CN211630702U

CN211630702U - Cooling fin heat dissipation integrated assembly

Info

Publication number: CN211630702U
Application number: CN202020469966.0U
Authority: CN
Inventors: 段红杰; 赵兵; 曹召朋; 王浩; 阎夏云; 张建义
Original assignee: Hebei Puni Medical Technology Co ltd
Current assignee: Hebei Puni Medical Technology Co ltd
Priority date: 2020-04-02
Filing date: 2020-04-02
Publication date: 2020-10-02
Anticipated expiration: 2030-04-02

Abstract

The utility model discloses a refrigeration piece heat dissipation integrated assembly, including the refrigeration piece, still include the heat dissipation box, the two sides of heat dissipation box respectively distribute and have two at least heat dissipation draw-in grooves, it is two liang just right to be located the two side heat dissipation draw-in grooves of heat dissipation box, it has the refrigeration piece to be located the card income of every heat dissipation draw-in groove, the face of heating and the heat dissipation box of refrigeration piece meet, it has a plurality of heat dissipation channels to be located the heat dissipation box along vertical direction equipartition, the one end of heat dissipation box be fixed with the fan, adopt the combined heat abstractor of thermoelectric cooler + fin + fan, wherein, the fan can adopt controllable fan, adjustable rotational speed has realized preventing the accumulational beneficial efficiency of heat in quick the heat transfer of.

Description

Cooling fin heat dissipation integrated assembly

Technical Field

The invention belongs to the field of heat dissipation equipment structures and discloses a cooling fin heat dissipation integrated assembly.

Background

With the continuous development of microelectronic devices, the number of elements inside the devices is also multiplied, which causes the heat generation condition to be more serious, thereby affecting the normal operation of the devices. Therefore, the heat dissipation problem of the device is more and more emphasized, and the conventional heat dissipation device mainly dissipates heat by wind cooling, water cooling, heat dissipation by heat pipes and the like.

At present, electric field treatment equipment on the market needs to output larger power to realize effective treatment, so that the equipment has serious heating condition during working, generally adopts an air cooling mode to dissipate heat of the equipment, but the heat dissipation effect is not ideal.

Aiming at air cooling heat dissipation, forced cooling is mainly achieved through a fan, meanwhile, the contact area between the fin structure in the heat dissipation sheet and air can be increased, heat can be quickly dissipated into the air through the fins, and the heat dissipation effect is achieved. However, as the power of various components and devices is continuously increased, the heat generation amount thereof is increased, and the required heat dissipation power is also continuously increased, so that the power, the volume and the number of the fans are also continuously increased, noise generated during the operation of the fans and the space required to be reserved in the equipment are also continuously increased, and the portable equipment or the equipment required to be used in a quiet place is undoubtedly disadvantageous.

There is a thermoelectric cooler based on semiconductor material for heat conducting electronic components. The heat transfer quantity changes along with the change of current by providing a direct current power supply, is as small as several milliwatts and as large as more than kilowatt, and can be regulated and controlled according to actual requirements. However, when the thermoelectric refrigerator is used alone for heat dissipation, the thermoelectric refrigerator can only transfer heat from one side of the component to the other side, and the heat still exists in the equipment and is not discharged.

Disclosure of Invention

The invention aims to avoid the accumulation of heat energy caused by the fact that the refrigerator in the background art cannot effectively exchange heat in use, thereby providing a refrigeration fin heat dissipation integrated assembly which realizes the effective control of the temperature high point of the refrigeration fin.

The technical scheme is as follows:

the utility model provides a refrigeration piece heat dissipation integrated assembly, includes the refrigeration piece, still includes the heat dissipation box, and the two sides of heat dissipation box respectively distribute has at least one heat dissipation draw-in groove, and it is two liang just right to be located the two side heat dissipation draw-in grooves of heat dissipation box, it has the refrigeration piece to be located every heat dissipation draw-in groove card income, the face of heating of refrigeration piece meet with the heat dissipation box, it has a plurality of heat dissipation passageways to be located the heat dissipation box along vertical direction equipartition, the one end of heat dissipation box be fixed with the.

