CN211296696U

CN211296696U - Crystal oscillator chip carrying equipment

Info

Publication number: CN211296696U
Application number: CN202020069706.4U
Authority: CN
Inventors: 范奕彪; 陈正仕; 冯桂庆
Original assignee: Shenzhen Sunyilg Intelligent Equipment Co ltd
Current assignee: Shenzhen Sunyilg Intelligent Equipment Co ltd
Priority date: 2020-01-13
Filing date: 2020-01-13
Publication date: 2020-08-18
Anticipated expiration: 2030-01-13

Abstract

The utility model provides a crystal oscillator chip carries on equipment, include: the chip feeding mechanism is used for feeding chips; the crystal oscillator feeding mechanism is used for feeding crystal oscillators; the first turntable mechanism is used for receiving the crystal oscillator of the crystal oscillator feeding mechanism, transferring the crystal oscillator to be carried with a chip after the glue dispensing of the crystal oscillator, and transferring the chip carrying the crystal oscillator; the second rotary table mechanism is used for receiving the chip from the chip feeding mechanism and carrying the chip to the first rotary table mechanism; the glue dispensing mechanism is used for dispensing glue to the crystal oscillator and the crystal oscillator with the chip; the detection mechanism is used for detecting the crystal oscillator subjected to glue dispensing and the crystal oscillator subjected to glue dispensing after the chip is loaded; and the blanking mechanism is used for blanking the crystal oscillator wobble plate carrying the chip. The utility model provides a crystal oscillator chip carries on equipment, and the precision of gluing and carrying is high, and is fast, and the steady quality can improve the productivity greatly.

Description

Crystal oscillator chip carrying equipment

Technical Field

The utility model belongs to the technical field of crystal oscillator makes, more specifically say, relate to a crystal oscillator chip carries on equipment.

Background

A tiny quartz crystal resonator is called a crystal oscillator for short. A crystal element in which a chip is added inside a package to constitute an oscillation circuit is called a crystal oscillator. The product is generally packaged by a metal shell, and also packaged by a glass shell, ceramics or plastics. In this electronic and electrical era, the demand of crystal oscillator is bigger and bigger, however, still there are many crystal oscillators to paste the chip on the crystal oscillator through artifical some glue at present, and is inefficient like this, and the cost of labor is high, and the operator needs to possess conscientious handicraft, and to the manufacturing enterprise of mass, the production efficiency of this kind of mode is low, product quality is also unstable.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a crystal oscillator chip carries on equipment to solve the artifical glue that exists among the prior art and glue the production efficiency that leads to low, the unstable technical problem of production quality.

In order to achieve the above object, the utility model adopts the following technical scheme: provided is a crystal oscillator chip mounting apparatus including:

the chip feeding mechanism is used for feeding chips;

the crystal oscillator feeding mechanism is used for feeding crystal oscillators;

the first turntable mechanism is used for receiving the crystal oscillator of the crystal oscillator feeding mechanism, transferring the crystal oscillator to be carried with a chip after the glue dispensing of the crystal oscillator, and transferring the chip carrying the crystal oscillator;

the second rotary table mechanism is used for receiving the chip from the chip feeding mechanism and carrying the chip to the first rotary table mechanism;

the glue dispensing mechanism is used for dispensing glue to the crystal oscillator and the crystal oscillator with the chip;

the detection mechanism is used for detecting the crystal oscillator subjected to glue dispensing and the crystal oscillator subjected to glue dispensing after the chip is loaded; and

and the blanking mechanism is used for blanking the crystal oscillator wobble plate carrying the chip.

In one embodiment, the chip feeding mechanism comprises a magazine mechanism, the magazine mechanism comprises at least one magazine, a lifting assembly, a material taking assembly and a translation assembly, one magazine is placed at a moving end of the lifting assembly, the magazine comprises a plurality of stacked and spaced trays, the trays are provided with a plurality of chip accommodating cavities for placing chips, the lifting assembly is used for lifting the magazine for the material taking assembly to take materials, and the translation assembly is used for transferring empty magazines which are taken away chips.

In one embodiment, the magazine mechanism further comprises a support frame, the support frame comprises a bottom frame and an upper frame, the translation assembly is arranged on the bottom frame to transfer empty magazines placed on the bottom frame, and the material taking assembly is fixed on the upper frame to grab trays suspended in magazines above the bottom frame.

