CN211160878U

CN211160878U - Novel cleaning tool container for diamond wire cutting silicon wafer

Info

Publication number: CN211160878U
Application number: CN201921066456.2U
Authority: CN
Inventors: 武肖伟; 郭会杰; 杨国辰; 王民磊
Original assignee: Henan Shengda Photovoltaic Technology Co ltd
Current assignee: Henan Shengda Photovoltaic Technology Co ltd
Priority date: 2019-07-09
Filing date: 2019-07-09
Publication date: 2020-08-04
Anticipated expiration: 2029-07-09

Abstract

The utility model discloses a novel cleaning tool container for diamond wire cutting silicon chips, which comprises a bottom plate, wherein a bottom wall side plate is arranged on the bottom plate, a side plate is arranged on the bottom wall side plate, a middle side plate is arranged between the bottom wall side plate and the side plate, a middle arc plate is arranged on the middle side plate, a U-shaped hole is formed in the middle arc plate, a rubber pad is pasted in the U-shaped hole, bottom support rods are respectively arranged on two sides of the bottom plate, a rectangular grid hole is formed between the bottom support rods, a side plate surface is arranged on the side plate, a triangular grid hole is formed in the side plate surface, a triangular angle plate is arranged on the triangular grid hole, the bottom wall side plate is provided with a bottom wall side plate surface, a triangular grid hole is formed in the bottom wall side plate surface, the problem that liquid rapidly enters and exits from a flower basket and the flow of a reagent silicon material in chemical treatment of the diamond wire cutting silicon chips, the production cost is reduced.

Description

Novel cleaning tool container for diamond wire cutting silicon wafer

Technical Field

The utility model relates to a garrulous silicon chip washs technical field, specifically is a novel frock container that washs of garrulous silicon chip of buddha's warrior attendant wire-electrode cutting.

Background

The development and utilization of solar energy enable the modern energy structure to be changed greatly, photovoltaic solar energy becomes a very important role in renewable energy, and the current polycrystalline silicon wafer production enterprises face the price reduction of polycrystalline silicon wafer products, while the price of raw materials of the used polycrystalline silicon materials is relatively higher; production enterprises have a necessary way to better develop and reduce the investment cost of ingot casting raw materials; along with the influence of the factor, the use demand of the recovered silicon chips generated by diamond wire cutting is increased, the silicon chips recovered by diamond wire cutting cannot be normally used due to the fact that cutting fluid residues, cutting silicon powder, cleaning agent residues, equipment metal falling objects and the like are adhered to the surfaces of the silicon chips by the cutting process and various human factors, and chemical treatment is needed, and the traditional common treatment method comprises the following steps: the method comprises the following steps of manually filling broken silicon wafers into a container for chemical treatment, wherein liquid cannot rapidly enter and exit the container in the treatment process of the container, different differences appear in the treatment quality of the broken silicon wafers, the silicon material treatment of the broken silicon wafers increases the reagent loss amount and the process time of various chemical treatments because the liquid cannot rapidly enter and exit the container, a rectangular or square flower basket is used in the traditional chemical treatment flower basket, the flower basket is provided with holes as original holes, the broken materials are seriously lost in the treatment process of the broken silicon wafers, the treatment cost of the broken silicon wafers is indirectly increased, the product quality is improved, the production cost is reduced, the broken silicon wafers are recycled after chemical cleaning by linear cutting, and the method is widely researched and popularized in the industry; how to balance a series of cost variables such as chemical treatment quality, reagent loss and silicon material loss and the like becomes a trouble in the chemical treatment link of the broken silicon wafers; the problem of the liquid rapidly entering and exiting the flower basket and the loss of the reagent silicon material is solved, and the method becomes a project for controversial research, cost reduction and efficiency improvement of the silicon material cleaning industry.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is overcome current defect, a novel washing frock container of buddha's warrior attendant wire-electrode cutting silicon chip is provided, the diapire has increased the support, it is internal to make the silicon material put into the tank, basket of flowers and cell body separation, the permeability of basket of flowers bottom silicon material and reagent has been promoted, make bottom silicon material reaction more thoroughly quick, the bottom surface trompil is closely arranged for rectangle grid hole and side triangle-shaped trompil are depended mutually, the quick trafficability characteristic of reagent has been accelerated, the same size has reduced the diameter than round hole and rectangle, silicon material loss is reduced, solve during the buddha's warrior attendant wire section retrieves silicon chip chemical treatment, the quick business turn over basket of liquid loses a difficult problem with reagent silicon material flow, improve the product quality, reagent and silicon material loss have been reduced, the production cost is reduced, can effectively.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a novel washing tool container of garrulous silicon chip of buddha's warrior attendant wire-electrode cutting, including the bottom surface board, be equipped with the diapire curb plate on the bottom surface board, be equipped with the middle part curb plate between diapire curb plate and the curb plate, be equipped with middle part arc board on the middle part curb plate, and it has U type hole to open on the arc board of middle part, the downthehole portion of U type is pasted and is had the rubber pad, bottom surface board both sides are equipped with the bottom sprag pole respectively, and be equipped with the rectangle grid hole between the bottom sprag pole, be equipped with the curb plate face on the curb plate, and it has triangle-shaped grid hole to open on the curb plate face, be equipped with the triangle.