Furthermore, each heat dissipation channel is separated from the adjacent heat dissipation channel through a heat dissipation fin, and the heat dissipation fins and the heat dissipation box are integrally formed.

Furthermore, the inner wall of the heat dissipation channel is in a wave shape for increasing the effective heat dissipation surface area.

Furthermore, a heat conduction heat pipe is arranged between every two opposite heat dissipation clamping grooves in at least one corresponding heat dissipation channel, and two ends of the heat conduction heat pipe are respectively connected to the side faces of the heat dissipation clamping grooves.

Furthermore, the refrigeration piece is fixed in the heat dissipation clamping groove through heat conduction RTV glue. Compared with the prior art, the invention has the beneficial effects that:

1. a combined heat dissipation device of a thermoelectric cooler, a heat dissipation sheet and a fan is adopted, wherein the fan can adopt a controllable fan, and the rotating speed can be adjusted.

2. The direct-current voltage at the two ends of the thermoelectric refrigerator is adjusted or the rotating speed of the controllable fan is adjusted in a matching mode, so that the heat dissipation power of the whole heat dissipation device is adjusted and controlled, the required heat dissipation power can be adjusted according to the heating condition of actual components, and the components can be kept to work at the proper temperature all the time.

3. The surface of the fin in the radiating fin adopts a corrugated structure design, so that the contact area of the radiating fin and air is further increased, and heat can be rapidly radiated into the air.

4. The heat sources can be symmetrically arranged on two sides of the radiating fin, the structure is more compact, the length of the radiating fin in the axial direction of the fan is shortened, the thermal resistance value of air inside the radiating fin is reduced, and the radiating efficiency is improved.

5. The thermoelectric cooler is installed in the slot of the heat sink, and the heat generating surface of the thermoelectric cooler is directly contacted with the heat sink, so that the heat is rapidly transferred to the heat sink.

6. The radiating fins are made of materials with high heat conductivity coefficient, such as aluminum, copper and the like, and are thin in structural design and small in thermal resistance. And the inside is formed by a plurality of fins, increases the area of contact with the air. The surface of the fin is designed into a corrugated structure, so that the contact area with air is further increased. Therefore, heat can be rapidly transferred to the fins in the heat sink and diffused into the air.

7. The fan is installed to the both sides of fin, and the fan during operation improves the inside air velocity of fin for the air that has the heat can shift rapidly, and finally discharges through the louvre.

Drawings

Fig. 1 is an axial view of the present invention;

fig. 2 is a side view of the present invention;

3 FIG. 3 3 3 is 3 a 3 cross 3- 3 sectional 3 view 3 taken 3 at 3 A 3- 3 A 3 of 3 FIG. 3 2 3; 3

FIG. 4 is a view showing an internal structure of a refrigerator;

FIG. 5 is a view of the present invention with a heat pipe shaft;

description of reference numerals:

the heating element 1 and the refrigerating sheet 2; a fan 3; a heat dissipation case 4, a substrate 5; a heat conductive sheet 6; a semiconductor crystal grain 7 and a heat pipe 8;

Detailed Description

The invention will be further explained below with reference to the accompanying figures 1 to 5:

the utility model provides a refrigeration piece heat dissipation integrated assembly, including the refrigeration piece, still include the heat dissipation box, the two sides of heat dissipation box respectively distribute and have two at least heat dissipation draw-in grooves, it is two liang just right to be located the two side heat dissipation draw-in grooves of heat dissipation box, it has the refrigeration piece to be located every heat dissipation draw-in groove card income, the face of heating of refrigeration piece meet with the heat dissipation box, it has a plurality of heat dissipation passageways to be located the heat dissipation box along vertical direction equipartition, every heat dissipation passageway separate through heat radiation fins with adjacent heat dissipation passageway, heat radiation fins and heat dissipation box integrated into one piece, the one end of heat dissipation box be fixed with the fan.

