CN220507045U - Electric appliance box heat radiation assembly and air conditioner - Google Patents
Electric appliance box heat radiation assembly and air conditioner Download PDFInfo
- Publication number
- CN220507045U CN220507045U CN202322331808.5U CN202322331808U CN220507045U CN 220507045 U CN220507045 U CN 220507045U CN 202322331808 U CN202322331808 U CN 202322331808U CN 220507045 U CN220507045 U CN 220507045U
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- heat
- power generation
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- semiconductor power
- assembly
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- 230000005855 radiation Effects 0.000 title description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 62
- 238000010248 power generation Methods 0.000 claims abstract description 60
- 230000017525 heat dissipation Effects 0.000 claims abstract description 54
- 238000005192 partition Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 10
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 238000004134 energy conservation Methods 0.000 abstract description 5
- 238000004378 air conditioning Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model relates to the technical field of air conditioning, and provides an electric appliance box heat dissipation assembly and an air conditioner, wherein the electric appliance box heat dissipation assembly comprises: the device comprises an electric box, a temperature difference semiconductor power generation assembly and a cooling fan; the temperature difference semiconductor power generation assembly is used for penetrating through a partition plate between a compressor and a fan of the air conditioner, so that temperature difference is formed at two sides of the temperature difference semiconductor power generation assembly; the radiator fan is arranged at the top of the electric box and is electrically connected with the temperature difference semiconductor power generation assembly. The temperature difference semiconductor power generation assembly can generate power by utilizing the temperature difference naturally formed in the working process of the air conditioner so as to supply power for a cooling fan arranged at the top of the electric box. The structure not only has the advantages of energy conservation and environmental protection, but also realizes that heat is taken away from the upper side of the electric appliance box to dissipate heat of the electric appliance box. The fan is matched with the original fan to radiate heat, so that the heat can be radiated from two different directions to the electric box, and the fan has a good radiating effect.
Description
Technical Field
The utility model relates to the technical field of air conditioning, in particular to an electric appliance box heat dissipation assembly and an air conditioner.
Background
An air conditioner is a device for adjusting and controlling parameters such as temperature, humidity and flow rate of air in a building or a structure by using manual means.
The air conditioner generally comprises an indoor unit and an outdoor unit, wherein the outdoor unit comprises an outdoor unit shell, a compressor, a condenser, a fan and an electric appliance box, and a computer board is arranged in the electric appliance box. The number of electronic components on the computer board is great, the arrangement is compact, and a large amount of heat can be emitted in the working process. In order to avoid influencing the service life of the electronic components due to overhigh temperature, the computer board needs to be cooled.
In the prior art, a fan is generally used for radiating heat of a computer board, however, the fan is generally installed at the bottom of the computer board, and the radiating direction is single, so that the radiating effect is poor.
Disclosure of Invention
The utility model provides a heat dissipation assembly of an electric appliance box and an air conditioner, which are used for solving the defects that in the prior art, a fan is usually arranged at the bottom of a computer board, the heat dissipation direction is single, and the heat dissipation effect is poor, so that heat is taken away from the upper side of the electric appliance box, and the heat is dissipated for the electric appliance box. The fan is matched with the original fan to radiate heat, so that the heat can be radiated from two different directions to the electric box, and the fan has a good radiating effect.
The utility model provides a heat dissipation assembly of an electric box, which comprises: the device comprises an electric box, a temperature difference semiconductor power generation assembly and a cooling fan;
the temperature difference semiconductor power generation assembly is used for being arranged on a partition plate between a compressor and a fan of the air conditioner in a penetrating mode, so that temperature difference is formed at two sides of the temperature difference semiconductor power generation assembly;
the heat radiation fan is arranged at the top of the electric box and is electrically connected with the temperature difference semiconductor power generation assembly.
According to the utility model, the heat dissipation assembly of the electrical box comprises:
a semiconductor power generation unit disposed on a side of the separator facing the compressor, the semiconductor power generation unit having an outer shape matching the compressor;
and the heat absorbing sheet is arranged at the end part of the semiconductor power generation unit.
According to the heat dissipation assembly of the electrical box, the end part of the semiconductor power generation unit is provided with the arc-shaped groove, and the radian of the arc-shaped groove is consistent with that of the compressor.
According to the heat dissipation assembly of the electrical box, the heat absorption sheet is made of flexible heat conduction materials.
