CN208622684U - A kind of wire bonding tooling - Google Patents
A kind of wire bonding tooling Download PDFInfo
- Publication number
- CN208622684U CN208622684U CN201821113443.1U CN201821113443U CN208622684U CN 208622684 U CN208622684 U CN 208622684U CN 201821113443 U CN201821113443 U CN 201821113443U CN 208622684 U CN208622684 U CN 208622684U
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- CN
- China
- Prior art keywords
- loading plate
- plate
- absorption
- holes
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of wire bonding toolings, including loading plate, loading plate pressing plate and absorption fixed plate, loading plate is equipped with several grooves, positioning mistake proofing pin hole and multiple bearing holes, magnet is fixedly installed in groove, positioning mistake proofing pin and the fixed tenon of multiple absorption that setting in fixed plate corresponds to loading plate setting are adsorbed, adsorbs in fixed tenon and vacuum absorption holes is set；Loading plate pressing plate generally magnetic material supports, it is set on the upper surface of loading plate, adsorbs with the magnet in groove, it is provided with several bearing holes on loading plate, several hollow holes are provided on the loading plate pressing plate, the bearing holes and the hollow hole correspond；Several fastener holes are set in absorption fixed plate, fastener hole is bolted to production equipment.The utility model, which solves existing platform-type wire bonder, to download circuit problem on monolithic, while the one of part of the utility model tooling can be used as transhipment loading plate, and the circuit that can effectively shorten is uploaded, carries the time, reduces mold changing number, improves working efficiency.
Description
Technical field:
The utility model relates to frock clamp fields, particularly use and set for semiconductor integrated circuit package process
A kind of standby upper wire bonding tooling.
Background technique:
Semiconductor integrated circuit ceramic package or Metal Packaging, wire bonding are all made of monolithic integrated circuit and carry above and below, in this way
It individually uploads in wire bonding sequence, download, a large amount of time will be wasted, cause the efficiency of semiautomatic equipment that can not play, half
Mainly by adsorbing or clamping to shell when conductor leads of IC is bonded, thus guarantee that bonded support is stablized, clamping side
Formula is easy to cause shell to crush, and vacuum suction not will lead to shell then and crush, and the utility model patent is by designing a set of work
Dress can be achieved once to upload multiple circuits, and use vacuum suction mode, at the same can effectively shorten monolithic integrated circuit upload and under
Carry the time.
There are many application wire bonding tooling patent in the prior art, and wherein Wuxi Zhongwei High-tech Electronics Co., Ltd applies
Bonding machine worktable multi-grab patent, the patent describe a kind of multipurpose upload tool for realizing monolithic integrated circuit, with
The use of the new type realizes that multiple circuits upload mode difference.
Other patents are also all to describe how to realize 3D or antarafacial wire bonding tooling, without in place of communicating with this patent.
Utility model content:
Purpose of the utility model is to solve the deficiencies in the prior art, provide a kind of wire bonding tooling.
The technical solution adopted in the utility model are as follows:
A kind of wire bonding tooling, including loading plate, loading plate pressing plate and absorption fixed plate, it is characterised in that:
The loading plate is equipped with several grooves, positioning mistake proofing pin hole and multiple bearing holes, is fixedly installed with magnetic in groove
Iron, adsorbing setting in fixed plate, corresponding to the positioning mistake proofing pin of loading plate setting and the fixed tenon of multiple absorption, absorption fixation is convex
Vacuum absorption holes are set in tenon；
Loading plate pressing plate generally magnetic material support, be set on the upper surface of loading plate, with groove in magnet
Absorption is provided with several bearing holes on loading plate, is provided with several hollow holes on the loading plate pressing plate, the bearing holes with
The hollow hole corresponds；
Several fastener holes are set in absorption fixed plate, fastener hole is bolted to production equipment, absorption fixed plate with
Production equipment vacuumizes one layer of gasket of setting between interface.
A kind of wire bonding tooling, it is characterised in that:
The multiple bearing holes are uniformly distributed on loading plate, and shape, size and spacing are according to wire bonding circuit
Shell shape setting.
