CN211265461U - Lead frame structure for preventing lead welding spots on pins from being broken - Google Patents
Lead frame structure for preventing lead welding spots on pins from being broken Download PDFInfo
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- CN211265461U CN211265461U CN201922426808.7U CN201922426808U CN211265461U CN 211265461 U CN211265461 U CN 211265461U CN 201922426808 U CN201922426808 U CN 201922426808U CN 211265461 U CN211265461 U CN 211265461U
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- well muscle
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Abstract
The utility model relates to a prevent cracked lead frame structure of lead wire solder joint on pin, including a plurality of lead frame units and well muscle, well muscle is used for connecting between the adjacent lead frame unit, and the lead frame unit is including the inside pad that is located the centre and the pin that is located both sides, and the other both sides of inside pad all are connected with well muscle, the outside end of pin also is connected with well muscle, inside pad and pin are the solid metal, and well muscle is half etching metal, need weld two lead wires and above pin medial extremity also be connected with well muscle. The pins are provided with one more supporting point, the strength is increased, the vibration generated by the chopper during the thermosonic welding can be transmitted, and when a second welding point is formed on the pins through the thermosonic welding, the risk of fracture of the second welding point is avoided, and particularly, when the number of the leads of a single pin is 8 or more, the effect is more obvious; in addition, the area available for connecting the two welding spots is greatly increased; the difficulty of the lead bonding operation is reduced, and the parameter debugging is easier.
Description
Technical Field
The utility model relates to a chip package technical field especially relates to a prevent cracked lead frame structure of lead wire solder joint on pin.
Background
The QFN/DFN is a leadless package in a square or rectangular shape, a large-area exposed bonding pad is arranged at the center of the bottom of the package for heat conduction, and conductive bonding pads for realizing electrical connection are arranged around the periphery of the package surrounding the exposed bonding pad. QFN packages provide excellent electrical performance because they do not have gull-wing leads as do conventional SOIC and TSOP packages, their internal pin to bare pad electrical conduction paths are short, their self-inductance and in-package wiring resistance are low. In addition, it provides excellent heat dissipation through exposed bare pads with direct heat dissipation paths for dissipating heat within the package. The bare pads are typically soldered directly to the circuit board and the thermal dissipating vias in the circuit board help to spread excess power dissipation into the copper ground plate, thereby absorbing excess heat.
Because the pin is the solid metal material when traditional QFN/DFN pin cutting shaping, the very easy cutting tool life that loses, for solving this problem, as shown in figure 1, the industry all carries out half etching to the well muscle part of QFN/DFN frame, and the metal thickness of muscle part is attenuate like this, when the packaging body cutting, can effectively reduce the wearing and tearing of cutter, has improved cutting efficiency (the shadow part is the back half etching region). This solution has the following drawbacks: 1. the lead is only connected with the middle rib at the outer side end, and the middle rib of the DFN/QFN frame is half-etched, so the strength of the lead is general, when wire bonding is performed, if only one lead is used for one lead, when a plurality of leads are used for the same lead, and a Second welding point (Second bond) is used for the lead through thermosonic welding, the cleaver can respectively apply force in two directions parallel to and vertical to the lead due to the fact that the welding mode is thermosonic welding, so that the lead generates vibration, but because the metal thickness of the middle rib part is reduced by half, the vibration generated when the lead bonding cannot be transmitted by the independent lead alone can cause vibration of the two welding points; the prior art personnel can only get into the hand from adjusting the parameter of thermosonic welding to solve this problem, firstly the debugging degree of difficulty is great, wastes time and energy, secondly still has certain defective rate, so await improvement.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a more effectual cracked lead frame structure of lead wire solder joint on preventing the pin.
The utility model discloses a realize like this: the utility model provides a prevent that lead wire solder joint is cracked lead frame structure on pin, includes a plurality of lead frame units and well muscle, well muscle is used for connecting between the adjacent lead frame unit, the lead frame unit is including the inside pad that is located the centre and the pin that is located both sides, the other both sides of inside pad all are connected with well muscle, the outside end of pin also is connected with well muscle, inside pad and pin are the entity metal, and well muscle is half etching metal, need weld two lead wires and above pin medial extremity also be connected with well muscle.
Wherein, the inner ends of the adjacent pins of the part are also connected through a middle rib.
The utility model has the advantages that: the lead frame structure for preventing the lead welding spots on the pins from being broken is improved aiming at the pin structure needing to weld two leads, so that the inner side ends of the pins are also connected with the middle rib, the pins have one more supporting point, the strength is increased, the vibration generated by a cleaver during thermosonic welding can be transmitted, when a second welding spot is welded on the pins through thermosonic welding, the risk of breaking the second welding spot is avoided, and particularly when the number of the leads of a single pin is 8 or more, the effect is more obvious; in addition, the area available for connecting the two welding spots is greatly increased; the production difficulty of the lead frame is not increased, and the production cost cannot be changed; the difficulty of the lead bonding operation is reduced, and the parameter debugging is easier.