According to the heat dissipation component of the electrical box, the heat absorption sheet is provided with the heat collection groove, the heat collection groove is in a straight line shape, and the length direction of the heat collection groove is perpendicular to the arc surface of the arc-shaped groove.
According to the heat dissipation assembly of the electrical box provided by the utility model, the temperature difference semiconductor power generation assembly further comprises: and the heat dissipation piece is arranged on one side, facing the fan, of the partition plate.
According to the heat dissipation assembly of the electrical box, the heat dissipation fan comprises the supporting plate and the fan body, the supporting plate is connected to the top plate of the electrical box, a round hole is formed in the supporting plate, and the fan body is embedded into the round hole.
According to the heat dissipation assembly of the electrical box, a preset distance is reserved between the heat dissipation fan and the top plate of the electrical box.
According to the heat dissipation assembly of the electric box, hollowed heat dissipation holes are formed in the areas, corresponding to the heat dissipation fans, of the top plate and the bottom plate of the electric box.
The utility model provides an air conditioner, which comprises any one of the electric appliance box heat dissipation components.
According to the electric box heat dissipation assembly, the temperature difference semiconductor power generation assembly is arranged on the partition plate between the compressor and the fan of the air conditioner, so that power generation can be performed by utilizing the temperature difference naturally formed in the working process of the air conditioner, and the heat dissipation fan arranged at the top of the electric box can be conveniently powered. The structure not only has the advantages of energy conservation and environmental protection, but also realizes that heat is taken away from the upper side of the electric appliance box to dissipate heat of the electric appliance box. The fan is matched with the original fan to radiate heat, so that the heat can be radiated from two different directions to the electric box, and the fan has a good radiating effect.
In the air conditioner provided by the embodiment of the utility model, the heat dissipation component of the electrical box is applied, so that the air conditioner also has the advantages as described above, and the details are not repeated here.
Drawings
In order to more clearly illustrate the utility model or the technical solutions of the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the utility model, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a heat dissipating assembly of an electrical box according to the present utility model;
FIG. 2 is a schematic diagram of the structure of an electric box and a cooling fan in the heat dissipation assembly of the electric box provided by the utility model;
fig. 3 is a schematic structural view of an air conditioner provided by the present utility model.
Reference numerals:
1: an electric box heat dissipation assembly;
10: an electric appliance box;
20: a thermoelectric semiconductor power generation assembly; 21: a semiconductor power generation unit; 22: a heat absorbing sheet; 221: a heat collecting tank; 23: a heat sink;
30: a heat radiation fan; 31: a support plate; 32: a fan body;
2: a compressor;
3: a blower;
4: a partition board.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the embodiments of the present utility model, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.
In embodiments of the utility model, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
The examples provided by the present utility model will now be described with reference to fig. 1 to 3, it being understood that the following are merely illustrative embodiments of the present utility model and are not to be construed as limiting the present utility model in any way.
The present utility model provides a heat-radiating assembly for an electrical box, which can be arranged inside an electrical apparatus such as an air conditioner, etc., so as to radiate heat from the electrical box 10 therein.
Fig. 1 is a schematic structural diagram of a heat dissipation assembly of an electrical box according to the present utility model, please refer to fig. 1. Specifically, this heat dissipation subassembly includes: an electrical box 10, a temperature difference semiconductor power generation assembly 20, and a cooling fan 30. Wherein, a computer board is arranged in the electric appliance box 10. The number of electronic components on the computer board is great, the arrangement is compact, and a large amount of heat can be emitted in the working process. The thermoelectric semiconductor power generation module 20 is configured to generate power using the temperature difference, and to supply power to the heat radiation fan 30, and the heat radiation fan 30 is configured to radiate heat from the electrical box 10.
In an air conditioner, a compressor 2 and a blower 3 are generally provided, the compressor 2 emits heat during operation, and the blower 3 is used for radiating heat from the compressor 2 and other components. Specifically, the fan 3 rotates to drive the airflow to flow, and heat of the electrical box 10 is taken away from the lower side of the electrical box 10 to dissipate heat. Specifically, the fan 3 may be an axial flow fan, and when the axial flow fan works, the blades push air to flow in the same direction as the shaft, so that the structure is simpler.