In one embodiment, the lifting assembly comprises a lifting motor, a screw rod driven by the lifting motor, a screw rod sliding block connected with the screw rod, and a carrier plate fixed on the screw rod sliding block, and the material box is placed on the carrier plate.

In one embodiment, the chip feeding mechanism further comprises a swinging plate mechanism for receiving a chip tray from the taking component, the swinging plate mechanism comprises an XY moving module, a clamp moving along with the XY moving module and used for limiting the tray, and a pushing component used for fixing the tray, the clamp is arranged on one side of the second turntable mechanism, so that the pressing mechanism on the second turntable mechanism drives the suction nozzle to grab a chip from the tray of the clamp.

In one embodiment, the first turntable mechanism comprises a first rotary driving part and a first turntable driven by the first rotary driving part to rotate, the first turntable at least comprises eight stations, each station is provided with a placing table for placing a crystal oscillator, and the eight stations are a crystal oscillator feeding station, a first glue dispensing station, a first detection station, a first carrying station, a carrying detection station, a second glue dispensing station, a second detection station and a blanking station which are sequentially arranged; the discharging port of the crystal oscillator feeding mechanism is arranged on the crystal oscillator feeding station, the number of the glue dispensing mechanisms is at least two, the glue dispensing mechanisms are respectively arranged on the first glue dispensing station and the second glue dispensing station, the number of the detection mechanisms is three, the detection mechanisms are respectively arranged on the first detection station, the carrying detection station and the second detection station, one of the stations of the second turntable mechanism is arranged on the first carrying station, and the blanking mechanism is arranged on the blanking station.

In one embodiment, the first turntable further has a crystal oscillator positioning station, the crystal oscillator positioning station is arranged between the crystal oscillator feeding station and the first dispensing station, and a crystal oscillator positioning mechanism for positioning a crystal oscillator is arranged at the crystal oscillator positioning station.

In one embodiment, the second rotary table mechanism comprises a second rotary driving part and a second rotary table driven by the second rotary driving part to rotate, the second rotary table has at least three stations, each station has a suction nozzle for sucking a chip, the three stations are a chip loading station, a chip positioning station and a second loading station which are sequentially arranged, a discharge port of the chip loading mechanism is arranged on the chip loading station, a four-claw positioning mechanism for positioning the chip is arranged at the chip positioning station, and the second loading station is arranged above the first loading station.

In one embodiment, the blanking mechanism comprises a third turntable mechanism, the third turntable mechanism comprises a third rotary driving member and a third turntable driven by the third rotary driving member to rotate, the third turntable has at least two stations, each station has a suction nozzle for sucking a chip, the two stations are a first crystal oscillator transfer station and a second crystal oscillator transfer station, the first crystal oscillator transfer station is arranged above the blanking station, and the second crystal oscillator transfer station is arranged above the blanking mechanism.

The utility model provides a crystal oscillator chip carries on equipment's beneficial effect lies in: compared with the prior art, the utility model discloses crystal oscillator chip carries on equipment includes chip feed mechanism, crystal oscillator feed mechanism, first carousel mechanism, second carousel mechanism, point gum machine constructs, detection mechanism and unloading mechanism. The chip feeding mechanism feeds chips to the second turntable, the crystal oscillator feeding mechanism is used for feeding crystal oscillators to the first turntable, the crystal oscillators are dispensed through the dispensing mechanism and detected by the detection mechanism and then transferred to the second turntable mechanism, the second turntable mechanism carries the chips on the crystal oscillators, and then the crystal oscillators are dispensed again and detected and then transferred to the blanking mechanism. The utility model provides a crystal oscillator chip carries on equipment and carries on method, the precision that glues and carry on is high, and is fast, and the steady quality can improve the productivity greatly.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a plan view of a crystal oscillator chip mounting apparatus according to an embodiment of the present invention;

fig. 2 is a three-dimensional structure diagram of a vibration mechanism provided in an embodiment of the present invention;

fig. 3 is a first three-dimensional structure diagram of a magazine mechanism according to an embodiment of the present invention;

fig. 4 is a second three-dimensional structure diagram of the magazine structure provided by the embodiment of the present invention;

fig. 5 is a three-dimensional structure diagram of the wobble plate mechanism provided in the embodiment of the present invention;

fig. 6 is a perspective structural view of a first turntable mechanism provided in an embodiment of the present invention;

fig. 7 is a three-dimensional structure diagram of a crystal oscillator positioning mechanism according to an embodiment of the present invention;

fig. 8 is a three-dimensional structure diagram of a glue dispensing mechanism provided in the embodiment of the present invention;

fig. 9 is a three-dimensional structure diagram of the detection mechanism provided in the embodiment of the present invention;

fig. 10 is a perspective structural view of a second turntable mechanism according to an embodiment of the present invention;

fig. 11 is a perspective view of a four-jaw positioning mechanism according to an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

