CN211791950U

CN211791950U - Microphone structure and detection component

Info

Publication number: CN211791950U
Application number: CN202020818024.9U
Authority: CN
Inventors: 谢水源
Original assignee: Harmony Electronics Corp
Current assignee: Harmony Electronics Corp
Priority date: 2020-05-15
Filing date: 2020-05-15
Publication date: 2020-10-27
Anticipated expiration: 2030-05-15

Abstract

A microphone structure and a detection assembly are provided. The microphone structure comprises a substrate, a cover body, a specific application chip and a microphone chip. The substrate has a first side and a second side opposite to each other. The first side is provided with a concave structure which is concave from the surface of the first side to form a concave space. The cover body is arranged on the second side of the substrate, wherein the cover body and the substrate form an accommodating space together. The cover body is provided with a sound inlet hole communicated with the accommodating space. The specific application chip is arranged on the second side and is electrically connected with the substrate. The microphone chip is arranged on the second side and electrically connected with the substrate and the specific application chip. The substrate is provided with a through hole which is communicated with the concave space and the accommodating space. The microphone chip is arranged at a position aligned with the transmission hole. When the microphone structure is arranged on the application end part, the substrate, the microphone chip and the application end part jointly form a closed cavity in the concave space. Therefore, the novel microphone structure can directly form a large back cavity space together with the application end part, so that the microphone structure has good sensitivity.

Description

Microphone structure and detection component

Technical Field

The present invention relates to a microphone structure and a detecting assembly thereof, and more particularly to a microphone structure with a large back cavity space and a detecting assembly for detecting the microphone structure.

Background

The existing microphone structure is mainly divided into a front-sound type microphone structure and a rear-sound type microphone structure. The common forward-sound microphone structure mainly uses the space where the sound enters the microphone chip and the application-specific chip from the upper cover as a front cavity, and when the sound enters the front cavity and passes through the microphone chip, the cavity of the microphone chip is a back cavity.

However, the sensitivity of sound is mainly determined by the volume of the back cavity, so when the cavity of the microphone chip itself is used as the back cavity, the problem of low sensitivity often occurs because the volume of the back cavity is too small.

SUMMERY OF THE UTILITY MODEL

It is therefore an object of the present invention to provide a microphone structure and a detection assembly for detecting the same, wherein the substrate structure of the microphone structure can directly form a large back cavity space together with an application end component, so that the microphone structure has good sensitivity.

In accordance with the above objects of the embodiments of the present invention, a microphone structure is provided. The microphone structure is configured to be connected to an application terminal. The microphone structure comprises a substrate, a cover body, an application specific chip and a microphone chip. The substrate is provided with a first side and a second side which are opposite, wherein the first side is provided with a concave structure which is concave from the surface of the first side to form a concave space. The cover body is arranged on the second side of the substrate, wherein the cover body and the substrate jointly form an accommodating space, and the cover body is provided with a sound inlet hole communicated with the accommodating space. The specific application chip is arranged on the second side and is electrically connected with the substrate. The microphone chip is arranged on the second side and electrically connected with the substrate and the specific application chip. The substrate is provided with a through hole for communicating the concave space and the accommodating space, the microphone chip is arranged at the position aligned with the through hole, and when the microphone structure is arranged on the application end part, the substrate, the microphone chip and the application end part jointly enable the concave space to form a closed cavity.

According to an embodiment of the present invention, a retaining wall is disposed on a periphery of the second side of the substrate. The cover body is a plate body and is covered on the retaining wall to form the accommodating space.

According to an embodiment of the present invention, the cover has an inverted-u-shaped cross-section, and the cover is disposed on the second side of the substrate to form an accommodating space.

According to an embodiment of the present invention, the substrate is a ceramic substrate or a printed circuit board.

According to an embodiment of the present invention, the second side of the substrate is provided with at least one bonding pad located in the accommodating space, and the first side of the substrate is provided with at least one bonding pad adjacent to the recessed structure. The at least one bonding pad and the at least one bonding pad are electrically connected with each other through at least one conductive structure penetrating through the substrate.

According to an embodiment of the present invention, the recessed structure on the first side of the substrate is provided with a seal ring structure, and the seal ring structure is connected to another seal ring structure on the application terminal component by a conductive adhesive or a non-conductive adhesive.

According to the above object of the present invention, another detecting assembly is provided. The detecting component is mainly configured to detect the microphone structure. Wherein, the detection component comprises a measuring seat and a gasket structure. The measuring seat is provided with a plurality of probes which are configured to be electrically connected with the substrate of the microphone structure. The gasket structure is arranged on the measuring seat. When the microphone structure is arranged on the measuring seat, the substrate, the microphone chip and the gasket structure together enable the concave space to form another closed cavity.

