of the plastic enclosure 100.
A TOP type four-in-one full-color LED support comprises a metal frame 000, four partitions arranged on the metal frame 000 and outer pins, wherein each partition comprises a die bonding area and a bonding area.
In the step of carrying out later stage encapsulation by using the support structure, each partition is provided with a bowl cup, and a crystal fixing area in each partition is fixedly provided with a tricolor chip: r, G, B chip.
The outer pins are eight symmetrically arranged: the first R cathode external pin 006-2, the second R cathode external pin 006-4, the first G cathode external pin 006-1, the second G cathode external pin 006-5, the first B cathode external pin 006-6, the second B cathode external pin 006-8, the first common anode external pin 006-3 and the second common anode external pin 006-7; the eight outer leads are respectively positioned at two sides of the metal frame, 4 of each side, and are respectively connected with the cathode bonding area and the common anode bonding area.
The solid crystal region comprises four regions which are respectively arranged in the four regions:
four R chip die attach regions: a first R chip die bonding region 001-1, a second R chip die bonding region 002-1, a third R chip die bonding region 003-1 and a fourth R chip die bonding region 004-1;
four G chip die attach regions: a first G chip die bonding area 001-2, a second G chip die bonding area 002-2, a third G chip die bonding area 003-2 and a fourth G chip die bonding area 004-2;
four B chip die bonding areas: a first B chip die bonding region 001-3, a second B chip die bonding region 002-3, a third B chip die bonding region 003-3 and a fourth B chip die bonding region 004-3;
the first R chip die bonding region 001-1, the first G chip die bonding region 001-2, the first B chip die bonding region 001-3 and the fourth R chip die bonding region 004-1 are integrated and connected with a first R cathode outer pin 006-2;
the second R chip die bonding region 002-1, the second G chip die bonding region 002-2, the second B chip die bonding region 002-3 and the third R chip die bonding region 003-1 are integrated and connected with a second R cathode outer pin 006-4;
the third G chip die bonding region 003-2 and the third B chip die bonding region 003-3 are integrated, are connected with the second B cathode bonding region 002-5 in the second subarea and are connected with the first B cathode outer lead 006-6;
the fourth G chip die bonding region 004-2 and the fourth B chip die bonding region 004-3 are integrated, are connected with the first B cathode bonding region 001-5 in the first subarea and are connected with the second B cathode outer lead 006-8;
the bonding regions comprise four anode bonding regions and twelve R, G, B cathode bonding regions which are respectively arranged in four subareas, wherein the R cathode bonding region in each subarea is superposed with the R chip die bonding region in the R chip die bonding region and is the same region.
Four anodic bonding regions: a first anodic bonding region 001-6, a second anodic bonding region 002-6, a third anodic bonding region 003-6, and a fourth anodic bonding region 004-6;
the first anode bonding region 001-6 is connected with the second anode bonding region 002-6 to form an I-shaped first common anode bonding region 008-1 and is connected with a first common anode outer lead 006-3;
the third anodic bonding region 003-6 is connected with the fourth anodic bonding region 004-6 to form an I-shaped second common-anode bonding region 008-2 and is connected with a second common-anode outer lead 006-7;
twelve R, G, B negative electrode bonding regions, wherein the first G negative electrode bonding region is connected with the fourth G negative electrode bonding region and is connected with the first G negative electrode outer lead; the second G negative electrode bonding region is connected with the third G negative electrode bonding region and is connected with a second G negative electrode outer lead.
The root parts of the outer pins are provided with anti-seepage grooves 005 so as to increase the resistance of moisture entering.
The I-shaped structures of the first common positive bonding area 008-1 and the second common positive bonding area 008-2 are used for increasing the strength of plastic cladding.
The metal frame 000 is further provided with a support clamp 007 for supporting the plastic package during packaging.
When the formed bracket is used, the R/G/B tricolor chips are fixedly placed in the bowl cups respectively, then the keys and the leads are used for connecting each functional area, and then the bowl cups are filled with pouring sealant;
the embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. The utility model provides a TOP type four unification full-color LED packaging structure which characterized in that, includes metal crate, sets up plastic encapsulated body and four bowls on metal crate: first bowl cup, second bowl cup, third bowl cup and fourth bowl cup all are provided with potting adhesive, chip solid crystal district, negative pole bonding district and total positive bonding district in every bowl cup, all fix on the chip solid crystal district in every bowl cup and put the tricolor chip: r, G, B chip, the tricolor chip is connected with the cathode bonding region and the common anode bonding region of the same color through bonding wires;
the tricolor chips in the first bowl cup are all arranged on the same chip die bonding area and are connected with the R chip die bonding area of the fourth bowl cup; the tricolor chips of the second bowl cup are all arranged on the same chip die bonding area and are connected with the R chip die bonding area of the third bowl cup; the chip G and the chip B of the third bowl cup are fixedly arranged in the same chip die bonding area; the chip G and the chip B of the fourth bowl cup are fixedly arranged in the same chip die bonding area;
the first bowl cup and the second bowl cup share the anode, and the third bowl cup and the fourth bowl cup share the anode; r, G, B chips fixed in the first bowl are respectively connected with R, G, B chips fixed in the fourth bowl in a same color and collinear way; r, G, B chips fixed in the second bowl are respectively connected with R, G, B chips fixed in the third bowl in the same color and the same line;
eight outer pins are symmetrically arranged on the metal frame, are respectively positioned on two sides of the metal frame and are respectively connected with the cathode bonding area and the common anode bonding area.