As shown in fig. 3 and 5, the inner wall of the heat dissipation channel is wavy for increasing the effective heat dissipation surface area, a heat conduction pipe is disposed in at least one corresponding heat dissipation channel between each two opposite heat dissipation slots, two ends of the heat conduction pipe are respectively connected to the side surfaces of the heat dissipation slots, the middle of the heat conduction pipe is open-circuited, each heat conduction pipe is composed of two heat conduction pipe units which are freely butted together, and the butt end of each heat conduction pipe unit is a condensation end.

The refrigeration piece fix in the heat dissipation draw-in groove through heat conduction RTV glue, heating element be connected as an organic whole through heat conduction RTV and heat dissipation draw-in groove.

As shown in fig. 4, the refrigerating sheet is composed of a base plate 5; a heat conductive sheet 6; the semiconductor crystal grain structure comprises a semiconductor crystal grain 7, a plurality of semiconductor crystal grains are combined in series and parallel, all the semiconductor crystal grains are arranged in a packaging substrate 5, the semiconductor crystal grains are composed of P-type semiconductor crystal grains and M-type semiconductor crystal grains which are arranged in a staggered mode, and the semiconductor crystal grains are connected with the substrate 5 through a heat conducting sheet 6.

The heating element is connected with the thermoelectric cooler through the heat-conducting silica gel; the thermoelectric cooler is inserted into a slot hole of the radiating fin corresponding to the preset slot hole, the wiring is upward, and the thermoelectric cooler is fixed with the radiating fin body through the heat-conducting silica gel; the fan is fixed on the two sides of the radiating fin through screws.

The utility model discloses an operation process does:

after the starting equipment normally works, a large amount of heat is generated at the heating element, a direct current voltage is applied to two ends of the refrigerating sheet, the refrigerating sheet starts to work, the heat of the contact surface of the refrigerating sheet and the heating element is quickly transferred to the other surface of the refrigerating sheet through a circuit, the heat is transferred to the heat dissipation box through the contact of the heat dissipation box and the current, a plurality of heat dissipation channels are separated from the heat dissipation box through the heat dissipation fins, and the heat is diffused into the air through the contact of the fins and the air. The fan is electrified and starts to work, the fans on the two sides keep the same direction to blow out air with a large amount of heat in the radiating fins, and finally the air is rapidly discharged to the external environment through the radiating holes in the equipment, so that the temperature in the equipment is always kept around the normal working temperature.

Claims

1. The utility model provides a refrigeration piece integrated assembly that dispels heat, includes the refrigeration piece, its characterized in that: still include the heat dissipation box, the two sides of heat dissipation box respectively distribute has at least one heat dissipation draw-in groove, and two liang of right in the two side heat dissipation draw-in grooves that are located the heat dissipation box are gone into to have the refrigeration piece in being located every heat dissipation draw-in groove, the face of heating and the heat dissipation box of refrigeration piece meet, be located the heat dissipation box and have a plurality of heat dissipation passageways along vertical direction equipartition, the one end of heat dissipation box be fixed with the fan.

2. A integrated cooling fin heat sink assembly as recited in claim 1 wherein: each heat dissipation channel is separated from the adjacent heat dissipation channel through a heat dissipation fin, and the heat dissipation fins and the heat dissipation box are integrally formed.

3. A integrated cooling fin heat sink assembly as recited in claim 2 wherein: the inner wall of the heat dissipation channel is wave-shaped for increasing the effective heat dissipation surface area.

4. A integrated cooling fin heat sink assembly as recited in claim 1 wherein: and a heat conduction heat pipe is arranged in at least one corresponding heat dissipation channel between every two opposite heat dissipation clamping grooves, and two ends of the heat conduction heat pipe are respectively connected to the side surfaces of the heat dissipation clamping grooves.

5. A integrated cooling fin heat sink assembly as recited in claim 1 wherein: the refrigeration piece is fixed in the heat dissipation clamping groove through heat conduction RTV glue.