The above-mentioned compressor 2 and the fan 3 generally have the partition board 4 therebetween, and the temperature of the fan 3 side of the partition board 4 is lower than the temperature of the compressor 2 side due to the heat dissipation effect of the fan 3, that is, a temperature difference is naturally formed at both sides of the partition board 4 during the operation of the air conditioner.
Based on the above-mentioned temperature difference between the two sides of the partition board 4, the installation holes may be formed in the partition board 4, and the temperature difference semiconductor power generation assembly 20 in this embodiment may be installed on the partition board 4 between the compressor 2 and the fan 3 of the air conditioner in a penetrating manner, thereby forming temperature differences between the two sides of the temperature difference semiconductor power generation assembly 20. Based on the temperature difference, the temperature difference semiconductor power generation assembly 20 is capable of generating power.
Specifically, the thermoelectric semiconductor power generation assembly 20 is a novel power generation device capable of directly converting thermal energy into electrical energy using the seebell effect of semiconductor materials. In particular, semiconductor thermoelectric devices are typically composed of two different semiconductor materials. The working principle of the device is as follows: if there is a temperature difference across two different properties of the semiconductor, one of the materials will be heated and the other will be cooled. Because of the nature of the semiconductor materials, one material absorbs heat generated by the compressor 2 and the other material dissipates heat in the region of the flow of the fan 3, a potential difference is created between the two materials due to charge transport, thereby creating a dc voltage across the semiconductor which can be connected to an external circuit to form an electrical power output.
The thermoelectric semiconductor power generation has the characteristics of no noise, long service life, stable performance and the like. In the present embodiment, the thermoelectric semiconductor power generation assembly 20 generates power by using the temperature difference naturally generated during the operation of the air conditioner, and has the advantages of energy saving and environmental protection.
The heat dissipation fan 30 is disposed at the top of the electrical box 10, and the heat dissipation fan 30 is electrically connected to the thermoelectric semiconductor power generation assembly 20, and the thermoelectric semiconductor power generation assembly 20 supplies power to the heat dissipation fan 30, so that heat can be taken away from the upper side of the electrical box 10, thereby dissipating heat from the electrical box 10. The original fan 3 is matched for heat dissipation, so that heat dissipation can be conducted on the electric box 10 from two different directions, and the heat dissipation effect is improved.
According to the electric box heat dissipation assembly 1 provided by the utility model, the temperature difference semiconductor power generation assembly 20 is arranged on the partition plate 4 between the compressor 2 and the fan 3 of the air conditioner, so that the temperature difference naturally formed in the working process of the air conditioner can be utilized for generating power, and the heat dissipation fan 30 arranged at the top of the electric box 10 can be supplied with power. The structure not only has the advantages of energy conservation and environmental protection, but also realizes that heat is taken away from the upper side of the electric box 10 to dissipate heat of the electric box 10. The fan 3 is matched for radiating, so that the electric box 10 can radiate from two different directions, and the fan has good radiating effect.
In one embodiment provided by the present utility model, the thermoelectric semiconductor power generation assembly 20 includes: a semiconductor power generation unit 21 and a heat absorbing sheet 22. Wherein the semiconductor power generation unit 21 is used for generating power, and the heat absorbing sheet 22 is used for better absorbing heat released by the compressor 2.
Specifically, the semiconductor power generation unit 21 is provided on the partition plate 4 on the side facing the compressor 2, the outer shape of the semiconductor power generation unit 21 matches the compressor 2, and the heat absorbing sheet 22 is provided at the end of the semiconductor power generation unit 21 so as to fully utilize the internal space of the air conditioner to absorb heat from the compressor 2.
Further, in one embodiment provided by the present utility model, the end of the semiconductor power generation unit 21 forms a circular arc groove, and the arc of the circular arc groove is consistent with the arc of the compressor 2. That is, the ends of the semiconductor power generation unit 21 and the corresponding heat absorbing sheets 22 form a wave-shaped structure, thereby forming a larger heat exchange area with the compressor 2 and improving the heat absorbing effect.
Still further, in an embodiment of the present utility model, the heat absorbing sheet 22 is made of a flexible heat conducting material, and if collision is formed between the heat absorbing sheet 22 and the compressor 2, the heat absorbing sheet 22 can be deformed to avoid damaging the compressor 2 during the working process of the compressor 2.
In one embodiment of the present utility model, the heat absorbing sheet 22 is provided with the heat collecting groove 221, so that the heat exchange area can be further increased, and the heat collecting groove 221 is linear, and the length direction of the heat collecting groove 221 is perpendicular to the arc surface of the arc-shaped groove. This structure facilitates the processing and can further enhance the deformability of the heat absorbing sheet 22, thereby protecting the compressor 2.
In one embodiment provided by the present utility model, the thermoelectric semiconductor power generation assembly 20 further comprises: and a heat sink 23, the heat sink 23 being disposed on the partition plate 4 on a side facing the fan 3. The heat dissipation member 23 dissipates heat not used for power generation from the heat absorbed by the thermoelectric semiconductor power generation module 20, and increases the temperature difference between the two ends of the thermoelectric semiconductor power generation module 20, so that the thermoelectric semiconductor power generation module 20 can continuously generate power.
Specifically, the heat sink 23 may be a heat sink, which is not limited in this embodiment.
In any of the above embodiments provided by the present utility model, the heat radiation fan 30 includes a support plate 31 and a fan body 32, the support plate 31 being coupled to the top plate of the electric box 10 for supporting the fan body 32. Specifically, the support plate 31 has a circular hole therein, and the fan 32 is inserted into the circular hole. With this structure, the operation of the fan 32 is maintained stable and safe so as to blow or suck air from the upper side of the electric box 10, thereby radiating heat from the electric box 10.
Further, fig. 2 is a schematic structural diagram of an electrical box and a cooling fan in the electrical box cooling assembly provided by the utility model, please refer to fig. 2. In one embodiment of the present utility model, the heat dissipation fan 30 is spaced apart from the top plate of the electrical box 10 by a predetermined distance. That is, a gap is provided between the heat radiation fan 30 and the top plate of the electric box 10, thereby facilitating the flow of the heat radiation air flow. In application, the preset distance may be set as required, which is not limited in this embodiment.
Further, in one embodiment of the present utility model, hollowed heat dissipation holes are formed on the top plate and the bottom plate of the electrical box 10 corresponding to the heat dissipation fan 30, and the heat dissipation holes are arranged to facilitate the flow of the heat dissipation air flow, so as to further improve the heat dissipation effect of the heat dissipation fan 30 on the electrical box 10.
Furthermore, the bottom of the electrical box 10 may be further provided with a heat dissipation fin, based on which the heat dissipation area of the electrical box 10 may be increased, and the fan 3 rotates to drive the air flow to take away the heat of the heat dissipation fin from the lower side of the electrical box 10.
According to the electric box heat dissipation assembly 1 provided by the utility model, the temperature difference semiconductor power generation assembly 20 is arranged on the partition plate 4 between the compressor 2 and the fan 3 of the air conditioner, so that the temperature difference naturally formed in the working process of the air conditioner can be utilized for generating power, and the heat dissipation fan 30 arranged at the top of the electric box 10 can be supplied with power. The structure not only has the advantages of energy conservation and environmental protection, but also realizes that heat is taken away from the upper side of the electric box 10 to dissipate heat of the electric box 10. The fan 3 is matched for radiating, so that the electric box 10 can radiate from two different directions, and the fan has good radiating effect.
Further, in one embodiment provided by the present utility model, the thermoelectric semiconductor power generation assembly 20 includes: a semiconductor power generation unit 21 and a heat absorbing sheet 22. Wherein the semiconductor power generation unit 21 is used for generating power, and the heat absorbing sheet 22 is used for better absorbing heat released by the compressor 2. The heat absorbing sheet 22 is made of flexible heat conducting material, and if collision is formed between the heat absorbing sheet 22 and the compressor 2, the heat absorbing sheet 22 can be deformed to avoid damaging the compressor 2 in the working process of the compressor 2.
The utility model provides an air conditioner, and fig. 3 is a schematic structural diagram of the air conditioner provided by the utility model, please refer to fig. 3. The air conditioner comprises any one of the electric box heat dissipation components 1. Specifically, the air conditioner generally includes an indoor unit and an outdoor unit, the outdoor unit includes an outdoor unit casing, a compressor 2, a condenser, a fan 3, and an electric box 10, and a computer board is disposed in the electric box 10. The number of electronic components on the computer board is great, the arrangement is compact, and a large amount of heat can be emitted in the working process. In order to avoid influencing the service life of the electronic components due to overhigh temperature, the computer board needs to be cooled. The heat radiation component can be arranged in the outdoor unit shell of the air conditioner and combined with the compressor 2 and the fan 3 to radiate heat for the electric appliance box 10.
In specific embodiments, the air conditioner may be of various types, such as a wall-mounted air conditioner, a cabinet air conditioner, a window air conditioner, a ceiling air conditioner, a central air conditioner, or an air duct machine.
According to the air conditioner provided by the utility model, the temperature difference semiconductor power generation assembly 20 is arranged on the partition board 4 between the compressor 2 and the fan 3 of the air conditioner, and the power generation can be performed by utilizing the temperature difference naturally formed in the working process of the air conditioner so as to supply power to the cooling fan 30 arranged at the top of the electric box 10. The structure not only has the advantages of energy conservation and environmental protection, but also realizes that heat is taken away from the upper side of the electric box 10 to dissipate heat of the electric box 10. The fan 3 is matched for radiating, so that the electric box 10 can radiate from two different directions, and the fan has good radiating effect.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. An electrical cabinet heat dissipation assembly, comprising: an electric box (10), a temperature difference semiconductor power generation assembly (20) and a cooling fan (30);
the temperature difference semiconductor power generation assembly (20) is used for being arranged on a partition board (4) between a compressor (2) and a fan (3) of the air conditioner in a penetrating way, so that temperature difference is formed at two sides of the temperature difference semiconductor power generation assembly (20);
the cooling fan (30) is arranged at the top of the electrical box (10), and the cooling fan (30) is electrically connected with the temperature difference semiconductor power generation assembly (20).
2. The electrical box heat sink assembly of claim 1, wherein the thermoelectric semiconductor power generation assembly (20) comprises:
a semiconductor power generation unit (21), wherein the semiconductor power generation unit (21) is arranged on one side of the partition board (4) facing the compressor (2), and the shape of the semiconductor power generation unit (21) is matched with the compressor (2);
and a heat absorbing sheet (22), wherein the heat absorbing sheet (22) is arranged at the end part of the semiconductor power generation unit (21).
3. An electrical cabinet heat sink assembly according to claim 2, wherein the ends of the semiconductor power generation unit (21) form a circular arc shaped recess having a curvature conforming to the curvature of the compressor (2).
4. An electrical cabinet heat sink assembly according to claim 3, wherein the heat absorbing sheet (22) is of a flexible heat conducting material.
5. The electrical box heat dissipation assembly as set forth in claim 4, wherein the heat absorbing sheet (22) is provided with a heat collecting groove (221), the heat collecting groove (221) is linear, and the length direction of the heat collecting groove (221) is perpendicular to the arc surface of the arc-shaped groove.
6. The electrical box heat sink assembly of claim 2, wherein the thermoelectric semiconductor power generation assembly (20) further comprises: and the heat dissipation piece (23) is arranged on one side, facing the fan (3), of the partition board (4).
7. -electrical box heat sink assembly according to any of the claims 1 to 6, characterised in that the heat sink fan (30) comprises a support plate (31) and a fan body (32), the support plate (31) being connected to the top plate of the electrical box (10), the support plate (31) having a circular hole therein, the fan body (32) being embedded in the circular hole.
8. The electrical box heat sink assembly of claim 7, wherein the heat dissipating fan (30) is a predetermined distance from the top plate of the electrical box (10).
9. The electrical box heat dissipating assembly of claim 7, wherein the top and bottom plates of the electrical box (10) have hollowed-out heat dissipating holes formed therein in areas corresponding to the heat dissipating fan (30).
10. An air conditioner characterized by comprising the electrical box heat dissipating assembly (1) of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322331808.5U CN220507045U (en) | 2023-08-29 | 2023-08-29 | Electric appliance box heat radiation assembly and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322331808.5U CN220507045U (en) | 2023-08-29 | 2023-08-29 | Electric appliance box heat radiation assembly and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220507045U true CN220507045U (en) | 2024-02-20 |
Family
ID=89870136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322331808.5U Active CN220507045U (en) | 2023-08-29 | 2023-08-29 | Electric appliance box heat radiation assembly and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220507045U (en) |
-
2023
- 2023-08-29 CN CN202322331808.5U patent/CN220507045U/en active Active
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