1-a crystal oscillator feeding mechanism; 11-a vibration mechanism; 111-a vibrating pan; 112-a direct vibration track; 113-direct vibration generator; 12-a manipulator; 2-a chip feeding mechanism; 21-a magazine mechanism; 211-a lifting assembly; 2111-lifting motor; 2112-lead screw; 2113-carrier plate; 212-a translation assembly; 2121-a translation motor; 2122-a belt assembly; 2123-push rod; 213-a take-off assembly; 2131-material taking motor; 2132-a conveyor belt assembly; 2133-material taking claw; 214-a cartridge; 215-a support frame; 2151-chassis; 2152-on shelf; 216-a microswitch; 217-a clamping cylinder; 22-a wobble plate mechanism; 221-XY moving module; 222-a clamp; 2221-a stop bar; 2222-stop block; 223-a pushing assembly; 2231-limit push cylinder; 2232-a slide rail of a spacing cylinder; 2233-a limit cylinder push block; 2234-corner stops; 3-a first turntable mechanism; 31-a first rotary drive; 32-a first carousel; 4-a second turntable mechanism; 41-a second rotary drive; 42-a second carousel; 5-a third turntable mechanism; 6-a blanking mechanism; 71-a crystal oscillator positioning mechanism; 711-crystal oscillator positioning cylinder; 712-positioning the cylinder slide rail; 713-positioning the cylinder block; 714-corner locators; 72-a four-jaw positioning mechanism; 721-positioning motor; 722-a cam; 723-positioning jaws; 724-an elastic member; 8-glue dispensing mechanism; 81-X shaft assembly; 82-Y shaft assembly; 83-Z shaft assembly; 84-a needle tip assembly; 9-a detection mechanism; 91-lens fixing plate; 92-lens; 93-light source fixing plate; 94-light source.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

The embodiment of the present invention provides a crystal oscillator chip mounting apparatus.

Referring to fig. 1, in one embodiment, the crystal oscillator chip mounting apparatus includes a chip feeding mechanism 2, a crystal oscillator feeding mechanism 1, a first turntable mechanism 3, a second turntable mechanism 4, a glue dispensing mechanism 8, a detection mechanism 9, a blanking mechanism 6, and the like. The crystal oscillator feeding mechanism 1 is used for transferring a crystal oscillator to the first rotating disc mechanism 3, after the first rotating disc mechanism 3 receives the crystal oscillator, the crystal oscillator rotates to the position where the glue dispensing mechanism 8 is located along with the first rotating disc mechanism 3, the glue dispensing mechanism 8 dispenses the crystal oscillator at the position, the crystal oscillator after dispensing rotates to the detection mechanism 9 along with the first rotating disc mechanism 3, the detection mechanism 9 detects the crystal oscillator after dispensing, and whether the glue dispensing position is accurate is detected. The chip feeding mechanism 2 is used for transferring the chip to the second turntable mechanism 4, and the second turntable mechanism 4 transfers the chip to the crystal oscillator which is dispensed and detected, so that the chip is carried on the crystal oscillator. After the crystal oscillator carries a chip, the crystal oscillator continues to rotate to the dispensing mechanism 8 along with the first turntable mechanism 3, the dispensing mechanism 8 dispenses the crystal oscillator carrying the chip again, the crystal oscillator rotates to the detection mechanism 9 along with the first turntable mechanism 3 after dispensing, and the detection mechanism 9 detects the chip again. After the detection is finished, the qualified products are transferred through the blanking mechanism 6, and are placed on a tray for blanking. The glue dispensing mechanism 8 used for twice glue dispensing can be the same glue dispensing mechanism 8 or different glue dispensing mechanisms 8; the detection mechanism 9 used for the two detections may be the same detection mechanism 89 or different detection mechanisms 9.

The crystal oscillator chip carrying equipment in the embodiment has the advantages of high dispensing and carrying precision, high speed, stable quality and capability of greatly improving the productivity.