As a preferred technical proposal of the utility model, the bottom support rod is 200-400mm long, 10-25mm high, 5-10mm thick, 5-10mm long, 1-3mm wide and 0.5-1mm high.

As an optimized technical proposal of the utility model, the triangular angle plate is a right-angled triangle, and the length of the two right-angled sides is 5-10 mm.

As a preferred technical proposal of the utility model, the U-shaped hole has the width of 30-60mm and the height of 10-15 mm.

Compared with the prior art, the beneficial effects of the utility model are that: the diapire has increased the support, it is internal to make the silicon material put into the tank, flower basket and cell body separation, the permeability of flower basket bottom silicon material and reagent has been promoted, make bottom silicon material reaction more thoroughly quick, the bottom surface trompil is closely arranged for rectangle grid hole and side triangle-shaped trompil are depended on mutually, the quick trafficability characteristic of reagent has been accelerated, the same size has reduced the diameter than round hole and rectangle, silicon material loss is reduced, solve among the diamond wire section recovery silicon chip chemical treatment, the quick business turn over flower basket of liquid and reagent silicon material flow lose difficult problem, the product quality is improved, reagent and silicon material loss are reduced, and the production cost is reduced.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic front view of the present invention;

FIG. 3 is a schematic view of the side plate structure of the present invention;

FIG. 4 is a schematic view of the triangular grid hole structure of the present invention;

FIG. 5 is a schematic view of the U-shaped hole structure of the present invention;

FIG. 6 is a schematic view of the rectangular grid hole structure of the present invention;

fig. 7 is a schematic view of the triangular grating hole structure of the sidewall surface of the bottom wall of the present invention.

In the figure: 1 middle side plate, 2 bottom side plates, 3 side plates, 4 bottom side plates, 11 middle arc plates, 21 bottom support rods, 22 rectangular grid holes, 31 side plate surfaces, 32 triangular grid holes, 111U-shaped holes, 112 rubber pads, 321 triangular corner plates, 41 bottom side plate surfaces and 42 bottom side plate surface triangular grid holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution: a novel cleaning tool container for diamond wire cutting silicon chips comprises a bottom panel 2, wherein a bottom wall side plate 4 is arranged on the bottom panel 2, a side plate 3 is arranged on the bottom wall side plate 4, a middle side plate 1 is arranged between the bottom wall side plate 4 and the side plate 3, a middle arc plate 11 is arranged on the middle side plate 1, a U-shaped hole 111 is formed in the middle arc plate 11, the width of the U-shaped hole 111 is 30-60mm, the height of the U-shaped hole is 10-15mm, a rubber pad 112 is adhered inside the U-shaped hole 111, bottom support rods 21 are respectively arranged on two sides of the bottom panel 2, the length of each bottom support rod 21 is 200-400mm, the height of each bottom support rod is 10-25mm, the thickness of each bottom support rod is 5-10mm, the length of each rectangular grid hole 22 is 5-10mm, the width of each bottom support rod is 1-3mm, the height of each bottom support rod 21, be equipped with triangle-shaped scute 321 on triangle-shaped grid hole 32, triangle-shaped scute 321 is right angled triangle, and the length on two right-angle sides is 5-10mm, diapire curb plate 4 is equipped with diapire curb plate face 41, and it has diapire curb plate face triangle-shaped grid hole 42 to open on the diapire curb plate face 41, whole basket of flowers is according to six rhombus designs, the diapire has increased the support, make after the cell body is put into to the silicon material, basket of flowers and cell body separation, the permeability of basket of flowers bottom silicon material and reagent has been promoted, lateral wall trompil quantity has been increased, the rapidity of reagent business turn over has been driven, let the silicon material reaction.