A kind of wire bonding tooling, it is characterised in that:
The loading plate edge is equipped with loading plate side platform, and loading plate side platform thickness is thinner than loading plate, it is desirable that its thickness and away from
It is suitble to manpower to take, put with a distance from loading plate pressing plate.
A kind of wire bonding tooling, it is characterised in that:
The multiple surface for adsorbing fixed tenon is respectively provided with one layer of cushion, vacuum absorption holes and is set as stepped hole, delays
Punching pads upper aperture and its aperture is arranged greater than vacuum suction bore dia.
A kind of wire bonding tooling, it is characterised in that:
Deep gouge is arranged in the back side of the absorption fixed plate, and gasket covers the fixed plate surface of the absorption around deep gouge, by spiral shell
Tether be connected to production equipment vacuumize interface.
Compared with prior art, the utility model has the beneficial effects that:
The utility model, which solves existing platform-type wire bonder, to download circuit problem, while the utility model on monolithic
The one of part of tooling can be used as transhipment loading plate, and the circuit that can effectively shorten is uploaded, carries the time, reduces mold changing number, improves
Working efficiency.
Detailed description of the invention:
Fig. 1 is the main view the schematic diagram of the section structure of the utility model；
Fig. 2 is the overlooking structure diagram of the utility model loading plate；
Fig. 3 is the overlooking structure diagram that the utility model adsorbs fixed plate；
Fig. 4 is the overlooking structure diagram of the utility model loading plate pressing plate；
Fig. 5 is the side elevational cross-section structural schematic diagram of the utility model.
Specific embodiment:
With reference to the accompanying drawing, the utility model is described in further detail by embodiment:
A kind of wire bonding tooling, including loading plate 4, loading plate pressing plate 13 and absorption fixed plate 9, loading plate 4 are equipped with
Several grooves 1 position mistake proofing pin hole 2 and multiple bearing holes 3, and magnet is fixedly installed in groove 1, adsorbs and is arranged in fixed plate 9
The positioning mistake proofing pin 10 being arranged corresponding to loading plate 4 and the fixed tenon 8 of multiple absorption adsorb setting vacuum in fixed tenon 8 and inhale
Attached hole 7；
Loading plate pressing plate 13 generally magnetic material support, be set on the upper surface of loading plate 4, with groove 1 in
Magnet adsorbs, and bearing holes 3 are arranged on loading plate 4, hollow hole 12, bearing holes 3 and hollow hole 12 are provided on loading plate pressing plate 13
It corresponds；
Several fastener holes 6 are set in absorption fixed plate 9, and fastener hole 6 is bolted to production equipment, adsorbs fixed plate
9 and production equipment vacuumize between interface one layer of gasket 15 of setting.
Multiple bearing holes 3 are uniformly distributed on loading plate 4, and shape, size and spacing are according to wire bonding circuit
The setting of shell shape.
4 edge of loading plate is equipped with loading plate side platform 5, and 5 thickness of loading plate side platform is thinner than loading plate 4, it is desirable that its thickness and away from
It is suitble to manpower to take, put with a distance from loading plate pressing plate 13.
Multiple surfaces for adsorbing fixed tenon 8 are respectively provided with one layer of cushion 14, vacuum absorption holes 7 are set as stepped hole, delay
It rushes aperture on pad 14 and the diameter that its aperture is greater than vacuum absorption holes 7 is set.
Adsorb fixed plate 9 the back side be arranged deep gouge 11, gasket 15 cover deep gouge around 9 surface of absorption fixed plate, by
Be bolted to production equipment vacuumizes interface.