2. The structure of claim 1, wherein the metal frame further comprises a support fastening point, and the support fastening point supports the plastic encapsulant.
3. The TOP type four-in-one full-color LED package structure of claim 1, wherein the plastic encapsulant has a polarity identification mark on its surface.
4. The structure of claim 1, wherein the surface of the plastic encapsulant is frosted.
5. The TOP type four-in-one full-color LED package structure of claim 1, wherein an injection molding nozzle is disposed on the back of the metal frame, and the injection molding nozzle is connected to the plastic encapsulation body.
6. The TOP type four-in-one full-color LED package structure of claim 1, wherein the metal frame has two symmetrical bottom-recessed notches on the back surface.
7. A TOP type four-in-one full-color LED bracket is characterized by comprising a metal frame, four subareas and outer pins, wherein the four subareas and the outer pins are arranged on the metal frame, and each subarea internally comprises a solid crystal area and a bonding area;
the outer pins are eight symmetrically arranged: the first R negative electrode outer pin, the second R negative electrode outer pin, the first G negative electrode outer pin, the second G negative electrode outer pin, the first B negative electrode outer pin, the second B negative electrode outer pin, the first common-anode outer pin and the second common-anode outer pin;
the solid crystal region comprises four regions which are respectively arranged in the four regions:
four R chip die attach regions: a first R chip die bonding area, a second R chip die bonding area, a third R chip die bonding area and a fourth R chip die bonding area;
four G chip die attach regions: the first G chip die bonding area, the second G chip die bonding area, the third G chip die bonding area and the fourth G chip die bonding area;
four B chip die bonding areas: a first B chip die bonding area, a second B chip die bonding area, a third B chip die bonding area and a fourth B chip die bonding area;
the first R chip die bonding area, the first G chip die bonding area, the first B chip die bonding area and the fourth R chip die bonding area are integrated and connected with the first R cathode outer pin;
the second R chip die bonding area, the second G chip die bonding area, the second B chip die bonding area and the third R chip die bonding area are integrated and connected with a second R negative electrode outer pin;
the third G chip die bonding area and the third B chip die bonding area are integrated and are connected with the first B cathode outer pin;
the fourth G chip die bonding area and the fourth B chip die bonding area are integrated and are connected with a second B cathode outer pin;
the bonding region comprises four regions respectively arranged in the four regions:
four anodic bonding regions: a first anodic bonding region, a second anodic bonding region, a third anodic bonding region and a fourth anodic bonding region;
the first anode bonding region and the second anode bonding region are connected to form a first common anode bonding region and are connected with a first common anode outer lead;
the third anodic bonding area and the fourth anodic bonding area are connected to form a second common-anode bonding area and are connected with a second common-anode outer lead;
twelve R, G, B negative electrode bonding regions, wherein the first G negative electrode bonding region is connected with the fourth G negative electrode bonding region and is connected with the first G negative electrode outer lead; the second G negative electrode bonding region is connected with the third G negative electrode bonding region and is connected with a second G negative electrode outer lead.
8. The TOP type four-in-one full-color LED bracket according to claim 7, wherein the root of each outer pin is provided with an anti-seepage groove.
9. The TOP type four-in-one full-color LED support according to claim 7, wherein the first and second common positive bonding regions are both I-shaped.
10. The TOP type four-in-one full-color LED bracket according to claim 7, wherein the metal frame is further provided with a support clamping point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201922224355.XU CN211907432U (en) | 2019-12-12 | 2019-12-12 | TOP type four-in-one full-color LED support and packaging structure thereof |
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| CN201922224355.XU CN211907432U (en) | 2019-12-12 | 2019-12-12 | TOP type four-in-one full-color LED support and packaging structure thereof |
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| CN211907432U true CN211907432U (en) | 2020-11-10 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594144A (en) * | 2021-07-07 | 2021-11-02 | 浙江英特来光电科技有限公司 | N-in-1 full-color display device with face mask |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113594144A (en) * | 2021-07-07 | 2021-11-02 | 浙江英特来光电科技有限公司 | N-in-1 full-color display device with face mask |
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