Drawings
FIG. 1 is a diagram of a conventional lead frame structure of a QFN/DFN package product in the prior art;
fig. 2 is a schematic structural diagram of a first embodiment of a lead frame structure for preventing a lead pad on a pin from being broken according to the present invention;
fig. 3 is a perspective view of the lead frame unit of fig. 2;
fig. 4 is a schematic structural diagram of a second embodiment of the lead frame structure for preventing a lead pad on a pin from being broken according to the present invention;
fig. 5 is a schematic structural diagram of a third embodiment of the lead frame structure for preventing a lead pad on a pin from being broken according to the present invention;
fig. 6 is a schematic structural diagram of a fourth embodiment of the lead frame structure for preventing lead pads from being broken on pins according to the present invention.
The cross-sectional line portion of the above figures is a half-etched metal region.
Wherein, 1, lead frame unit; 11. an inner pad; 12. a pin; 2. and (5) a middle rib.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As prevent lead wire solder joint cracked lead frame structure embodiment one on pin, as shown in fig. 2 and fig. 3, including a plurality of lead frame units 1 and well muscle 2, well muscle 2 is used for connecting between the adjacent lead frame unit 1, lead frame unit 1 is including the inside pad 11 that is located the centre and the pin 12 that is located both sides, the other both sides of inside pad 11 all are connected with well muscle 2, the outside end of pin 12 also is connected with well muscle 2, inside pad 11 and pin 12 are the solid metal, and well muscle 2 is half etching metal, need weld two lead wires and above pin 12 medial extremity also be connected with well muscle 2. In this embodiment, only the leads at the upper left corner and the upper right corner need to be soldered with a plurality of leads, so only the inner ends of the two leads are connected with the middle rib.
The lead frame structure for preventing the lead welding spots on the pins from being broken is improved aiming at the pin structure needing to weld two leads, so that the inner side ends of the pins 12 are also connected with the middle rib 2, thus the pins 12 have one more supporting point, the strength is increased, the vibration generated by a cleaver during thermosonic welding can be transmitted, when a second welding spot is formed on the pins through thermosonic welding, the risk of breaking the two welding spots is avoided, and particularly when the number of the leads of a single pin is 8 or more, the effect is more obvious; in addition, the area available for the connection of the two solder joints is also greatly increased (in this embodiment, the solderable area of the pins is increased by 38.2% compared with the frame structure in the background art); the production difficulty of the lead frame is not increased, and the production cost cannot be changed; the difficulty of the lead bonding operation is reduced, and the parameter debugging is easier.
As the second embodiment of the lead frame structure for preventing lead pads from breaking on the pins, as shown in fig. 4, the first embodiment is different from the second embodiment in that the pins 12 on four corners all need to be welded with a plurality of leads, so the inner ends of the four pins 12 are connected with the middle rib 2.
As the utility model discloses a prevent cracked lead frame structure embodiment third of lead wire solder joint on pin, as shown in fig. 5, lie in with embodiment one difference the medial extremity of the adjacent pin 12 of part also connects through well muscle 2, and the function of two pins in the upper left corner is the same, and the function of two pins in the upper right corner is the same, is called the pin of sharing, and this embodiment lets these two adjacent pins also connect through half etching metal (also called well muscle here), and pin intensity of sharing is better like this, can weld more many leads.
As the fourth embodiment of the lead frame structure for preventing lead pads from breaking on the pins, as shown in fig. 6, the pins 12 at the lower left corner and the lower right corner, which are different from the fourth embodiment, also need to be welded with a plurality of leads, so the inner side ends of these two pins 12 are also connected with the middle rib 2.
The utility model discloses in, can be according to different product demands, select to link to each other lead wire more pin and well muscle, or whole pins link to each other with well muscle.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (2)
1. The utility model provides a prevent cracked lead frame structure of lead wire solder joint on pin, includes a plurality of lead frame units and well muscle, well muscle is used for connecting between the adjacent lead frame unit, the lead frame unit is including the inside pad that is located the centre and the pin that is located both sides, the other both sides of inside pad all are connected with well muscle, the outside end of pin also is connected with well muscle, inside pad and pin are the entity metal, and well muscle is half etching metal, its characterized in that, need weld two lead wires and above pin medial extremity also be connected with well muscle.
2. The lead frame structure for preventing lead pad fracture on a lead according to claim 1, wherein the inner ends of some adjacent leads are also connected by a middle rib.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922426808.7U CN211265461U (en) | 2019-12-27 | 2019-12-27 | Lead frame structure for preventing lead welding spots on pins from being broken |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922426808.7U CN211265461U (en) | 2019-12-27 | 2019-12-27 | Lead frame structure for preventing lead welding spots on pins from being broken |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211265461U true CN211265461U (en) | 2020-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922426808.7U Active CN211265461U (en) | 2019-12-27 | 2019-12-27 | Lead frame structure for preventing lead welding spots on pins from being broken |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211265461U (en) |
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2019
- 2019-12-27 CN CN201922426808.7U patent/CN211265461U/en active Active
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