Specifically used and connection type:
The tooling fastens in use, fixed plate 9 will need to be adsorbed by fastener hole 6 using bolt first with production equipment
Connection, at the same need to absorption fixed plate 9 and equipment interface between place gasket 15, thus guarantee will not from junction gas leakage,
Then circuit to be bonded is placed at same direction on the bearing holes 3 of loading plate 4, by loading plate pressing plate after the completion of putting
13 are placed on 4 top of loading plate, guarantee not falling out in shell transport process, then by loading plate 4 together with loading plate pressing plate
13 are placed in absorption fixed plate 9, that is, realize uploading for circuit to be bonded, by loading plate 4 together with holding after equipment completes bonding
Support plate pressing plate 13 is removed down together reaches next process.
Above-described embodiment is only the preferable embodiment of the utility model, and in addition to this, the utility model can also have
Other implementations.It should be noted that without departing from the concept of this utility model, any conspicuous improvement
It should fall within the protection scope of this utility model with modification.
Claims (5)
1. a kind of wire bonding tooling, including loading plate, loading plate pressing plate and absorption fixed plate, it is characterised in that:
The loading plate is equipped with several grooves, positioning mistake proofing pin hole and multiple bearing holes, is fixedly installed with magnet in groove, inhales
Setting corresponds to the positioning mistake proofing pin and the fixed tenon of multiple absorption of loading plate setting in attached fixed plate, adsorbs and sets in fixed tenon
Set vacuum absorption holes；
Loading plate pressing plate generally magnetic material supports, and is set on the upper surface of loading plate, adsorbs with the magnet in groove,
Be provided with several bearing holes on loading plate, be provided with several hollow holes on the loading plate pressing plate, the bearing holes with it is described
Hollow hole corresponds；
Several fastener holes are set in absorption fixed plate, and fastener hole is bolted to production equipment, absorption fixed plate and production
Equipment vacuumizes one layer of gasket of setting between interface.
2. a kind of wire bonding tooling according to claim 1, it is characterised in that:
The multiple bearing holes are uniformly distributed on loading plate, and shape, size and spacing are according to the pipe of wire bonding circuit
The setting of hull shape shape.
3. a kind of wire bonding tooling according to claim 1, it is characterised in that:
The loading plate edge is equipped with loading plate side platform, and loading plate side platform thickness is thinner than loading plate, it is desirable that its thickness and distance are held
The distance of support plate pressing plate is suitble to manpower to take, put.
4. a kind of wire bonding tooling according to claim 1, it is characterised in that:
The multiple surface for adsorbing fixed tenon is respectively provided with one layer of cushion, vacuum absorption holes are set as stepped hole, cushion
Upper aperture and its aperture is set greater than vacuum suction bore dia.
5. a kind of wire bonding tooling according to claim 1, it is characterised in that:
Deep gouge is arranged in the back side of the absorption fixed plate, and the absorption around gasket covering deep gouge is fixed plate surface, connected by bolt
Be connected to production equipment vacuumizes interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821113443.1U CN208622684U (en) | 2018-07-13 | 2018-07-13 | A kind of wire bonding tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821113443.1U CN208622684U (en) | 2018-07-13 | 2018-07-13 | A kind of wire bonding tooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208622684U true CN208622684U (en) | 2019-03-19 |
Family
ID=65705555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821113443.1U Expired - Fee Related CN208622684U (en) | 2018-07-13 | 2018-07-13 | A kind of wire bonding tooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208622684U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111299880A (en) * | 2019-11-06 | 2020-06-19 | 张拥银 | Lead bonding machine |
| CN112331583A (en) * | 2020-10-14 | 2021-02-05 | 安徽科技学院 | Packaging device for MOSFET device production |
-
2018
- 2018-07-13 CN CN201821113443.1U patent/CN208622684U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111299880A (en) * | 2019-11-06 | 2020-06-19 | 张拥银 | Lead bonding machine |
| CN111299880B (en) * | 2019-11-06 | 2022-01-07 | 江苏微邦电子有限公司 | Lead bonding machine |
| CN112331583A (en) * | 2020-10-14 | 2021-02-05 | 安徽科技学院 | Packaging device for MOSFET device production |
| CN112331583B (en) * | 2020-10-14 | 2023-04-07 | 安徽科技学院 | Packaging device for MOSFET device production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190319 Termination date: 20190713 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |