CN211295066U

CN211295066U - Magnetic adsorption bonding clamp

Info

Publication number: CN211295066U
Application number: CN201922440372.7U
Authority: CN
Inventors: 魏勇平; 张雅; 闫坤坤
Original assignee: Beijing Zhongke Feihong Technology Co ltd
Current assignee: Beijing Zhongke Feihong Technology Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-08-18
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a magnetism adsorbs bonding anchor clamps, including anchor clamps lower part and anchor clamps upper portion, the anchor clamps lower part is equipped with the strong magnet array, and anchor clamps upper portion is equipped with the cell body array, and the cell body array places the SMD tube that corresponds the size. Four corners of the lower part of the clamp and the upper part of the clamp are provided with positioning holes which correspond up and down, and the four loop bars are used for positioning and aligning the corresponding positioning holes. The strong magnet array and the groove body array are in one-to-one correspondence from top to bottom. And the device to be bonded is firmly fixed on a plane by adopting strong magnetic force adsorption. The back pollution problem that sticky absorption brought is fine solution to magnetic force absorption SMD tube shell. The adoption can not be held by magnet and does not shield the material of magnetic force, is favorable to the magnetic force most on the device, effective fixed tube shell.

Description

Magnetic adsorption bonding clamp

Technical Field

The utility model relates to a mounting fixture of SMD tube in the bonding process especially relates to a magnetism adsorbs bonding anchor clamps, is applicable to the frock clamp in semiconductor microelectronics field.

Background

With the development of the semiconductor industry, in the processing technology of microelectronic devices, a bonding process is determined as a key process by many process lines, bonding is an important process for connecting chip signals to a device tube shell, and the reliability of an electronic component is directly determined by the quality of bonding.

Ultrasonic wedge bonding or gold wire ball bonding is generally adopted in the bonding process, and the common characteristic of the ultrasonic wedge bonding or the gold wire ball bonding is that the bonded device needs to be firmly fixed on a plane, otherwise, phenomena such as desoldering, insufficient bonding and the like can occur due to insufficient ultrasonic power.

The traditional device to be bonded is adhered to a plane by using a double-sided adhesive tape, so that although the device is stable, the back surface of the device can remain colloid, and the reliability of the device is affected. In recent years, many equipment manufacturers have adopted a vacuum adsorption device to perform bonding, which requires additional vacuum equipment and is relatively complicated to operate.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a magnetism adsorbs bonding anchor clamps, the fixed problem when mainly solving chip and device bonding. Not only solve the pollution problem of traditional fixed mode and can also promote the work efficiency of bonding process by a wide margin.

The utility model aims at realizing through the following technical scheme:

the utility model discloses a magnetism adsorbs bonding anchor clamps, including anchor clamps lower part and anchor clamps upper portion, the anchor clamps lower part is equipped with the strong magnet array, anchor clamps upper portion is equipped with the cell body array, the cell body array places the SMD tube that corresponds the size.

By the foregoing the utility model provides a technical scheme can see out, the embodiment of the utility model provides a mode that magnetic adsorption bonding anchor clamps effectively replace sticky SMD tube of tradition or vacuum adsorption SMD tube to carry out the bonding makes the bonding process simple, need not extra plant service equipment. And the problem that the SMD tube shell is provided with adhesive residue is solved, so that the reliability of military electronic components is improved.

Drawings

Fig. 1 is the embodiment of the utility model provides a magnetic adsorption bonding fixture substructure schematic diagram.

Fig. 2 is the embodiment of the utility model provides a magnetism adsorbs bonding anchor clamps superstructure sketch map.

In the figure:

1. the fixture comprises a fixture lower portion, 2 positioning holes I and 3, a strong magnet array, 4 groove body arrays, 5 positioning holes II and 6 and a fixture upper portion.

Detailed Description

Embodiments of the present invention will be described in further detail below. Details not described in the embodiments of the present invention belong to the prior art known to those skilled in the art.

The utility model discloses a magnetism adsorbs bonding anchor clamps, the concrete implementation mode of its preferred is:

including anchor clamps lower part and anchor clamps upper portion, the anchor clamps lower part is equipped with the strong magnet array, anchor clamps upper portion is equipped with the cell body array, the SMD tube shell of corresponding size is placed to the cell body array.

Four corners of the lower part of the clamp and the upper part of the clamp are provided with positioning holes which correspond up and down, and the four loop bars are used for positioning and aligning the corresponding positioning holes.

The strong magnet array is formed by arranging a plurality of cylindrical or polygonal magnets, the groove body array is formed by arranging a plurality of cubic groove bodies, and the magnets are in one-to-one correspondence with the groove bodies up and down.

The thickness of the bottom of the groove array is less than 1 mm.

The lower part of the clamp is used as a fixed working platform.

The utility model discloses a magnetism adsorbs bonding anchor clamps, including magnetism adsorption base and the cell body array board of placing the SMD tube, the base is box-packed, and cylindric strong magnet array is inlayed to inside sticky mode of adoption. The array plate for placing the SMD device is matched with the base in position size, so that the magnetic poles can adsorb the SMD tube shell to be bonded. The clamp effectively replaces the traditional mode of bonding an SMD tube shell by gluing or vacuum adsorption of the SMD tube shell, so that the bonding process is simple, and additional plant equipment is not needed. And the problem that the SMD tube shell is provided with adhesive residue is solved, so that the reliability of military electronic components is improved.

The utility model discloses a strong magnetic force adsorbs, makes and treats that the bonding device stabilizes in the plane. The back pollution problem that sticky absorption brought is fine solution to magnetic force absorption SMD tube shell. The adoption can not be held by magnet and does not shield the material of magnetic force, is favorable to the magnetic force most on the device, effective fixed tube shell.

The specific embodiment is as follows:

as shown in figure 1, the lower clamp is made of aluminum alloy, the length and the width of the lower clamp are both 84mm, and the thickness of the lower clamp is 8 mm. The depth of the groove for placing the magnet is 3 mm. The magnet specification is 8mm diameter high 3 mm's cylinder.

As shown in FIG. 2, the length and width of the upper clamp are both 84mm, and the thickness is 1.5 mm. The groove body array is 1.4mm deep, and the groove body is 5 mm's square groove, and four corners and middle both sides are drawn empty with diameter 1 mm's cylinder, prevent that the SMD tube shell from being blocked in the groove because of the error.

The above description is only for the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are all covered by the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a magnetism adsorbs bonding anchor clamps, its characterized in that includes anchor clamps lower part (1) and anchor clamps upper portion (6), anchor clamps lower part (1) is equipped with strong magnet array (3), anchor clamps upper portion (6) are equipped with cell body array (4), cell body array (4) place the SMD tube shell of corresponding size.

2. The magnetic adsorption bonding fixture of claim 1, wherein four corners of the lower fixture portion (1) and the upper fixture portion (6) are provided with corresponding positioning holes, and the four loop bars are used for positioning and aligning the corresponding positioning holes.

3. The magnetic adsorption bonding fixture of claim 2, wherein the strong magnet array (3) is formed by arranging a plurality of magnets in a cylindrical shape or a polygonal prism shape, the groove body array (4) is formed by arranging groove bodies in a plurality of cube shapes, and the magnets are in one-to-one correspondence with the groove bodies in the vertical direction.

4. The magnetic adsorption bonding fixture of claim 3, wherein the thickness of the bottom of the groove array (4) is less than 1 mm.

5. A magnetic adsorption bonding fixture as claimed in any one of claims 1 to 4, characterized in that the lower fixture portion (1) serves as a stationary work platform.