In one embodiment of the crystal oscillator feeding mechanism 1, the crystal oscillator feeding mechanism 1 includes a vibrating mechanism 11 and a manipulator 12, the crystal oscillator is a bulk material, the bulk material is fed into the vibrating mechanism 11, the crystal oscillators are discharged one by one through the vibrating mechanism 11, and then transferred to the first turntable mechanism 3 through the manipulator 12. Referring to fig. 2, the vibration mechanism 11 includes a vibration plate 111, a straight vibration rail 112 and a straight vibration generator 113, wherein one end of the straight vibration rail 112 is connected to an outlet of the vibration plate 111, the other end of the straight vibration rail 112 discharges materials, and the straight vibration generator 113 is used for vibrating the straight vibration rail 112. When the vibration disk 111 works, the crystal oscillators are arranged to the straight oscillation track 112 one by one, and the crystal oscillators are continuously moved to the discharge end of the straight oscillation track 112 by the vibration of the straight oscillation track 112. The robot 12 picks the material from the outfeed end of the straight vibrating track 112 and transfers the crystal to the first turntable 32. The type of robot 12 is not limited herein and may be a three-axis robot. Or, the manipulator 12 includes rotating electrical machines, dwang and suction nozzle, and the length direction of dwang sets up along rotating electrical machines's radial, and the suction nozzle is fixed in the tip of dwang, and the rotating electrical machines during operation, the dwang swing makes the suction nozzle along with the dwang swing to make the suction nozzle can move between the discharge end of the track 112 that directly shakes and the crystal oscillator material loading station of first carousel mechanism 3, such manipulator 12 simple structure can satisfy the transmission of short distance material.

Referring to fig. 3 and 4, in one embodiment of the chip loading mechanism 2, the chips are loaded into the magazine 214. The chip feeding mechanism 2 includes a magazine mechanism 21, and the magazine mechanism 21 includes a magazine 214, a lifting assembly 211, a material taking assembly 213, and a translation assembly 212. One of the material boxes 214 is disposed at the moving end of the lifting assembly 211, and the movement of the lifting assembly 211 can drive the material box 214 to move up and down. The magazine 214 includes a plurality of trays arranged in a stacked and spaced manner, each tray having a plurality of chip placing cavities for placing chips. Translation assembly 212 is used to transfer empty magazines 214 from which chips have been removed. More specifically, when material needs to be taken, the lifting assembly 211 raises the material box 214 to a height corresponding to the material taking assembly 213, the material taking assembly 213 extends into the material box 214 to clamp one of the material trays, and then the material tray is transferred to the material placing mechanism 22, or directly extends into the material box 214 to clamp one of the chips, and then the chip is directly transferred to the second turntable mechanism 4. After the chip of the tray is taken out, the lifting assembly 211 moves to make the other tray have the same height as the taking assembly 213, and the above steps are repeated to complete the taking of one of the material boxes 214. After one of the magazines 214 is completely removed, the elevator assembly 211 lowers the magazine 214 to the translation assembly 212, and the empty magazine 214 is transported away by the translation assembly 212. While one of the magazines 214 is taking material, another magazine 214 full of material may be placed in a waiting position, which is disposed directly above the magazine 214 taking material.

Furthermore, the magazine mechanism 21 further includes a support frame 215, the support frame 215 includes a base frame 2151 and an upper frame 2152, the translation assembly 212 is disposed on the base frame 2151, the empty magazine 214 is transferred on the base frame 2151 through the translation assembly 212, and the material taking assembly 213 is fixed on the upper frame 2152 and has a certain distance from the base frame 2151, so as to prevent the magazine 214 of the translation assembly 212 and the magazine 214 taking materials from interfering with each other to a high degree. The material taking assembly 213 can take the material tray suspended in the material box 214 above the bottom frame 2151, and the material taking assembly 213 transfers the material tray to the tray placing mechanism 22 after taking the material tray.

Optionally, the magazine mechanism 21 further comprises a clamping cylinder 217. Specifically, when the material is loaded on the material box 214, two or more material boxes 214 can be placed on the carrier plate 2113, the carrier plate 2113 rises to make the lowest material box 214 highly aligned with the material taking assembly 213, after the material is taken, all chips in the material box 214 are taken out, then the clamping cylinder 217 clamps the material box 214 above the empty material box 214, the carrier plate 2113 drives the empty material box 214 to descend to the translation assembly 212, the empty material box 214 which has taken the material is separated from the material box 214 which has not taken the material, the clamping cylinder 217 can prevent the material box 214 which has not taken the material from falling down, so that the material boxes 214 can be placed on the carrier plate 2113 at the same time to take the material, the material taking efficiency can be improved, the material box 214 does not need to be replaced after the material taking of each material box 214 is finished, and the material boxes 214 can be replaced after the material.

Optionally, the lifting assembly 211 includes a lifting motor 2111, a lead screw 2112, a lead screw slider, and a carrier plate 2113. The lifting motor 2111 drives the screw 2112 to rotate, the screw slider is connected with the screw 2112 and moves up and down relative to the screw 2112, the carrier plate 2113 is fixed on the screw slider, the carrier plate 2113 also moves up and down, and the material taking magazine 214 is placed on the carrier plate 2113, so that the magazine 214 can move up and down. Further, the carrier plate 2113 may be moved to the translation assembly 212, and the translation assembly 212 may also be capable of moving the magazine 214 full of chips onto the carrier plate 2113 and then up and down with the carrier plate 2113.

Optionally, the translation assembly 212 includes a translation motor 2121, a belt assembly 2122, and a push rod 2123, the push rod 2123 is fixed to the belt assembly 2122, the translation motor 2121 drives the belt assembly 2122 to translate, and the belt assembly 2122 drives the push rod 2123 to translate. Wherein, the push rod 2123 is vertically arranged for pushing the magazine 214. When the material cartridge 214 finishes taking the material and moves down to the translation assembly 212 from the lifting assembly 211, the translation assembly 212 operates, and the push rod 2123 pushes the material cartridge 214 to move so as to free the space below the material cartridge 214 taking the material.

Optionally, the translation assembly 212 further comprises a micro switch 216 disposed at the rear end of the translation assembly 212, which is the end away from the carrier plate 2113. When the placing space on the translation assembly 212 is filled with the empty magazine 214, the push rod 2123 will continue to push the empty magazine 214 to move towards the tail end, the magazine 214 at the tail end will trigger the micro switch 216, and the micro switch 216 will feed back information to the operator through sound, light or a display screen, so as to remind the operator that the magazine 214 finishes taking the material without staring at the chip feeding mechanism 2.

Optionally, the material taking assembly 213 includes a material taking motor 2131, a conveyor belt assembly 2132 and a material taking claw 2133, the material taking motor 2131 drives the conveyor belt assembly 2132 to move, the conveyor belt assembly 2132 drives the material taking claw 2133 to move, so that the material tray can be clamped and pulled to the tray swinging mechanism 22. The moving direction of the conveyor belt assembly 2132 is the horizontal direction, so that the material taking claw 2133 can extend into the space between the two material trays to take the material trays. The specific structure of the material taking claw 2133 is not limited here, and the material taking claw can be used for taking and clamping a material tray.

Referring to fig. 5, in one embodiment of the chip loading mechanism 2, the chip loading mechanism 2 includes a magazine mechanism 21 and a swinging tray mechanism 22 for receiving chips from the picking assembly 213. The tray placing mechanism 22 comprises an XY moving module 221, a clamp 222 and a pushing assembly 223, wherein the clamp 222 is connected to the XY moving module 221, the clamp 222 is used for positioning and receiving the tray from the material taking assembly 213, and the pushing assembly 223 is used for pushing the tray to fix the tray in the clamp 222 after the tray is placed into the clamp 222, so that the tray is prevented from moving relative to the clamp 222. More specifically, when the taking assembly 213 picks up a tray from the magazine 214, the XY-moving module 221 moves the gripper 222 close to the magazine 214, the taking claw 2133 pulls the tray from the magazine 214 into the gripper 222, and then the pushing assembly 223 pushes the tray tightly and fixes the tray in the gripper 222. More specifically, the fixture 222 has two parallel limiting strips 2221, and further has a stop block 2222 disposed at one end of the limiting strips 2221 facing away from the magazine 214, so that when the tray is transferred from the magazine 214 to the fixture 222, the tray is limited between the two limiting strips 2221, and can only move in the dragging direction of the material taking assembly 213. The moving end of the pushing component 223 is provided with a corner position-limiting part 2234, and the corner position-limiting part 2234 is provided with a groove matching with the shape of the corner of the tray. The corner stopper 2234 pushes the tray from one of the corners of the tray, so that the other end of the tray opposite to the corner abuts against the stop 2222, and cannot move further in the dragging direction of the material taking assembly 213, so that the tray is fixed in the fixture 222. After the tray is clamped in the jig, the chip is sequentially aligned to the chip loading station of the second turntable mechanism 4 under the action of the XY moving module 221, and the pressing mechanism at the chip loading station drives the suction nozzle to suck up the chip. After all the chips in the tray are transferred, the XY moving module 221 moves the empty tray to be close to the magazine 214, the material taking assembly 213 of the magazine mechanism 21 pulls the empty tray back to the magazine 214 again, and the lifting assembly 211 works to feed the next tray.

Optionally, the pushing assembly 223 includes a limiting pushing cylinder 2231, a limiting cylinder push block 2233, a limiting cylinder slide rail 2232, and a corner limiting block 2234, where the limiting cylinder push block 2233 is connected to a moving end of the limiting pushing cylinder 2231, the corner limiting block 2234 is fixed to the limiting cylinder push block 2233, and the limiting cylinder push block 2233 is slidably connected to the limiting cylinder slide rail 2232, so as to guide movement of the limiting cylinder push block 2233.

Referring to fig. 1 and 6, in one embodiment of the first turntable mechanism 3, the first turntable mechanism 3 includes a first rotary driving member 31 and a first turntable 32, the first rotary driving member 31 drives the first turntable 32 to rotate, the first turntable 32 has at least eight stations, and each station has a placing table for placing a crystal oscillator. Wherein eight stations are crystal oscillator material loading station, the station is glued to first point, first detection station, first carry on the station, carry on detection station, the station is glued to the second point, second detection station and unloading station that set gradually, and crystal oscillator is from crystal oscillator material loading station material loading back, in proper order through glue for the first time, detect for the first time, carry with the chip, detect for the second time, glue for the second time, detect for the third time after, from unloading station circulation to unloading mechanism 6. The discharge port of the crystal oscillator feeding mechanism 1 is arranged at a crystal oscillator feeding station, and specifically, the manipulator 12 transfers the crystal oscillator at the discharge port to a placing table of the crystal oscillator feeding station. The glue dispensing mechanisms 8 are at least two in number and are respectively arranged at the first glue dispensing station and the second glue dispensing station. Of course, the first turntable 32 may also be provided with two first dispensing stations for dispensing at two different positions of the crystal oscillator, or two second dispensing stations for dispensing again at two different positions of the crystal oscillator, in this embodiment, the number of the dispensing mechanisms 8 is four. The number of the detection mechanisms 9 is three, the detection mechanisms are respectively arranged on the first detection station, the carrying detection station and the second detection station, the structures of the detection mechanisms 9 can be the same and can be different, and the specific detection mechanism 9 is selected according to specific content detected as required. In addition, one of the stations of the second turntable mechanism 4 is arranged at the first carrying station, and when the chip moving along with the second turntable mechanism 4 is transferred to the first carrying station, the chip can be directly adhered to the crystal oscillator at the first carrying station. The blanking mechanism 6 is arranged at the blanking station and performs blanking from the blanking station.

Further, the first rotary table 32 has crystal positioning stations, so that the number of the stations of the first rotary table 32 is at least nine. The number of stations of the first rotary table 32 is not limited here, and the number of stations can be selected according to the production cycle. The crystal oscillator positioning station is arranged between the crystal oscillator feeding station and the first glue dispensing station, and a crystal oscillator positioning mechanism 71 for positioning the crystal oscillator is arranged at the crystal oscillator positioning station. Before dispensing by the crystal oscillator, the dispensing position can be more accurate after the positioning by the crystal oscillator positioning mechanism 71.

Optionally, referring to fig. 7, the crystal oscillator positioning mechanism 71 includes a crystal oscillator positioning cylinder 711, a positioning cylinder slider 713, a positioning cylinder slide rail 712, and a corner positioning element 714, where the positioning cylinder slider 713 is connected to a moving end of the crystal oscillator positioning cylinder 711, the corner positioning element 714 is fixed to the positioning cylinder slider 713, and the positioning cylinder slider 713 is slidably connected to the positioning cylinder slide rail 712, so as to guide the movement of the positioning cylinder slider 713. The corner positioning element 714 has a groove matched with the shape of the corner of the crystal oscillator, and when the positioning cylinder slider 713 pushes the positioning cylinder slider to move, the positioning cylinder slider will abut against the inner wall of the crystal oscillator placing position of the first rotating disk 32, so that the crystal oscillator is positioned.