When in use: the bottom support rods 21 are arranged on the edges of two sides of the bottom panel 2, triangular holes are formed in the bottom wall, the whole bottom is closely matched with the bottom, liquid can conveniently flow in and out, the middle position of the side panel 3 is bent inwards by 20 degrees, the middle diameter is increased by 20mm outwards, triangular grid holes 32 are formed in the side surface, the cleaning amount of broken silicon wafers is increased, the number of holes is increased, the rapidness of reagent flowing in and out is solved, silicon material reaction is more consistent, the whole flower basket is designed according to a hexagonal diamond shape, the number of the triangular grid holes 32 is increased, the rapidness of reagent flowing in and out is driven, the silicon material reaction is more consistent, the bottom holes are formed by closely matching the bottom side panel grid holes 22 with the triangular grid holes 32, the rapid passing through of the reagent is accelerated, the diameter is reduced compared with round holes and rectangles in the same size, and the silicon.

The utility model discloses the diapire has increased the support, it is internal to make the silicon material put into the groove, basket of flowers and cell body separation, the permeability of basket of flowers bottom silicon material and reagent has been promoted, make bottom silicon material reaction more thoroughly quick, the bottom surface trompil is closely arranged for rectangle grid hole and side triangle-shaped trompil are depended mutually, the quick trafficability characteristic of reagent has been accelerated, the diameter has been reduced than round hole and rectangle to same size, silicon material loss is reduced, solve among the diamond wire section recovery silicon chip chemical treatment, the quick business turn over basket of flowers of liquid and reagent silicon material flow lose difficult problem, the product quality is improved, reagent and silicon material loss are reduced, and production cost is reduced.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel frock container that washs of garrulous silicon chip of buddha's warrior attendant wire-electrode cutting, includes bottom surface board (2), its characterized in that: a bottom wall side plate (4) is arranged on the bottom panel (2), a side plate (3) is arranged on the bottom wall side plate (4), a middle side plate (1) is arranged between the bottom side plate (4) and the side plate (3), a middle arc plate (11) is arranged on the middle side plate (1), a U-shaped hole (111) is arranged on the middle arc plate (11), a rubber pad (112) is stuck in the U-shaped hole (111), two sides of the bottom panel (2) are respectively provided with a bottom support rod (21), and a rectangular grid hole (22) is arranged between the bottom support rods (21), a side plate surface (31) is arranged on the side plate (3), a triangular grid hole (32) is arranged on the side plate surface (31), a triangular angle plate (321) is arranged on the triangular grid hole (32), a bottom wall side plate (4) is provided with a bottom wall side plate surface (41), and the bottom wall side plate surface (41) is provided with a bottom wall side plate surface triangular grid hole (42).

2. The novel cleaning tool container for broken silicon wafers cut by diamond wires according to claim 1, is characterized in that: the bottom support rod (21) is 400mm long, 10-25mm high, 5-10mm thick, the rectangular grid hole (22) is 5-10mm long, 1-3mm wide and 0.5-1mm high.

3. The novel cleaning tool container for broken silicon wafers cut by diamond wires according to claim 1, is characterized in that: the triangular angle plate (321) is a right-angled triangle, and the length of the two right-angled sides is 5-10 mm.

4. The novel cleaning tool container for broken silicon wafers cut by diamond wires according to claim 1, is characterized in that: the width of the U-shaped hole (111) is 30-60mm, and the height is 10-15 mm.