Therefore, the present invention mainly changes the structure itself of the substrate of the microphone structure and the relative position configuration between the substrate and the microphone chip, so that when the microphone structure is installed in an application product, the back cavity of the microphone structure can be formed at the same time, thereby improving the problems of too small back cavity and poor sensitivity of the existing forward-sound type microphone structure. Specifically, this novel mode through set up concave structure on the base plate forms an open space on the base plate to set up microphone chip on the base plate and communicate this open space's the position of passing the through-hole, make the base plate can make open space on the base plate be sealed by application end part and form a closed cavity when installing in application end part, come as the back cavity of microphone structure, borrow this sensitivity that promotes whole microphone structure.

On the other hand, since the concave structure on the substrate of the microphone structure is an open space when the microphone structure is not yet coupled to the application end member, the microphone structure cannot be detected by using the conventional detection equipment. Therefore, this novel another provides a determine module, the configuration is in order to detect aforementioned microphone structure, when this novel microphone structure sets up on this novel determine module's measuring seat, can simulate this novel microphone structure and carry state when using the end product, and then test the sensitivity of microphone structure.

Drawings

For a more complete understanding of the embodiments and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:

fig. 1 is an external view schematically showing a microphone structure according to a first embodiment of the present invention;

fig. 2 is a schematic cross-sectional view showing a microphone structure according to a first embodiment of the present invention;

fig. 3 is an exploded view of a substrate and a cover of a microphone structure according to a first embodiment of the present invention;

fig. 4 is a schematic bottom view of a substrate showing a microphone structure according to a first embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a microphone configuration utilizing a detection assembly in accordance with the present novel concept;

fig. 6 is an external view schematically showing a microphone structure according to a second embodiment of the present invention;

fig. 7 is a schematic cross-sectional view showing a microphone structure according to a second embodiment of the present invention;

fig. 8 is an exploded view of a substrate and a cover showing a microphone structure according to a second embodiment of the present invention; and

fig. 9 is a schematic bottom view showing a microphone structure according to a second embodiment of the present invention.

Description of reference numerals:

100: microphone structure

110: substrate

110 a: through hole

111: first side

111 a: recessed structure

112: second side

112 a: retaining wall

120: cover body

121: sound inlet hole

130: application specific chip

140: microphone chip

200: application end component

301: bonding pad

302: bonding pad

303: conductive structure

400: detection assembly

410: measuring seat

411: probe needle

420: gasket structure

500: microphone structure

510: substrate

510 a: through hole

511: first side

511 a: recessed structure

512: second side

520: cover body

521: sound inlet hole

530: application specific chip

540: microphone chip

601: bonding pad

602: bonding pad

603: conductive structure

A1: depressed space

A2: containing space

A3: depressed space

A4: containing space

S1: sealing ring structure

S2: sealing ring structure

S3: sealing ring structure

S4: sealing ring structure

Detailed Description

Referring to fig. 1 and fig. 2, wherein fig. 1 and fig. 2 respectively show an appearance schematic diagram and a cross-sectional schematic diagram of a microphone structure according to a first embodiment of the present invention. The microphone structure 100 of the present embodiment is configured to be connected to the application terminal assembly 200, and can directly form a sealed cavity with the application terminal assembly 200, which can be used as a back cavity of the microphone structure 100. In the present embodiment, the microphone structure 100 mainly includes a substrate 110, a cover 120, an asic 130, and a microphone chip 140. In an embodiment, the substrate 110 may be a ceramic substrate or a printed circuit substrate, but is not limited to these examples. The asic 130 and the microphone chip 140 are electrically connected to the substrate 110, and the asic 130 is mainly used for detecting the structural deformation of the microphone chip 140, converting the structural deformation into an electrical signal, and transmitting the electrical signal to a related processing element, such as a baseband processor or an amplifier.

Referring to fig. 2 to 4, fig. 3 is an exploded view illustrating a substrate and a cover of a microphone structure according to a first embodiment of the present invention, and fig. 4 is a bottom view illustrating a substrate of a microphone structure according to a first embodiment of the present invention. In the present embodiment, the cross-sectional shape of the substrate 110 is substantially H-shaped. The substrate 110 has a first side 111 and a second side 112 opposite to each other, wherein the first side 111 of the substrate 110 has a concave structure 111a, and the concave structure 111a is recessed from a surface of the first side 111 to form a recessed space a 1. The periphery of the second side 112 of the substrate 110 is provided with a retaining wall 112 a. The cover 120 is a flat plate and covers the retaining wall 112a, such that the cover 120 and the retaining wall 112a form an accommodating space a2 on the second side 112 of the substrate 110. In some embodiments, the top surface of the retaining wall 112a may be provided with a sealing ring structure, and the cover 120 may be bonded to the retaining wall 112a of the substrate 110 by using a conductive adhesive or a non-conductive adhesive. In other examples, the cover 120 may be made of metal or glass, or the cover 120 itself may be a printed circuit board. The asic 130 and the microphone chip 140 are disposed on the second side 112 of the substrate 110 and located in the accommodating space a 2.

Referring to fig. 2 again, the sound inlet hole 121 is disposed on the cover 120 and communicates with the accommodating space a2, so that external sound waves can enter the accommodating space a2 from the sound inlet hole 121, and the accommodating space a2 can serve as a front cavity of the microphone structure 100. In addition, the substrate 110 has a through hole 110a communicating the accommodating space a2 and the recessed space a1, and the microphone chip 140 is disposed at a position aligned with the through hole 110a of the substrate 110. When the microphone structure 100 is disposed on the application terminal 200 as shown in fig. 1, the substrate 110, the microphone chip 140, and the application terminal 200 can jointly form a closed cavity in the recessed space a 1. Thus, the enclosed recessed space a1 can serve as a back cavity of the microphone structure 100. That is, by providing the concave structure 111a on the substrate 110, the substrate 110 can make the concave space a1 of the concave structure 111a directly serve as the back cavity of the microphone structure 100 when being bonded to the application terminal assembly 200, thereby increasing the back cavity volume of the whole microphone structure 100 to improve the sensitivity of the microphone structure 100.

As shown in fig. 2 and 4, a seal ring structure S1 is disposed around the periphery of the recessed structure 111a on the first side 111 of the substrate 110, and the seal ring structure S1 is connected to another seal ring structure S2 on the application terminal 200 shown in fig. 1 by a conductive adhesive or a non-conductive adhesive. As shown in fig. 2, the second side 112 of the substrate 110 is provided with at least one pad 301 located in the accommodating space a2, and the first side 111 of the substrate 110 is provided with at least one pad 302 adjacent to the concave structure 111 a. The pads 301 and the pads 302 are electrically connected to each other through the conductive structures 303 penetrating through the substrate 110, so as to guide the electrical signal to the outside of the product.

Referring to fig. 5, a schematic diagram illustrating a microphone structure detected by a detecting component according to the present invention is shown. The detecting assembly 400 of the present embodiment mainly includes a measuring seat 410 and a spacer structure 420. The measuring base 410 has a plurality of probes 411, and the spacer structure 420 is disposed on the measuring base 410. When the microphone structure 100 is disposed on the measuring seat 410, the probe 411 of the measuring seat 410 is electrically connected to the pad 302 at the bottom of the substrate 110 of the microphone structure 100, and the substrate 110, the microphone chip 140 and the pad structure 420 of the microphone structure 100 together form a closed cavity in the recess space a1, so as to simulate the state of the microphone structure 100 when it is mounted on an application product, and further test the sensitivity of the microphone structure 100.

It should be understood that, in the above embodiments, the cross-section of the substrate of the microphone structure is generally H-shaped, and is not intended to limit the present invention. In other embodiments, the substrate of the microphone structure may have different structural designs. Referring to fig. 6 to 9, fig. 6 and 7 are an external schematic view and a cross-sectional schematic view respectively illustrating a microphone structure according to a second embodiment of the present invention. Fig. 8 is an exploded view showing a substrate and a cover of a microphone structure according to a second embodiment of the present invention, and fig. 9 is a bottom surface angle view showing a microphone structure according to a second embodiment of the present invention.

As shown in fig. 6 and 7, in the present embodiment, the microphone structure 500 mainly includes a substrate 510, a cover 520, an asic 530, and a microphone chip 540. In one embodiment, the ASIC 530 and the microphone 540 are electrically connected to the substrate 510. In this embodiment, the substrate 510 of this embodiment is a flat plate block, and does not have the retaining wall as in the previous embodiments.

As shown in fig. 7 and 9, the substrate 510 has a first side 511 and a second side 512 opposite to each other, wherein the first side 511 of the substrate 510 has a concave structure 511a, and the concave structure 511a is recessed from the surface of the first side 511 to form a concave space a 3. The cover 520 is an n-shaped structure and covers the second side 512 of the substrate 510, and the cover 520 and the substrate 510 together form an accommodating space a 4. As shown in fig. 8, in the present embodiment, the second side 512 of the substrate 510 may be provided with a sealing ring structure S3, and the cover 520 may be bonded to the substrate 510 by using a conductive adhesive or a non-conductive adhesive. In the present embodiment, the asic 530 and the microphone chip 540 are disposed on the second side 512 of the substrate 510 and located in the accommodating space a 4.

Referring to fig. 7 again, the cover 520 has the sound inlet 521 connected to the accommodating space a4, so that external sound waves can enter the transmitting accommodating space a4 from the sound inlet 521, and the accommodating space a4 can serve as a front cavity of the microphone structure 500. In addition, the substrate 510 has a through hole 510a communicating the accommodating space a4 and the recessed space A3, and the microphone chip 540 is disposed at a position aligned with the through hole 510a of the substrate 510. When the microphone structure 500 is disposed on the application terminal 200 as shown in fig. 1, the substrate 110, the microphone chip 540, and the application terminal 200 can jointly form a closed cavity with the recessed space a 3. Thus, the enclosed recessed space a3 can serve as a back cavity of the microphone structure 500. That is, by providing the concave structure 511a on the substrate 510, when the substrate 510 is coupled to the application end part 200 shown in fig. 1, the concave space a3 of the concave structure 511a can be directly used as the back cavity of the microphone structure 500, thereby increasing the volume of the back cavity of the microphone structure 500 and further improving the sensitivity of the microphone structure 500.

As shown in fig. 7 and 9, a sealing ring structure S4 is disposed around the periphery of the concave structure 511a on the first side 511 of the substrate 510, and the sealing ring structure S4 is connected to the sealing ring structure S2 on the application terminal 200 shown in fig. 1 by conductive adhesive. As shown in fig. 7, the second side 512 of the substrate 510 is provided with at least one pad 601 located in the accommodating space a4, and the first side 511 of the substrate 510 is provided with at least one pad 602 adjacent to the concave structure 511 a. The pad 601 and the pad 602 are electrically connected to each other through the conductive structure 603 penetrating through the substrate 510, so as to guide the electrical signal to the outside of the product.

Referring to fig. 5 and fig. 7, similarly, the microphone structure 500 of the present embodiment may also use the detection assembly 400 shown in fig. 5 to perform detection, and when the microphone structure 500 is disposed on the measuring seat 410, the substrate 510, the microphone chip 540 and the pad structure 420 of the microphone structure 500 may jointly form a closed cavity with the recessed space a3, so as to simulate a state where the microphone structure 500 is mounted on an application product, and further test the sensitivity of the microphone structure 500.

In view of the above, the present invention mainly changes the structure itself of the substrate of the microphone structure and the relative position configuration between the substrate and the microphone chip, so that the microphone structure can form the back cavity of the microphone structure when the microphone structure is installed in the application product, thereby improving the problem that the back cavity of the existing forward-sound microphone structure is too small and the sensitivity is not good. Specifically, this novel mode through set up concave structure on the base plate forms an open space on the base plate to set up microphone chip on the base plate and communicate this open space's the position of passing the through-hole, make the base plate can make open space on the base plate be sealed by application end part and form a closed cavity when installing in application end part, come as the back cavity of microphone structure, borrow this sensitivity that promotes whole microphone structure.

Claims

1. A microphone structure configured to be connected to an application terminal, the microphone structure comprising:

a substrate having a first side and a second side opposite to each other, wherein the first side has a concave structure recessed from a surface of the first side to form a recessed space;

a cover body arranged at the second side of the substrate, wherein the cover body and the substrate form an accommodating space together, and the cover body is provided with a sound inlet hole communicated with the accommodating space;

a specific application chip disposed on the second side and electrically connected to the substrate; and

a microphone chip arranged on the second side and electrically connected with the substrate and the specific application chip;

when the microphone structure is arranged on the application end part, the substrate, the microphone chip and the application end part jointly enable the concave space to form a closed cavity.

2. The microphone structure as claimed in claim 1, wherein a retaining wall is disposed around the second side of the substrate, and the cover is a plate and covers the retaining wall to form the receiving space.

3. The microphone structure of claim 1, wherein the cover has a n-shaped cross-section and is disposed on the second side of the substrate to form the receiving space.

4. The microphone structure of claim 1 wherein the substrate is a ceramic substrate or a printed circuit substrate.

5. The microphone structure of claim 1 wherein the second side of the substrate has at least one pad disposed in the receiving space, and the first side of the substrate has at least one pad disposed adjacent to the recessed structure, wherein the at least one pad and the at least one pad are electrically connected to each other through at least one conductive structure penetrating through the substrate.

6. The microphone structure of claim 1 wherein the recessed structural peripheral ring on the first side of the substrate is provided with a seal ring structure that is connected to another seal ring structure on the application terminal member by a conductive or a non-conductive adhesive.

7. A detection assembly configured to detect a microphone structure according to any one of claims 1 to 6, the detection assembly comprising:

a measuring base having a plurality of probes configured to electrically connect to the substrate of the microphone structure; and

a gasket structure arranged on the measuring seat;

when the microphone structure is arranged on the measuring seat, the substrate, the microphone chip and the gasket structure together enable the concave space to form another closed cavity.