Optionally, referring to fig. 8, the glue dispensing mechanism 8 includes an X-axis assembly 81, a Y-axis assembly 82, a Z-axis assembly 83, and a needle nozzle assembly 84, which are connected in sequence, so that the needle nozzle assembly 84 can move in three axes to dispense glue to the crystal oscillator. The specific structure of the X-axis assembly 81, the Y-axis assembly 82, and the Z-axis assembly 83 is not limited herein, and may be driven by a motor or an air cylinder. The nozzle assembly 84 is used to dispense glue downwardly, and the nozzle assembly 84 may be any structure known in the art.

Optionally, referring to fig. 9, the detecting mechanism 9 includes a lens fixing plate 91, a lens 92, a light source fixing plate 93 and a light source 94, the lens 92 is disposed above the light source 94, the light source 94 irradiates on the crystal oscillator, and the lens 92 photographs the crystal oscillator to detect whether the dispensing position and the dispensing amount meet the requirements, so as to prevent the defective products from flowing into the subsequent stations.

Referring to fig. 10, in one embodiment of the second rotating disk mechanism 4, the second rotating disk mechanism 4 includes a second rotary driving member 41 and a second rotating disk 42. The second rotary disk 42 is driven to rotate by the second rotary driving member 41, the second rotary disk 42 has at least three stations, and each station has a suction nozzle for sucking a chip. Wherein three stations are chip feeding station, chip location station and the second that sets gradually and carry on the station, and chip feed mechanism 2 shifts the chip to chip feeding station back, and the chip is through the back of fixing a position, carries on the station department at the second and shifts to the first station of carrying on of first carousel 32, makes the chip paste to the crystal oscillator of first carousel 32 on. The discharge port of the chip feeding mechanism 2 is arranged at a chip feeding station, and the material pressing mechanism on the chip feeding station drives the suction nozzle to move so as to suck the chip in the chip feeding mechanism 2 into the second turntable 42 mechanism 4. The chip positioning station is provided with a four-claw positioning mechanism 72 for positioning the chip, so that the chip is positioned and then carried with the crystal oscillator, and the carrying precision is improved. The second carrying station is arranged above the first carrying station, when the chip moves to the second carrying station, the material pressing mechanism at the second carrying station drives the suction nozzle to move downwards to place the chip on the crystal oscillator at the first carrying station, and the chip and the crystal oscillator are pasted.

Optionally, referring to fig. 11, the four-pawl positioning mechanism 72 includes a positioning motor 721, a cam 722 disposed at a moving end of the positioning motor 721, four positioning pawls 723 abutting against an outer wall of the cam 722, and an elastic member 724 for retracting the four positioning pawls 723. When the motor works, the cam 722 rotates to push the four positioning claws 723 open, so that the four positioning claws 723 are opened, the chip is placed in the four positioning claws 723, the motor rotates to return the cam 722, and the elastic piece 724 pulls the four positioning claws 723 back to clamp the chip and position the chip.

In one embodiment of the crystal oscillator carrying apparatus, the blanking mechanism 6 includes a third turntable mechanism 5, and the third turntable mechanism 5 is configured to receive the crystal oscillator (product for short) carrying the chip and transfer the product to the blanking mechanism 6. The third turntable mechanism 5 comprises a third rotary driving part and a third turntable, the third rotary driving part drives the third turntable to rotate, the third turntable at least has two stations, each station is provided with a suction nozzle for adsorbing a chip, and the two stations are specifically a first crystal oscillator transfer station and a second crystal oscillator transfer station. The suction nozzle of the first crystal oscillator transfer station is used for sucking the product from the second rotating disc mechanism 4, and the suction nozzle of the second crystal oscillator transfer station is used for transferring the product to the blanking mechanism 6. The first crystal oscillator transfer station is arranged above the blanking station of the first rotary disc 32, and the second crystal oscillator transfer station is arranged above the blanking mechanism 6. The number of the stations of the third rotating disc is not limited, and is larger than two, and the stations can be selected according to the production rhythm. Optionally, the third turntable mechanism 5 and the second turntable mechanism 4 have the same structure, and the number of the stations may be the same or different.

Optionally, the blanking mechanism 6 further includes a wobble plate mechanism having the same structure as the chip feeding mechanism 2.

The number of the glue dispensing mechanisms 8 can be two, and the two glue dispensing mechanisms are respectively used for first glue dispensing and second glue dispensing; the number of the glue dispensing mechanisms 8 can also be four, and the four glue dispensing mechanisms are respectively used for dispensing glue at different positions of the crystal oscillator for the first time and dispensing glue at different positions of the crystal oscillator for the second time. The number of the detection mechanisms 9 may be three, and the detection mechanisms are respectively used for detection after the first dispensing, detection after chip mounting, and detection after the second dispensing.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. Crystal oscillator chip carries on equipment, its characterized in that includes:

the chip feeding mechanism is used for feeding chips;

2. The crystal oscillator chip mounting apparatus according to claim 1, wherein: the chip feeding mechanism comprises a material box mechanism, the material box mechanism comprises at least one material box, a lifting assembly, a material taking assembly and a translation assembly, one of the material boxes is placed at a moving end of the lifting assembly, the material box comprises a plurality of material discs which are stacked at intervals, the material discs are provided with a plurality of chip accommodating cavities for placing chips, the lifting assembly is used for lifting the material box to enable the material taking assembly to take the materials, and the translation assembly is used for transferring an empty material box which takes away the chips.

3. The crystal oscillator chip mounting apparatus according to claim 2, wherein: the material box mechanism further comprises a support frame, the support frame comprises a bottom frame and an upper frame, the translation assembly is arranged on the bottom frame and used for transferring an empty material box placed on the bottom frame, and the material taking assembly is fixed on the upper frame and used for grabbing a material tray suspended in the material box above the bottom frame.

4. The crystal oscillator chip mounting apparatus according to claim 2, wherein: the lifting assembly comprises a lifting motor, a lead screw driven by the lifting motor, a lead screw sliding block connected with the lead screw and a carrier plate fixed on the lead screw sliding block, and the material box is placed on the carrier plate.

5. The crystal oscillator chip mounting apparatus according to claim 2, wherein: the chip feeding mechanism further comprises a tray swinging mechanism used for receiving a chip tray from the material taking assembly, the tray swinging mechanism comprises an XY moving module, a fixture moving along with the XY moving module and used for limiting the tray and a pushing assembly used for fixing the tray, the fixture is arranged on one side of the second turntable mechanism, and a material pressing mechanism on the second turntable mechanism drives a suction nozzle to grab a chip from the tray of the fixture.

6. The crystal oscillator chip mounting apparatus according to claim 1, wherein: the first turntable mechanism comprises a first rotary driving piece and a first turntable driven by the first rotary driving piece to rotate, the first turntable is at least provided with eight stations, each station is provided with a placing table for placing a crystal oscillator, and the eight stations comprise a crystal oscillator feeding station, a first glue dispensing station, a first detection station, a first carrying station, a carrying detection station, a second glue dispensing station, a second detection station and a blanking station which are sequentially arranged; the discharging port of the crystal oscillator feeding mechanism is arranged on the crystal oscillator feeding station, the number of the glue dispensing mechanisms is at least two, the glue dispensing mechanisms are respectively arranged on the first glue dispensing station and the second glue dispensing station, the number of the detection mechanisms is three, the detection mechanisms are respectively arranged on the first detection station, the carrying detection station and the second detection station, one of the stations of the second turntable mechanism is arranged on the first carrying station, and the blanking mechanism is arranged on the blanking station.

7. The crystal oscillator chip mounting apparatus according to claim 6, wherein: the first rotary disc is further provided with a crystal oscillator positioning station, the crystal oscillator positioning station is arranged between the crystal oscillator feeding station and the first glue dispensing station, and a crystal oscillator positioning mechanism used for positioning the crystal oscillator is arranged at the crystal oscillator positioning station.

8. The crystal oscillator chip mounting apparatus according to claim 6, wherein: second carousel mechanism include the second rotary driving piece, by the rotatory second carousel of second rotary driving piece drive, the second carousel has three station at least, and every station all has the suction nozzle that is used for adsorbing the chip, and wherein three station is for the chip feeding station, chip location station and the second that set gradually carry on the station, chip feeding mechanism's discharge gate is located chip feeding station, chip location station department is equipped with the four-jaw positioning mechanism who is used for fixing a position the chip, the second carries on the station and locates the top of first station of carrying on.

9. The crystal oscillator chip mounting apparatus according to claim 6, wherein: unloading mechanism includes third carousel mechanism, third carousel mechanism include the third rotary driving piece, by the rotatory third carousel of third rotary driving piece drive, the third carousel has two stations at least, and every station all has the suction nozzle that is used for adsorbing the chip, and wherein two stations shift the station for first crystal oscillator and second crystal oscillator, first crystal oscillator shifts the station and locates the top of unloading station, the second crystal oscillator shifts the station and locates the top of unloading mechanism.